Dual-mode communication chip module

Abstract

The utility model discloses a dual-mode communication chip module which comprises a substrate, a wired communication module, a wireless communication module, a microprocessor, a memory, a power management chip, a rubber support column and a damping connection point, the wired communication module is welded on the left side of the top of the substrate, and the wireless communication module is welded on the right side of the top of the substrate. The microprocessor is welded to the left side of the front end of the top of the substrate, the memory is welded to the center of the front end of the top of the substrate, the power management chip is welded to the right side of the front end of the top of the substrate, the three rubber supporting columns are equidistantly connected to the top of the substrate through glue, and the four damping connecting points are equidistantly formed in the four vertex angles of the substrate. According to the utility model, the design structure of the existing dual-mode communication chip module is improved, the shock resistance of the chip module is improved, the influence of impact force on the circuit board is reduced to the greatest extent after the chip module is impacted, and the normal work of each element is further ensured.

Description

TECHNICAL FIELD

[0001] The utility model relates to a kind of dual-mode communication chip module. BACKGROUND

[0002] Communication chip module is the component that can realize communication function, it is based on chip, and it is the standard piece after customizing and integrating for specific industry demand, it is usually constituted by main chip, microprocessor, memory, power chip and functional interface etc., is installed in terminal equipment inside, as the core component of communication with external network.

[0003] The dual-mode communication chip module currently used does not have shock absorption function, and internal components are easily damaged or malfunctioned when receiving some impact, affecting equipment use. UTILITY MODEL CONTENT

[0004] The utility model aims at providing a kind of dual-mode communication chip module to solve the above technical problem.

[0005] To achieve the above object, the utility model adopts the following technical scheme:

[0006] A kind of dual-mode communication chip module, including substrate, wired communication module, wireless communication module, microprocessor, memory, power management chip, rubber support column, shock absorption connecting point, the wired communication module is welded on the left side of substrate top, the wireless communication module is welded in substrate top right side, the microprocessor is welded in substrate top front end left side, the memory is welded in substrate top front end center, the power management chip is welded in substrate top front end right side, three the rubber support column is equidistantly glued in substrate top, four the shock absorption connecting point is equidistantly opened in substrate four top corners.

[0007] On the basis of the above technical scheme, the shock absorption connecting point includes composite outer frame, rubber ring, screw pipe, the rubber ring is fixedly connected in the inside of composite outer frame, and the screw pipe is fixedly connected at the center of rubber ring.

[0008] On the basis of the above technical scheme, the composite outer frame includes polypropylene outer layer, polycarbonate structure layer, TPE contact layer and rubber ring groove, the polycarbonate structure layer is distributed below the polypropylene outer layer, the TPE contact layer is distributed below the polycarbonate structure layer, and the rubber ring groove is arranged outside the center of the TPE contact layer.

[0009] Compared with the prior art, the utility model has the following advantages: the utility model improves the design structure of the existing dual-mode communication chip module, improves the shock resistance of the chip module, minimizes the impact of impact force on the circuit board after receiving impact, and further ensures the normal work of each component. BRIEF DESCRIPTION OF DRAWINGS

[0010] Fig. 1 It is the appearance structure schematic view of the utility model.

[0011] Fig. 2 It is the damping connection point structure schematic view of the utility model.

[0012] Fig. 3 It is the composite outer frame structure schematic view of the utility model.

[0013] In the drawing: 1. base plate, 2. wired communication module, 3. wireless communication module, 4. microprocessor, 5. memory, 6. power management chip, 7. rubber support column, 8. damping connection point, 9. composite outer frame, 10. rubber ring, 11. spiral tube, 12. polypropylene outer layer, 13. polycarbonate structure layer, 14. TPE contact layer, 15. rubber ring groove. DETAILED DESCRIPTION

[0014] The utility model will be further described in detail below in combination with the drawings and specific embodiments.

[0015] As Figs. 1-3 Indicated, a kind of dual-mode communication chip module, including base plate 1, wired communication module 2, wireless communication module 3, microprocessor 4, memory 5, power management chip 6, rubber support column 7, damping connection point 8, the wired communication module 2 is welded in base plate 1 top left side, the wireless communication module 3 is welded in base plate 1 top right side, the microprocessor 4 is welded in base plate 1 top front end left side, the memory 5 is welded in base plate 1 top front end center, the power management chip 6 is welded in base plate 1 top front end right side, three described rubber support column 7 equidistantly glue connection in base plate 1 top, four described damping connection points 8 equidistantly open in base plate 1 four top corners.

[0016] The damping connection point 8 includes composite outer frame 9, rubber ring 10, spiral tube 11, the rubber ring 10 is fixedly connected inside the composite outer frame 9, the spiral tube 11 is fixedly connected at rubber ring 10 center.

[0017] The composite outer frame 9 includes polypropylene outer layer 12, polycarbonate structure layer 13, TPE contact layer 14, rubber ring groove 15, polypropylene outer layer 12 is distributed with polycarbonate structure layer 13 below, TPE contact layer 14 is distributed below polycarbonate structure layer 13, rubber ring groove 15 is set up in TPE contact layer 14 center outside.

[0018] The utility model discloses a working principle: the circuit board surface of this novel is provided with three rubber support columns, can be installed in the terminal when top in the shell and circuit board between, and four shock attenuation connecting points utilize the screw pipe and screw bolt connection in the shell inside. When the impact occurs, the impact force is transmitted to the rubber support column and the shock attenuation connecting point of shell, and a part of external force is absorbed by the physical property of rubber support, and another part is absorbed through the multilayer structure of rubber ring and composite outer frame, and the influence of the impact force on the circuit board is reduced to the maximum extent.

[0019] The above is the preferred embodiment of the utility model, and for the ordinary skilled person in the art, according to the teaching of the utility model, the change, modification, replacement and variation of the embodiment without departing from the principle and spirit of the utility model still fall within the protection scope of the utility model.

Claims

1. A dual-mode communication chip module, comprising a substrate (1), a wired communication module (2), a wireless communication module (3), a microprocessor (4), a memory (5), a power management chip (6), a rubber support column (7), and a shock-absorbing connection point (8), characterized in that: The wired communication module (2) is welded on the top left side of the substrate (1), the wireless communication module (3) is welded on the top right side of the substrate (1), the microprocessor (4) is welded on the top front left side of the substrate (1), the memory (5) is welded on the top front center of the substrate (1), the power management chip (6) is welded on the top front right side of the substrate (1), three rubber support columns (7) are equidistantly connected on the top of the substrate (1), and four damping connection points (8) are equidistantly arranged at the four top corners of the substrate (1).

2. The dual-mode communication chip module of claim 1, wherein: The damping connection point (8) comprises a composite outer frame (9), a rubber ring (10) and a spiral pipe (11), the rubber ring (10) is fixedly connected in the composite outer frame (9), and the spiral pipe (11) is fixedly connected at the center of the rubber ring (10).

3. The dual-mode communication chip module of claim 2, wherein: The composite outer frame (9) comprises a polypropylene outer layer (12), a polycarbonate structure layer (13), a TPE contact layer (14) and a rubber ring groove (15), the polycarbonate structure layer (13) is arranged below the polypropylene outer layer (12), the TPE contact layer (14) is arranged below the polycarbonate structure layer (13), and the rubber ring groove (15) is arranged outside the center of the TPE contact layer (14).

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