Universal case for quantum communication equipment

By designing a universal chassis structure in quantum communication devices with the main control board and optical modules arranged vertically and cooled by side fans, the problems of large device size and poor heat dissipation are solved, achieving miniaturization and ease of use, and adapting to the needs of different products.

CN223613710UActive Publication Date: 2025-11-28QUANTUMCTEK CO LTD
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Patent Information

Application Number
CN202423196478.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-23
Publication Date
2025-11-28
Estimated Expiration
2034-12-23

AI Technical Summary

Technical Problem

Existing electronic communication devices suffer from problems such as large size, poor heat dissipation, and poor usability.

Method used

Design a universal chassis for quantum communication equipment. The main control board module and optical module are arranged vertically, and the fan modules are located on both sides for heat dissipation. The internal space of the chassis is rationally distributed, and the fan and power supply modules are hot-swappable for easy maintenance and replacement.

Benefits of technology

It achieves small device size, good heat dissipation, high ease of use, compatibility with different products, convenient maintenance and replacement, and conforms to industry standards.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a universal case for quantum communication equipment. The universal case comprises a main control board module, an optical module, a front panel, a fan module, a power supply module and a case platform, the front panel is connected with the front side face of the case platform, and the power module is located in the case platform and detachably connected with the rear side face of the case platform. The main control board module and the optical module are arranged along the vertical direction and are connected in the case platform; the fan modules are located in the case platform and located on the two sides of the optical module, and the fan modules are detachably connected with the case platform. The LED lamp has the advantages of being reasonable in space distribution, good in heat dissipation effect and convenient to disassemble and assemble.
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Description

TECHNICAL FIELD

[0001] The utility model belongs to quantum communication technical field, especially relates to a quantum communication equipment general machine case. BACKGROUND

[0002] With the rapid development of quantum communication technology, quantum communication technology gradually becomes a mature application technology. This technology is based on the cloning theorem and the uncertainty principle of quantum, theoretically has super high security, and can be applied in high security level. The existing quantum communication technology is mainly realized through quantum key distribution (QKD) sending equipment and receiving equipment.

[0003] The person skilled in the art finds the following problems when using the above-mentioned QKD transceiver equipment:

[0004] At present, with the gradual maturity of technology and products, the quantum communication industry has entered the promotion stage of product application, but compared with the widely used traditional cryptographic products, the quantum communication equipment still has problems such as large product volume, high cost, low reliability, poor heat dissipation performance, poor ease of use, etc. The market expects to launch more economical, high-reliability, miniaturized, modularized, and easy-to-use terminal QKD products to better meet user needs.

[0005] Patent No. 202022870868.0, a kind of quantum key transmitter integrated system, the integrated system includes integrated shell, quantum encoding module, flat cable module, light source module, photodiode integrated detection module, main control circuit board;Integrated shell includes first box body and second box body, first box body and second box body are integrally formed;Flat cable module includes first flat cable module and second flat cable module;Quantum encoding module is placed in second box body, first flat cable module is placed in first box body;Main control circuit board is fixed below integrated shell, light source module, photodiode integrated detection module and second flat cable module are fixed on main control circuit board and located between integrated shell and main control circuit board. In the prior art, the electronic main control board and the optical structure are divided into two layers, so that the system volume is small, but the equipment heat dissipation performance is poor, cannot be installed on the standard cabinet, so that the whole machine is poor in ease of use, and it is more complicated when disassembling, repairing or assembling.

[0006] The information disclosed in this BACKGROUND section is only intended to increase an understanding of the general background of the application and is not intended to be a recognition or an implication that this information forms a prior art that is already known in the art. CONTENT OF THE UTILITY MODEL

[0007] The technical problem to be solved by the utility model is how to solve the problems of large volume, poor heat dissipation and poor ease of use of the current quantum communication equipment.

[0008] The utility model discloses through following technical means realizes the technical problem of solving above-mentioned:

[0009] A quantum communication equipment universal case, including main control board module, optical module, front panel, fan module, power module, case platform, the front panel is connected the front side of case platform, the power module is located in the case platform is with the detachable connection of the rear side of case platform, main control board module and optical module are connected in the case platform along the vertical direction arrangement, fan module is located in the case platform and is located the both sides of optical module, and the fan module is detachable with the connection of case platform.

[0010] The utility model discloses through the main control board module with the optical module along the vertical direction arrangement, makes quantum communication equipment universal case volume smaller, simultaneously, both sides fan module can heat dissipation to main control board module and power module, guarantees the heat dissipation effect, in addition, main control board module and optical module are located 1U space of case upper and lower respectively, and the front panel is located the front side of case, and the space distribution is reasonable, can be through replacing the front panel, main control board module, optical module adaptation different product, and the easy use is higher, and fan module and power module can all hot plug, and the later maintenance and replacement are all more convenient.

[0011] Preferably, the case platform includes an upper cover, a case main body, a fan rail, a main control board support, and a power supply frame. The upper cover is connected to a top opening of the case main body. A power supply frame connection port is formed at the rear side of the case main body. The power supply frame is located inside the case main body and connected to the power supply frame connection port. The fan rail is connected to the inside of both sides of the case platform. The main control board support is connected to the inside of both sides of the case platform and located between the fan rails on both sides. The main control board module is connected to the top surface of the main control board support. The optical module is located between the main control board supports.

[0012] The main control board support is designed on the inside of both sides of the case platform, which improves the overall strength of the machine. At the same time, the parts of the case platform are riveted to the case main body, which has high overall strength and reduces the assembly of parts.

[0013] Preferably, the fan rail includes a rail support and a rail cover plate. The rail support is an L-shaped bent plate. Ventilation holes are formed on the vertical side of the rail support. The rail cover plate is an inverted L-shaped bent plate. Ventilation holes are formed on the vertical side of the rail cover plate. The rail cover plate and the rail support are spliced to form a rectangular frame body with empty ends.

[0014] Preferably, one end of the upper cover bottom comprises a clamping tongue, both sides of the upper cover are bent downward, and the inner side of the bent surface is connected with a plurality of first rivet columns; one end of the top of the cabinet body comprises an inner bend, the top of both sides of the cabinet body is bent inward, and the bent surface comprises a clamping groove; the clamping tongue is inserted into the inner bend, and the first rivet column is clamped in the clamping groove.

[0015] Preferably, the front side of the cabinet body comprises a rectangular hole, the rear side of the cabinet body comprises a first notch for inserting a fan module and a second notch for a power module, and both sides of the cabinet body comprise a heat dissipation hole.

[0016] Preferably, the fan module comprises a fan shell, a fan body, a fan control board assembly, and a fan back plate assembly; a plurality of the fan bodies are connected to the inside of the fan shell at intervals, the fan control board assembly is connected to one end of the fan shell, the fan back plate assembly is connected in the cabinet platform, and the fan control board assembly and the fan back plate assembly are connected to realize electrical connection.

[0017] Preferably, the position of the fan body close to the power module is lower than the position of the fan body close to the main control board module.

[0018] Due to the different positions of the power module and the main control board module, part of the fan bodies are used for heat dissipation of the power module, and the remaining fan bodies are used for heat dissipation of the main control board module, so that the heat dissipation effect is further improved.

[0019] Preferably, the fan control board assembly comprises a control board body, a positioning pin female head, and a connector female head; the control board body is connected to the fan shell, and the positioning pin female head and the connector female head are both connected to the control board body; the fan back plate assembly comprises a back plate body, a back plate connecting piece, a positioning pin male head, and a connector male head; the back plate body is connected to the back plate connecting piece, and then the back plate body is integrally connected to the cabinet platform; the positioning pin male head and the connector male head are both connected to the back plate body; the connector female head is connected to the connector male head, and the positioning pin female head is connected to the positioning pin male head.

[0020] Preferably, the main control board module comprises a main control board body and a bottom plate; the main control board body is connected to the bottom plate, and both sides of the bottom plate are insulatively connected to the top of the main control board support.

[0021] Preferably, the optical module comprises an optical module box and an optical device; the optical device is connected in the optical module box, and the optical module box is connected to the bottom surface of the bottom plate of the main control board module.

[0022] The utility model discloses the advantages are:

[0023] The utility model discloses a main control board module and the optical module are arranged along the vertical direction, so that quantum communication equipment general cabinet volume is smaller, simultaneously, the fan module of two sides can heat dissipation to main control board module and power module, guarantee heat dissipation effect, in addition, main control board module and optical module are located 1U space of case upper and lower respectively, and the front panel is located case front side, and the space distribution is reasonable, can be through replacing front panel, main control board module, optical module adaptation different product, and the easy use is higher, and fan module and power module can all be hot plug, and the later maintenance and replacement are all more convenient.

[0024] The main control board support is designed on the left and right sides of the case platform, the strength of the whole machine is improved, and the parts of the case platform are riveted on the case body, so that the overall strength is high and the part assembly is reduced.

[0025] The case structure meets the general standard of the industry and is suitable for the general cabinet of the industry. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 It is an explosion schematic view of the quantum communication equipment general cabinet of the utility model embodiment;

[0027] Figure 2 It is an explosion schematic view of the case platform of the utility model embodiment;

[0028] Figure 3 It is an assembly schematic view of the upper cover and the case body of the utility model embodiment;

[0029] Figure 4 It is an assembly sectional view of the upper cover and the case body of the utility model embodiment;

[0030] Figure 5 It is an explosion schematic view of the fan guide rail of the utility model embodiment;

[0031] Figure 6 It is an assembly explosion schematic view of the fan module of the utility model embodiment;

[0032] Figure 7 It is a side view of the fan module of the utility model embodiment;

[0033] Figure 8 It is an assembly schematic view of the main control board module of the utility model embodiment;

[0034] Figure 9 It is an assembly schematic view of the optical module of the utility model embodiment;

[0035] Figure 10 It is an assembly schematic view of the front panel of the utility model embodiment;

[0036] Mark in the drawing:

[0037] 1, main control board module;11, main control board body;12, disc head screw;13, T-shaped insulating pad;14, bottom plate;15, Teflon insulating pad;

[0038] 2, optical module;21, optical module box;22, first screw;23, optical device;

[0039] 3, front panel;31, front panel body;32, second screw;

[0040] 4, fan module;41, fan shell;411, fan left frame;412, fan right frame;413, rubber pad;42, fan body;43, fan control board assembly;431, control board body;432, positioning pin female head;433, connector female head;44, fan back plate assembly;441, back plate body;442, back plate connecting piece;443, positioning pin male head;444, connector male head;45, fan handle;46, locking bolt;

[0041] 5, power module;

[0042] 6, case platform;61, upper cover;611, card tongue;612, first rivet column;62, case body;621, inner bend;622, card slot;623, spring hole;63, fan guide rail;631, guide rail support;632, guide rail cover plate;64, main control board support;641, first support;642, second support;65, power frame;66, hanging ear;67, whole machine handle. DETAILED DESCRIPTION

[0043] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model more clear, the technical scheme in the embodiments of the utility model will be described clearly and completely below in combination with the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0044] As Figure 1As shown, a general-purpose chassis for quantum communication equipment includes a main control board module 1, an optical module 2, a front panel 3, a fan module 4, a power supply module 5, and a chassis platform 6. The main control board module 1 and the optical module 2 are arranged vertically and installed inside the chassis platform 6. The front panel 3 is connected to the front side of the chassis platform 6. The power supply module 5 is inserted into the chassis platform 6 from the rear side and connected to the chassis platform 6. The power supply module 5 is located on the rear side inside the chassis platform 6. There are two fan modules 4, which are inserted into the chassis platform 6 from both ends of the rear side and connected to the chassis platform 6. The two fan modules 4 are located on both sides inside the chassis platform 6, and the fan modules on both sides are used to dissipate heat from the main control board module 1 and the power supply module 5.

[0045] In this embodiment, the side connected to the front panel 3 is the front side of the chassis platform 6, and correspondingly, the side connected to the power module 5 is the rear side of the chassis platform 6, and the side connected to the fan module 4 is the left and right sides of the chassis platform 6.

[0046] In this embodiment, the main control board module 1 is located in the upper 1U space of the chassis platform 6; the optical module 2 is located in the lower 1U space of the main control board module 1; the power supply module 5 is located in the lower rear 1U space of the chassis platform 6; and the fan module 4 is located on the left and right sides of the chassis platform 6, occupying 2U space.

[0047] like Figure 2 As shown, in this embodiment, the chassis platform 6 includes a top cover 61, a chassis body 62, a fan rail 63, a main control board bracket 64, a power supply frame 65, a mounting bracket 66, and a handle 67.

[0048] The chassis platform 6 serves as the load-bearing structure of the entire general-purpose chassis, and the entire structure is arranged symmetrically from left to right. The top cover 61 is connected to the top opening of the chassis body 62. The fan rails 63 are connected to the left and right sides of the chassis platform 6. The main control board bracket 64 is connected to the left and right sides of the chassis platform 6 and is located inside the fan rails 63 on both sides. The main control board bracket 64 provides structural support for the entire machine and is used to connect the main control board module 1, so that the main control board module 1 and the optical module 2 are arranged vertically. The two power supply frames 65 are connected together and fixed to the rear side of the chassis body 62. The openings of the power supply frames 65 face outwards, and the openings of the power supply frames 65 are used to push in and install the power supply module 5. Two mounting ears 66 are respectively connected to the two ends of the front side of the chassis body 62, and the handle 67 is installed on the mounting ears 66 with screws.

[0049] like Figure 3 , Figure 4As shown, the connection mode of the upper cover 61 and the top opening of the case body 62 is as follows: the front bottom surface of the upper cover 61 includes a clamping tongue 611, and a counterbore hole is provided at the rear side. The left and right sides of the upper cover 61 are bent downward, and the inner side of the bent surface is connected to a plurality of first rivet columns 612 arranged at intervals. Correspondingly, the front side of the case body 62 has an inner bend 621, and the top ends of the left and right sides of the case body 62 are bent inward, and the bent portion includes a clamping groove 622, and the clamping groove 622 is arranged at intervals. The upper cover 61 is slid from the rear side of the case body 62, so that the clamping tongue 611 tightly clamps the inner bend 621 of the front side of the case body 62, and the first rivet column 612 is slid into the clamping groove 622 of the case body 62, thereby fixing the front side and the left and right sides of the case body 62 and the upper cover 61. Finally, the bolt is fixed in the threaded hole at the rear side of the case body 62 from the counterbore hole above the rear side of the upper cover 61, thereby fixing the upper cover 61 and the case body 62.

[0050] The left and right sides of the case body 62 are made of a whole piece of galvanized steel plate bent and formed, and the side edges are spot welded. The rear side of the case body 62 is provided with grooves for inserting the fan module 4 and the power module 5. The grooves for inserting the fan module 4 are located at both ends of the rear side of the case body 62, and the grooves for inserting the power module 5 are located at the middle of the rear side of the case body 62. The left and right sides of the case body 62 are provided with heat dissipation holes arranged in a rectangular or honeycomb shape. The front surface of the case body 62 is designed with a larger rectangular hole to avoid the contact between the main control board module 1 and the case body 62 shell, thereby preventing interference.

[0051] The upper parts of the left and right sides of the case body 62 are bent inward to ensure that the left and right sides of the case body 62 and the upper cover 61 are in the same plane when the upper cover 61 is covered, and the overall appearance of the case is beautiful. The upper side of the case body 62 is provided with a reed hole 623 around, and the reed is directly clamped in the reed hole 623. When the upper cover 61 and the case body 62 are fixed together, the gap between the upper cover 61 and the case body 62 is eliminated by pressing the reed, thereby meeting the electromagnetic shielding requirement. The case body 62 is designed with riveting holes at the bottom side and the front and rear sides, and the power frame 65 and the main control board support 64 are directly riveted on the case body 62, thereby further enhancing the strength of the case platform 6.

[0052] As shown in Figure 2 The fan guide rail 63 is two, and the two fan guide rails 63 are the same in structure and the same in installation mode. Figure 5As shown, in this embodiment, the fan guide rail 63 includes a guide rail bracket 631 and a guide rail cover plate 632. The guide rail bracket 631 is an L-shaped bent plate, and the vertical side of the guide rail bracket 631 is a grid-shaped hole. In order to achieve ventilation, the guide rail cover plate 632 is an inverted L-shaped bent plate, and the vertical side of the guide rail cover plate 632 is also a grid-shaped hole. In order to achieve ventilation, the guide rail bracket 631 and the guide rail cover plate 632 are spliced to form a rectangular frame body with openings at both ends along the length direction. The guide rail cover plate 632 is fixed with the guide rail bracket 631 by rivets or other means, and the two are fixed together and then fixed on the case main body 62 by screws. The opening at the rear end of the fan guide rail 63 is used for pushing the fan module 4 in.

[0053] Of course, the guide rail bracket 631 can also be a U-shaped bracket, and the guide rail cover plate 632 is a flat plate connected to the top opening of the guide rail bracket 631 by bolts or the like. The two sides of the guide rail bracket 631 are provided with grid holes. This embodiment only gives two splicing forms of the fan guide rail 63. The fan guide rail 63 can also have other splicing forms, or can be a whole rectangular frame structure, or can be a trapezoidal frame structure based on the rectangular frame structure. As long as the fan module 4 can be pushed in and fixed, it is within the protection scope of this embodiment.

[0054] Reference Figure 2 As shown, the main control board bracket 64 is two, and the two main control board brackets 64 are the same in structure and the same in installation. In this embodiment, the main control board bracket 64 includes a first bracket 641 and a second bracket 642. The first bracket 641 and the second bracket 642 are approximately C-shaped structures, and the two are spliced to form a rectangular frame. The first bracket 641 and the second bracket 642 include a plurality of openings on the side surfaces to reduce weight while ensuring support strength. The first bracket 641 and the second bracket 642 are fixed together by upper side screws to form the main control board bracket 64, and then fixed on the case main body 62 by lower side rivets.

[0055] Reference Figure 2 As shown, the power supply frame 65 is two, and the two power supply frames 65 are fixed together by front side rivets. The power supply frame 65 is an inverted U-shaped bent plate, and the bottom of the power supply frame 65 is bent outward. The bent part is used to be fixed on the case main body 62 by front side rivets and lower side rivets. The vertical surface of the power supply frame 65 is provided with ventilation holes. The rear surface of the case main body 62 includes two power supply frame connection ports which are rectangular holes. The end of the power supply frame 65 can be connected with the power supply frame connection port by bolts or welding, so that the power supply module 5 is inserted into the power supply frame 65 through the power supply frame connection port, and then the power supply module 5 is fixed on the rear surface of the case main body 62 by bolts or the like.

[0056] The whole machine handle 67 and the lug 66 are fixed together by a countersunk screw, and then the whole is fixed on the case main body 62 by a countersunk screw.

[0057] As shown in Figure 6 , Figure 7 , the fan module 4 includes a fan shell 41, a fan body 42, a fan control board assembly 43, a fan back plate assembly 44, a fan handle 45, and a locking bolt 46.

[0058] The fan body 42 is multiple, and the multiple fan bodies 42 are connected in the fan shell 41. The fan control board assembly 43 is connected to one end of the fan shell 41. The fan back plate assembly 44 is connected to the case main body 62 and located at the end of the fan guide rail 63. The fan control board assembly 43 and the fan back plate assembly 44 are connected to realize electrical connection. The locking bolt 46 is connected to the fan handle 45. The fan handle 45 is fixed on the fan shell 41 by a countersunk screw.

[0059] In this embodiment, the fan shell 41 includes a fan left frame 411, a fan right frame 412, and a rubber pad 413. The fan left frame 411 and the fan right frame 412 each include multiple ventilation round holes, and the positions of the ventilation round holes correspond to the positions of the fan bodies 42. The fan left frame 411 and the fan right frame 412 are spliced to form a substantially rectangular box structure, with the right end being empty. The fan handle 45 is fixed on one end of the fan left frame 411 by a countersunk screw. The fan control board assembly 43 is fixed on the other end of the fan left frame 411 by a screw. The rubber pad 413 is fixed on the rivet columns of the fan left frame 411 and the fan right frame 412 by interference fit, respectively. Then, according to the positions of the mounting holes on the fan bodies 42, the fan bodies 42 are placed on the corresponding rivet columns of the fan left frame 411 by interference fit. Then, the rivet columns of the fan right frame 412 are also respectively inserted through the corresponding mounting holes of the fan bodies 42. The fan left frame 411 and the fan right frame 412 are fixed together by screws, and the installation of the fan bodies 42 is completed.

[0060] According to the up-down layout structure of the main control board module 1 and the power module 5, the fan module 4 is also arranged in an up-down layout structure according to the different distances from the main control board module 1 and the power module 5. One of the fan bodies 42 in the fan module 4, which is close to the fan handle 45, is fixed at a lower position to dissipate heat for the power module 5. The other three fan bodies 42 are fixed at upper positions to dissipate heat for the main control board module 1.

[0061] As shown in Figure 6 , Figure 7As shown, the fan control board assembly 43 includes a control board body 431, a positioning pin female head 432, and a connector female head 433. The control board body 431 is fixed to the left frame 411 of the fan by screws, and the positioning pin female head 432 and the connector female head 433 are both installed on the vertical plate of the control board body 431.

[0062] The fan backplate assembly 44 includes a backplate body 441, a backplate connector 442, a locating pin male connector 443, and a connector male connector 444. The backplate body 441 is fixed to the backplate connector 442 by bolts, and the entire structure is then fixed to the chassis body 62 by bolts. The fan backplate assembly 44 is located at the end of the fan module 4 away from the fan handle 45. The locating pin male connector 443 and the connector male connector 444 are both connected to the backplate body 441.

[0063] The fan control board assembly 43 in fan module 4 is equipped with a female connector 433, and the fan backplane assembly 44 is equipped with a male connector 444. The connection between the female connector 433 and the male connector 444 allows for hot-swapping, enabling power supply and signal transmission through plugging and unplugging. The distance between the fan backplane assembly 44 and the fan control board assembly 43 is set to ensure that the male connector 444 on the backplane body 441 can be properly connected to the female connector 433 on the control board body 431.

[0064] Connector female 433 is a ZD connector female, and connector male 444 is a ZD connector male.

[0065] The fan module 4 can be fixed by inserting the female locating pin 432 and the male locating pin 443 together.

[0066] During operation, the fan module 4 is inserted into the fan rail 63 from the rear side of the chassis body 62, and its left and right positions are limited. For example... Figure 7 As shown, the male locating pin 443 and the female locating pin 432 are connected to fix the fan module 4 from the front. The fan module 4 is further fixed to the chassis platform 6 from the rear by the locking bolt 46 on the fan module 4, thus realizing the installation process of the fan module 4.

[0067] like Figure 8 As shown, the main control board module 1 includes a main control board body 11, pan head screws 12, T-shaped insulating pads 13, a base plate 14, and Teflon insulating pads 15.

[0068] The Teflon insulating pad 15 is in a strip shape, and a hole position is arranged on the Teflon insulating pad 15, and the hole position is aligned with the rivet column on the main control board support 64 to realize limiting. The main control board body 11 is fixed on the bottom plate 14 through a screw, the disc head screw 12 passes through the T-shaped insulating pad 13 and the Teflon insulating pad 15 to fix the bottom plate 14 on the main control board support 64. In the above, the main control board module 1 and the case platform 6 are separated by the T-shaped insulating pad 13 and the Teflon insulating pad 15 to realize insulation.

[0069] As shown in Figure 9 The optical module 2 comprises an optical module box 21, a first screw 22 and an optical device 23.

[0070] The optical device 23 is fixed in the optical module box 21 through a screw, and the whole is fixed on the bottom plate 14 of the main control board module 1 through the first screw 22.

[0071] As shown in Figure 10 The front panel 3 comprises a front panel body 31 and a second screw 32; the front panel body 31 is fixed on the front side of the case platform 6 from the inside of the case platform 6 through the second screw 32.

[0072] The power module 5 is inserted from the rear side of the case platform 6 and is fixed through a bolt or a screw.

[0073] In the embodiment, the quantum communication equipment universal case, the main control board module 1 and the optical module 2 are respectively located on the upper and lower 1U spaces of the case platform 6, the front panel 3 is located on the front side of the case platform 6, the space distribution is reasonable, in addition, different products can be adapted by replacing the front panel 3, the main control board module 1 and the optical module 2, the ease of use is higher; and the fan module 4 and the power module 5 can be hot-plugged, and the later maintenance and replacement are convenient; the case supports are designed on the left and right sides in the case platform 6, the whole machine strength is improved, meanwhile, the parts of the case platform 6 are riveted on the case body 62, the whole strength is higher and the part assembly can be reduced.

[0074] The above embodiments are only used to illustrate the technical solutions of the present application, but not limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can be modified, or some technical features can be replaced equivalently; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A quantum communication device general case, characterized in that, The main control board module, the optical module, the front panel, the fan module, the power module and the case platform are included. The front panel is connected to the front side of the case platform, and the power module is located in the case platform and detachably connected to the rear side of the case platform. The main control board module and the optical module are arranged in the vertical direction and connected in the case platform. The fan module is located in the case platform and on both sides of the optical module, and the fan module is detachably connected to the case platform.

2. The general case of a quantum communication device according to claim 1, characterized in that, The case platform includes an upper cover, a case body, a fan rail, a main control board support, and a power frame. The upper cover is connected to the top opening of the case body. The rear side of the case body is provided with a power frame connecting port, and the power frame is located in the case body and connected to the power frame connecting port. The fan rail is connected to the inside of the case platform on both sides, and the main control board support is connected to the inside of the case platform on both sides and between the fan rails on both sides. The main control board module is connected to the top surface of the main control board support, and the optical module is located between the main control board supports.

3. The general case of a quantum communication device according to claim 2, characterized in that, The fan rail includes a rail support and a rail cover plate. The rail support is an L-shaped bent plate, and the vertical side of the rail support is provided with a ventilation hole. The rail cover plate is an inverted L-shaped bent plate, and the vertical side of the rail cover plate is provided with a ventilation hole. The rail cover plate and the rail support are spliced to form a rectangular frame body with two empty ends.

4. The general case of a quantum communication device according to claim 2, characterized in that, One end of the bottom of the upper cover includes a clamping tongue, and the two sides of the upper cover are bent downward, and the inner side of the bent surface is connected to a plurality of first rivet columns. One end of the top of the case body includes an inner bend, and the two sides of the top of the case body are bent inward, and the bent surface includes a clamping groove. The clamping tongue is inserted into the inner bend, and the first rivet column is clamped in the clamping groove.

5. The general case of a quantum communication device according to claim 2, characterized in that, The front side of the case body includes a rectangular hole, the rear side of the case body includes a first notch for inserting the fan module and a second notch for the power module, and the two sides of the case body include heat dissipation holes.

6. The general case of a quantum communication device according to claim 1, characterized in that, The fan module includes a fan shell, a fan body, a fan control board assembly, and a fan back plate assembly. A plurality of fan bodies are connected to the inside of the fan shell in intervals, the fan control board assembly is connected to one end of the fan shell, the fan back plate assembly is connected in the case platform, and the fan control board assembly and the fan back plate assembly are connected to realize electrical connection.

7. The general case of a quantum communication device according to claim 6, characterized in that, The position of the fan body close to the power module is lower than the position of the fan body close to the main control board module.

8. The general case of a quantum communication device according to claim 6, characterized in that, The fan control board assembly includes a control board body, a positioning pin female head, and a connector female head. The control board body is connected to the fan shell, and the positioning pin female head and the connector female head are connected to the control board body. The fan back plate assembly includes a back plate body, a back plate connecting piece, a positioning pin male head, and a connector male head. The back plate body is connected to the back plate connecting piece, and then the whole is connected to the case platform, and the positioning pin male head and the connector male head are connected to the back plate body. The connector female head is connected to the connector male head, and the positioning pin female head is connected to the positioning pin male head.

9. The general case of a quantum communication device according to claim 2, characterized in that, The main control board module comprises a main control board body and a bottom plate; the main control board body is connected to the bottom plate, and the two sides of the bottom plate are insulatively connected to the top of the main control board support.

10. The general case of a quantum communication device according to claim 9, characterized in that, The optical module comprises an optical module box and optical devices; the optical devices are connected in the optical module box, and the optical module box is connected to the bottom surface of the bottom plate of the main control board module.

Citation Information

Patent Citations

  • Quantum key transmitter integrated system

    CN214045656U