Electroplating supporting seat and electroplating equipment

Abstract

The utility model relates to the technical field of electroplating equipment, and discloses an electroplating supporting seat and electroplating equipment, the electroplating supporting seat comprises a supporting seat and a liquid supply assembly, the supporting seat comprises a body part and supporting parts, the body part comprises two supporting surfaces which are arranged at an angle, and a plurality of supporting parts are protruded on the supporting surfaces in the direction deviating from the body part; at least part of the supporting part is contacted with the roller conductive rod; the liquid supply assembly is connected to the supporting base and used for providing conductive liquid for the supporting face so as to increase the conductive area between the supporting face and the roller conductive rod. In the rotating process of the roller current-conducting rod, the supporting part has a stripping effect on the oxide layer on the surface of the roller current-conducting rod, the stripped oxide layer is scoured by the conductive liquid, and the conductive efficiency between the roller current-conducting rod and the electroplating supporting seat is further improved.

Description

Technical Field

[0001] This utility model relates to the field of electroplating equipment technology, and in particular to an electroplating support base and electroplating equipment. Background Technology

[0002] An electroplating support is a cathode conductive device used in electroplating. Its main function is to provide support and conduct electricity to the edge of the electroplating tank, such as for supporting the conductive rods of the roller.

[0003] In existing technologies, copper electroplating support bases are commonly used. Under high-temperature working conditions, the reaction rate of copper with oxygen will accelerate, causing the surface of the electroplating support base and the roller conductive rod to oxidize and turn black. Corrosive gases such as carbon dioxide, sulfur dioxide, and nitrogen oxides in the air will also accelerate the oxidation of the surface of the electroplating support base and the roller conductive rod. Dust, salt, acid mist and other airborne sediments will also corrode the surface of the electroplating support base and the roller conductive rod, accelerating their oxidation.

[0004] In related technologies, water is usually introduced into the surface of the electroplating support to wash away impurities, but this method has the problem of poor washing effect. Utility Model Content

[0005] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes an electroplating support base and electroplating equipment, which can increase the gap between the support surface and the roller conductive rod through the support part, so as to facilitate the filling and flushing of conductive liquid on the roller conductive rod and the support surface.

[0006] On one hand, this utility model embodiment provides an electroplating support base, including:

[0007] The support base includes a body part and a support part. The body part includes two support surfaces arranged at an angle. A plurality of the support parts protrude from the support surfaces in a direction away from the body part. At least a portion of the support parts are in contact with the roller conductive rod.

[0008] A liquid supply assembly, connected to the support base, is used to supply conductive liquid to the support surface to increase the conductive area between the support surface and the roller conductive rod.

[0009] According to some embodiments of the present invention, the main body is provided with a liquid supply through hole, one end of which is connected to the liquid supply component, and the other end of which is connected to at least one of the two support surfaces.

[0010] According to some embodiments of the present invention, the support base includes a plurality of support parts, arranged layer by layer along the direction from the liquid supply hole to the bottom of the support base, with the number of support parts in each layer gradually increasing, and adjacent support parts in adjacent layers being staggered.

[0011] According to some embodiments of the present invention, the main body is provided with a clearance groove, which is located at the intersection of the two supporting surfaces and is used to avoid the roller conductive rod.

[0012] According to some embodiments of the present invention, the liquid supply assembly includes a flow control valve, which is capable of controlling the flow rate of the conductive liquid supplied by the liquid supply assembly.

[0013] According to some embodiments of the present invention, the electroplating support base further includes a water receiving tray, the water receiving tray is provided with a water receiving groove, and the support base is connected to the water receiving tray and located in the water receiving groove.

[0014] According to some embodiments of the present invention, the water receiving tray is provided with an openable and closable water receiving outlet, which is suitable for the conductive liquid in the water receiving tank to flow out.

[0015] According to some embodiments of the present invention, the main body includes two support blocks arranged opposite to each other, each support block having a support surface, the support blocks being detachably connected to the water receiving tray, and the distance between the two support blocks being adjustable.

[0016] According to some embodiments of the present invention, the electroplating support base further includes a support baffle, which is disposed on one side of the support base along a direction parallel to the support surface.

[0017] On the other hand, this utility model embodiment also provides an electroplating device, including the electroplating support base as described above.

[0018] The present invention has at least the following beneficial effects: by providing a support portion, a gap is reserved between the support surface and the roller conductive rod to allow conductive liquid to pass through, which facilitates the conductive liquid to wash away impurities on the support surface or the roller conductive rod surface; at the same time, the conductive liquid is fully filled between the support surface and the roller conductive rod, improving the conductivity between the electroplating support and the roller conductive rod; and during the rotation of the roller conductive rod, the support portion peels off the oxide layer on the surface of the roller conductive rod, and the peeled oxide layer is washed away by the conductive liquid, further improving the conductivity between the roller conductive rod and the electroplating support.

[0019] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0020] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0021] Figure 1 This is a schematic diagram of the structure of the electroplating support base according to an embodiment of the present utility model. Attached image description:

[0023] 100. Support base; 110. Body; 111. Support surface; 112. Liquid supply through hole; 113. Clearance groove; 114. Support block; 120. Support part;

[0024] 200, Liquid supply assembly; 210, Flow control valve; 400, Water receiving tray; 410, Water receiving trough; 420, Water outlet. Detailed Implementation

[0025] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0026] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0027] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If "first," "second," etc., are used in the description, they are only for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the sequential relationship of the indicated technical features.

[0028] In the description of this utility model, unless otherwise explicitly defined, the terms "setting", "installation", "connection", etc. should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in combination with the specific content of the technical solution.

[0029] Please refer to Figure 1This embodiment discloses an electroplating support base for supporting a roller conductive rod. The electroplating support base includes a support base 100 and a liquid supply assembly 200. The support base 100 includes a body portion 110 and a support portion 120. The body portion 110 includes two support surfaces 111 arranged at an angle. Several support portions 120 protrude from the support surfaces 111 in a direction away from the body portion 110. At least some of the support portions 120 are in contact with the roller conductive rod. The liquid supply assembly 200 is connected to the support base 100 and is used to provide conductive liquid to the support surfaces 111 to increase the conductive area between the support surfaces 111 and the roller conductive rod.

[0030] According to the electroplating support of this utility model embodiment, when there is an electroplating requirement, the roller conductive rod is placed between two support surfaces 111 and abuts against a portion of the support part 120. The conductive liquid provided by the liquid supply assembly 200 flows along the support surface 111 and fills a portion of the space between the roller conductive rod and the support surface 111. The current from the external power supply of the electroplating support flows to the product to be electroplated through the body part 110, the support part 120 or the conductive liquid, and the roller conductive rod, thereby realizing the electroplating process of the product.

[0031] According to the electroplating support base of this utility model embodiment, by providing a support part 120, a gap is reserved between the support surface 111 and the roller conductive rod to allow conductive liquid to pass through, which facilitates the conductive liquid to wash away impurities on the surface of the support surface 111 or the roller conductive rod; at the same time, the conductive liquid is fully filled between the support surface 111 and the roller conductive rod, improving the conductivity between the electroplating support base and the roller conductive rod; and during the rotation of the roller conductive rod, the support part 120 plays a peeling role on the oxide layer on the surface of the roller conductive rod, and the peeled oxide layer is washed away by the conductive liquid, further improving the conductivity between the roller conductive rod and the electroplating support base.

[0032] In this embodiment, the conductive liquid can be water, which can cool the electroplating conductive base or the roller conductive rod while improving the conductivity. Of course, in other embodiments, the conductive liquid can also be an organic electrolyte solution, liquid metal alloy, etc.

[0033] In this embodiment, the angle between the two support surfaces 111 ranges from 30 degrees to 60 degrees. Of course, the specific angle can be adjusted based on actual needs.

[0034] In some embodiments, combined with Figure 1 As shown, the main body 110 is provided with a liquid supply through hole 112. One end of the liquid supply through hole 112 is connected to the liquid supply assembly 200, and the other end of the liquid supply through hole 112 is connected to at least one of the two support surfaces 111. The conductive liquid is concentrated through the liquid supply through hole 112 to prevent the conductive liquid from spilling before flowing to the support surface 111.

[0035] In this embodiment, the main body 110 is provided with an independent liquid supply through hole 112 corresponding to each support surface 111, and the flow rate of each liquid supply through hole 112 is independently controlled to individually control the flow rate of conductive liquid on the surface of each support surface 111; of course, in other embodiments, two liquid supply through holes 112 can also be connected in series; or a liquid supply through hole 112 can be provided on only one support surface 111.

[0036] In some embodiments, combined with Figure 1 As shown, the support base 100 includes multiple support parts 120, which are arranged in the direction of the liquid supply through hole 112 pointing to the bottom of the support base 100 (the opposite direction of the Z direction in the figure). The multiple support parts 120 are arranged layer by layer, and the number of support parts 120 in each layer gradually increases. The adjacent support parts 120 in adjacent layers are staggered.

[0037] In this embodiment, the conductive liquid flows downward from the liquid supply hole 112 along the support surface 111. After encountering the support portion 120 of the first layer, it is diverted to both sides of the support portion 120. The diverted conductive liquid encounters the support portion 120 of the second layer and is diverted again. Through the multi-layered and staggered support portions 120, the conductive liquid flowing out of the liquid supply hole 112 is diverted, so that the conductive liquid fully fills and flushes the support surface 111.

[0038] In this embodiment, the self-supplying liquid through hole 112 is provided with three layers of support parts 120 downwards, and the number of support parts 120 from top to bottom is four, five and six; of course, in other embodiments, the number of layers and number of support parts 120 can be adjusted adaptively.

[0039] In some embodiments, combined with Figure 1 As shown, the main body 110 is provided with a clearance groove 113, which is located at the intersection of the two support surfaces 111 and is used to avoid the roller conductive rod. The clearance groove 113 prevents the roller conductive rod from directly contacting the support base 100 and ensures that the roller conductive rod abuts against the support part 120.

[0040] In some embodiments, combined with Figure 1 As shown, the liquid supply assembly 200 includes a flow control valve 210, which controls the flow rate of the conductive liquid supplied by the liquid supply assembly 200. This prevents insufficient flow of the conductive liquid from causing insufficient heat dissipation, which could lead to conductive heating between the roller conductive rod and the electroplating support, causing some of the conductive liquid to evaporate and oxidize the electroplating support. It also prevents excessive flow from causing the conductive liquid to splash or having excessive scouring force, which could wash oxides on the surface of the electroplating support into the electroplating tank containing the electroplating solution, thus affecting the electroplating process.

[0041] In some embodiments, combined with Figure 1As shown, the electroplating support also includes a water receiving tray 400, which has a water receiving groove 410. The support 100 is connected to the water receiving tray 400 and located within the water receiving groove 410. The water receiving groove 410 receives the conductive liquid flowing through the support surface 111 and the impurities washed away by the conductive liquid, preventing the conductive liquid or impurities from entering the electroplating tank and affecting the electroplating process.

[0042] In some embodiments, combined with Figure 1 As shown, the water receiving tray 400 is provided with an openable and closable water receiving outlet 420, which is suitable for the conductive liquid in the water receiving tank 410 to flow out. The conductive liquid is collected in the water receiving tank 410 and released through the water receiving outlet 420. The conductive liquid can be reused after impurities are removed, reducing the cost of using the electroplating support.

[0043] In some embodiments, combined with Figure 1 As shown, the main body 110 includes two support blocks 114 arranged opposite to each other. Each support block 114 is provided with a support surface 111. The support blocks 114 are detachably connected to the water receiving tray 400, and the distance between the two support blocks 114 is adjustable.

[0044] In this embodiment, by moving the support block 114 to increase the distance between the support surfaces 111, the electroplating support base can make the roller conductive rod abut against the support part 120 when adapting to roller conductive rods of different diameters.

[0045] In this embodiment, the detachable connection can be achieved by pin connection, plug connection, magnetic attraction, adhesive connection, etc.

[0046] In some embodiments, the electroplating support base further includes a support baffle (not shown in the figure), which is disposed on one side of the support base 100 along a direction parallel to the support surface 111 (Y direction in the figure). The support baffle is used to prevent the roller conductive rod from moving along the direction parallel to the support surface 111, avoid the roller conductive rod from detaching from the support base 100, and improve the safety of the electroplating support base in use.

[0047] On the other hand, this utility model embodiment also provides an electroplating device, including an electroplating support base as described in the above embodiment.

[0048] The electroplating equipment according to the embodiment of this utility model has the same technical effect as the electroplating support base according to the embodiment of this utility model, and will not be described again here.

[0049] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. An electroplating support base for supporting a roller conductive rod, characterized in that, include: The support base (100) includes a body part (110) and a support part (120). The body part (110) includes two support surfaces (111) arranged at an angle. A plurality of the support parts (120) protrude from the support surfaces (111) in a direction away from the body part (110). At least a portion of the support parts (120) are in contact with the roller conductive rod. A liquid supply assembly (200), connected to the support base (100), is used to supply conductive liquid to the support surface (111) to increase the conductive area between the support surface (111) and the roller conductive rod.

2. The electroplating support base according to claim 1, characterized in that, The main body (110) is provided with a liquid supply through hole (112), one end of which is connected to the liquid supply assembly (200), and the other end of which is connected to at least one of the two support surfaces (111).

3. The electroplating support base according to claim 2, characterized in that, The support base (100) includes a plurality of support parts (120). Along the direction from the liquid supply through hole (112) to the bottom of the support base (100), the plurality of support parts (120) are arranged layer by layer, the number of support parts (120) in each layer gradually increases, and the adjacent support parts (120) in adjacent layers are staggered.

4. The electroplating support base according to claim 1, characterized in that, The main body (110) is provided with a clearance groove (113), which is located at the intersection of the two support surfaces (111) and is used to avoid the roller conductive rod.

5. The electroplating support base according to claim 1, characterized in that, The liquid supply assembly (200) includes a flow control valve (210) which is capable of controlling the flow rate of the conductive liquid supplied by the liquid supply assembly (200).

6. The electroplating support base according to any one of claims 1 to 5, characterized in that, The electroplating support base also includes a water receiving tray (400), which has a water receiving groove (410). The support base (100) is connected to the water receiving tray (400) and located in the water receiving groove (410).

7. The electroplating support base according to claim 6, characterized in that, The water receiving tray (400) is provided with a water receiving outlet (420) that can be opened and closed, and the water receiving outlet (420) is suitable for the conductive liquid in the water receiving tank (410) to flow out.

8. The electroplating support base according to claim 6, characterized in that, The main body (110) includes two support blocks (114) arranged opposite to each other. Each support block (114) is provided with a support surface (111). The support blocks (114) are detachably connected to the water receiving tray (400), and the distance between the two support blocks (114) is adjustable.

9. The electroplating support base according to claim 6, characterized in that, The electroplating support also includes a support baffle. Along a direction parallel to the support surface (111), the support baffle is disposed on one side of the support (100), and the support baffle is at least partially higher than the support portion (120).

10. An electroplating device, characterized in that, Includes the electroplating support base as described in any one of claims 1 to 9.

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