Optical module heat dissipation assembly and electronic equipment

Abstract

The utility model relates to the field of LED display, and provides an optical module heat dissipation assembly and electronic equipment. The optical module heat dissipation assembly comprises an amplification heat dissipation device, an optical cage and a matched heat dissipation device arranged on the optical cage, the amplification heat dissipation device comprises a heat dissipation body, and the heat conduction surface of the heat dissipation body is connected with the heat dissipation surface of the matched heat dissipation device in an attached mode. The amplification radiator is arranged, and the surface of the heat dissipation main body of the amplification radiator is in fit connection with the surface of the matched radiator, so that the heat dissipation area of the radiator of the optical module is enlarged, the heat dissipation capability of the optical module is improved, and the risk of failure of the optical module due to over-high temperature is reduced.

Description

Technical Field

[0001] This application relates to the field of LED displays, and more particularly to a heat dissipation component for an optical module and an electronic device. Background Technology

[0002] An optical module is a photoelectric conversion module. It outputs an electrical signal at its transmitting end, which is then converted back into an electrical signal at the receiving end via optical fiber. With the development of communication technology, the transmission rate requirements for optical modules are increasing, leading to higher power consumption and new demands on heat dissipation. Temperature significantly affects the performance of optical modules; when heat accumulates and the temperature rises to a certain level, the module's functionality is affected, and it may even cease to function effectively.

[0003] In related technologies, the main approach is to install a small heat sink on the optical module's optical cage, which has insufficient heat dissipation capacity. Utility Model Content

[0004] In order to solve the above-mentioned technical problems, or at least partially solve the above-mentioned technical problems, this application provides an optical module heat dissipation component and an electronic device.

[0005] This application provides a heat dissipation assembly for an optical module, including an amplification heat sink, an optical cage, and a matching heat sink disposed on the optical cage. The amplification heat sink includes a heat dissipation body, and the surface of the heat dissipation body is attached to the surface of the matching heat sink.

[0006] Optionally, the optical module heat dissipation assembly further includes an optical module body, the optical cage having a cavity for mounting the optical module body, the top of the optical cage having an opening communicating with the cavity, a portion of the matching heat sink passing through the opening, and the matching heat sink being movable toward or away from the cavity at the opening.

[0007] Optionally, the optical module heat dissipation assembly further includes a circuit board, and a floating component is provided between the amplification heat sink and the circuit board. The amplification heat sink can move toward or away from the circuit board through the floating component to adapt to the movement of the matching heat sink toward or away from the cavity.

[0008] Optionally, a mounting bracket is provided between the amplification heat sink and the circuit board. The mounting bracket includes a support column and a support plate. The support column is connected between the support plate and the circuit board. The optical cage is located between the support plate and the circuit board. The amplification heat sink is connected to the support plate. The support plate is provided with a through groove extending along its thickness direction.

[0009] A portion of the through-slot on the support plate is sandwiched between the optical cage and the heat-conducting surface. The heat-dissipating end of the matching heat sink, which contacts the heat-conducting surface, passes through the through-slot, and the end face of the heat-dissipating end is a heat-dissipating surface; or,

[0010] The heat dissipation body has a protrusion on the side facing the circuit board. The protrusion passes through the through groove, and the end face of the protrusion facing the matching heat sink is the heat-conducting surface.

[0011] Optionally, the floating component includes a connecting post and a spring. The connecting post is inserted through the amplification heat sink with a clearance fit. The first end of the connecting post is fixedly connected to the support plate. The second end of the connecting post has a large head. The spring is sleeved around the connecting post and connected between the second end and the amplification heat sink.

[0012] Optionally, the floating component includes a connecting post and a spring, and the amplified heat sink includes the heat sink body and the floating plate of an integral structure. The connecting post is inserted through the floating plate with a clearance fit. The first end of the connecting post is fixedly connected to the circuit board, and the second end of the connecting post forms a large head. The spring is sleeved on the periphery of the connecting post and connected between the second end and the floating plate.

[0013] Optionally, the floating plate includes a horizontal plate and a vertical plate connected in an L-shape. The vertical plate is connected to the amplification heat sink. The connecting post is inserted through the horizontal plate with a gap fit. The plane of the horizontal plate is located between the plane of the amplification heat sink and the plane of the circuit board.

[0014] Optionally, a thermally conductive interface material layer is connected to the heat dissipation surface of the matching heat sink.

[0015] Optionally, the heat dissipation body includes an integral heat dissipation main board and multiple heat dissipation sub-boards. The multiple heat dissipation sub-boards are intersected and connected to the heat dissipation main board. The heat dissipation main board has the heat-conducting surface and a connecting surface disposed opposite to the heat-conducting surface. The multiple heat dissipation sub-boards are spaced apart and connected to the connecting surface.

[0016] Another embodiment of this application provides an electronic device including the above-described optical module heat dissipation assembly.

[0017] The technical solution provided in this application has the following advantages compared with the prior art:

[0018] The optical module heat dissipation assembly and electronic device provided in this application embodiment expands the heat dissipation area of ​​the optical module by attaching the surface of the heat dissipation body to the surface of the matching heat dissipation radiator, thereby improving the heat dissipation capacity of the optical module and reducing the risk of optical module failure due to overheating. Furthermore, an expansion heat dissipation radiator can be directly added to the outside of the pre-assembled optical module, making it suitable for mass-produced existing optical modules. Attached Figure Description

[0019] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0020] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the structure of an optical module heat dissipation assembly according to one embodiment of this application;

[0022] Figure 2 This is a three-dimensional structural diagram of the optical module heat dissipation assembly according to one embodiment of this application;

[0023] Figure 3 This is a schematic diagram of the structure of the optical module heat dissipation assembly according to another embodiment of this application.

[0024] Among them, 1. Circuit board; 2. Amplified heat sink; 21. Heat sink body; 211. Heat sink main board; 212. Heat sink sub-board; 22. Floating plate; 3. Optical cage; 4. Matching heat sink; 5. Floating component; 51. Connecting column; 52. Spring; 6. Mounting bracket; 61. Support column; 62. Support plate; 7. Thermal interface material layer. Detailed Implementation

[0025] To better understand the above-mentioned objectives, features, and advantages of this application, the solution of this application will be further described below. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0026] Many specific details are set forth in the following description in order to provide a full understanding of this application, but this application may also be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only some embodiments of this application, and not all embodiments.

[0027] An optical module is a photoelectric conversion module. The transmitting end of an optical module outputs an electrical signal, which is then converted back into an electrical signal at the receiving end via optical fiber. With the development of communication technology, the transmission rate requirements for optical modules are increasing, leading to higher power consumption and new demands on heat dissipation. Temperature significantly affects the performance of optical modules; when heat accumulates and the temperature rises to a certain level, the module's functionality is affected, and it may even cease to function effectively. Current technologies primarily rely on a small heat sink on the optical module's cage (3), but this heat dissipation capacity is insufficient.

[0028] Based on this, this application provides an optical module heat dissipation assembly that increases the heat dissipation area of ​​the optical module and improves its heat dissipation capacity. Furthermore, it allows for the direct addition of an expansion heat sink 2 to the outside of the pre-assembled optical module, making it suitable for mass-produced existing optical modules.

[0029] The following is a detailed description of the heat dissipation component for the optical module through specific embodiments:

[0030] Reference Figures 1 to 3 As shown, this embodiment provides a heat dissipation component for an optical module, including an amplification heat sink 2, an optical cage 3, and a matching heat sink 4 disposed on the optical cage 3. For example, the matching heat sink 4 is located at the top of the optical cage 3, the bottom of the optical cage 3 is connected to the circuit board 1, the amplification heat sink 2 is connected to the circuit board 1, and the heat dissipation body 21 of the amplification heat sink 2 is located above the optical cage 3. The thermally conductive surface of the heat dissipation body 21 is in contact with the heat dissipation surface of the matching heat sink 4, reducing the contact thermal resistance of heat conduction between the amplification heat sink 2 and the matching heat sink 4. The heat inside the optical cage 3 is transferred to the amplification heat sink 2 through the matching heat sink 4 to expand the heat dissipation area. The thermally conductive surface of the heat dissipation body 21 can be understood as the side surface of the heat dissipation main board 211 of the amplification heat sink 2 that contacts and is in contact with the matching heat sink 4, and the heat dissipation surface of the matching heat sink 4 is the surface of the matching heat sink 4 that contacts the external airflow.

[0031] The optical module heat dissipation assembly provided in this embodiment expands the heat dissipation area of ​​the optical module by connecting an amplification heat sink 2 to the circuit board 1, with the heat dissipation body 21 of the amplification heat sink 2 located above the optical cage 3, and attaching the heat-conducting surface of the heat dissipation body 21 to the heat dissipation surface of the matching heat sink 4, thereby improving the heat dissipation capacity of the optical module and reducing the risk of the optical module failing due to excessive temperature.

[0032] Furthermore, the mass-produced old optical module heat dissipation components include an optical cage 3 and a matching heat sink 4 configured on the top of the optical cage 3. An expansion heat sink 2 can be directly installed on the old optical module heat dissipation components to increase heat dissipation capacity.

[0033] In some embodiments, the optical module heat dissipation assembly further includes an optical module body. The optical cage 3 has a cavity for mounting the optical module body. The top of the optical cage 3 has an opening communicating with the cavity. A portion of the matching heat sink 4 passes through the opening. The matching heat sink 4 can move towards or away from the cavity at the opening to facilitate the insertion or removal of the optical module body into or from the cavity, reducing the resistance of the optical module body during insertion into the optical module heat dissipation assembly (an electronic device equipped with an optical module heat dissipation assembly), achieving easy insertion and removal, and ensuring appropriate insertion and removal force for the optical module. The connection method between the optical cage 3 and the matching heat sink 4 is prior art and will not be described in detail here.

[0034] Considering that the thermally conductive surface of the amplification heat sink 2 and the heat dissipation surface of the matching heat sink 4 are always in contact to reduce contact thermal resistance, in some embodiments, a floating component 5 is also provided between the amplification heat sink 2 and the circuit board 1. The amplification heat sink 2 can move toward or away from the circuit board 1 through the floating component 5 to adapt to the movement of the matching heat sink 4 toward or away from the cavity. When the optical module body is inserted into the cavity, the amplification heat sink 2 and the matching heat sink 4 move away from the circuit board 1, reducing the resistance of the optical module body during the insertion of the optical module heat dissipation assembly (electronic device equipped with an optical module heat dissipation assembly), achieving easy insertion and removal and ensuring appropriate insertion and removal force of the optical module.

[0035] In some embodiments, such as Figure 1 and Figure 2 As shown, a mounting bracket 6 is provided between the amplification heat sink 2 and the circuit board 1. The mounting bracket 6 includes a support column 61 and a support plate 62. The support column 61 is connected between the support plate 62 and the circuit board 1 to leave a gap between the support plate 62 and the circuit board 1 to accommodate the optical cage 3. The optical cage 3 is located between the support plate 62 and the circuit board 1. The amplification heat sink 2 is mounted on the support plate 62, and the mounting bracket 6 provides support and fixation for the amplification heat sink 2. The support plate 62 has a through groove extending along its thickness direction. Since the matching heat sink 4 is floating, in order to achieve a close connection between the heat-conducting surface of the heat sink body 21 and the heat dissipation surface of the matching heat sink 4, reduce the contact thermal resistance between the two, and improve the heat transfer efficiency, there can be at least two implementation methods, but not limited to: a local area of ​​the through groove on the support plate 62 is sandwiched between the optical cage 3 and the heat-conducting surface, and the heat dissipation end of the matching heat sink 4 that contacts the heat-conducting surface passes through the through groove, and the end face of the heat dissipation end is the heat dissipation surface. Alternatively, a protrusion is formed on the side of the heat dissipation body 21 facing the circuit board 1, the protrusion passes through the through groove, and the end face of the protrusion facing the matching heat sink 4 is a heat-conducting surface.

[0036] The floating component 5 includes a connecting post 51 and a spring 52. The connecting post 51 is fitted through the amplification heat sink 2 with a clearance fit. The first end of the connecting post 51 is fixedly connected to the support plate 62, and the second end of the connecting post 51 has a large head. The spring 52 is sleeved around the connecting post 51 and connected between the second end and the amplification heat sink 2. After the amplification heat sink 2 is lifted by the matching heat sink 4 and pushed away from the circuit board 1, the amplification heat sink 2 moves away from the circuit board 1. At this time, the spring 52 is compressed, and the pressure of the spring 52 on the amplification heat sink 2 can ensure that the heat-conducting surface of the heat sink body 21 is in close contact with the heat-dissipating surface of the matching heat sink 4. Figure 2 As shown, multiple floating components 5 are provided, and the multiple floating components 5 are distributed at intervals, so that the expanded heat sink 2 moves smoothly and the force points under the pressure of multiple springs 52 are evenly distributed, so that the heat-conducting surface of the heat sink body 21 is in close contact with the heat-dissipating surface of the matching heat sink 4.

[0037] The mounting bracket 6 between the amplified heat sink 2 and the circuit board 1 can also be omitted, such as... Figure 3 As shown, in some embodiments, the floating component 5 includes a connecting post 51 and a spring 52. The amplification heat sink 2 includes an integral heat sink body 21 and a floating plate 22. The connecting post 51 is fitted through the floating plate 22 with a clearance fit. The first end of the connecting post 51 is fixedly connected to the circuit board 1, and the second end of the connecting post 51 has a large head and is a free end. The spring 52 is sleeved around the periphery of the connecting post 51 and connects the second end to the floating plate 22. After the amplification heat sink 2 is lifted by the matching heat sink 4 and pushed away from the circuit board 1, the amplification heat sink 2 moves away from the circuit board 1. At this time, the spring 52 is compressed, and the pressure of the spring 52 on the floating plate 22 can ensure that the heat-conducting surface of the heat sink body 21 is in close contact with the heat dissipation surface of the matching heat sink 4. Multiple floating components 5 and multiple floating plates 22 can be provided, and the multiple floating plates 22 are distributed at intervals along the circumference of the heat sink body 21.

[0038] The first end of the connecting post 51 is fixedly connected to the support plate 62 or the circuit board 1 in the following ways: the first end of the connecting post 51 is threaded, welded or bonded to the support plate 62 or the circuit board 1; the first end of the connecting post 51 passes through the support plate 62 or the circuit board 1 and is connected to a locking nut; the outer surface of the first end of the connecting post 51 is provided with a claw, and after the first end is inserted into the through hole on the support plate 62 or the circuit board 1, the claw abuts against the inner wall of the through hole.

[0039] In some embodiments, the floating plate 22 includes a horizontal plate and a vertical plate connected in an L-shape. The vertical plate is connected to the amplification heat sink 2. The plane where the horizontal plate is located is between the plane where the amplification heat sink 2 is located and the plane where the circuit board 1 is located. That is, the horizontal plate that is in clearance fit with the connecting post 51 is lowered. Because the height of the connecting post 51 is required to accommodate the floating amount of the floating plate 22, the horizontal plate is lowered so that the part of the connecting post 51 used to sleeve the spring 52 is also lowered. Then the height of the entire connecting post 51 on the circuit board 1 is reduced, which avoids the connecting post 51 being higher than the amplification heat sink 2, which would increase the height of the entire optical module heat dissipation assembly. The increased height of the optical module heat dissipation assembly would also occupy more space.

[0040] In some embodiments, a thermally conductive interface material layer 7 is connected to the heat dissipation surface of the matching heat sink 4 to fill the micro-gaps and uneven surfaces generated when the heat dissipation surface of the matching heat sink 4 comes into contact with the thermally conductive surface of the heat dissipation body 21, thereby reducing thermal resistance and improving the heat dissipation performance of the device.

[0041] In some embodiments, such as Figure 2 and Figure 3 As shown, the heat dissipation body 21 includes an integral heat dissipation main board 211 and multiple heat dissipation sub-boards 212. The multiple heat dissipation sub-boards 212 are intersected and connected to the heat dissipation main board 211. The heat dissipation main board 211 has a heat-conducting surface and a connecting surface disposed opposite to the heat-conducting surface. The multiple heat dissipation sub-boards 212 are spaced apart and connected to the connecting surface. The arrangement of the multiple heat dissipation sub-boards 212 and the heat dissipation main board 211 maximizes the area of ​​the heat dissipation plate while occupying a certain space, thereby improving the heat dissipation efficiency of the expanded heat sink 2.

[0042] Of course, multiple light cages 3 can be provided on the circuit board 1, and the multiple light cages 3 are distributed at intervals. The heat dissipation main board 211 can be provided as a single piece or multiple pieces, and this application does not make a specific limitation.

[0043] Another embodiment of this application provides an electronic device including the above-described optical module heat dissipation assembly.

[0044] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0045] The above description is merely a specific embodiment of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments described herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A heat dissipation component for an optical module, characterized in that, It includes an amplification heat sink (2), an optical cage (3), and a matching heat sink (4) disposed on the optical cage (3). The amplification heat sink (2) includes a heat dissipation body (21), and the surface of the heat dissipation body (21) is attached to the surface of the matching heat sink (4).

2. The optical module heat dissipation assembly according to claim 1, characterized in that, The optical module assembly also includes an optical module body. The optical cage (3) has a cavity for mounting the optical module body. The top of the optical cage (3) is provided with an opening communicating with the cavity. A portion of the matching heat sink (4) passes through the opening. The matching heat sink (4) can move toward or away from the cavity at the opening.

3. The optical module heat dissipation assembly according to claim 2, characterized in that, The optical module heat dissipation assembly also includes a circuit board (1). A floating component (5) is provided between the amplification heat sink (2) and the circuit board (1). The amplification heat sink (2) can move toward or away from the circuit board (1) through the floating component (5) to adapt to the movement of the matching heat sink (4) toward or away from the cavity.

4. The optical module heat dissipation assembly according to claim 3, characterized in that, An mounting bracket (6) is provided between the amplification heat sink (2) and the circuit board (1). The mounting bracket (6) includes a support column (61) and a support plate (62). The support column (61) is connected between the support plate (62) and the circuit board (1). The optical cage (3) is located between the support plate (62) and the circuit board (1). The amplification heat sink (2) is mounted on the support plate (62). The support plate (62) has a through groove that runs through its thickness direction. The heat-conducting surface of the heat dissipation body (21) is in close contact with the heat dissipation surface of the matching heat sink (4). A partial area of ​​the through groove on the support plate (62) is sandwiched between the light cage (3) and the heat-conducting surface. The heat dissipation end of the matching heat sink (4) that contacts the heat-conducting surface passes through the through groove, and the end face of the heat dissipation end is the heat dissipation surface; or, The heat dissipation body (21) has a protrusion on the side facing the circuit board (1), the protrusion passes through the through groove, and the end face of the protrusion facing the matching heat sink (4) is the heat-conducting surface.

5. The optical module heat dissipation assembly according to claim 4, characterized in that, The floating component (5) includes a connecting post (51) and a spring (52). The connecting post (51) is inserted into the amplification heat sink (2) with a clearance fit. The first end of the connecting post (51) is fixedly connected to the support plate (62). The second end of the connecting post (51) has a large head. The spring (52) is sleeved on the periphery of the connecting post (51) and connected between the second end and the amplification heat sink (2).

6. The optical module heat dissipation assembly according to claim 3, characterized in that, The floating component (5) includes a connecting post (51) and a spring (52). The amplified heat sink (2) includes the heat sink body (21) and the floating plate (22) of an integral structure. The connecting post (51) is inserted through the floating plate (22) with a clearance fit. The first end of the connecting post (51) is fixedly connected to the circuit board (1). The second end of the connecting post (51) forms a large head. The spring (52) is sleeved on the periphery of the connecting post (51) and connected between the second end and the floating plate (22).

7. The optical module heat dissipation assembly according to claim 6, characterized in that, The floating plate (22) includes a horizontal plate and a vertical plate connected in an L-shape. The vertical plate is connected to the amplification heat sink (2). The connecting column (51) is inserted through the horizontal plate with a clearance fit. The plane of the horizontal plate is located between the plane of the amplification heat sink (2) and the plane of the circuit board (1).

8. The optical module heat dissipation assembly according to claim 1, characterized in that, A thermal interface material layer (7) is connected to the heat dissipation surface of the matching radiator (4).

9. The optical module heat dissipation assembly according to claim 4, characterized in that, The heat dissipation body (21) includes an integral heat dissipation main board (211) and multiple heat dissipation sub-boards (212). The multiple heat dissipation sub-boards (212) are intersected and connected to the heat dissipation main board (211). The heat dissipation main board (211) has the heat-conducting surface and a connecting surface disposed opposite to the heat-conducting surface. The multiple heat dissipation sub-boards (212) are spaced apart and are all connected to the connecting surface.

10. An electronic device, characterized in that, Includes the optical module heat dissipation component as described in any one of claims 1 to 9.

Images