Disc type motor

By introducing a heat dissipation mechanism into the disc motor, and utilizing the thermal circulation and fan system of the submersible pump and semiconductor heat sink, the problem of insulation layer and winding aging caused by high temperature in the disc motor is solved, achieving effective heat dissipation and improving the motor's operating efficiency and lifespan.

CN223613170UActive Publication Date: 2025-11-28DONGGUAN KUNLIN TECH CO LTD
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Patent Information

Application Number
CN202520238049.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-02-14
Publication Date
2025-11-28
Estimated Expiration
2035-02-14

AI Technical Summary

Technical Problem

When a disc motor operates at high temperatures, the internal insulation layer and winding coils age, affecting its lifespan, and existing technologies have not effectively solved the heat dissipation problem.

Method used

The system employs a heat dissipation mechanism, including a submersible pump, cooling pipes, semiconductor heat sinks, and a cooling fan. It reduces the motor temperature through heat circulation and heat exchange, utilizes the submersible pump to deliver cold water for heat exchange, and further dissipates heat by combining the semiconductor heat sink and fan.

Benefits of technology

It effectively reduces motor temperature, improves operating efficiency, extends motor life, and reduces maintenance costs.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a disc type motor which comprises a disc type motor body and a water storage tank. A heat dissipation mechanism is arranged in the disc type motor body; the heat dissipation mechanism comprises a heat dissipation assembly and a cooling assembly. When the disc type motor works, a cooling fan, a submersible pump and a semiconductor cooling fin are started, firstly, the refrigeration end of the semiconductor cooling fin is attached to a water storage tank, cold water in the water storage tank is cooled during semiconductor refrigeration, and the further cooled cold water is conveyed to a cooling pipe through the submersible pump; cold water in the cooling pipe is heated by heat in the disc type motor body, so that heat conversion is realized, the further heated cold water enters the water storage tank through the water return pipe and continues to be cooled through the semiconductor cooling fins, heat generated when the disc type motor body works is dissipated, and the service life of the disc type motor is prolonged. The working temperature of the disc type motor is reduced through heat dissipation, the operation efficiency of the disc type motor is improved, the service life of the motor can be prolonged, the reliability is improved, and the maintenance cost is reduced.
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Description

TECHNICAL FIELD

[0001] The utility model relates to motor technical field, concretely is a disc type motor. BACKGROUND

[0002] Disc type motor is a special type of motor, adopts disc shape structure design, usually with a disc shape rotor and stator relative rotation, compared with traditional axial or radial motor, disc type motor has unique structural advantage, is widely used in some volume, efficiency or drive mode has special requirement field.

[0003] The structure of disc type motor is similar to traditional motor, is mainly composed of stator, rotor and electromagnetic coil.But its difference lies in, the rotor of disc type motor is usually disc shape, and the magnetic force line between stator and rotor is radial distribution.Working principle is same with other motor, is based on electromagnetic induction principle, and when current flows through motor coil, will produce rotating torque in magnetic field, thereby makes rotor rotate, when disc type motor works, current through coil produces heat, will lead to disc type motor internal temperature rise, when disc type motor internal temperature rises, will make disc type motor energy efficiency drop, and disc type motor is in high temperature state under long time operation, will lead to the problem of aging of motor internal insulation layer and winding coil etc., further influence disc type motor life, for this purpose, we propose a disc type motor with heat dissipation function to solve the above problems. SUMMARY

[0004] In view of the defects of prior art, the utility model provides a disc type motor, has the advantages that the heat generated during the operation of the disc type motor can be effectively dissipated, and the problem that the high temperature in the disc type motor causes the aging of the internal insulation layer and winding coil of the disc type motor and affects the service life of the disc type motor is solved.

[0005] To achieve the above object, the utility model provides the following technical scheme: a disc type motor, comprising a disc type motor body and a water storage tank.

[0006] The disc type motor body is provided with a heat dissipation mechanism;

[0007] The heat dissipation mechanism comprises a heat dissipation assembly and a cooling assembly.

[0008] The heat dissipation assembly comprises a submersible pump fixed to the bottom surface of the inner cavity of the water storage tank, the water outlet end of the submersible pump is communicated with a water inlet pipe, the other end of the water inlet pipe is communicated with a cooling pipe in the shape of a snake, and the other end of the cooling pipe is communicated with a water return pipe.

[0009] Further, the other end of the water return pipe is communicated with the water storage tank, and the cooling pipe is located inside the disc type motor body.

[0010] Further, a water supplement pipe is communicated with the right end of the water storage tank close to the top end, and a water drainage pipe is communicated with the right end of the water storage tank close to the bottom end, and the outer surfaces of the water supplement pipe and the water drainage pipe are sleeved with control valves.

[0011] Further, the cooling assembly comprises a heat-conducting copper sheet fixed to the bottom surface of the water storage tank, a semiconductor heat sink is fixed to the bottom surface of the heat-conducting copper sheet, a plurality of heat dissipation fins are fixed to the bottom end of the semiconductor heat sink, and a heat dissipation fan is fixed to the bottom surface of the semiconductor heat sink.

[0012] Further, the refrigeration end of the semiconductor heat sink is attached to the heat-conducting copper sheet, and the heat dissipation end of the semiconductor heat sink corresponds to the heat dissipation fan.

[0013] Compared with the prior art, the technical scheme has the following beneficial effects:

[0014] The disc motor, in operation, starts the heat dissipation fan, the submersible pump and the semiconductor heat sink, the refrigeration end of the semiconductor heat sink is attached to the water storage tank, and the cold water in the water storage tank is cooled in the semiconductor refrigeration, the further cooled cold water is delivered to the cooling pipe by the submersible pump, the cold water in the cooling pipe is heated by the heat in the disc motor body, thereby realizing heat conversion, the further heated cold water enters the water storage tank through the water return pipe and is cooled by the semiconductor heat sink, thereby realizing heat dissipation of the heat generated by the disc motor body in operation, reducing the working temperature of the disc motor by heat dissipation, helping to improve the operation efficiency, prolonging the service life of the motor, improving the reliability, and reducing the maintenance cost. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a structure schematic view of the whole utility model;

[0016] Figure 2 It is a structure schematic view of the disc motor body inside;

[0017] Figure 3 It is a structure schematic view of the bottom surface.

[0018] In the figure: 1, disc motor body; 2, water storage tank; 3, submersible pump; 4, water inlet pipe; 5, cooling pipe; 6, water return pipe; 7, heat-conducting copper sheet; 8, semiconductor heat sink; 9, heat dissipation fin; 10, heat dissipation fan; 11, water supplement pipe; 12, water drainage pipe. DETAILED DESCRIPTION

[0019] With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.

[0020] Please refer to Figure 1 and Figure 2 In order to dissipate heat from the disc motor body 1, the disc motor in the embodiment comprises a disc motor body 1 and a water storage tank 2; the disc motor body 1 is provided with a heat dissipation mechanism; wherein the heat dissipation mechanism comprises a heat dissipation assembly and a cooling assembly; the heat dissipation assembly comprises a submersible pump 3 fixed on the bottom surface of the inner cavity of the water storage tank 2, the water outlet end of the submersible pump 3 is communicated with a water inlet pipe 4, the other end of the water inlet pipe 4 is communicated with a cooling pipe 5 in the shape of a snake, the cooling pipe 5 is located inside the disc motor body 1, the other end of the cooling pipe 5 is communicated with a water return pipe 6, and the other end of the water return pipe 6 is communicated with the water storage tank 2.

[0021] When it is necessary to dissipate heat generated by the disc motor body 1, the submersible pump 3 is first started, the submersible pump 3 will deliver cold water in the water storage tank 2 to the water inlet pipe 4, the cold water in the water inlet pipe 4 will further enter the cooling pipe 5, when the cold water enters the cooling pipe 5, the heat emitted by the disc motor body 1 will heat the cold water in the cooling pipe 5, the further heated cold water will be re-delivered to the water storage tank 2 through the water return pipe 6, thereby achieving the purpose of heat circulation, so as to achieve the purpose of dissipating heat in the disc motor body 1.

[0022] In order to replenish water or drain water in the water storage tank 2, a water replenishing pipe 11 is communicated with the right end of the water storage tank 2 close to the top end, a water draining pipe 12 is communicated with the right end of the water storage tank 2 close to the bottom end, and control valves are sleeved on the outer surfaces of the water replenishing pipe 11 and the water draining pipe 12.

[0023] Please refer to Figure 3 In order to cool the water in the water storage tank 2, the cooling assembly in the embodiment comprises a heat-conducting copper sheet 7 fixed on the bottom surface of the water storage tank 2, a semiconductor heat sink 8 fixed on the bottom surface of the heat-conducting copper sheet 7, a refrigeration end of the semiconductor heat sink 8 being attached to the heat-conducting copper sheet 7, a plurality of heat dissipation fins 9 fixed on the bottom end of the semiconductor heat sink 8, a heat dissipation fan 10 fixed on the bottom surface of the semiconductor heat sink 8, and a heat dissipation end of the semiconductor heat sink 8 corresponding to the heat dissipation fan 10.

[0024] When the heated water in the backwater pipe 6 is delivered into the water storage tank 2, firstly, by starting the semiconductor heat sink 8, the refrigeration end of the semiconductor heat sink 8 will deliver cold air into the water storage tank 2 through the heat-conducting copper sheet 7, so as to further cool the heated water in the water storage tank 2, and the heat conversion end of the semiconductor heat sink 8 will lead out heat, the heat emitted by the semiconductor heat sink 8 is led out by the plurality of heat dissipation fins 9, at the same time, by starting the heat dissipation fan 10, the heat emitted by the semiconductor heat sink 8 can be further blown away, so as to achieve the purpose of dissipating the heat emitted by the semiconductor heat sink 8.

[0025] Although the embodiments of the present application have been shown and described, it is to be understood that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A disc-type electric machine characterized by: The disc motor body (1) and the water storage tank (2) are included. The disc motor body (1) is internally provided with a heat dissipation mechanism. The heat dissipation mechanism includes a heat dissipation assembly and a cooling assembly. The heat dissipation assembly includes a submersible pump (3) fixed to the bottom surface of the inner cavity of the water storage tank (2), the water outlet end of the submersible pump (3) is communicated with a water inlet pipe (4), the other end of the water inlet pipe (4) is communicated with a cooling pipe (5) in a serpentine shape, and the other end of the cooling pipe (5) is communicated with a water return pipe (6).

2. A disc machine according to claim 1, characterised in that: The other end of the water return pipe (6) is communicated with the water storage tank (2), and the cooling pipe (5) is located inside the disc motor body (1).

3. A disc machine according to claim 1, characterized in that: The right end of the water storage tank (2) near the top end is communicated with a water supplement pipe (11), and the right end of the water storage tank (2) near the bottom end is communicated with a drain pipe (12), and the outer surfaces of the water supplement pipe (11) and the drain pipe (12) are sleeved with control valves.

4. A disc machine according to claim 1, characterized in that: The cooling assembly includes a heat-conducting copper sheet (7) fixed to the bottom surface of the water storage tank (2), the bottom surface of the heat-conducting copper sheet (7) is fixed with a semiconductor heat sink (8), the bottom end of the semiconductor heat sink (8) is fixed with a plurality of heat dissipation fins (9), and the bottom surface of the semiconductor heat sink (8) is fixed with a heat dissipation fan (10).

5. A disc machine according to claim 1, characterized in that: The refrigeration end of the semiconductor heat sink (8) is attached to the heat-conducting copper sheet (7), and the heat dissipation end of the semiconductor heat sink (8) corresponds to the heat dissipation fan (10).