Rear heat dissipation type notebook computer heat dissipation device

Abstract

The utility model provides a rear heat dissipation type notebook computer heat dissipation device which comprises a heat dissipation element, a refrigeration element and a magnetic attraction frame, the refrigeration element is fixedly installed on the heat dissipation element, the magnetic attraction frame is fixedly installed on the heat dissipation element, and the heat dissipation element is attracted to a notebook computer support through the magnetic attraction frame. According to the utility model, refrigeration and heat dissipation elements are efficiently combined to form a powerful heat dissipation system. The refrigeration sheet rapidly cools, the cooling fins expand heat exchange, and the fan strengthens air cooling, so that low-temperature operation of the notebook computer under high load is ensured. The magnetic suction frame is simplified in design and installation, free of tools, fast and stable. The refrigeration protrusions and the plate are integrated, the contact face is enlarged, and heat conduction is improved. The refrigeration sheets are evenly distributed, heat is evenly and rapidly transferred and rapidly discharged through the fins and the draught fan, and the overall heat dissipation performance is excellent.

Description

Technical Field

[0001] This utility model belongs to the field of laptop cooling technology, and in particular relates to a rear-mounted laptop cooling device. Background Technology

[0002] With the rapid development of technology, laptops have become indispensable tools for modern people's work, study, and entertainment. However, high-performance laptops often generate a lot of heat when running complex tasks or games. If not cooled in time, this can not only affect the computer's performance and stability but also damage the hardware and shorten its lifespan. Traditional laptop cooling methods mainly rely on built-in fans and heat sinks, but these methods are insufficient under heavy use, especially in enclosed environments or without additional cooling assistance. To solve these problems, various external cooling devices have emerged on the market, such as cooling pads and cooling stands. However, most of these devices improve cooling performance by increasing the heat dissipation area or the number of fans, resulting in large size, inconvenience in carrying, and complex installation.

[0003] Therefore, it is essential to invent a rear-mounted heat dissipation device for laptops. Utility Model Content

[0004] To solve the above-mentioned technical problems, this utility model provides a rear-mounted heat dissipation laptop cooling device, including a heat dissipation element, a cooling element, and a magnetic frame. The cooling element is fixedly installed on the heat dissipation element, and the magnetic frame is fixedly installed on the heat dissipation element. The heat dissipation element is attracted to the laptop stand through the magnetic frame.

[0005] The heat dissipation element includes a housing, heat dissipation holes, a heat dissipation fan, and heat dissipation fins. The heat dissipation holes are provided on the housing. The heat dissipation fan is fixedly installed inside the housing. The heat dissipation fan is fixedly connected to the heat dissipation fins. The heat dissipation fins are fixedly installed inside the housing and connected to the cooling element.

[0006] The refrigeration element includes a refrigeration plate, refrigeration protrusions, refrigeration fins, and a heat sink. The refrigeration protrusions are evenly distributed on the outer surface of the refrigeration plate, and the refrigeration fins are disposed between the refrigeration plate and the heat sink. The heat sink is fixedly connected to the heat sink fins.

[0007] Preferably, the heat dissipation holes in the outer casing are located on one side of the heat dissipation fan, and the heat dissipation fan is fixedly installed inside the lower part of the outer casing.

[0008] Preferably, the heat dissipation holes, heat dissipation fan, heat dissipation fins, heat dissipation plate, cooling fins, cooling plate and cooling protrusion are arranged sequentially from bottom to top, and the cooling plate and cooling protrusion are integrally arranged together.

[0009] Preferably, a plurality of cooling chips are provided, and the plurality of cooling chips are evenly distributed between the heat sink and the cooling plate. The cooling protrusions integrally provided on the cooling plate are circular protrusions, and there are gaps between the cooling protrusions to allow gas flow.

[0010] Preferably, the magnetic frame has a rectangular structure and a magnetic strip is embedded inside the magnetic frame.

[0011] Compared with the prior art, the present invention has the following beneficial effects:

[0012] This invention integrates cooling and heat dissipation components to form a highly efficient heat dissipation system. The cooling elements effectively reduce the temperature of the heat sink, while the heat dissipation fins increase the heat exchange area. Combined with the forced air cooling effect of the cooling fan, this significantly improves heat dissipation efficiency, ensuring the laptop maintains a low temperature even under heavy load. Furthermore, a magnetic frame design allows for easy attachment to the laptop stand via embedded magnets, eliminating the need for additional tools or screws and enabling quick installation and removal. The cooling protrusion is integrated with the cooling plate, increasing the contact area between the cooling plate and the air, thus improving heat conduction efficiency. The cooling elements are evenly distributed between the cooling plate and the heat sink, ensuring that heat is transferred evenly and quickly to the heat sink, and then dissipated into the air by the heat dissipation fins and the cooling fan. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0014] Figure 2 This is an exploded structural diagram of the present invention.

[0015] Figure 3 This is a half-sectional structural diagram of the present invention.

[0016] In the picture:

[0017] Heat dissipation element 1, outer shell 11, heat dissipation hole 12, heat dissipation fan 13, heat dissipation fin 14, cooling element 2, cooling plate 21, cooling protrusion 22, cooling chip 23, heat dissipation plate 24, magnetic frame 3. Detailed Implementation

[0018] To enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0019] In the description of the embodiments, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the present invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. In the description of the utility model, it should be noted that unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in the present utility model based on the specific circumstances.

[0020] As attached Figure 1 To be continued Figure 3 As shown:

[0021] This utility model provides a rear-mounted heat dissipation device for laptop computers, including a heat dissipation element 1, a cooling element 2, and a magnetic frame 3. The cooling element 2 is fixedly mounted on the heat dissipation element 1, and the magnetic frame 3 is fixedly mounted on the heat dissipation element 1. The heat dissipation element 1 is attracted to the laptop computer stand by the magnetic frame 3.

[0022] The heat dissipation element 1 includes a housing 11, heat dissipation holes 12, a heat dissipation fan 13, and heat dissipation fins 14. The heat dissipation holes 12 are provided on the housing 11. The heat dissipation fan 13 is fixedly installed inside the housing 11. The heat dissipation fan 13 is fixedly connected to the heat dissipation fins 14. The heat dissipation fins 14 are fixedly installed inside the housing 11 and connected to the cooling element 2.

[0023] The refrigeration element 2 includes a refrigeration plate 21, refrigeration protrusions 22, refrigeration plates 23 and a heat sink 24. The refrigeration protrusions 22 are evenly distributed on the outer surface of the refrigeration plate 21. The refrigeration plates 23 are disposed between the refrigeration plate 21 and the heat sink 24. The heat sink 24 is fixedly connected to the heat dissipation fins 14.

[0024] Example 1:

[0025] Specifically, the heat dissipation holes 12 on the outer casing 11 are carefully arranged on one side of the cooling fan 13. This arrangement allows the cooling fan 13 to directly draw in cool air through the heat dissipation holes 12 during operation, forming an effective airflow channel. At the same time, the cooling fan 13 is fixedly installed inside the lower part of the outer casing 11. This positioning helps reduce noise caused by fan vibration and allows airflow to pass more smoothly through the entire cooling system.

[0026] Specifically, the heat dissipation element 1 and the cooling element 2 form a tight and orderly hierarchical structure to ensure that heat can be efficiently conducted from the laptop to the external environment. Arranged from bottom to top are: heat dissipation holes 12 (located on the outer casing 11), cooling fan 13, heat dissipation fins 14, heat sink 24, cooling pad 23, cooling plate 21, and cooling protrusion 22. This design ensures that heat is gradually dispersed and reduced during the transfer process, ultimately achieving the purpose of heat dissipation.

[0027] Specifically, the cooling plate 21 and the cooling protrusions 22 adopt an integrated design, enhancing overall stability and heat transfer efficiency. The cooling protrusions 22 are circular protrusions, evenly distributed on the outer surface of the cooling plate 21, which not only increases the contact area with air but also promotes free gas flow through the flow gaps between them. In addition, several cooling fins 23 are evenly distributed between the heat sink 24 and the cooling plate 21. These cooling fins 23 utilize the thermoelectric effect to conduct heat from the cooling plate 21 to the heat sink 24, and further dissipate it into the air through the heat dissipation fins 14 and the cooling fan 13.

[0028] Specifically, to facilitate user installation and removal of the cooling device, a magnetic frame 3 design is adopted. The magnetic frame 3 has a rectangular structure with embedded magnetic strips, allowing it to firmly attach to the laptop stand. This design not only simplifies the installation process but also allows the cooling device to be easily removed when not in use, facilitating portability and storage. At the same time, the rectangular structure of the magnetic frame 3 ensures a good fit with the laptop stand, further improving heat dissipation.

[0029] Example 2:

[0030] The cooling plate 21 in the cooling element is in close contact with the laptop. Heat is rapidly conducted to the cooling plate 21 through the thermal conductivity of the metal. Cooling protrusions 22 on the cooling plate 21 increase the contact area with air, further improving heat transfer efficiency. The cooling element 23 is located between the cooling plate 21 and the heat sink 24, absorbing heat from the cooling plate 21 and conducting it to the heat sink 24 using the thermoelectric effect. The cooling fan 13 in the heat dissipation element generates airflow by rotating, drawing external cool air into the casing 11 through the heat dissipation holes 12. As the cool air passes through the heat dissipation fins 14, it exchanges heat with the heat on the fins, carrying away the heat and converting it into hot air. The hot air is then exhausted to the external environment through the heat dissipation holes 12 on the casing 11, creating a convection cooling effect. The cooling element 23 is a key component in realizing the thermoelectric cooling effect. It utilizes the properties of thermoelectric materials to generate a hot-cold end effect when current passes through, absorbing heat from the cooling plate 21 and transferring it to the heat sink 24. In this way, the cooling element 23 can actively reduce the temperature of the cooling plate 21, thereby enhancing the overall heat dissipation effect.

[0031] Any technical solution that achieves the above-mentioned technical effects by utilizing the technical solution described in this utility model, or by designing a similar technical solution inspired by the technical solution described in this utility model, falls within the protection scope of this utility model.

Claims

1. A rear-mounted heat dissipation device for laptop computers, characterized in that, It includes a heat dissipation element (1), a cooling element (2) and a magnetic frame (3). The cooling element (2) is fixedly installed on the heat dissipation element (1), and the magnetic frame (3) is fixedly installed on the heat dissipation element (1). The heat dissipation element (1) is attracted to the laptop stand by the magnetic frame (3). The heat dissipation element (1) includes a housing (11), heat dissipation holes (12), a heat dissipation fan (13), and heat dissipation fins (14). The heat dissipation holes (12) are provided on the housing (11). The heat dissipation fan (13) is fixedly installed inside the housing (11). The heat dissipation fan (13) is fixedly connected to the heat dissipation fins (14). The heat dissipation fins (14) are fixedly installed inside the housing (11) and connected to the cooling element (2). The refrigeration element (2) includes a refrigeration plate (21), refrigeration protrusions (22), refrigeration plates (23) and a heat sink (24). The refrigeration protrusions (22) are evenly distributed on the outer surface of the refrigeration plate (21). The refrigeration plates (23) are disposed between the refrigeration plate (21) and the heat sink (24). The heat sink (24) is fixedly connected to the heat sink fins (14).

2. The rear-mounted heat dissipation device for laptop computers as described in claim 1, characterized in that: The heat dissipation hole (12) of the outer shell (11) is located on one side of the heat dissipation fan (13), and the heat dissipation fan (13) is fixedly installed inside the lower part of the outer shell (11).

3. The rear-mounted heat dissipation device for laptops as described in claim 1, characterized in that: The heat dissipation holes (12), heat dissipation fan (13), heat dissipation fins (14), heat dissipation plate (24), cooling fins (23), cooling plate (21) and cooling protrusions (22) are arranged sequentially from bottom to top, and the cooling plate (21) and cooling protrusions (22) are integrated together.

4. The rear-mounted heat dissipation device for laptop computers as described in claim 1, characterized in that: The cooling chip (23) is provided in a plurality of them, and the plurality of cooling chips (23) are evenly distributed between the heat sink (24) and the cooling plate (21). The cooling protrusion (22) integrally provided on the cooling plate (21) is a circular protrusion, and there is a gap between the cooling protrusions (22) to allow gas flow.

5. A rear-mounted heat dissipation device for laptop computers as described in claim 1, characterized in that: The magnetic frame (3) has a rectangular structure and a magnetic strip is embedded inside the magnetic frame (3).

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