Integrated pressure and temperature sensor

By directly electrically connecting the pressure sensor and temperature sensor components in an integrated pressure and temperature sensor, the complexity of manufacturing and assembly in existing technologies is solved, achieving simple and efficient sensor integration suitable for a variety of application scenarios.

CN223623643UActive Publication Date: 2025-12-02SESATA SCI & TECH CHANGZHOU CO LTD
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Patent Information

Application Number
CN202423077231.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-12
Publication Date
2025-12-02
Estimated Expiration
2034-12-12

AI Technical Summary

Technical Problem

Existing integrated pressure and temperature sensors are complex to manufacture and assemble, especially due to the use of carrier components, which makes the structure less simple and flexible.

Method used

An integrated pressure and temperature sensor is designed, in which the pressure sensor component and temperature sensor component are directly electrically connected within the housing and fixed by brazing with electrical conductors. Optionally, a carrier component can be used for integration, simplifying the manufacturing and assembly process.

Benefits of technology

It achieves efficient integration of pressure and temperature sensors, simplifies the manufacturing process, improves assembly flexibility and structural simplicity, and adapts to the needs of different application scenarios.

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Abstract

The utility model relates to an integrated pressure and temperature sensor which comprises a shell (10), the shell is provided with a cavity and a fluid inlet (7) used for introducing fluid to be measured into the cavity, and a pressure sensor assembly (30) used for sensing the pressure of the fluid to be measured and a temperature sensor assembly (20) used for sensing the temperature of the fluid to be measured are contained in the cavity. The utility model relates to a pressure sensor assembly (10) for a temperature sensor assembly, comprising a bore (14) which receives an electrical conductor (14) for the temperature sensor assembly, which electrical conductor is electrically connected to a temperature sensing element of the temperature sensor assembly, which electrical conductor is fixed in the bore by brazing, the bore being sealed in a fluid-tight manner by a brazing material in the bore. The integrated pressure and temperature sensor has a compact structure and is easy to assemble.
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Description

Technical Field

[0001] This application relates to a sensor, specifically an integrated pressure and temperature sensor. Background Technology

[0002] Integrated pressure-temperature sensors are known in practice; they can sense not only the pressure of the fluid being measured but also its temperature simultaneously. These sensors can be widely used in applications requiring both pressure and temperature determination, such as in vehicles, particularly in automotive air conditioning systems, battery coolant systems, and engine lubrication systems. For example, patent document CN102980714A discloses such an integrated pressure-temperature sensor.

[0003] In practice, known integrated pressure and temperature sensors can have a carrier assembly. The pressure sensor assembly and the temperature sensor assembly can be positioned on opposite sides of this carrier assembly, with the temperature sensor assembly located on the side of the carrier assembly facing the fluid inlet, and the pressure sensor assembly located on the side of the carrier assembly facing away from the fluid inlet. This carrier assembly acts as a bridge for integrating the temperature and pressure sensor assemblies. Because this carrier assembly provides a path for temperature signal transmission, it can also be called a temperature sensor carrier or a T-shaped carrier. Utility Model Content

[0004] The objective of this application is to provide an integrated pressure-temperature sensor that can be advantageously manufactured and assembled.

[0005] The task is solved by an integrated pressure-temperature sensor comprising a housing having a chamber and a fluid inlet for introducing a fluid to be measured into the chamber, wherein a pressure sensor assembly for sensing the pressure of the fluid to be measured and a temperature sensor assembly for sensing the temperature of the fluid to be measured are housed in the chamber, the pressure sensor assembly having a perforation receiving an electrical conductor for the temperature sensor assembly, the electrical conductor being electrically connected to a temperature sensing element of the temperature sensor assembly, the electrical conductor being brazed and fixed in the perforation, the brazing material in the perforation flow-tightly sealing the perforation.

[0006] In the integrated pressure and temperature sensor according to this invention, the integration of the temperature sensor assembly and the pressure sensor assembly does not require a carrier assembly as a bridge. Here, the carrier assembly is optional; in other words, depending on the actual needs, the integrated pressure and temperature sensor may or may not include a carrier assembly. When assembling the integrated pressure and temperature sensor, the temperature sensor assembly and the pressure sensor assembly can be assembled with other components as a structural unit or as part of a structural assembly. Furthermore, when a carrier assembly is present, it can be constructed in a simpler way than carrier assemblies in the prior art.

[0007] In some embodiments, the integrated pressure-temperature sensor further includes a carrier assembly housed in the housing, wherein an electrical conductor segment extending from the pressure sensor assembly toward the temperature sensing element is welded to the temperature sensing element, for example by resistance welding, and the electrical conductor segment and the temperature sensing element are inserted into the carrier assembly from the side of the carrier assembly facing the pressure sensor assembly.

[0008] In some embodiments, the carrier assembly is a single-piece or multi-piece element.

[0009] In some implementations, the carrier assembly is an injection-molded part, for example comprising one or more separate injection-molded parts.

[0010] In some embodiments, the carrier assembly is fixed to at least one of the electrical conductor segment and the temperature sensing element by plastic thermoplastic riveting, for example, fixed to the temperature sensing element.

[0011] In some embodiments, the carrier assembly is not enclosed to the temperature sensing element, allowing the fluid to be measured to come into contact with the temperature sensing element.

[0012] In some embodiments, the carrier assembly is enclosed for the temperature sensing element, allowing the fluid to be measured to transfer heat to the temperature sensing element through a metal tube (and, if necessary, thermally conductive filler) enclosing the temperature sensing element.

[0013] In some embodiments, the carrier assembly is hollow and includes a tubular section having an open, free end. The temperature sensing element is housed within the tubular section, and the fluid to be measured can enter the tubular section from the open, free end. Optionally, the tubular section may have a complete or incomplete peripheral wall.

[0014] In some embodiments, the pressure sensor assembly includes a disc-shaped ceramic substrate and a pressure sensing element abutting a first side surface of the ceramic substrate facing the temperature sensor assembly. The perforation penetrates the ceramic substrate in an area not covered by the pressure sensing element, or the perforation penetrates both the ceramic substrate and the pressure sensing element.

[0015] In some embodiments, the ceramic substrate has a circular profile, and the pressure sensing element has a circular profile, and the perforation penetrates not only the ceramic substrate but also the pressure sensing element.

[0016] In some embodiments, the ceramic substrate has a circular profile and the pressure sensing element has a rectangular profile, and the perforation penetrates the ceramic substrate in an area not covered by the pressure sensing element.

[0017] In some embodiments, the number of electrical conductors is two, and the number of through-holes is two, with each electrical conductor passing through one of the through-holes. The number of electrical conductors and thus the corresponding number of through-holes can be selected according to actual needs. For example, it is also possible that the temperature sensor assembly may include two temperature sensing elements, each temperature sensing element being provided with two electrical conductors and two through-holes; alternatively, the two temperature sensing elements may share one electrical conductor and one through-hole.

[0018] In some embodiments, the integrated pressure and temperature sensor further includes a circuit assembly housed in a housing, the circuit assembly being configured to receive a temperature sensing signal from a temperature sensor assembly and / or a pressure sensing signal from a pressure sensor assembly.

[0019] In some embodiments, the circuit assembly is disposed on a second side surface of the pressure sensor assembly opposite to the temperature sensor assembly, the electrical conductor having a first contact extending from the pressure sensor assembly toward the circuit assembly and electrically connected to the circuit assembly (especially by brazing), and the pressure sensor assembly having a second contact extending toward the circuit assembly and electrically connected to the circuit assembly (especially by brazing).

[0020] In some embodiments, the housing is constructed in multiple parts, such as two or three parts.

[0021] In some embodiments, the housing includes a hollow base element having a canister and a nozzle extending from the bottom of the canister.

[0022] In some embodiments, the connector has external threads for mounting an integrated pressure-temperature sensor to the object under test (e.g., an air conditioning system for a motor vehicle or a cooling system for a motor vehicle's power battery).

[0023] In some embodiments, the free end of the nozzle forms the fluid inlet.

[0024] In some embodiments, the pressure sensor assembly rests against the bottom of the tank and is radially sealed relative to the bottom of the tank by a first seal.

[0025] In some embodiments, the housing also includes a sealing element, particularly a connector, that closes the open side of the can. Typically, the connector can be a standardized electrical plug or socket.

[0026] In some embodiments, the housing is configured in multiple parts, wherein the housing includes a hollow base element, a closure element (especially a connector), and a hollow intermediate element disposed between the base element and the closure element. The base element has a bottom and a connecting pipe extending from the bottom. The connecting pipe has external threads for mounting an integrated pressure and temperature sensor. The free end of the connecting pipe forms the fluid inlet. The pressure sensor assembly rests against the bottom of the base element and is radially sealed relative to the bottom of the base element by a first seal.

[0027] In some embodiments, the first seal may be a rubber-elastic sealing ring.

[0028] In some embodiments, the first seal may be implemented by applying silicone sealant during assembly, which, upon curing, forms the first seal. Alternatively, the first seal (or any other seal, such as the second or third seal mentioned below) may be implemented during assembly by applying solder, wherein the solder can be melted and then re-cured to form the corresponding seal.

[0029] In some embodiments, the fluid to be tested may be the working medium of the vehicle's air conditioning system, the vehicle's fuel, or the coolant of the power battery.

[0030] In some embodiments, the temperature sensing element may be a thermistor with a negative temperature coefficient.

[0031] In some embodiments, the connector is configured to connect an integrated pressure and temperature sensor to an external device, such as an onboard network of a motor vehicle.

[0032] In some embodiments, the base element is made of a metallic material, such as aluminum alloy or stainless steel.

[0033] In some implementations, the sealing of the enclosure element, particularly the connector, from other parts of the housing and / or the external environment is achieved by means of a second seal.

[0034] In some embodiments, the second seal can be achieved using an environmental sealant, wherein the environmental sealant is applied during assembly and forms the second sealant after curing.

[0035] In some embodiments, the second seal may be a rubber-elastic sealing ring.

[0036] In some implementations, the base element is sealed relative to the object under test by means of a third seal mounted on the nozzle.

[0037] In some embodiments, the third seal may be a rubber-elastic sealing ring.

[0038] In some embodiments, the third seal may be implemented by applying silicone sealant when the integrated pressure and temperature sensor is mounted to the object being measured, the silicone sealant forming the third sealant after curing.

[0039] In some implementations, the temperature sensor assembly may extend beyond the fluid inlet, or alternatively, be aligned with the fluid inlet, or be recessed relative to the fluid inlet.

[0040] The technical features mentioned above, those to be mentioned below, and those shown individually in the accompanying drawings can be combined arbitrarily, provided that the combined technical features are not contradictory. All feasible combinations of features are the technical content explicitly described herein. Any one of the multiple sub-features contained in the same statement can be applied independently, without necessarily being applied together with other sub-features. Attached Figure Description

[0041] The present invention will now be described in more detail with reference to the accompanying drawings and exemplary embodiments. A brief description of the drawings is as follows:

[0042] Figure 1 An exploded view of an integrated pressure and temperature sensor according to a first embodiment of this application is shown.

[0043] Figure 2 show Figure 1 A longitudinal sectional view of the integrated pressure and temperature sensor in its assembled state.

[0044] Figure 3 show Figure 1 An exploded view of the pressure sensor assembly and temperature sensor assembly of the integrated pressure and temperature sensor.

[0045] Figure 4 show Figure 1A perspective view of the pressure sensor assembly and temperature sensor assembly of the integrated pressure and temperature sensor in an interconnected state.

[0046] Figure 5 show Figure 1 A longitudinal sectional view of the pressure sensor assembly and temperature sensor assembly of the integrated pressure and temperature sensor in their interconnected state.

[0047] Figure 6 An exploded view of an integrated pressure and temperature sensor according to a second embodiment of this application is shown.

[0048] Figure 7 show Figure 6 A longitudinal sectional view of the integrated pressure and temperature sensor in its assembled state.

[0049] Figure 8 show Figure 6 An exploded view of the pressure sensor assembly and temperature sensor assembly of the integrated pressure and temperature sensor.

[0050] Figure 9 show Figure 6 A longitudinal sectional view of the pressure sensor assembly and temperature sensor assembly of the integrated pressure and temperature sensor in their interconnected state.

[0051] Figure 10 show Figure 6 A perspective view of the pressure sensor assembly and temperature sensor assembly of the integrated pressure and temperature sensor in an interconnected state.

[0052] Figure 11 show Figure 6 Another perspective view of the pressure sensor assembly and temperature sensor assembly of the integrated pressure and temperature sensor in an interconnected state. Detailed Implementation

[0053] Several exemplary embodiments will now be described more fully with reference to the accompanying drawings. It should be understood that elements not essential for understanding the invention may be omitted from the drawings for ease of illustration and understanding. In the drawings, the same reference numerals may denote the same parts or parts that function identically. Numerous specific details, such as examples of specific parts, devices, and methods, are set forth in the following description to provide a thorough understanding of embodiments of the present disclosure. It will be apparent to those skilled in the art that not all of these specific details are necessarily required. The exemplary embodiments should not be construed as limiting.

[0054] First refer to Figures 1 to 5 The integrated pressure and temperature sensor 100 according to the first embodiment of this utility model can also be called a sealed pressure and temperature sensor. Figure 1 and Figure 2 The exploded view and longitudinal sectional view of the integrated pressure and temperature sensor 100 are shown. Figures 3 to 5 Details of the pressure sensor assembly 30 and temperature sensor assembly 20 of the integrated pressure and temperature sensor 100 are displayed.

[0055] The integrated pressure and temperature sensor 100 includes a housing 10. The housing 10 is constructed in two parts, comprising a hollow base element 5 and a connector 8. The base element 5 may be made of a corrosion-resistant metal material, such as aluminum alloy or stainless steel. The base element 5 has a canister and a connecting pipe 6 extending from the bottom of the canister. The base element 5 may have a polygonal profile (e.g., hexagonal or octagonal), thereby allowing it to be manipulated with a wrench. The connecting pipe 6 of the base element 5 may have external threads. The base element 5 can be screwed into the mounting interface of the object under test via these external threads, with the addition of a sealing ring (also generally referred to herein as a third seal 3), so that the pressure and temperature of the fluid under test can be detected by the integrated pressure and temperature sensor 100. The free end of the connecting pipe 6 forms a fluid inlet 7 for the fluid under test. The fluid under test can enter the housing 10 via the fluid inlet 7. The connector 8 connects to the base element 5, thus forming a chamber within the housing 10. The connector 8 can be sealed to the base element 5 and / or the external environment by means of a second seal 2. The second seal 2 can be implemented, for example, by means of an environmental sealant, wherein the environmental sealant cures after application.

[0056] A carrier assembly 4, a temperature sensor assembly 20 for sensing the temperature of the fluid to be measured, and a pressure sensor assembly 30 for sensing the pressure of the fluid to be measured are housed within the chamber of the housing 10. The pressure sensor assembly 30 and the temperature sensor assembly 20 can be inserted into the carrier assembly 4 as a structural unit or as a component of a structural unit (in the latter case, the structural unit may also include a circuit assembly 40). The carrier assembly 4 is then fixed to the temperature sensor assembly 20 by plastic thermoforming. In the current embodiment, the temperature sensor assembly 20 consists of a temperature sensing element. Typically, the temperature sensing element can be an NTC (negative temperature coefficient) element. Additionally, in addition to the temperature sensing element, the temperature sensor assembly 20 may also include a support member and / or a protective member for the temperature sensing element. The carrier assembly 4 can be open to the temperature sensing element, allowing the fluid to be measured to contact the temperature sensing element. Here, the carrier assembly 4 is hollow and includes a tubular section with an open, free end. The temperature sensing element is housed within the tubular section, and the fluid to be measured can enter the tubular section from the open, free end. The tubular section may have complete or incomplete peripheral walls. The carrier assembly 4 may be a single piece, i.e., composed of a single, integral component; or alternatively, it may be multi-piece, i.e., comprising multiple components assembled together. The fluid to be measured can reach the pressure sensor assembly 30 via the gap between the connector 6 and the tubular section of the carrier assembly 4, and through the tubular section of the carrier assembly 4, thus enabling the sensing of the pressure of the fluid to be measured.

[0057] As by Figures 3 to 5More clearly, the pressure sensor assembly 30 includes a disc-shaped ceramic substrate 11 and a pressure sensing element 12 abutting a first side surface of the ceramic substrate 11 facing the temperature sensor assembly 20. Typically, the pressure sensing element 12 can be a capacitive pressure sensing element. When a fluid to be measured is applied to the pressure sensing element 12, the capacitance of the pressure sensing element 12 changes in relation to the pressure of the fluid to be measured, thereby generating a pressure sensing signal. Here, the ceramic substrate 11 has a circular profile, and the pressure sensing element 12 has a circular profile, with the pressure sensing element 12 substantially completely covering the first side surface of the ceramic substrate 11. Two through-holes 13 penetrate not only the ceramic substrate 11 but also the pressure sensing element 12. An electrical conductor 14 is disposed in each through-hole 13, and the electrical conductor 14 is brazed and fixed in the corresponding through-hole 13, with the brazing material in the through-hole 13 flow-tightly sealing the through-hole 14. Here, the brazing material is particularly a low-temperature brazing material. Two electrical conductors 14 extend from a first side surface of the pressure sensor assembly 30 as a conductor segment 15, and from a second side surface of the pressure sensor assembly 30 opposite to the first side surface as a first contact 16. The two conductor segments 15 can be electrically connected to the two free ends of the temperature sensor assembly 20, or the temperature sensing element, for example, by resistance welding to achieve a material-locked connection. Figure 1 As can be seen, the pressure sensor assembly 30 can be sealed relative to the base element 5 of the housing 10 by means of the first seal 1.

[0058] In the current embodiment, a circuit assembly 40 is also housed within the cavity of the housing 10. The circuit assembly 40 is configured to receive pressure sensing signals from the pressure sensor assembly 30 and temperature sensing signals from the temperature sensor assembly 20, thus enabling simultaneous determination of the temperature and pressure values ​​of the fluid being measured. The circuit assembly 40 may advantageously be disposed on the second side surface of the pressure sensor assembly 30. For electrical connection between the circuit assembly 40 and the temperature sensor assembly 20, the circuit assembly 40 may be electrically connected, in particular, by soldering, to first contacts 16 of two electrical conductors 14. For electrical connection between the circuit assembly 40 and the pressure sensor assembly 30, the pressure sensor assembly 30 may have a plurality of second contacts 17 (currently three second contacts 17) extending from its second side surface, and is electrically connected to the circuit assembly 40 by means of these second contacts 17 through soldering connections.

[0059] like Figure 2As shown, the tubular section of the carrier assembly 4 and the temperature sensing element housed in the tubular section extend from the connecting pipe 6. The fluid to be measured can reach the pressure sensing element 12 of the pressure sensor assembly 30 through the gap between the connecting pipe 6 and the tubular section of the carrier assembly 4, the notch in the wall of the tubular section, and the gap between the tubular section and the temperature sensing element. Alternatively, the tubular section of the carrier assembly can be flush with or recessed relative to the free end of the connecting pipe 6. Furthermore, instead of an open tubular section of the carrier assembly 4, a closed tubular section that encloses the temperature sensing element can also be used.

[0060] Next, refer to Figures 6 to 11 This description describes an integrated pressure and temperature sensor 100 according to a second embodiment of the present invention. The following mainly describes the differences from the first embodiment; other aspects can be referred to in the description of the first embodiment to avoid repetition. In the drawings, identical components or components with the same function may be provided with the same reference numerals.

[0061] In the second embodiment, the housing 10 is constructed in three parts. The housing 10 includes a hollow base element 5, a connector 8, and a hollow intermediate element 9 disposed between the base element 5 and the connector 8. The base element 5 has a bottom and a connecting pipe 6 extending from the bottom. The connecting pipe 6 has external threads for mounting the integrated pressure-temperature sensor 100 to the object being measured, and the free end of the connecting pipe 6 forms a fluid inlet. The pressure sensor assembly 30 rests against the bottom of the base element 5 and is radially sealed relative to the bottom of the base element 5 by a first seal 1. The first seal 1 can be achieved here by applying silicone sealant during the assembly of the integrated pressure-temperature sensor 100, which forms the first seal 1 after curing.

[0062] In the second embodiment, the pressure sensor assembly 30 includes a disc-shaped ceramic substrate 11 and a pressure sensing element 12 abutting against a first side surface of the ceramic substrate 11 facing the temperature sensor assembly 20. Here, the ceramic substrate 11 has a circular outline, and the pressure sensing element 12 has a rectangular outline. Two through-holes 13 penetrate the ceramic substrate 11 in areas not covered by the pressure sensing element 12. Similarly, an electrical conductor 14 is disposed in each through-hole 13.

[0063] In another embodiment not shown, the disc-shaped ceramic substrate 11 of the pressure sensor assembly 30 may have a generally rectangular outline, and the pressure sensing element 12 may have a generally circular outline. At least one perforation 13 may penetrate only the area of ​​the ceramic substrate 11 not covered by the pressure sensing element 12, or penetrate both the ceramic substrate 11 and the pressure sensing element 12.

[0064] In another embodiment not shown, the disc-shaped ceramic substrate 11 of the pressure sensor assembly 30 may have a generally rectangular outline, and the pressure sensing element 12 may have a generally rectangular outline, with at least one through-hole 13 penetrating the ceramic substrate 11 and the pressure sensing element 12.

[0065] It should be noted that the terminology used herein is for illustrative purposes only and is not intended to limit the disclosure. The singular forms “a” and “the one” as used herein should include the plural forms unless the context explicitly states otherwise. It is understood that the terms “comprising” and “including,” and other similar terms, when used in the application documents, specifically describe the presence of the stated operation, element, and / or component, without excluding the presence or addition of one or more other operations, elements, components, and / or combinations thereof. The term “and / or” as used herein includes all arbitrary combinations of one or more of the associated listed items. In the description of the drawings, similar reference numerals always denote similar elements.

[0066] The thickness of the elements in the accompanying drawings may be exaggerated for clarity. It is also understood that if an element is described as being on, coupled to, or connected to another element, then the element may be directly formed on, coupled to, or connected to the other element, or there may be one or more intermediate elements between them. Conversely, if the expressions "directly on," "directly coupled to," and "directly connected to" are used herein, it indicates that there is no intermediate element. Other terms used to describe relationships between elements should be interpreted similarly, such as "between" and "directly between," "attached" and "directly attached," "adjacent" and "directly adjacent," etc.

[0067] Terms such as “top,” “bottom,” “above,” “below,” “over,” “under,” etc., are used to describe the relationship of one element, layer, or region relative to another element, layer, or region, as shown in the accompanying drawings. It is understood that these terms should also encompass other orientations of the device in addition to those described in the accompanying drawings.

[0068] It is understood that although the terms "first," "second," etc., may be used herein to describe different elements, these elements should not be limited by these terms. These terms are merely used to distinguish one element from another. Therefore, a first element may be referred to as a second element without departing from the teachings of this inventive concept.

[0069] It can also be considered that all the exemplary embodiments disclosed herein can be arbitrarily combined with each other. Finally, it should be noted that the above embodiments are only used to understand the present invention and do not constitute a limitation on the protection scope of the present invention. For those skilled in the art, modifications can be made based on the above embodiments, and these modifications do not depart from the protection scope of the present invention.

Claims

1. An integrated pressure-temperature sensor comprising a housing (10) having a chamber and a fluid inlet (7) for introducing a fluid to be measured into the chamber, wherein a pressure sensor assembly (30) for sensing the pressure of the fluid to be measured and a temperature sensor assembly (20) for sensing the temperature of the fluid to be measured are housed in the chamber, characterized in that, The pressure sensor assembly has a perforation (13) that receives an electrical conductor (14) for a temperature sensor assembly, the electrical conductor being electrically connected to a temperature sensing element of the temperature sensor assembly, the electrical conductor being brazed and fixed in the perforation, the brazing material in the perforation flow-tightly sealing the perforation.

2. The integrated pressure and temperature sensor according to claim 1, characterized in that, The integrated pressure and temperature sensor also includes a carrier assembly (4) housed in the housing, wherein an electrical conductor segment (15) extending from the pressure sensor assembly toward the temperature sensing element is welded to the temperature sensing element, and the electrical conductor segment and the temperature sensing element are inserted into the carrier assembly from the side of the carrier assembly toward the pressure sensor assembly.

3. The integrated pressure and temperature sensor according to claim 2, characterized in that, The carrier assembly is fixed to at least one of the electrical conductor section and the temperature sensing element by plastic thermoplastic riveting.

4. The integrated pressure and temperature sensor according to claim 2, characterized in that, The carrier assembly is not enclosed for the temperature sensing element, allowing the fluid to be measured to come into contact with the temperature sensing element.

5. The integrated pressure and temperature sensor according to claim 4, characterized in that, The carrier assembly is hollow and includes a tubular section having an open free end. The temperature sensing element is housed within the tubular section, and the fluid to be measured can enter the tubular section from the open free end.

6. The integrated pressure and temperature sensor according to any one of claims 1 to 5, characterized in that, The pressure sensor assembly includes a disc-shaped ceramic substrate (11) and a pressure sensing element (12) abutting a first side surface of the ceramic substrate facing the temperature sensor assembly. The perforation penetrates the ceramic substrate in an area not covered by the pressure sensing element, or the perforation penetrates both the ceramic substrate and the pressure sensing element.

7. The integrated pressure and temperature sensor according to claim 6, characterized in that, The ceramic substrate has a circular outline, and the pressure sensing element also has a circular outline; the perforation penetrates not only the ceramic substrate but also the pressure sensing element; or The ceramic substrate has a circular outline, and the pressure sensing element has a rectangular outline. The perforation penetrates the ceramic substrate in an area not covered by the pressure sensing element.

8. The integrated pressure and temperature sensor according to any one of claims 1 to 5, characterized in that, The number of electrical conductors is 2, and the number of perforations is 2, with each electrical conductor passing through one of the perforations.

9. The integrated pressure and temperature sensor according to any one of claims 1 to 5, characterized in that, The integrated pressure and temperature sensor also includes a circuit assembly (40) housed in a housing, the circuit assembly being configured to receive a temperature sensing signal from the temperature sensor assembly and a pressure sensing signal from the pressure sensor assembly, the circuit assembly being disposed on a second side surface of the pressure sensor assembly opposite to the temperature sensor assembly, the electrical conductor having a first contact (16) extending from the pressure sensor assembly toward the circuit assembly and electrically connected to the circuit assembly, the pressure sensor assembly having a second contact (17) extending toward the circuit assembly and electrically connected to the circuit assembly.

10. The integrated pressure and temperature sensor according to any one of claims 1 to 5, characterized in that, The housing is constructed in two parts, wherein the housing includes a hollow base element (5) having a tank and a nozzle (6) extending from the bottom of the tank, the nozzle having external threads for mounting an integrated pressure and temperature sensor, the free end of the nozzle forming the fluid inlet, the pressure sensor assembly resting against the bottom of the tank and radially sealed relative to the bottom of the tank by a first seal (1), and the housing also includes a connector that closes the open side of the tank.

11. The integrated pressure and temperature sensor according to any one of claims 1 to 5, characterized in that, The housing is constructed in three parts, including a hollow base element, a connector, and a hollow intermediate element (9) disposed between the base element and the connector. The base element has a bottom and a tube extending from the bottom. The tube has external threads for mounting an integrated pressure and temperature sensor. The free end of the tube forms the fluid inlet. The pressure sensor assembly rests against the bottom of the base element and is radially sealed relative to the bottom of the base element by a first seal.

Citation Information

Patent Citations

  • Combination pressure / temperature in a compact sensor assembly

    CN102980714A