Power device heat dissipation structure for switching power supply

Abstract

The utility model relates to a power device heat dissipation structure for a switching power supply, which belongs to the field of switching power supplies and comprises a metal outer shell of the switching power supply, the metal outer shell is composed of an outer shell base, a heat conduction silica gel sheet and a side cover, and a first metal pressing plate is arranged in the outer shell base. A first printed circuit board assembly is arranged on the inner side of the shell base, and a first screw is in threaded connection with the interior of the shell base. According to the power device heat dissipation structure used by the switching power supply, heat of the power element is transmitted to the metal shell, so that the situations that air in the power supply does not flow, heat accumulation is easily caused, overheating protection of the switching power supply is possibly caused, and even damage is caused by long-term overheating operation are reduced; the heat dissipation effect of the power element is improved, the service life of the power element is prolonged, the device does not need to be subjected to high-requirement process parameter control, mounting and dismounting are convenient, subsequent maintenance and repair are facilitated, and the use convenience of the device is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of switching power supply, concretely is a kind of power device heat dissipation structure for switching power supply. BACKGROUND

[0002] Switching power supply is a kind of power conversion device using modern power electronics technology, through the time ratio of control switch tube opening and shutting, maintain stable output voltage, with signal power module size is more and more small, and module power is more and more big, its power device will generate very large heat when working, thus need to carry out heat dissipation treatment to power piece.

[0003] Please refer to the announcement number CN107295791A, a kind of heat dissipation method for switching power supply, the patent discloses "heat dissipation method for switching power supply", it is adjusted air volume according to temperature rise variation by fan as heat dissipation device, however this mode has defect, fan heat dissipation itself has the risk of failure, in long time running process, its bearing can appear abrasion, motor can also occur failure etc., once fan fails, not only will influence the work of power supply, seriously it can also lead to heat accumulation, so that the equipment connected with it appears failure shutdown, use fan also can bring noise and dust problem, with the elapse of time, dust in the surrounding air can be sucked into fan, constantly accumulated and covered on the surface of electronic component, this can influence the heat dissipation performance of component, even possibly cause short circuit etc. Electrical fault, affect the quality of power device heat dissipation for switching power supply, and another technical scheme is proposed to solve the technical problem in view of the problem. UTILITY MODEL CONTENTS

[0004] In view of the deficiencies of prior art, the utility model provides a kind of power device heat dissipation structure for switching power supply, with the advantages of convenient installation high thermal conductivity, solve the problem that fan heat dissipation exists self-failure risk, and noise and dust are generated when fan high-speed operation, affect the use effect and heat dissipation efficiency of power device for switching power supply.

[0005] To achieve the above object, the utility model provides the following technical scheme: a kind of power device heat dissipation structure for switching power supply, including the metal outer shell of switching power supply, metal outer shell is composed of shell base, heat-conducting silica gel sheet, side cover;

[0006] The inside of the shell base is provided with a first metal pressing plate, the inner side of the shell base is provided with a first printed circuit board assembly, the inside of the shell base is threadedly connected with a first screw, and the side surface of the first printed circuit board assembly is pasted with insulating silica gel cloth;

[0007] The inner wall of the shell base is provided with a second metal pressing plate, the side of the shell base is inserted with a second screw, the inside of the shell base is provided with a second printed circuit board assembly, the inside of the second printed circuit board assembly is movably installed with a fourth screw and a third screw, the side of the second printed circuit board assembly is provided with a third metal pressing plate, and the bottom of the first metal pressing plate is movably installed with a fourth metal pressing plate.

[0008] Further, the inner side bottom of the shell base is convex, and a heat-conducting silica gel sheet is attached to the convex portion, and the bottom area of the heating element on the first printed circuit board assembly corresponds to the convex portion.

[0009] Further, the inside of the shell base is provided with a draft angle, the two ends of the first metal pressing plate are provided with a draft angle matched with the inside area of the shell base, and a bending angle is arranged, the number of the insulating silica gel cloths is several, and the size and thickness of the insulating silica gel cloths are completely same.

[0010] Further, the side of the shell base is provided with an opening, the second metal pressing plate is provided with a first threaded hole, the second screw fixes the second metal pressing plate to one side of the inner wall of the shell base through the opening and the first threaded hole, and the screw hole on the second metal pressing plate is aligned with the opening on the side of the shell base.

[0011] Further, the first printed circuit board assembly and the second printed circuit board assembly constitute a switching power supply, and the first printed circuit board assembly and the second printed circuit board assembly are arranged and installed perpendicularly at 90 degrees.

[0012] Further, the shell base is provided with a waist-shaped hole, the second printed circuit board assembly is provided with a mounting hole in the inside, the third metal pressing plate is provided with a second threaded hole in the middle, the fourth screw penetrates to the outside of the second printed circuit board assembly through the waist-shaped hole and the mounting hole, and is connected with the third metal pressing plate through the second threaded hole.

[0013] Further, the first metal pressing plate is provided with two extension holes in the middle, and the fourth screw is installed into the two press-in nuts of the fourth metal pressing plate through the extension holes.

[0014] Further, the side of the shell base is provided with three through holes, the side of the first metal pressing plate is provided with three nut holes, and the second screw fixes the assembly composed of the first metal pressing plate and the fourth metal pressing plate in the inside of the shell base through the through holes and the nut holes.

[0015] Compared with the prior art, the technical scheme of the present application has the following beneficial effects:

[0016] The power device heat dissipation structure of the utility model is used for the switch power supply, through transmitting the heat of the power element to the metal shell, reducing the air in the switch power supply, which is easy to cause heat accumulation and may cause the switch power supply to overheat and even be damaged due to long-term overheating operation, improving the heat dissipation effect and service life of the power element, and the device does not need to control the process parameters with high requirements, is convenient to install and disassemble, and is convenient for subsequent maintenance and repair, improving the convenience of using the device. BRIEF DESCRIPTION OF DRAWINGS

[0017] Fig. 1 It is a structural schematic diagram of the utility model;

[0018] Fig. 2 It is a first printed circuit board assembly and shell base structure installation perspective view of the utility model;

[0019] Fig. 3 It is a first printed circuit board assembly, a first metal pressing plate and a shell base structure installation fixing view of the utility model;

[0020] Fig. 4 It is a second printed circuit board assembly and shell base structure perspective view of the utility model;

[0021] Fig. 5 It is a first printed circuit board assembly part heat generating device upper surface paste heat-conducting silica gel piece structure schematic diagram of the utility model;

[0022] Fig. 6 It is a metal shell body structure perspective view of the utility model.

[0023] In the drawing: 1, shell base; 2, first metal pressing plate; 3, heat-conducting silica gel piece; 4, side cover; 5, first screw; 6, insulating silica gel cloth; 7, first printed circuit board assembly; 8, second metal pressing plate; 9, second screw; 10, third metal pressing plate; 11, third screw; 12, fourth screw; 13, second printed circuit board assembly; 14, fourth metal pressing plate. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the utility model will be clearly and completely described in combination with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0025] Please refer to Figs. 1 to 6 A power device heat dissipation structure of the utility model is used for the switch power supply, comprising a metal shell body of the switch power supply, which is composed of a shell base 1, a heat-conducting silica gel piece 3 and a side cover 4.

[0026] It should be noted that the inside of the shell base 1 is provided with a draft angle, which facilitates the demolding of the aluminum alloy die-casting mold during the production of the metal shell, and the heat-conducting silica gel sheet 3 can fill the gap, open the heat exchange channel between the heating element and the metal shell, effectively improve the heat transfer efficiency, and also play the role of insulation, shock absorption, sealing, etc.

[0027] The inside bottom of the shell base 1 is convex, and the convex part is pasted with a heat-conducting silica gel sheet 3. The bottom area of the heating element on the first printed circuit board assembly 7 corresponds to the convex shape.

[0028] Embodiment one: please refer to Fig. 1 and Fig. 2 The inside of the shell base 1 is provided with a first metal pressing plate 2, and the two ends of the first metal pressing plate 2 are provided with a bending angle matched with the draft angle of the inside area of the shell base 1. The inside of the shell base 1 is provided with a first printed circuit board assembly 7, and the inside of the shell base 1 is threadedly connected with a first screw 5.

[0029] The side of the first printed circuit board assembly 7 is pasted with an insulating silica cloth 6, and the number of the insulating silica cloth 6 is several, and the size and thickness of the insulating silica cloth 6 are completely the same. Specifically, the field effect tube and the fast recovery diode on the first printed circuit board assembly 7 adopt the same packaging form.

[0030] Among them, on the side of the first printed circuit board assembly 7, there are three areas that need to be pasted with heat-conducting and insulating materials. First, the side of the energy storage magnetic ring inductor needs to be pasted with a heat-conducting silica gel sheet 3; second, the side of the field effect tube and the fast recovery diode needs to be pasted with an insulating silica cloth 6; third, the side of the rectifier bridge stack needs to be pasted with a heat-conducting silica gel sheet 3.

[0031] Specifically, a heat-conducting silica gel sheet 3 is pasted on the upper surface of the internal heating element of the switching power supply, and then a first metal pressing plate 2 connected with the shell base is tightly pressed above the heat-conducting silica gel sheet 3, so as to achieve heat conduction of the heating element to the surface of the shell, and then transfer heat through the convection of the shell surface and the surrounding air, so as to achieve the purpose of heat dissipation of the power device used by the switching power supply.

[0032] The inner wall of the shell base 1 is provided with a second metal pressing plate 8, the second metal pressing plate 8 is in contact with the side of the heating element, the side of the shell base 1 is inserted with a second screw 9, the side of the shell base 1 is provided with an opening, the second metal pressing plate 8 is provided with a first threaded hole, and the second screw 9 fixes the second metal pressing plate 8 to one side of the inner wall of the shell base 1 through the opening and the first threaded hole.

[0033] The convex part formed by the side bending is put into the two positioning holes of the shell base 1, the screw hole on the second metal pressing plate 8 is aligned with the side opening of the shell base 1, and three components can be fixed at one time.

[0034] The inside of the shell base 1 is provided with a second printed circuit board assembly 13, the first printed circuit board assembly 7 and the second printed circuit board assembly 13 constitute a switching power supply, the first printed circuit board assembly 7 and the second printed circuit board assembly 13 are arranged vertically at 90 degrees, and are connected together through a group of 90-degree vertical board-to-board connectors.

[0035] Embodiment two: please refer to Figs. 3 to 6 The inside of the second printed circuit board assembly 13 is movably provided with a fourth screw 12 and a third screw 11, and the side of the second printed circuit board assembly 13 is provided with a third metal pressing plate 10. Specifically, the fourth screw 12 is used to fix the second printed circuit board assembly 13 and the shell base 1 together.

[0036] The shell base 1 is provided with a waist-shaped hole, the second printed circuit board assembly 13 is provided with a mounting hole, and the third metal pressing plate 10 is provided with a second threaded hole in the middle. The fourth screw 12 penetrates the waist-shaped hole and the mounting hole to the outside of the second printed circuit board assembly 13, and is connected with the third metal pressing plate 10 through the second threaded hole.

[0037] The bottom of the first metal pressing plate 2 is movably provided with a fourth metal pressing plate 14, and the middle of the first metal pressing plate 2 is provided with two extension holes. The fourth screw 12 is installed into the two pressing nuts of the fourth metal pressing plate 14 through the extension holes.

[0038] The side of the shell base 1 is provided with three through holes, and the side of the first metal pressing plate 2 is provided with three nut holes. The second screw 9 is used to fix the assembly composed of the first metal pressing plate 2 and the fourth metal pressing plate 14 in the inside of the shell base 1 through the through holes and the nut holes.

[0039] It should be noted that by transferring the heat of the power element to the metal shell 1, the air flow inside the power supply is reduced, which is easy to cause heat accumulation and may cause the switching power supply itself to overheat and even be damaged due to long-term overheating operation. The heat dissipation effect and service life of the power element are improved.

[0040] Specifically, the position of the first metal pressing plate 2 is adjusted appropriately, so that the second screw 9 penetrates the three through holes on the side of the shell base 1, and the assembly composed of the first metal pressing plate 2 and the fourth metal pressing plate 14 is connected with the shell base 1, so that the heat generated by the heating element during operation can be conducted to the shell base 1 through the metal pressing plate, thereby being dissipated.

[0041] The working principle of the above embodiment is as follows:

[0042] The power device heat dissipation structure used by the switching power supply is that the first printed circuit board assembly 7 is fixed on the shell base 1 through the first screw 5, then the heat-conducting silica gel sheet 3 is pasted on the side of the energy storage magnetic ring inductor and the rectifier bridge stack, the insulating silica gel cloth 6 is pasted on the side of the field effect tube and the fast recovery diode, the second metal pressing plate 8 is in contact with the side of the heat generating element, and is fixed on the inner wall of the shell base 1 through the second screw 9, then the second printed circuit board assembly 13 is fixed together with the shell base 1 through the fourth screw 12, and the third metal pressing plate 10 is fixed on the second printed circuit board assembly 13 through the third screw 11;

[0043] The heat-conducting silica grease is smeared on the mutually adhering surfaces of the first metal pressing plate 2 and the fourth metal pressing plate 14, then the first metal pressing plate 2 and the fourth metal pressing plate 14 are connected and installed through the fourth screw 12, the heat-conducting silica grease is smeared on the area outside the bending area of the first metal pressing plate 2 and the fourth metal pressing plate 14 and adhering to the shell base 1, then the metal pressing plate assembly is clamped into the shell base 1 downwards, the position of the first metal pressing plate 2 is adjusted appropriately, so that the second screw 9 passes through the three through holes on the side of the shell base 1, and the assembly composed of the first metal pressing plate 2 and the fourth metal pressing plate 14 is connected with the shell base 1.

[0044] It should be noted that, in the present document, relational terms such as first and second and the like can be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by "comprises... a" does not, without more constraints, exclude the presence of additional identical elements in the process, method, article, or apparatus that comprises the element.

[0045] Although the embodiments of the present application have been shown and described, it is to be understood that various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A power device heat dissipation structure for use in a switching power supply, comprising a metal outer housing of the switching power supply, characterized in that: Metal outer shell body is composed of shell base (1), heat-conducting silica gel sheet (3), side cover (4); The inside of the shell base (1) is provided with a first metal pressing plate (2), the inner side of the shell base (1) is provided with a first printed circuit board assembly (7), the inside of the shell base (1) is threadedly connected with a first screw (5), and the side of the first printed circuit board assembly (7) is pasted with insulating silica gel cloth (6); The inner wall of the shell base (1) is provided with a second metal pressing plate (8), the side of the shell base (1) is inserted with a second screw (9), the inside of the shell base (1) is provided with a second printed circuit board assembly (13), the inside of the second printed circuit board assembly (13) is movably mounted with a fourth screw (12) and a third screw (11), the side of the second printed circuit board assembly (13) is provided with a third metal pressing plate (10), and the bottom of the first metal pressing plate (2) is movably mounted with a fourth metal pressing plate (14).

2. The power device heat dissipation structure for use in a switching power supply according to claim 1, wherein: The inner side bottom of the shell base (1) is convex, and the convex part is pasted with a heat-conducting silica gel sheet (3), and the bottom area of the heating element on the first printed circuit board assembly (7) corresponds to the convex part.

3. The power device heat dissipation structure for use in a switching power supply according to claim 1, wherein: The inside of the shell base (1) is provided with a draft angle, both ends of the first metal pressing plate (2) are matched with the draft angle of the inside area of the shell base (1) and are provided with a bending angle, the number of the insulating silica gel cloth (6) is several, and the size and thickness of the insulating silica gel cloth (6) are completely same.

4. The power device heat dissipation structure for use in a switching power supply according to claim 1, wherein: The side of the shell base (1) is provided with an opening, the second metal pressing plate (8) is provided with a first threaded hole, the second metal pressing plate (8) is fixed to the inner wall of the shell base (1) through the opening and the first threaded hole, and the screw hole on the second metal pressing plate (8) is aligned with the opposite position of the side opening of the shell base (1).

5. The power device heat dissipation structure for use in a switching power supply according to claim 1, wherein: The first printed circuit board assembly (7) and the second printed circuit board assembly (13) constitute a switching power supply, and the first printed circuit board assembly (7) and the second printed circuit board assembly (13) are arranged and installed perpendicularly at ninety degrees.

6. The power device heat dissipation structure for use in a switching power supply according to claim 1, wherein: The shell base (1) is provided with a waist-shaped hole, the second printed circuit board assembly (13) is provided with a mounting hole in the inside, the third metal pressing plate (10) is provided with a second threaded hole in the middle, the fourth screw (12) penetrates to the outside of the second printed circuit board assembly (13) through the waist-shaped hole and the mounting hole, and is connected with the third metal pressing plate (10) through the second threaded hole.

7. The power device heat dissipation structure for use in a switching power supply according to claim 1, wherein: The middle of the first metal pressing plate (2) is provided with two extension holes, and the fourth screw (12) is installed into the two press-in nuts of the fourth metal pressing plate (14) through the extension holes.

8. The power device heat dissipation structure for use in a switching power supply according to claim 1, wherein: The side of the shell base (1) is provided with three through holes, the side of the first metal pressing plate (2) is provided with three nut holes, and the second screw (9) fixes the assembly composed of the first metal pressing plate (2) and the fourth metal pressing plate (14) in the inside of the shell base (1) through the through holes and the nut holes.

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