Wafer degumming, stripping and cleaning device

Abstract

The utility model discloses a wafer degumming, stripping and cleaning device, which relates to the technical field of wafer cleaning and comprises a base, symmetrical supporting seats are fixedly arranged on two sides of the middle of the base, a drainage tank is arranged in the middle of the base, a top plate is arranged in the middle of the drainage tank, a lifting rail is arranged on the center line of each supporting seat, and a lifting seat is slidably arranged on each lifting rail. Supporting springs are arranged in the lifting seats and connected with spring rods, arc-shaped clamping plates are fixedly arranged at the extending positions of the spring rods on the lifting seats, clamping grooves are formed in the opposite sides of the arc-shaped clamping plates, a transmission belt is arranged above the top plate, arrayed wafers are conveyed on the transmission belt, and the connecting positions of the spring rods and the arc-shaped clamping plates deviate from the center lines of the arc-shaped clamping plates. And vertical scrubbing discs are arranged on two sides of the arc-shaped clamping plate on the base through a driving structure. The wafer cleaning device is simple in structure, capable of automatically conducting photoresist removing, stripping and cleaning on the wafer, capable of erecting the wafer when the wafer is clamped, capable of cleaning the two faces of the wafer at the same time, high in practicability and suitable for popularization.

Description

Technical Field

[0001] This utility model belongs to the field of wafer cleaning technology, specifically relating to a wafer adhesive stripping and cleaning device. Background Technology

[0002] In the semiconductor technology field, it is necessary to form a metal layer on the surface of a wafer. The current common practice is to first form a photoresist layer on the wafer, then etch it to form grooves, and then form a metal layer on the photoresist surface and within the wafer grooves using metal ion evaporation. Finally, the useless photoresist and metal layer are removed through a stripping and resist removal process, while the metal within the grooves is retained. Existing common methods for removing photoresist and metal layers involve spraying a cleaning solution and cleaning the wafer surface.

[0003] When removing adhesive from wafers, the wafers need to be placed in the cleaning area and clamped, and both sides of the wafers need to be cleaned separately, resulting in low work efficiency. Utility Model Content

[0004] The purpose of this invention is to provide a wafer de-adhesive stripping and cleaning device with a simple structure that can automatically remove and clean wafers. When clamping the wafer, it can stand the wafer upright and clean both sides of the wafer at the same time. It is highly practical and suitable for widespread application.

[0005] This utility model provides the following technical solution: a wafer de-adhesive stripping and cleaning device, including a base, with symmetrical support seats fixed on both sides of the middle of the base, a drainage groove in the middle of the base, a top plate fixed in the middle of the drainage groove via a mounting seat, a lifting rail on the center line of the support seats, a lifting seat slidably mounted on the lifting rail, a second telescopic rod with its output end vertically downward on the mounting seat, and a lifting rod penetrating through the base fixed at the bottom of the lifting seat, the lifting rod being connected to the output end of the second telescopic rod;

[0006] The lifting seat is equipped with a support spring, the support spring is connected to a spring rod, the lifting seat is fixedly equipped with an arc-shaped clamping plate at the extension of the spring rod, the opposite side of the arc-shaped clamping plate is provided with a clamping groove, and a transmission belt is provided above the top plate, on which an array of wafers are transported;

[0007] The point where the spring rod connects to the arc-shaped clamp is off-center from the center line of the arc-shaped clamp. The base is located on both sides of the arc-shaped clamp and has upright brush plates provided by the drive structure.

[0008] Preferably, symmetrical support frames are fixedly provided on the front and rear sides of the base, and a sliding rail is fixedly provided at the top of the support frame. A movable frame is slidably provided between the two sliding rails on the same side. The movable frame is fixedly connected to the drive mechanism of the brush plate. A first telescopic rod with its output end connected to the movable frame is fixedly provided at the sliding rail.

[0009] Preferably, the arc-shaped clamping plate has a first inclined surface on the upper and lower sides, and the arc-shaped clamping plate has a second inclined surface on the upper and lower sides of the clamping groove, and the two ends of the first inclined surface are chamfered.

[0010] Preferably, the transmission belt is elastic, the top plate is circular and its diameter is smaller than that of the wafer, and the transmission belt stops when the wafer on it coincides with the center of the top plate during driving. When the arc-shaped clamp is not subjected to external force, the first inclined surface and the second inclined surface on it slide in contact with the edge of the wafer.

[0011] Preferably, a stop block is provided on one side of the spring rod inside the lifting seat, and a protruding strip is fixedly provided inside the lifting seat. When the arc-shaped clamp is in a vertical position, the stop block is blocked by the protruding strip.

[0012] The beneficial effects of this utility model are: simple structure, automated removal and cleaning of wafers, ability to stand wafers upright during wafer clamping, and simultaneous cleaning of both sides of the wafer, making it highly practical, as detailed below:

[0013] (1) This utility model is equipped with an arc-shaped clamp. When the transmission belt transports the wafer to the top plate, the second telescopic rod operates and pulls the lifting seat down. Due to the different counterweights on both sides of the arc-shaped clamp on the spring rod, the arc-shaped clamp is in a vertical state. However, due to the obstruction of the convex strip, there will be a certain degree of deviation. When the first inclined surface under the arc-shaped clamp contacts the wafer surface, it continues to tilt in the direction of deviation until the first inclined surface is parallel to the wafer. Under the action of pressure, the arc-shaped clamp opens to both sides, and the wafer is clamped at the clamping groove. The wafer can then be clamped and lifted. During the lifting process, the wafer is erected due to the shift of the center of gravity, and its two sides are exposed to the brushing plate, so that both sides can be brushed at the same time.

[0014] (2) This utility model is provided with a second inclined surface. After the cleaning fluid is sprayed and rotated by the brushing plate to clean the two sides of the wafer, the lifting seat drives the wafer to descend. After the wafer comes into contact with the transmission belt, it continues to tilt in the direction of its offset until it lies on the transmission belt. When the lifting seat continues to press down, the second inclined surface is squeezed by the wafer, and the arc-shaped clamp opens to both sides. The arc-shaped clamp moves to the bottom of the wafer. During the descent of the lifting seat, the compression of the transmission belt produces elastic deformation and passes under the transmission belt. After the transmission belt transports the cleaned wafer, the lifting seat rises and passes through the transmission belt, and waits for the next wafer to be transported to the top plate for cyclic operation. Attached Figure Description

[0015] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0016] Figure 1 This is an overall schematic diagram of the present invention;

[0017] Figure 2 This is a cross-sectional view of the present invention;

[0018] Figure 3 This is an enlarged view of point A of this utility model;

[0019] Figure 4 This is a cross-sectional view at point B in this utility model;

[0020] The following are marked in the diagram: 1. Base; 2. Support seat; 3. Top plate; 4. Drainage groove; 5. Lifting rail; 6. Lifting seat; 7. Arc-shaped clamp; 8. Lifting rod; 9. Transmission belt; 10. Support frame; 11. Sliding rail; 12. Moving frame; 13. First telescopic rod; 14. Brush plate; 15. Support spring; 16. Spring rod; 17. Second telescopic rod; 18. Mounting seat; 19. Wafer; 20. Clamping groove; 21. First inclined surface; 22. Second inclined surface; 23. Stop block; 24. Protruding strip. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0022] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "top / bottom," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0023] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "sleeved / connected," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0024] The structural features of this utility model will now be described in detail with reference to the accompanying drawings.

[0025] See Figure 1-2 A wafer de-adhesive stripping and cleaning device includes a base 1, with symmetrical support seats 2 fixed on both sides of the middle of the base 1. A drainage trough 4 is provided in the middle of the base 1 to discharge waste liquid. A top plate 3 is fixed in the middle of the drainage trough 4 via a mounting seat 18. The top plate 3 provides support for the wafer 19. A lifting rail 5 is provided on the center line of the support seat 2. A lifting seat 6 is slidably provided on the lifting rail 5. The lifting seat 6 slides up and down between the lifting rail 5. A second telescopic rod 17 with its output end pointing vertically downward is provided on the mounting seat 18. A lifting rod 8 penetrating through the base 1 is fixed at the bottom of the lifting seat 6. The lifting rod 8 is connected to the output end of the second telescopic rod 17. The second telescopic rod 17 pulls the lifting rod 8 up and down.

[0026] See Figure 1-3 The lifting seat 6 is equipped with a support spring 15, which is connected to a spring rod 16. The support spring 15 provides clamping force to the arc-shaped clamping plate 7. The lifting seat 6 is fixedly equipped with the arc-shaped clamping plate 7 at the extension of the spring rod 16. A clamping groove 20 is provided on the opposite side of the arc-shaped clamping plate 7. The wafer 19 is clamped and fixed in the clamping groove 20. A transmission belt 9 is provided above the top plate 3. The transmission belt 9 carries an array of wafers 19, so that the distance of movement of the transmission belt 9 is fixed and the wafers 19 can be transported to the designated position.

[0027] See Figure 3-4 The connection point between the spring rod 16 and the arc-shaped clamp 7 is off-center from the centerline of the arc-shaped clamp 7, causing the centers of gravity on both sides of the arc-shaped clamp 7 to be different. Under the action of gravity, it automatically deflects. A stop block 23 is provided on one side of the spring rod 16 inside the lifting seat 6. A protrusion 24 is fixed inside the lifting seat 6. When the arc-shaped clamp 7 is in a vertical position, the stop block 23 is blocked by the protrusion 24, causing the arc-shaped clamp 7 and the wafer to shift to a certain extent when lifted. The arc-shaped clamp 7 has a first inclined surface 21 on the upper and lower sides, and a second inclined surface 22 on the upper and lower sides of the clamping groove 20. The two ends of the first inclined surface 21 have chamfers. When the arc-shaped clamp 7 is pressed down, the chamfers move along the wafer. The circular 19 slides to prevent scratches. When the arc-shaped clamping plate 7 is not subjected to external force, its first inclined surface 21 and second inclined surface 22 slide in contact with the edge of the wafer 19. When the arc-shaped clamping plate 7 is pressed down, the wafer 19 can open the arc-shaped clamping plate 7 to both sides regardless of whether it is squeezed by the first inclined surface 21 or the second inclined surface 22. The transmission belt 9 is elastic. During the descent of the lifting seat 6, the compression of the transmission belt 9 produces elastic deformation and passes under the transmission belt 9. The top plate 3 is circular and its diameter is smaller than that of the wafer 19. When the transmission belt 9 is driven, it stops when the wafer 19 on it coincides with the center of the top plate 3, so that the arc-shaped clamping plate 7 can clamp the two sides of the wafer 19.

[0028] See Figure 1-2The base 1 is located on both sides of the arc-shaped clamping plate 7 and has a brush washing plate 14 erected by a drive structure. The base 1 has symmetrical support frames 10 fixed on the front and rear sides. The top of the support frame 10 is fixed with a sliding rail 11. A movable frame 12 is slidably arranged between the two sliding rails 11 on the same side. The movable frame 12 is fixedly connected to the drive mechanism of the brush washing plate 14. A first telescopic rod 13 with its output end connected to the movable frame 12 is fixed at the sliding rail 11. The first telescopic rod 13 drives the movable frame 12 to move on the sliding rail 11, thereby driving the brush washing plate 14 to move and preventing it from affecting the rise and deflection of the wafer 19.

[0029] The wafer de-adhesive stripping and cleaning device of this utility model has a simple structure and can automatically perform de-adhesive stripping and cleaning on wafers. When clamping the wafer, it can stand the wafer upright and clean both sides of the wafer at the same time. It is highly practical and suitable for widespread application.

[0030] For specific usage, please refer to... Figure 1-4 When the conveyor belt 9 transports the wafer 19 to the top plate 3, the second telescopic rod 17 operates, pulling the lifting seat 6 down. Due to the different counterweights on both sides of the arc-shaped clamp 7 on the spring rod 16, the arc-shaped clamp 7 is in a vertical state. However, due to the obstruction of the protrusion 24, it will deviate to a certain extent. When the first inclined surface 21 below the arc-shaped clamp 7 contacts the surface of the wafer 19, it continues to tilt in the direction of deviation until the first inclined surface 21 is parallel to the wafer 19. Under the action of pressure, the arc-shaped clamp 7 opens to both sides, and the wafer 19 is clamped at the clamping groove 20. The wafer 19 can then be clamped and lifted. During the lifting process, the wafer 19 is upright due to the shift in the center of gravity, and its two sides are exposed to the brushing tray 14. Both sides can be brushed simultaneously. After the brushing plate 14 sprays cleaning fluid and rotates to clean the surfaces of both sides of the wafer 19, the lifting seat 6 drives the wafer 19 to descend. After the wafer 19 contacts the transmission belt 9, it continues to tilt in the direction of offset until it lies on the transmission belt 9. When the lifting seat 6 continues to press down, the second inclined surface 22 is squeezed by the wafer 19, and the arc-shaped clamp 7 opens to both sides. The arc-shaped clamp 7 moves to below the wafer 19. During the descent of the lifting seat 6, the compression of the transmission belt 9 causes elastic deformation and passes under the transmission belt 9. After the transmission belt 9 transports the cleaned wafer 19, the lifting seat 6 rises and passes through the transmission belt 9, waiting for the next wafer 19 to be transported to the top plate 3 for cyclic operation.

[0031] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A wafer resist stripping and cleaning device, comprising a base (1), characterized in that, The base (1) has symmetrical support seats (2) fixed on both sides of the middle part. The base (1) has a drainage groove (4) in the middle part. The drainage groove (4) has a top plate (3) fixed on the middle part through the mounting seat (18). The support seat (2) has a lifting rail (5) on the center line. The lifting rail (5) has a lifting seat (6) sliding on it. The mounting seat (18) has a second telescopic rod (17) with its output end pointing vertically downward. The bottom of the lifting seat (6) has a lifting rod (8) that passes through the base (1). The lifting rod (8) is connected to the output end of the second telescopic rod (17). The lifting seat (6) is provided with a support spring (15), the support spring (15) is connected to a spring rod (16), the spring rod (16) extends to the lifting seat (6) and is fixedly provided with an arc-shaped clamping plate (7), the arc-shaped clamping plate (7) is provided with a clamping groove (20) on the opposite side, the top plate (3) is provided with a transmission belt (9), and an array of wafers (19) are transported on the transmission belt (9); The point where the spring rod (16) is connected to the arc-shaped clamp (7) is off-center from the center line of the arc-shaped clamp (7). The base (1) is located on both sides of the arc-shaped clamp (7) and has upright brush plates (14) provided by the drive structure.

2. The wafer resist stripping and cleaning device according to claim 1, characterized in that, The base (1) is fixed with symmetrical support frames (10) on the front and rear sides. The top of the support frame (10) is fixed with a sliding rail (11). A movable frame (12) is slidably arranged between the two sliding rails (11) on the same side. The movable frame (12) is fixedly connected to the drive mechanism of the brushing disc (14). A first telescopic rod (13) with its output end connected to the movable frame (12) is fixedly arranged at the sliding rail (11).

3. The wafer resist stripping and cleaning device according to claim 1, characterized in that, The arc-shaped clamp (7) has a first inclined surface (21) on its upper and lower sides, and a second inclined surface (22) on its upper and lower sides located in the clamping groove (20). The two ends of the first inclined surface (21) are chamfered.

4. The wafer resist stripping and cleaning device according to claim 3, characterized in that, The transmission belt (9) is elastic, the top plate (3) is circular and its diameter is smaller than that of the wafer (19). When the transmission belt (9) is driven, it stops when the wafer (19) on it coincides with the center of the top plate (3). When the arc-shaped clamp (7) is not subjected to external force, its first inclined surface (21) and second inclined surface (22) slide in contact with the edge of the wafer (19).

5. The wafer resist stripping and cleaning device according to claim 1, characterized in that, The spring rod (16) is provided with a stop block (23) on one side inside the lifting seat (6). The lifting seat (6) is fixedly provided with a protrusion (24). When the arc-shaped clamp (7) is biased to the vertical position, the stop block (23) is blocked by the protrusion (24).

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