Circuit board foil surface treatment device

Abstract

A circuit board foil surface treatment device relates to the technical field of circuit board foil production, and comprises a coarsening tank body and a foil surface, the inner side of the coarsening tank body is rotatably provided with a liquid extrusion roller and a conductive roller, the foil surface is extruded by the liquid extrusion roller and the conductive roller to discharge liquid, anode plates are fixed on the front side and the rear side, corresponding to the foil surface, in the coarsening tank body, and the front side and the rear side of the foil surface are respectively provided with an anode plate. According to the circuit board foil surface treatment device, when copper foil runs, the current density is improved, the cathode polarization can be improved, the electroplating efficiency can be improved, plating layer crystallization of the copper foil is more compact, and the copper foil surface treatment device has the advantages that the copper foil surface treatment effect is better, and the service life of the copper foil surface treatment device is prolonged. And the plating layer crystal is finer, that is, the appearance of the copper foil is reduced, and the electroplated crystal is more compact and uniform in growth vigor, so that short circuit and open circuit cannot occur when downstream customers use the copper foil, the current density can be improved to a certain extent, and the increase of the electric power cost is reduced.

Description

Technical Field

[0001] This utility model relates to the field of circuit board foil production technology, and in particular to a circuit board foil surface treatment device. Background Technology

[0002] Copper foil is an important material for copper-clad laminates (CCL) and circuit boards. Circuit board foil is the conductor in aluminum-based circuit boards and is also a cathodic electrolytic material, generally a thin, continuous metal foil deposited on the substrate layer of the circuit board. The production of circuit board foil differs from that of battery foil. There are significant differences in the process, from the preparation of the copper molten solution to the addition of additives, and the production of copper foil on the foil-making machine. Circuit board foil produced on the foil-making machine does not have anti-oxidation properties. The guide rollers are simpler than those for lithium battery foil. The most important aspect is surface treatment, which involves a series of processes such as pickling, curing, roughening, and alloying to improve peel resistance and oxidation resistance. In the surface treatment stage, it is necessary to consider not only the uniformity of the secondary electroplating but also various indicators, which cannot be too high or too low. When adjusting the current or changing parameters in the surface treatment stage, it is necessary not only to refer to the internal indicators to meet the standards but also to ensure that defects are minimized in appearance. Generally, performance and indicators are improved by changing the current parameters or the parameters of additives, but simply increasing the current will cause surface defects on the foil surface, and the indicators will not meet the requirements.

[0003] Currently, the method for adjusting foil surface roughness is to adjust the current. Generally, if the roughness is too high, it will not meet the requirements of downstream customers. Therefore, reducing the roughness by reducing the roughening current will cause the foil surface to turn white, which will not meet the usage requirements. Utility Model Content

[0004] The technical problem to be solved by this utility model is to overcome the existing defects and provide a circuit board foil surface treatment device. When the copper foil is running, increasing the current density can improve the cathode polarization, improve the electroplating efficiency, and make the plating layer crystal denser and more uniform. The finer the plating crystal, the smaller the appearance of the copper foil. The electroplated crystals are denser and have more uniform growth, so that downstream customers will not experience short circuits or open circuits during use. It can improve the current density to a certain extent and reduce the increase in electricity costs, which can effectively solve the problems in the background technology.

[0005] To achieve the aforementioned objective, this utility model adopts the following technical solution:

[0006] A circuit board foil surface treatment device includes a roughening tank and a foil surface. A squeezing roller and a conductive roller are rotatably installed on the inner side of the roughening tank. The foil surface is squeezed by the squeezing roller and the conductive roller to discharge liquid. An anode plate is fixed on the front and rear sides of the foil surface in the roughening tank. A first shielding plate is provided on the anode plate near the lower end. A second shielding plate is fixed on both the left and right sides of the anode plate. A copper busbar is installed on the side of the roughening tank.

[0007] Furthermore, it also includes an overflow port, which is located on the side of the roughening tank.

[0008] Furthermore, the roughening tank is made of PVC, with a width of 800mm and a length of 2000mm.

[0009] Furthermore, the conductive roller is made of stainless steel and has a diameter of 260 mm.

[0010] Furthermore, the squeezing roller is made of polytetrafluoroethylene and has a diameter of 210 mm.

[0011] Furthermore, the anode plate is a titanium-coated iridium structure, the original length of the anode plate is 750mm, and the length of the anode plate blocked by the first shielding plate is 250mm.

[0012] Compared with the prior art, the beneficial effects of this utility model are as follows: This circuit board foil surface treatment device has the following advantages: By reducing the size of the anode plate during the roughening stage of copper foil surface treatment, the area of ​​the anode plate is reduced. The current density of the copper foil during operation can be increased, which can improve cathode polarization, improve electroplating efficiency, and make the plating layer crystal more dense and uniform. The plating layer crystal is finer, which reduces the appearance of the copper foil. The electroplated crystals are denser and have uniform growth, so that downstream customers will not experience short circuits or open circuits. It can also reduce the vertical color difference of the electroplated surface, making the color more uniform and the appearance will not be degraded. In addition, it can greatly improve the uneven roughness of the processed copper foil. By adjusting the electroplating size of the anode plate, the current density can be increased to a certain extent and the increase in power costs can be reduced. Attached Figure Description

[0013] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0014] Figure 2 This is a three-dimensional cross-sectional structural diagram of the present invention.

[0015] In the diagram: 1-roughening tank, 2-copper busbar, 3-overflow port, 4-second shielding plate, 5-squeezing roller, 6-anode plate, 7-first shielding plate, 8-conductive roller. Detailed Implementation

[0016] The present invention will be explained in detail through the following embodiments. The purpose of disclosing the present invention is to protect all technical improvements within the scope of the present invention.

[0017] Please see Figure 1-2 This embodiment provides a technical solution: a circuit board foil surface treatment device, including a roughening tank 1 and a foil surface. A squeezing roller 5 and a conductive roller 8 are rotatably mounted on the inner side of the roughening tank 1. The foil surface is squeezed by the squeezing roller 5 and the conductive roller 8 to discharge liquid. An anode plate 6 is fixed inside the roughening tank 1 corresponding to the front and rear sides of the foil surface. A first shielding plate 7 is provided on the anode plate 6 near its lower end. Second shielding plates 4 are fixed on both the left and right sides of the anode plate 6. Copper busbars 2 are installed on the sides of the roughening tank 1. The main function of the second shielding plates 4 is to prevent discharge at the tips of the anode plates 6. The copper busbars 2 mainly provide conductivity, effectively transmitting current throughout the circuit and connecting electrical equipment. By reducing the size of the anode plate 6 during the roughening stage of the copper foil surface treatment, the area of ​​the anode plate 6 is reduced. This increases the current density during copper foil operation, improving cathode polarization and electroplating efficiency. The resulting plating layer crystals are denser, more uniform, and finer, thus reducing the appearance of the copper foil. The more dense and uniformly grown crystals prevent short circuits and open circuits for downstream customers. It also reduces vertical color differences on the electroplated surface, resulting in more uniform color and no degradation in appearance. Furthermore, it significantly improves the uneven roughness of the treated copper foil. Adjusting the electroplating size of the anode plate 6 can, to some extent, increase the current density and reduce the increase in electricity costs.

[0018] It also includes an overflow port 3, which is located on the side of the roughening tank 1. When the liquid in the roughening tank 1 reaches a certain amount, it overflows through the overflow port 3 to avoid excessive liquid.

[0019] The roughening tank 1 is made of PVC and is 800mm wide and 2000mm long. After pickling and washing, the foil is squeezed by the squeezing roller 5 and the conductive roller 8 to remove the liquid from the foil surface. Then it enters the first stage of roughening. The roughening tank 1 contains a roughening solution and two anode plates 6. When the roughening tank 1 is energized, the foil surface reacts with the anode plates 6 to complete the electroplating when the foil surface rotates. There are anode plates 6 on both the front and back of the foil surface. The two anode plates 6 have the same area, and the area of ​​the first shielding plate 7 is also the same to ensure uniform electroplating on both sides of the foil surface.

[0020] The conductive roller 8 is made of stainless steel with a diameter of 260mm, the squeezing roller 5 is made of polytetrafluoroethylene with a diameter of 210mm, and the anode plate 6 is made of titanium-coated iridium. The original length of the anode plate 6 is 750mm, and the length of the anode plate 6 blocked by the first shielding plate 7 is 250mm. By changing the area of ​​the roughened anode plate 6 in the surface treatment stage, the electroplating area is changed. The lower end of the anode plate 6 is blocked by the first shielding plate 7 to reduce the electroplating area, so that the length of the anode plate 6 is reduced from the original 750mm to 500mm, a reduction of 250mm. By reducing the length of the anode plate 6 and thus reducing the electroplating area, the current density is increased. Current density is the current passing through a unit area. Reducing the area increases the current density, thereby improving the electroplating efficiency and making the electroplating more uniform. At the same time, the copper crystals grow more densely. If the current of the roughening process is increased without reducing the electroplating area, it will lead to surface defects on the foil surface.

[0021] The working principle of the circuit board foil surface treatment device provided by this utility model is as follows: The roughening tank 1 is made of PVC. After pickling and washing, the foil is squeezed by the squeezing roller 5 and the conductive roller 8 to remove the liquid from the foil surface. Then it enters the first stage of roughening. The roughening tank 1 contains a roughening solution and two anode plates 6. When current is passed through the roughening tank 1, the foil surface reacts with the anode plates 6 to complete the electroplating when the foil surface rotates. There are anode plates 6 on both the front and back of the foil surface. The two anode plates 6 have the same area, and the area of ​​the first shielding plate 7 is also the same to ensure uniform electroplating on both sides of the foil surface. By changing the surface treatment stage... The area of ​​the roughened anode plate 6 in the section is changed to alter the electroplating area. The lower end of the anode plate 6 is blocked by the first shielding plate 7 to reduce the electroplating area, thereby reducing the length of the anode plate 6 from 750mm to 500mm, a reduction of 250mm. By reducing the length of the anode plate 6 and thus the electroplating area, the current density is increased. Current density is the current passing through a unit area. Reducing the area increases the current density, thereby improving electroplating efficiency and making the electroplating more uniform. At the same time, the copper crystals grow more densely. If the current is increased unilaterally without reducing the electroplating area, it will lead to surface defects on the foil surface.

[0022] It is worth noting that the components disclosed in the above embodiments are all general standard parts or parts known to those skilled in the art, and their structures and principles can be learned by those skilled in the art through technical manuals or conventional experimental methods.

[0023] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances. For example, a rotary connection can refer to a rotary connection through a bearing.

[0024] The parts of this utility model not described in detail are prior art. Although this utility model has been specifically shown and introduced in conjunction with preferred embodiments, there are many methods and approaches to implement this technical solution. The above description is only a preferred embodiment of this utility model. However, those skilled in the art should understand that various changes in form and detail can be made to this utility model without departing from the spirit and scope of this utility model as defined by the appended claims, and all such changes shall be within the protection scope of this utility model.

Claims

1. A circuit board foil surface treatment apparatus, comprising a roughening tank (1) and a foil surface, characterized in that: The inner side of the roughening tank (1) is rotatably equipped with a squeezing roller (5) and a conductive roller (8). The foil surface is squeezed by the squeezing roller (5) and the conductive roller (8) to discharge the liquid. The front and rear sides of the roughening tank (1) are fixed with an anode plate (6). A first shielding plate (7) is provided on the anode plate (6) near the lower end. A second shielding plate (4) is fixed on both the left and right sides of the anode plate (6). A copper busbar (2) is installed on the side of the roughening tank (1).

2. The circuit board foil surface treatment apparatus according to claim 1, characterized in that: It also includes an overflow port (3), which is located on the side of the roughening tank (1).

3. The circuit board foil surface treatment apparatus according to claim 1, characterized in that: The roughening tank (1) is made of PVC and has a width of 800 mm and a length of 2000 mm.

4. The circuit board foil surface treatment apparatus according to claim 1, characterized in that: The conductive roller (8) is made of stainless steel and has a diameter of 260 mm.

5. The circuit board foil surface treatment apparatus according to claim 1, characterized in that: The squeezing roller (5) is made of polytetrafluoroethylene and has a diameter of 210 mm.

6. The circuit board foil surface treatment apparatus according to claim 1, characterized in that: The anode plate (6) is a titanium-coated iridium structure. The original length of the anode plate (6) is 750mm, and the length of the anode plate (6) blocked by the first shielding plate (7) is 250mm.

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