Protective film peeling apparatus and semiconductor manufacturing apparatus

Abstract

The utility model provides a kind of protective film stripping device and semiconductor manufacturing equipment, protective film stripping device includes: stage and apron;Temperature control module is provided on stage and / or apron, temperature control module is used to heat and / or cool to mask and protective film;Apron is movable along the direction of approaching or moving away from stage, and when temperature control module heats mask, it is covered in the upper of protective film;Stripping module is equipped on apron, and stripping module is engaged with protective film when apron covers protective film;Wherein, apron is telescopic along the direction parallel to protective film, to match the size of protective film.Such configuration, by setting temperature control module, on the one hand, can be softened by heating adhesive, reduce glue residue, while cooling protective film, in stripping process, the rigidity of protective film can be maintained, avoid secondary pollution and mask surface damage caused by high-temperature softening;Apron can match different protective film size, improve the stripping efficiency of protective film.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of semiconductor manufacturing especially, and it is a kind of protective film stripping device and semiconductor manufacturing equipment. BACKGROUND

[0002] Mask protective film is the film structure covered in the pattern side of mask, it can prevent dust from falling in the pattern side of mask, to avoid affecting the subsequent use of mask.

[0003] The existing mask protective film removal method is usually to heat mask protective film, so that the adhesive of mask protective film softens, and then the mask and mask protective film are stripped. But high temperature can make the adhesive on mask protective film more viscous, increase the risk of adhesive residue, increase the difficulty of subsequent cleaning, and also can introduce new contaminants or damage the mask surface.

[0004] Therefore, how to efficiently and quickly remove the protective film and reduce the adhesive residue on the mask surface has become a technical problem to be solved by the technical personnel in the field. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a kind of protective film stripping device and semiconductor manufacturing equipment, to can efficiently and quickly remove protective film, and reduce the adhesive residue on the mask surface.

[0006] In order to achieve the above purpose, the utility model provides a kind of protective film stripping device, including: stage and cover plate;

[0007] The stage is used to carry the mask with protective film;

[0008] Temperature control module is arranged on the stage and / or the cover plate, and the temperature control module is used to heat and / or cool the mask and the protective film when stripping the protective film;

[0009] The cover plate is movable along the direction close to or away from the stage, and covers the upper side of the protective film when the temperature control module heats the mask;Stripping module is arranged on the cover plate, and the stripping module is engaged with the protective film when the cover plate covers the protective film, to drive the protective film to separate from the surface of the mask when the cover plate moves along the direction away from the stage;

[0010] Wherein, the cover plate is telescopic along the direction parallel to the protective film, to match the size of the protective film.

[0011] Optionally, the cover plate includes frame body, slide rail and at least one frame unit;

[0012] The frame unit is movably nested in the frame body or another frame unit along a direction parallel to the protective film;

[0013] The slide rail is arranged on the inner wall of the frame body and the frame unit, and is arranged along a direction parallel to the protective film.

[0014] Optionally, the frame unit has a retracted position and an extended position.

[0015] When the frame unit is in the retracted position, it is located in the frame body or another frame unit.

[0016] When the frame unit is in the extended position, it extends out of the frame body or another frame unit along the slide rail to match protective films of different sizes.

[0017] Optionally, the slide rail is further provided with a locking module, which is engaged with the frame unit after the frame unit is moved to a position matching the protective film, thereby achieving locking between the frame unit and the slide rail.

[0018] Optionally, the temperature control module includes a cooling pipe embedded in the inner wall of the frame unit and the frame body for circulation of refrigerant to contact and cool the protective film when the cover plate covers the protective film.

[0019] Optionally, the temperature control module includes a heating plate arranged inside the stage for heating the mask placed on the stage.

[0020] Optionally, the temperature control module further includes a temperature sensor arranged on the stage for detecting the temperature of the surface of the mask.

[0021] Optionally, the protective film peeling device includes a connecting rod connecting the stage and the cover plate, which is telescopically arranged along a direction approaching or away from the stage.

[0022] Optionally, the stage is further provided with a fixing module on the bearing surface of the stage, which is adapted in size to the mask for engagement with the mask to achieve fixation when the stage bears the mask.

[0023] To achieve the above-mentioned purpose, the utility model further provides a semiconductor manufacturing equipment, include: machine table and as above-mentioned protective film peeling device.

[0024] The protective film stripping device is arranged inside or outside the machine table and is used for stripping the protective film on the mask.

[0025] Compared with the existing protective film removing device, the protective film stripping device and the semiconductor manufacturing equipment have the following advantages:

[0026] The protective film stripping device provided by the application can heat and / or cool the temperature of the protective film during the stripping process of the protective film, which can soften the adhesive by heating to reduce the residual adhesive, and can maintain the rigidity of the protective film during the stripping process by cooling the protective film, thereby avoiding secondary pollution and damage to the mask surface caused by high temperature softening. The stripping module is arranged on the cover plate to prevent the mask from being damaged during the stripping process. In addition, the cover plate is retractable in a direction parallel to the protective film, which can adjust the size of the cover plate according to the size of different protective films, thereby widening the application range of the protective film stripping device, improving the practicability of the protective film stripping device, and reducing the difficulty of stripping different sizes of protective films. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 A structural schematic view of the protective film stripping device provided by the embodiment of the application is shown in the figure.

[0028] Figure 2 A structural schematic view of the cover plate in the retracted position provided by the embodiment of the application is shown in the figure.

[0029] Figure 3 A schematic view of the stripping module stripping the protective film provided by the embodiment of the application is shown in the figure.

[0030] Figure 4 A structural schematic view of the cover plate in the extended position provided by the embodiment of the application is shown in the figure.

[0031] Figure 5 A schematic view of the cooling pipe in the cover plate in the retracted position provided by the embodiment of the application is shown in the figure.

[0032] Figure 6 A schematic view of the cooling pipe in the cover plate in the extended position provided by the embodiment of the application is shown in the figure.

[0033] Figure 7 A partial detail view of the cover plate provided by the embodiment of the application is shown in the figure.

[0034] Among them, the explanation of each reference sign is as follows:

[0035] 1-Stage; 10-Heating plate; 11-Fixing module;

[0036] 2 - cover plate; 20 - frame body; 21 - frame unit; 22 - stripping module; 23 - slide rail; 24 - sliding block; 25 - cooling pipe; 26 - clamping groove; 260 - first straight section; 261 - second straight section; 262 - connecting section; 263 - straight section; 27 - locking module; 270 - bolt; 271 - through hole;

[0037] 3 - connecting rod; 4 - mask; 5 - protective film. DETAILED DESCRIPTION

[0038] In order to make the purpose, advantages and characteristics of the utility model more clear, the following will make further detailed description to the utility model combining with the drawings and specific embodiments. It should be noted that the drawings are all very simplified form and are not drawn according to proportion, just to facilitate, clearly assist the purpose of explaining the embodiment of the utility model. In addition, the structure shown in the drawings is often a part of the actual structure. In particular, the emphasis of each drawing needs to be different, sometimes different proportions are used.

[0039] As used in this specification, the singular forms "a," "an" and "the" include plural referents unless the context clearly dictates otherwise. The term "or" is generally employed in its sense including "and / or" unless the context clearly dictates otherwise. The term "and / or" means "and", "or" or both. The term "at least two" generally means "two or more" unless the context clearly dictates otherwise. The terms "first," "second," "third," etc. are used only to describe one member of a group and do not, unless the context clearly dictates otherwise, indicate or imply a relative importance or an order of magnitude of the indicated technical features. Thus, features defined with "first," "second," "third," etc. can explicitly or implicitly include one or at least two of the features. The terms "one end" and "the other end" and "proximal" and "distal" generally refer to two parts corresponding to each other, which not only includes the end points, and the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, or detachably connected, or integrated; it can be directly connected, or indirectly connected through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements. In addition, as used in this specification, a component disposed in another component generally only indicates that there is a connection, coupling, cooperation or transmission relationship between the two components, and the two components can be directly or indirectly connected, coupled, cooperated or transmitted through an intermediate component, and cannot be understood as indicating or implying the spatial positional relationship between the two components, i.e. one component can be in any position inside, outside, above, below or one side of another component, unless the content is otherwise clearly indicated. The terms "up", "down", "top", "bottom" are generally relative positional relationships arranged according to the direction of gravity; the terms "vertical direction" and "vertical direction" generally refer to the direction along the gravity, which is generally perpendicular to the ground, and the terms "horizontal direction" and "horizontal plane direction" generally refer to the direction parallel to the ground; for those skilled in the art, the specific meaning of the above terms in this specification can be understood according to the specific circumstances.

[0040] The utility model discloses a protective film stripping device and semiconductor manufacturing equipment, can efficiently and quickly remove the protective film, and reduce the residual glue on the mask surface.

[0041] Please refer to Figures 1 to 3The utility model provides a kind of protective film stripping device, comprising: stage 1 and cover plate 2;Stage 1 is used to carry the mask 4 with protective film 5;Temperature control module is provided on stage 1 and / or cover plate 2, temperature control module is used to heat and / or cool mask 4 and protective film 5 when stripping protective film 5;Cover plate 2 is movable along the direction close to or away from stage 1, and cover plate 2 is covered above protective film 5 when temperature control module heats mask 4;Stripping module 22 is provided on cover plate 2, stripping module 22 is engaged with protective film 5 when cover plate 2 covers protective film 5, to drive protective film 5 to separate from the surface of mask 4 when cover plate 2 moves along the direction away from stage 1;Wherein, cover plate 2 is telescopic along the direction parallel to protective film 5, to match the size of protective film 5.It needs to be explained, in the embodiment Figure 2 、 Figures 4 to 6 In Figure 1 、 Figure 3 And Figure 7 , the face of the upper cover plate 2 in actual use is the face of the cover plate 2 close to the protective film 5.

[0042] As shown in Figure 1 And Figure 2 , the temperature control module can include a heater for heating and a cooling system for cooling, or a temperature control device that combines heating and cooling, which can be provided on the stage 1 and the cover plate 2, or only on the stage 1 or only on the cover plate 2. Preferably, the heater is provided on the stage 1, and the cooling system is provided on the cover plate 2, because the heater needs to heat the mask 4 to transfer heat to the adhesive through the mask 4, and the cooling system only needs to cool the protective film 5 to maintain the rigidity of the protective film 5 during stripping. As shown in Figure 3 , the stripping module 22 can be a jaw that can rotate along the direction close to or away from the stage 1, and has a locking mechanism. Since the temperature control module heats the mask 4, the adhesive between the mask 4 and the protective film 5 begins to soften, and a gap appears between the protective film 5 and the mask 4. The stripping module 22 can extend into the gap between the protective film 5 and the mask 4 when the cover plate 2 covers the protective film 5, and lock the stripping module 22 to limit the rotation of the stripping module 22. The specific locking method can be a limit pin or other device that can achieve limiting. When the cover plate 2 moves away from the stage 1, the protective film 5 is driven off the surface of the mask 4.

[0043] As can be understood by those skilled in the art, the existing protective film 5 removal method is mostly to heat the adhesive between the protective film 5 and the mask 4 to soften the adhesive, so as to separate the protective film 5 from the mask 4. Although the above method can effectively remove the protective film 5, it is easy to form residual adhesive on the surface of the mask 4, which increases the difficulty of cleaning the mask 4 and also increases the probability of secondary pollution. The protective film peeling device provided in the embodiment can control the temperature of the mask 4 and the protective film 5 by setting a temperature control module that can heat and cool, so as to heat and soften the adhesive and cool the protective film 5 to keep the protective film 5 rigid during the peeling process, thereby reducing the formation of residual adhesive. On the other hand, by setting the telescopic cover plate 2, the application range of the device is widened, so that it can be used for protective films 5 of various sizes, thereby improving the peeling efficiency of the protective film 5. At the same time, by setting the peeling module 22, the contact between the protective film 5 and the mask 4 during the peeling process is reduced, so as to prevent the mask 4 from being damaged during the peeling process.

[0044] As an optional embodiment, please refer to Figure 2 and Figure 4 The cover plate 2 includes a frame body 20, a slide rail 23 (not shown in the figure) and at least one frame unit 21; the frame unit 21 is movably nested in the frame body 20 or another frame unit 21 in a direction parallel to the protective film 5; the slide rail 23 is arranged on the inner wall of the frame body 20 and the frame unit 21, and the slide rail 23 is arranged in a direction parallel to the protective film 5, and the frame unit 21 is movably arranged along the slide rail 23. It should be noted that in the exemplary embodiments shown in Figure 2 and Figure 4 , the cover plate 2 includes a frame body 20 and two frame units 21, both of which are nested in the frame body 20, one of which is nested in the other, and all of which are rectangular frame structures. The frame structure nested inside can be extended or retracted relative to the frame structure located outside. In other embodiments, the cover plate 2 can also be provided with a frame body 20 and one frame unit 21, or more frame units 21, and those skilled in the art can reasonably configure according to the different sizes of the protective film 5.

[0045] For example, the cover plate 2 includes a frame body 20 and one frame unit 21, please refer to Figure 7The slide rail 23 can be a linear slide rail, i.e., comprising the slide rail 23 installed inside the frame body 20 and the slide block 24 installed outside the frame unit 21, and the slide block 24 is slidably arranged along the extension direction of the slide rail 23. The slide rail 23 can also be a three-section slide rail 23, and the form of the slide rail 23 can be reasonably configured by those skilled in the art according to actual conditions. When the cover plate 2 comprises a plurality of frame units 21, the slide rail 23 between any two frame units 21 can be arranged in the above manner. Meanwhile, in order to facilitate the operator to pull out or push back the frame unit 21, a handle can be arranged on the outer wall of the frame unit 21 to apply an outward pulling force or an inward pushing force to the frame unit 21 by the operator.

[0046] Further, please continue to refer to Figure 2 and Figure 4 The frame unit 21 has a retracted position and an extended position; when the frame unit 21 is in the retracted position, it is located in the frame body 20 or another frame unit 21; when the frame unit 21 is in the extended position, it extends out of the frame body 20 or another frame unit 21 along the slide rail 23 to match the protective film 5 of different sizes. It should be noted that, as shown in Figure 2 , when the protective film 5 is small in size, the frame body 20 can meet the needs of covering the protective film 5, at this time, the frame unit 21 is in the retracted position, and it is completely retracted into the frame body 20; and as shown in Figure 4 , when the protective film 5 is large in size and cannot be covered by the frame body 20, the frame unit 21 needs to be extended out of the frame body 20, at this time, the frame unit 21 is in the extended position, i.e., the frame unit 21 is partially or entirely extended out of the frame body 20 to match the protective film 5 of different sizes.

[0047] Please refer to Figure 7 As an optional embodiment, the slide rail 23 is further provided with a locking module 27, which is engaged with the frame unit 21 after the frame unit 21 is moved to a position matched with the protective film 5, to realize the locking between the frame unit 21 and the slide rail 23. It should be noted that, as shown in Figure 7 , the locking module 27 comprises a latch 270 and a plurality of through holes 271, the latch 270 is detachably connected with the frame body 20 or the frame unit 21, the plurality of through holes 271 are uniformly arranged on the slide rail 23 along the extension direction of the slide rail 23, and one through hole 271 is also arranged on the slide block 24. During the sliding of the slide block 24 along the slide rail 23, the operator can pull out the frame unit 21 to a suitable distance according to the size of the protective film 5, and insert the latch 270 when the through hole 271 on the slide block 24 coincides with the through hole 271 on the slide rail 23 in the direction of gravity, so that the slide block 24 cannot continue to move on the slide rail 23, thereby realizing the locking between the frame unit 21 and the slide rail 23. In Figure 7In this embodiment, the slide rail 23 and the slider 24 are disposed on the top surface of the cover plate 2, and the pin 270 can be inserted along the direction of gravity to achieve locking. In other embodiments, the slide rail 23 and the slider 24 can also be disposed on the side of the cover plate 2, and the pin 270 can also be inserted in a direction perpendicular to the direction of gravity.

[0048] Please refer to Figures 5 to 6 The temperature control module includes a cooling pipe 25, which is embedded in the inner wall of the frame unit 21 and the frame body 20. The cooling pipe 25 is used for refrigerant flow, so that it contacts the protective film 5 when the cover plate 2 covers it, thereby cooling the protective film 5. It should be noted that the refrigerant can be cooling water or cooling gas. In this embodiment, the cooling pipe 25 can be a flexible hose with good deformability made of flexible materials such as silicone tubing or corrugated tubing. It is embedded in slots 26 formed in the frame unit 21 and the frame body 20. The slots 26 penetrate the surfaces of the frame unit 21 and the frame body 20, and multiple slots 26 coincide along the direction of gravity when the frame unit 21 is in the retracted position. The slot 26 on the frame body 20 includes a first straight segment 260, a second straight segment 261, and a connecting segment 262, while the slot 26 on the frame unit 21 only includes a straight segment 263. When the frame unit 21 extends out of the frame body 20, the straight segment 263 communicates with the first straight segment 260 and the second straight segment 261 respectively. The length of the cooling pipe 25 is adapted to the maximum size of the cover plate 2. The middle part of the cooling pipe 25 is fixedly connected to the connecting segment 262, which can be a snap-fit ​​connection or an adhesive bonding. The two ends of the cooling pipe 25 are respectively connected to the straight segment 263 located in the innermost frame unit 21, and are connected to the end of the straight segment 263 away from the connecting segment 262. The connection method can be a snap-fit ​​connection or an adhesive bonding. The other segments of the cooling pipe 25 are movably arranged in the first straight segment 260 and the second straight segment 261 respectively.

[0049] As an optional embodiment, in Figure 5 In the illustrated example, when the frame unit 21 is in the retracted position, the cooling pipe 25 located in the first straight segment 260 and the second straight segment 261 is also in a retracted state, that is, the cooling pipe 25 is in a bent state in the first straight segment 260 and the second straight segment 261; while Figure 6 In the illustrated example, when the frame unit 21 is in the extended position, since both ends of the cooling pipe 25 are connected to the internal frame unit 21, the cooling pipe 25 changes from a contracted state to a stretched state as the frame unit 21 moves. That is, the cooling pipe 25 straightens along its extension direction in the first straight segment 260 and the second straight segment 261, respectively. In other embodiments, the cooling pipe 25 may be configured in other ways, which is not limited in this embodiment.

[0050] Optionally, the temperature control module comprises a heating plate 10, which is arranged in the interior of the loading platform 1 and used for heating the mask 4 placed on the loading platform 1. Further, the heating temperature of the heating plate 10 is T, which satisfies 80℃≤T≤200℃. In the embodiment, the heating plate 10 is arranged on the loading platform 1, and when the mask 4 is placed on the loading platform 1, the heating plate 10 directly heats the mask 4. The mask 4 transmits the heat to the adhesive between the mask 4 and the protective film 5, so that the adhesive begins to soften and gradually loses the viscosity, and then the protective film 5 can be separated from the surface of the mask 4.

[0051] Further, the temperature control module further comprises a temperature sensor (not shown in the figure), which is arranged on the loading platform 1 and used for detecting the temperature of the surface of the mask 4. It should be noted that the temperature sensor can be in communication connection with the control end to transmit the detected temperature value to the control end. The operator can control the heating power of the heating plate 10 or the refrigerant flow in the cooling pipe 25 according to the temperature value, so as to control the temperature in a reasonable range, avoid the formation of residual adhesive due to too high temperature, and avoid the inconvenience of peeling due to too low temperature. The reasonable range can be obtained through multiple tests, or can be reasonably configured according to the melting point of different adhesives.

[0052] Please refer to Figure 1 The protective film peeling device comprises a connecting rod 3, which connects the loading platform 1 and the cover plate 2 and is telescopically arranged along the direction of approaching or moving away from the loading platform 1. It should be noted that in the embodiment, the connecting rod 3 can be a telescopic cylinder, which can be telescoped along the direction of approaching or moving away from the loading platform 1, thereby driving the cover plate 2 to move along the direction of approaching or moving away from the loading platform 1.

[0053] Please refer to Figure 1 The loading platform 1 is further provided with a fixing module 11, which is located on the bearing surface of the loading platform 1 and has a size suitable for the mask 4. The fixing module 11 is used for clamping the mask 4 when the mask 4 is loaded on the loading platform 1 to achieve fixation. In the embodiment, the fixing module 11 can be a clamping jaw, which can rotate along the direction of approaching or moving away from the mask 4 and has a locking mechanism. When the mask 4 is placed on the loading platform 1, the operator can rotate the fixing module 11 to clamp the mask 4 with the fixing module 11, and then lock the fixing module 11 to limit the rotation of the fixing module 11. The specific locking method can be a limiting pin or other devices capable of limiting.

[0054] The use principle of the protective film peeling device provided in the embodiment will be described below. Figures 1 to 7

[0055] ​The operator will need to peel off the mask 4 of the protective film 5 and place it on the loading platform 1, rotate the fixing module 11 to make the fixing module 11 clamped with the mask 4, then start the heating plate 10 to heat the mask 4, at the same time, based on the size of the protective film 5, the size of the cover plate 2 is adjusted, and after the size adjustment of the cover plate 2 is completed, the cooling pipe 25 power device is started to make the refrigerant flow in the cooling pipe 25, the connecting rod 3 is used to drive the cover plate 2 to move in the direction close to the mask 4 until the cover plate 2 is in contact with the protective film 5, a period of time is kept, in the process, based on the temperature measured by the temperature sensor, the heating power of the heating plate 10 is adjusted or the refrigerant flow in the cooling pipe 25 is adjusted to control the temperature to be in the appropriate range, then the peeling module 22 is inserted between the mask 4 and the protective film 5, the connecting rod 3 is used to drive the steel plate to move in the direction away from the mask 4 until the protective film 5 is completely separated from the surface of the mask 4.

[0056] In another embodiment, the utility model also provides a semiconductor manufacturing equipment, including: platform and as described above protective film stripping device, protective film stripping device is arranged in the inside or outside of platform, is used for stripping the protective film 5 on the mask 4. As an optional embodiment, the protective film stripping device is usually used with the mask protective film's pasting film device, residual glue removal device, particulate matter removal device to ensure that the use performance of the mask 4 is not affected.

[0057] In this way, by using the above protective film stripping device, the temperature of the environment when the protective film 5 is peeled off is controlled by the temperature control module, so that the secondary pollution and the damage to the surface of the mask 4 caused by the softening of the adhesive due to the excessively high temperature are avoided, and the use performance of the mask 4 is ensured not to be affected. At the same time, combined with the telescopic cover plate 2, the application range of the protective film stripping device is widened, and the efficiency of the protective film 5 peeling is improved.

[0058] In summary, in the protective film stripping device and the semiconductor manufacturing equipment provided in the embodiments of the utility model, the protective film stripping device includes a loading platform and a cover plate, the loading platform is used to carry a mask with a protective film, a temperature control module is arranged on the loading platform and / or the cover plate, the temperature control module is used to heat and / or cool the mask and the protective film when the protective film is peeled off, the cover plate is movable in the direction close to or away from the loading platform, and covers the protective film when the temperature control module heats the mask, a peeling module is arranged on the cover plate, the peeling module is clamped with the protective film when the cover plate covers the protective film, so as to drive the protective film to separate from the surface of the mask when the cover plate moves in the direction away from the loading platform, and the cover plate is telescopic in the direction parallel to the protective film to match the size of the protective film.

[0059] Thus, by setting the temperature control module, the temperature of the protective film is heated and / or cooled during the peeling process, which can soften the adhesive by heating to reduce glue residue, and maintain the rigidity of the protective film during the peeling process by cooling the protective film, thereby avoiding secondary pollution and damage to the mask surface caused by high temperature softening. In addition, the cover plate is provided with a peeling module to prevent the mask from being damaged during the peeling process. In addition, the cover plate is telescopic along the direction parallel to the protective film, which can adjust the size of the cover plate according to the size of the protective film, thereby widening the application range of the protective film peeling device, improving the practicability of the protective film peeling device, and reducing the difficulty of peeling different sizes of protective film.

[0060] The above description is only a description of the preferred embodiments of the present application, and is not any limitation on the scope of the present application. Any modification or modification made by a person skilled in the art according to the above disclosure is within the protection scope of the claims.

Claims

1. A protective film peeling device, characterized in that, The application relates to a protective film stripping device. The device comprises a carrier and a cover plate. The carrier is used for carrying a mask with a protective film. A temperature control module is arranged on the carrier and / or the cover plate, and is used for heating and / or cooling the mask and the protective film when the protective film is stripped. The cover plate is movable along a direction close to or away from the carrier, and covers the protective film when the temperature control module heats the mask. The cover plate is provided with a stripping module which is engaged with the protective film when the cover plate covers the protective film, and drives the protective film to separate from the surface of the mask when the cover plate moves along a direction away from the carrier.

2. The protective film peeling apparatus according to claim 1, wherein The cover plate is telescopic along a direction parallel to the protective film, so as to match the size of the protective film. The cover plate comprises a frame body, a slide rail and at least one frame unit. The frame unit is movably nested in the frame body or another frame unit along a direction parallel to the protective film.

3. The protective film peeling apparatus according to claim 2, wherein The slide rail is arranged on the inner wall of the frame body and the frame unit, and is arranged along a direction parallel to the protective film. The frame unit has a retracted position and an extended position. When the frame unit is in the retracted position, it is located in the frame body or another frame unit.

4. The protective film peeling apparatus according to claim 2, wherein When the frame unit is in the extended position, it extends out of the frame body or another frame unit along the slide rail, so as to match the protective film of different sizes.

5. The protective film peeling apparatus according to claim 2, wherein The slide rail is further provided with a locking module which is engaged with the frame unit after the frame unit moves to a position matched with the protective film, so as to lock the frame unit and the slide rail.

6. The protective film peeling apparatus according to claim 1, wherein The temperature control module comprises a cooling pipe which is embedded in the inner wall of the frame unit and the frame body, and is used for flowing refrigerant, so as to contact the protective film and cool the protective film when the cover plate covers the protective film.

7. The protective film peeling apparatus according to claim 6, wherein The temperature control module comprises a heating plate which is arranged in the interior of the carrier, and is used for heating the mask arranged on the carrier.

8. The protective film peeling apparatus according to claim 1, wherein The temperature control module further comprises a temperature sensor which is arranged on the carrier, and is used for detecting the temperature of the surface of the mask.

9. The protective film peeling apparatus according to Claim 1, wherein The protective film stripping device comprises a connecting rod which is connected between the carrier and the cover plate, and is telescopic along a direction close to or away from the carrier.

10. A semiconductor manufacturing apparatus, characterized by comprising: The carrier is further provided with a fixing module which is located on the carrying surface of the carrier, and is matched with the size of the mask, so as to be engaged with the mask when the carrier carries the mask, and to realize fixation. The application further relates to a machine and the protective film stripping device as claimed in any one of claims 1 to 9. The protective film stripping device is arranged in the interior or exterior of the machine, and is used for stripping the protective film on the mask.

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