Defective product punching device for semiconductor device production

Abstract

The utility model discloses a defective product punching device for semiconductor device production, which relates to the technical field of semiconductor processing, and comprises a rack, a driving mechanism, a punching upper die and a punching lower die are arranged on the rack; when the punching die is used, products in rows are placed on the carrying plate, and defective products needing to be cut off are placed on the punching female die block, so that positioning of target defective products is completed; the driving mechanism is used for driving the stamping knife to move downwards, the stamping knife cuts connecting ribs on the two sides of a target defective product at a concave hole under the stamping knife, then the driving mechanism drives the stamping knife to move upwards, the rows of products are reserved on the carrying plate and are convenient to take out, the purpose of cutting off the corresponding defective products in the rows of products is achieved, efficiency is improved, and production cost is reduced. And the damage to the product is also reduced.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, specifically to a punching device for defective semiconductor devices. Background Technology

[0002] The semiconductor device manufacturing process involves processes such as dicing, die bonding, bonding, encapsulation, lead cutting, testing, and packaging. The semiconductor frame is the main component of the semiconductor device, and during production, multiple semiconductor products arranged in rows are usually packaged on the semiconductor frame.

[0003] Since the semiconductor frame after molding may contain pins that are warped, uneven, or other defective products, these defective products need to be removed from the frame before lead cutting and molding. In the existing technology, defective products are mostly removed manually by operators using scissors or scalpel blades. However, manual removal is prone to removing displaced or damaged pins of good products, and it is also less efficient.

[0004] In view of this, there is an urgent need for a punching device for defective semiconductor devices. Utility Model Content

[0005] To address the problems existing in the prior art, this utility model solves the problem using the following technical structure.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A punching device for defective semiconductor devices includes: a frame on which a drive mechanism, an upper punching die, and a lower punching die are disposed;

[0008] The punching upper die includes a cover plate, a punch mounting plate, and a punch. The punch mounting plate is disposed at the bottom of the cover plate, and the punch is disposed at the bottom of the punch mounting plate.

[0009] The punching die includes a carrier plate, a base plate, and a punching recess module; the base plate is located directly below the punch, the carrier plate is located on the top surface of the base plate, the punching recess module is located inside the carrier plate, the top surface of the punching recess module is on the same horizontal plane as the top surface of the carrier plate, and the punching recess module is provided with an upward-opening recessed hole, which is adapted to the punch;

[0010] The drive mechanism is used to drive the punch to move up and down.

[0011] A further feature is that,

[0012] The frame includes a base, a support column, and a connecting frame. The support column is vertically mounted on the base, the connecting frame is mounted on the support column, the upper punching die is mounted on the connecting frame, and the base plate is mounted on the base.

[0013] One end of the connecting frame is fitted onto the support column, and the connecting frame is provided with a number of locking bolts for locking the connecting frame onto the support column.

[0014] The drive mechanism includes a handle and a drive shaft. The drive shaft is vertically mounted on the connecting frame. The cover plate is located at the bottom of the drive shaft. The handle is rotatably mounted on the connecting frame and connected to the drive shaft through a transmission component. Rotating the handle causes the drive shaft to move up and down.

[0015] The drive mechanism also includes a connecting plate, a connecting rod, and a reset spring. The connecting plate is disposed at the top of the drive shaft, the connecting rod is vertically disposed on the connecting frame, the connecting rod passes through the connecting plate, and one end of the reset spring is connected to the top of the connecting rod, and the other end is connected to the top of the drive shaft.

[0016] The connecting plate is vertically provided with several limiting bolts, which are threadedly connected to the connecting plate.

[0017] The punching die also includes an unloading plate, several guide pillars, and a return spring. The unloading plate is located below the punch mounting plate. The guide pillars are vertically mounted on the cover plate and pass through the unloading plate from top to bottom. One end of the return spring is connected to the top of the unloading plate, and the other end is connected to the bottom of the punch mounting plate.

[0018] The punching die also includes a collection box. A groove is provided on one side of the base plate. The collection box is horizontally slidably disposed in the groove. The bottom outlet of the concave hole is connected to the groove.

[0019] The carrier plate is provided with a number of guide holes that correspond one-to-one with the guide posts.

[0020] The punching die also includes an observation window, which passes through the cover plate, the punch mounting plate and the unloading plate from top to bottom.

[0021] The above-described structure of this utility model can achieve the following beneficial effects:

[0022] In use, rows of products are placed on the carrier plate, and defective products to be removed are placed on the punching recess module to complete the positioning of the target defective product. The drive mechanism is used to drive the punch to move downward. The punch cuts the connecting ribs on both sides of the target defective product at the recess directly below. Then the drive mechanism drives the punch to move upward, and the rows of products are left on the carrier plate for easy removal. This achieves the purpose of removing the corresponding defective product from the rows of products, which not only improves efficiency but also reduces damage to the products. Attached Figure Description

[0023] Figure 1 This is a front view of this embodiment;

[0024] Figure 2 This is a side view of this embodiment;

[0025] Figure 3 This is a top view of this embodiment;

[0026] Figure 4 This is a top view of the punching die in this embodiment.

[0027] In the diagram: 10. Frame; 11. Base; 12. Support column; 13. Connecting frame; 14. Locking bolt; 20. Drive mechanism; 21. Handle; 22. Drive shaft; 23. Connecting plate; 24. Connecting rod; 25. Return spring; 26. Limit bolt; 30. Upper punching die; 31. Cover plate; 32. Punch mounting plate; 33. Punch; 34. Unloading plate; 35. Guide post; 36. Return spring; 37. Observation window; 40. Lower punching die; 41. Carrying plate; 42. Base plate; 43. Punching recess module; 44. Collection box; 45. Guide hole. Detailed Implementation

[0028] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0029] It should be noted that the terms "comprising" and "having" and any variations thereof in the specification, claims and accompanying drawings of this utility model are intended to cover non-exclusive inclusion. For example, a process, method, apparatus, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such processes, methods, products or devices.

[0030] The following is in conjunction with the appendix Figure 1-4 This application will be described in further detail.

[0031] refer to Figure 1-3A semiconductor device defective part punching device is shown, comprising: a frame 10, on which a drive mechanism 20, an upper punching die 30, and a lower punching die 40 are mounted; the upper punching die 30 includes a cover plate 31, a punch mounting plate 32, and a punch 33, the punch mounting plate 32 being disposed at the bottom of the cover plate 31, and the punch 33 being disposed at the bottom of the punch mounting plate 32; the lower punching die 40 includes a carrier plate 41, a base plate 42, and a punching recess module 43; the base plate 42 is disposed directly below the punch 33, the carrier plate 41 is disposed on the top surface of the base plate 42, and the punching recess module 43 is disposed inside the carrier plate 41, the top surface of the punching recess module 43 being on the same horizontal plane as the top surface of the carrier plate 41, and the punching... The cutting module 43 has an upward-facing recessed hole that matches the punch 33. In use, rows of products are placed on the carrier plate 41, and the defective products to be removed are placed on the cutting module 43, thus positioning the target defective product. The drive mechanism 20 drives the punch 33 downwards, where the punch 36 cuts the connecting ribs on both sides of the target defective product at the recessed hole directly below. Then, the drive mechanism 20 drives the punch 33 (the specific shape of the punch 33 is adaptively selected according to the product cutting requirements) upwards, leaving the rows of products on the carrier plate for easy removal. This achieves the goal of removing the corresponding defective product from the row, improving efficiency and reducing product damage.

[0032] like Figure 1 , Figure 2 and Figure 4 As shown, the frame 10 specifically includes a base 11, a support column 12, and a connecting frame 13. The support column 12 is vertically mounted on the base 11, the connecting frame 13 is mounted on the support column 12, the upper punching die 30 is mounted on the connecting frame 13, and the base plate 42 is mounted on the base 11. One end of the connecting frame 13 is fitted onto the support column 12, and the connecting frame 13 is provided with several locking bolts 14 for locking the connecting frame 13 onto the support column 12. Thus, by tightening the locking bolts 14, the connecting frame 13 (as shown) can be secured to the support column 12. Figure 4 As shown, one end of the connecting bracket 13 is C-shaped, and the locking bolt 14 passes through both ends of the C-shaped opening to clamp the support column 12 and complete the locking.

[0033] like Figure 1 and Figure 2As shown, in order to drive the upper punching die 30, the drive mechanism 20 specifically includes a handle 21 and a transmission shaft 22. The transmission shaft 22 is vertically mounted on the connecting frame 13, and the cover plate 31 is set at the bottom end of the transmission shaft 22. The handle 21 is rotatably mounted on the connecting frame 13 and connected to the transmission shaft 22 through a transmission component. When the handle 21 is rotated, the transmission shaft 22 moves up and down. The drive component can drive the transmission shaft 22 to move up and down by rotating the handle 21. For example, a gear can be set at one end of the handle 21, and a rack (extending vertically) that meshes with the gear can be set on the transmission shaft 22. The gear is rotatably mounted on the connecting component 13, so that rotating the gear can drive the transmission shaft 22 to move up and down, thereby driving the upper punching die 30 to move up and down, and thus causing the punch 33 to move up and down.

[0034] like Figure 1 and Figure 2 As shown, to make the drive mechanism 20 of the transmission shaft 22 further include a connecting plate 23, a connecting rod 24, and a reset spring 25, the connecting plate 23 is set at the top of the transmission shaft 22, the connecting rod 24 is vertically set on the connecting frame 13, and the connecting rod 24 passes through the connecting plate 23. One end of the reset spring 25 is connected to the top of the connecting rod 24, and the other end is connected to the top of the transmission shaft 22. Thus, when the punch 33 descends and cuts off the defective product, the handle 21 is released, and the transmission shaft 22 is elastically reset by the reset spring 25, which drives the upper punching die 30 to rise and reset. In addition, several limiting bolts 26 are vertically set on the connecting plate 23. The limiting bolts 26 are threadedly connected to the connecting plate 23. When the upper punching die 30 is driven to descend to a certain height, the bottom of the limiting bolts 26 presses against the connecting frame 13, thereby limiting the descent height of the upper punching die 30. Rotating the limiting bolts can control the descent distance of the transmission shaft 22, thereby controlling the punching depth of the punch 33.

[0035] like Figure 1 and Figure 2 As shown, the upper punching die 30 also includes an unloading plate 34, several guide pillars 35, and a return spring 36. The unloading plate 34 is located below the punch mounting plate 32. The several guide pillars 35 are vertically arranged on the cover plate 31 and pass through the unloading plate 34 from top to bottom. One end of the return spring 36 is connected to the top of the unloading plate 34, and the other end is connected to the bottom of the punch mounting plate 32. Thus, when the upper punching die 30 descends to a certain height, the unloading plate 34 contacts the carrying plate 41 and is stopped, and the return spring 36 is compressed. When the upper punching die 30 rises, the elastic force of the return spring 36 increases the distance between the unloading plate 34 and the punch mounting plate 32, pushing the product downward and preventing the product from getting stuck on the punch 33, and rising with the punch 33.

[0036] like Figure 3As shown, in order to facilitate the collection of defective products cut off, the punching die 40 also includes a collection box 44. A groove is provided on one side of the base plate 42. The collection box 44 is horizontally slidably disposed in the groove. The bottom outlet of the concave hole is connected to the groove. In this way, after the punch 33 cuts the defective product, the defective product falls from the concave hole into the collection box 44 in the groove, thus completing the collection of the defective product.

[0037] like Figures 2-4 As shown, the carrier plate 41 is provided with a number of guide holes 45 corresponding to the guide posts 35. After the upper punching die 30 descends to a certain height, the guide posts 35 are inserted into the guide holes 45. The guide posts 35 and the guide holes 45 play a guiding role in punching, improving the accuracy of the punching position and ensuring that the punch 33 can accurately cut the target position.

[0038] like Figure 4 As shown, the upper punching die 30 also includes an observation window 37, which runs from top to bottom through the cover plate 31, the punch mounting plate 32, and the unloading plate 34. Through the observation window 37, the corresponding defective products in the row of products can be quickly placed into the punching recess module 43 without having to look down or observe from the side, making the operation more convenient.

[0039] In summary, during use, rows of products are placed on the carrier plate 41, and defective products to be removed are placed on the punching recess module 43 to complete the positioning of the target defective product. The drive mechanism 20 is used to drive the punch 33 to move downward, and the punch 36 cuts the connecting ribs on both sides of the target defective product at the recess directly below. Then, the drive mechanism 20 drives the punch 33 to move upward, and the rows of products are left on the carrier plate for easy removal. This achieves the purpose of removing the corresponding defective product from the rows of products, which not only improves efficiency but also reduces damage to the products.

[0040] The above are merely preferred embodiments of this application, and the present invention is not limited to the above embodiments. It is understood that other improvements and variations that can be directly derived or conceived by those skilled in the art without departing from the spirit and concept of the present invention should be considered to be included within the protection scope of the present invention.

Claims

1. A punching device for defective semiconductor devices, characterized in that, include: A frame (10) is provided with a drive mechanism (20), an upper punching die (30) and a lower punching die (40); The punching upper die (30) includes a cover plate (31), a punch mounting plate (32) and a punch (33). The punch mounting plate (32) is disposed at the bottom of the cover plate (31), and the punch (33) is disposed at the bottom of the punch mounting plate (32). The punching die (40) includes a carrier plate (41), a base plate (42), and a punching recess module (43); the base plate (42) is located directly below the punch (33), the carrier plate (41) is located on the top surface of the base plate (42), the punching recess module (43) is located inside the carrier plate (41), the top surface of the punching recess module (43) is on the same horizontal plane as the top surface of the carrier plate (41), and the punching recess module (43) is provided with an upward-opening recessed hole, which is adapted to the punch (33); The drive mechanism (20) is used to drive the punch (33) to perform lifting and lowering movements.

2. The semiconductor device defective product punching device according to claim 1, characterized in that: The frame (10) includes a base (11), a support column (12) and a connecting frame (13). The support column (12) is vertically mounted on the base (11), the connecting frame (13) is mounted on the support column (12), the upper punching die (30) is mounted on the connecting frame (13), and the base plate (42) is mounted on the base (11).

3. The semiconductor device defective product punching device according to claim 2, characterized in that: One end of the connecting frame (13) is sleeved on the support column (12), and the connecting frame (13) is provided with a plurality of locking bolts (14) for locking the connecting frame (13) on the support column (12).

4. The semiconductor device defective product punching device according to claim 2, characterized in that: The drive mechanism (20) includes a handle (21) and a drive shaft (22). The drive shaft (22) is vertically mounted on the connecting frame (13). The cover plate (31) is located at the bottom end of the drive shaft (22). The handle (21) is rotatably mounted on the connecting frame (13) and connected to the drive shaft (22) through a transmission component. When the handle (21) rotates, the drive shaft (22) moves up and down.

5. The semiconductor device defective product punching device according to claim 4, characterized in that: The drive mechanism (20) also includes a connecting plate (23), a connecting rod (24), and a reset spring (25). The connecting plate (23) is disposed at the top end of the drive shaft (22). The connecting rod (24) is vertically disposed on the connecting frame (13). The connecting rod (24) passes through the connecting plate (23). One end of the reset spring (25) is connected to the top end of the connecting rod (24), and the other end is connected to the top end of the drive shaft (22).

6. The semiconductor device defective product punching device according to claim 5, characterized in that: A plurality of limiting bolts (26) are vertically arranged on the connecting plate (23), and the limiting bolts (26) are threadedly connected to the connecting plate (23).

7. The semiconductor device defective product punching device according to claim 1, characterized in that: The upper punching die (30) also includes a stripper plate (34), a number of guide posts (35) and a return spring (36). The stripper plate (34) is located below the punch mounting plate (32). The number of guide posts (35) are vertically arranged on the cover plate (31) and pass through the stripper plate (34) from top to bottom. One end of the return spring (36) is connected to the top of the stripper plate (34) and the other end is connected to the bottom of the punch mounting plate (32).

8. The semiconductor device defective product punching device according to claim 1, characterized in that: The punching die (40) also includes a collection box (44). A groove is provided on one side of the base plate (42). The collection box (44) is horizontally slidably disposed in the groove. The bottom outlet of the concave hole is connected to the groove.

9. A punching device for defective semiconductor devices according to claim 7, characterized in that: The carrier plate (41) is provided with a plurality of guide holes (45) corresponding one-to-one with the guide post (35).

10. A punching device for defective semiconductor devices according to claim 7, characterized in that: The punching upper die (30) also includes an observation window (37), which passes through the cover plate (31), the punch mounting plate (32) and the unloading plate (34) from top to bottom.

Images