Flexible solar cell array isolation diode assembly structure and flexible solar cell array
By combining thin silicon diode chips, pure silver or Kovar alloy silver-plated interconnects, and polyimide cover plates, the thickness and thermal management issues of isolation diode components are solved, meeting the mechanical and thermal management requirements of flexible solar cell arrays and making them suitable for automated production processes.
Patent Information
- Application Number
- CN202422986073.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-04
- Publication Date
- 2025-12-02
- Estimated Expiration
- 2034-12-04
AI Technical Summary
Existing technologies cannot control the thickness of isolation diode components to below 0.2mm, which cannot meet the folding and pressing requirements of flexible thin-film triple-junction CIC cells, and at the same time cannot effectively reduce the absorption and dissipation of heat from solar radiation by the chip.
It uses thin silicon diode chips, pure silver or Kovar alloy silver-plated interconnects, polyimide cover plates and self-adhesive thermal control films. It is connected by S-shaped leads and fixed by through holes. The component thickness is controlled at 0.2mm, which achieves mechanical protection and reduces radiation absorption and heat radiation.
It meets the mechanical requirements of flexible solar cell arrays, satisfies the requirements for folding and pressing, and effectively reduces the absorption and dissipation of heat from solar radiation by the chips. The structure is simple and can be coupled with an automated production process.
Smart Images
Figure CN223624982U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of flexible solar cell array technology, and more specifically, to a flexible solar cell array isolation diode component structure and a flexible solar cell array. Background Technology
[0002] Isolation diodes are widely used in space solar cell arrays. They are placed at the positive output position of the cell module to isolate faults between unit circuits.
[0003] Rigid solar arrays typically place isolation diodes on the back of a rigid substrate. Glass-encapsulated isolation diodes can meet the space and thermal requirements. However, foldable and compacted solar arrays can only be placed on the front of the solar array, and the thickness requirements for face-to-face compaction of the solar array and the operating temperature requirements must be considered.
[0004] The existing technology solves the above problems with a thin isolation diode assembly, characterized by a frame plate providing an overall support structure, placing the isolation diode in the frame plate, and then bonding an anti-radiation OSR sheet on top of the chip to form an isolation diode assembly, which is then integrated into a flexible solar cell array. This can meet the requirements of flexible solar cell array folding and compression and operating environment temperature.
[0005] Previous technologies required the preparation of isolation diode components first. The thickness of the isolation diode components was more than 0.3 mm, which could be used to adapt to germanium-based triple junction CIC cells. However, the thickness of flexible thin-film triple junction CIC cells is 0.2 mm. When folded and pressed, the isolation diode components would protrude above the solar cell array surface.
[0006] The preceding description is intended to provide general background information and does not necessarily constitute prior art. Utility Model Content
[0007] The purpose of this invention is to provide a flexible solar cell array isolation diode component structure and a flexible solar cell array. The flexible solar cell array isolation diode component structure meets the mechanical requirements of the flexible solar cell array to be compressed and closed. The cover plate provides mechanical protection for the chip, and the thermal control film pasted on the surface effectively reduces the absorption of solar radiation by the chip, while also radiating the heat generated by the chip during operation. The component structure is simple and can be coupled into the automatic production process of the solar cell array.
[0008] This utility model provides a flexible solar cell array isolation diode assembly structure, including a chip, interconnects, leads, a cover plate, and a thermal control film; the interconnects are welded to both the positive and negative electrodes of the chip, and the leads are connected to both interconnects; a through hole is provided on the cover plate, the chip is connected and fixed at the through hole position, and the thermal control film with self-adhesive backing is pasted on the surface of the cover plate.
[0009] Furthermore, the thickness of the cover plate is 0.16mm-0.2mm.
[0010] Furthermore, the leads are arranged in an S-shape, and the leads on the positive electrode of the chip and the leads on the negative electrode of the chip are arranged symmetrically.
[0011] Furthermore, the thermal control film is a secondary surface mirror thermal control film or an F46 thermal control film.
[0012] Furthermore, the chip is a thin silicon diode chip, with a length and width of 5.5 mm and a thickness of 0.16 mm.
[0013] Furthermore, the interconnect is made of pure silver or silver-plated Kovar alloy, the interconnect has a thickness of 0.025 mm, and the interconnect has a planar stress-reducing structure.
[0014] Furthermore, the cover plate is made of polyimide material, and the length and width of the cover plate are 50mm and 11mm respectively, and the thickness of the cover plate is 0.2mm.
[0015] Furthermore, the through hole is square, and its length and width are 8.5 mm and 6 mm, respectively.
[0016] This invention also provides a flexible solar cell array, including the aforementioned flexible solar cell array isolation diode component structure.
[0017] Furthermore, the flexible solar cell array includes a flexible substrate, on which a cell current output terminal and a cell array busbar are disposed; the bottom of the cover plate is connected to the flexible substrate, the lead on the positive electrode of the chip is connected to the cell current output terminal, and the lead on the negative electrode of the chip is connected to the cell array busbar.
[0018] The flexible solar cell array isolation diode component structure provided by this utility model has a component thickness that can be controlled at 0.2mm, and the thickness of the flexible thin-film triple junction CIC cell is 0.2mm, which meets the mechanical requirements for the flexible solar cell array to be folded and pressed together. The cover plate provides mechanical protection for the chip, and the thermal control film pasted on the surface effectively reduces the absorption of solar radiation by the chip, while also radiating the heat generated by the chip during operation. The component structure is simple and can be coupled into the automatic production process of the solar cell array. Attached Figure Description
[0019] Figure 1 This is a plan view of the flexible solar cell array isolation diode assembly structure provided in an embodiment of the present invention.
[0020] Figure 2 A planar schematic diagram of a flexible solar cell array provided in an embodiment of this utility model.
[0021] The reference numerals and components involved in the accompanying drawings are shown below:
[0022] 100. Chip
[0023] 200, Lead wire
[0024] 300, cover plate
[0025] 400, through hole
[0026] 500, Flexible substrate
[0027] 600, Battery Current Output Terminal
[0028] 700, Battery Array Busbar Detailed Implementation
[0029] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit its scope.
[0030] The terms "first," "second," "third," "fourth," etc., used in the specification and claims of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.
[0031] Example 1
[0032] Figure 1 This is a planar schematic diagram of the flexible solar cell array isolation diode assembly structure provided in an embodiment of this utility model. Please refer to... Figure 1 The flexible solar cell array isolation diode assembly structure provided in this embodiment includes a chip 100, interconnects (not shown in the figure), leads 200, a cover plate 300, and a thermal control film (not shown in the figure). The interconnects are welded to both the positive and negative terminals of the chip 100, and the leads 200 are connected to both interconnects. A through hole 400 is provided on the cover plate 300, and the chip 100 is connected and fixed at the position of the through hole 400. The thermal control film with self-adhesive backing is pasted on the surface of the cover plate 300.
[0033] Specifically, the cover plate 300 has a thickness of 0.16mm-0.2mm; the leads 200 are arranged in an S-shape, and the leads 200 on the positive electrode of the chip 100 and the leads 200 on the negative electrode of the chip 100 are symmetrically arranged; the thermal control film is a secondary surface mirror thermal control film or an F46 thermal control film; the chip 100 is a thin silicon diode chip 100, the length and width of the chip 100 are both 5.5mm, and the thickness of the chip 100 is 0.16mm; the interconnect is made of pure silver or Kovar alloy silver-plated material, the interconnect has a thickness of 0.025mm, and the interconnect has a planar stress-reducing structure; the cover plate 300 is made of polyimide material, the length and width of the cover plate 300 are 50mm and 11mm respectively, and the thickness of the cover plate 300 is 0.2mm; the through hole 400 is square, the length and width of the through hole 400 are 8.5mm and 6mm respectively.
[0034] It should be noted that the flexible solar cell array isolation diode component structure provided by this utility model has a component thickness that can be controlled at 0.2mm, and the thickness of the flexible thin-film triple junction CIC cell is 0.2mm, which meets the mechanical requirements for the flexible solar cell array to be folded and pressed together; the cover plate 300 provides mechanical protection for the chip 100, while the thermal control film pasted on the surface effectively reduces the absorption of solar radiation by the chip, and can also radiate the heat generated by the chip during operation; the component structure is simple and can be coupled into the automatic production process of the solar cell array.
[0035] Figure 2 This is a planar schematic diagram of a flexible solar cell array provided in an embodiment of this utility model. Please refer to... Figure 2 This utility model also provides a flexible solar cell array, including the above-mentioned flexible solar cell array isolation diode component structure.
[0036] Furthermore, the flexible solar cell array of this utility model includes a flexible substrate 500, on which a battery current output terminal 600 and a battery array busbar 700 are disposed; the bottom of the cover plate 300 is connected to the flexible substrate 500, the lead 200 on the positive electrode of the chip 100 is connected to the battery current output terminal 600, and the lead 200 on the negative electrode of the chip 100 is connected to the battery array busbar 700.
[0037] The molding process of this flexible solar cell array is as follows:
[0038] Interconnectors are soldered to the positive and negative electrodes of chip 100 by resistance welding. Chip 100 with interconnects soldered is placed in the reserved position of flexible solar cell array. Adhesive is applied to the back and the interconnects are connected to the reserved FPC pads by soldering. Adhesive is applied to the blank positions on both sides of chip 100. The through holes 400 of cover plate 300 without thermal control film are aligned with chip 100 and pasted onto flexible substrate 500. Finally, F46 film with self-adhesive backing is pasted onto the surface of cover plate 300.
[0039] It should be noted that, compared with the prior art, this application uses a thin silicon diode as the chip, fixes the chip to the solar cell array substrate with adhesive, uses a metal foil with a planar stress-reducing structure as an interconnect, directly solders the interconnect to the reserved pads of the solar cell array, uses a polyimide cover plate as a rigid support, and reduces the chip's operating temperature by attaching a thermal control film to the surface. This structure can meet the space environment requirements, and the thickness can be controlled at 0.2 mm, meeting the requirements for folding and pressing of flexible thin-film solar cell arrays. During fabrication, it can be coupled into the automatic production process of solar cell arrays, and production can be completed using automatic dispensing and automatic welding functions.
[0040] As can be seen from the above description, the advantages of this utility model are:
[0041] 1. The flexible solar cell array isolation diode component structure provided by this utility model has a component thickness that can be controlled at 0.2mm, and the thickness of the flexible thin film triple junction CIC cell is 0.2mm, which meets the mechanical requirements for the flexible solar cell array to be folded and pressed together.
[0042] 2. The flexible solar cell array isolation diode assembly structure provided by this utility model provides mechanical protection for the chip 100 through the cover plate 300, while effectively reducing the absorption of solar radiation by the chip through the thermal control film pasted on the surface, and at the same time radiating the heat generated by the chip during operation.
[0043] 3. The flexible solar cell array isolation diode component structure provided by this utility model has a simple component structure and can be coupled into the automatic production process of the solar cell array.
[0044] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.
Claims
1. A flexible solar cell array isolation diode assembly structure, characterized in that, Includes a chip (100), interconnects, leads (200), cover plate (300), and thermal control film; The interconnect is soldered to both the positive and negative terminals of the chip (100), and the lead (200) is connected to both interconnects. A through hole (400) is provided on the cover plate (300), and the chip (100) is connected and fixed at the position of the through hole (400). A thermal control film with self-adhesive backing is pasted on the surface of the cover plate (300).
2. The flexible solar cell array isolation diode assembly structure according to claim 1, characterized in that, The cover plate (300) has a thickness of 0.16mm-0.2mm.
3. The flexible solar cell array isolation diode assembly structure according to claim 1, characterized in that, The leads (200) are arranged in an S-shape, and the leads (200) on the positive electrode of the chip (100) and the leads (200) on the negative electrode of the chip (100) are arranged symmetrically.
4. The flexible solar cell array isolation diode assembly structure according to claim 1, characterized in that, The thermal control film is a secondary surface mirror thermal control film or an F46 thermal control film.
5. The flexible solar cell array isolation diode assembly structure according to claim 1, characterized in that, The chip (100) is a thin silicon diode chip (100), the length and width of the chip (100) are both 5.5mm, and the thickness of the chip (100) is 0.16mm.
6. The flexible solar cell array isolation diode assembly structure according to claim 1, characterized in that, The interconnect is made of pure silver or silver-plated Kovar alloy, the interconnect is 0.025 mm thick, and the interconnect has a planar stress-reducing structure.
7. The flexible solar cell array isolation diode assembly structure according to claim 1, characterized in that, The cover plate (300) is made of polyimide material, and the length and width of the cover plate (300) are 50mm and 11mm respectively, and the thickness of the cover plate (300) is 0.2mm.
8. The flexible solar cell array isolation diode assembly structure according to claim 1, characterized in that, The through hole (400) is square, and the length and width of the through hole (400) are 8.5 mm and 6 mm, respectively.
9. A flexible solar cell array, characterized in that, The flexible solar cell array isolation diode assembly structure includes any one of claims 1-8.
10. The flexible solar cell array according to claim 9, characterized in that, The flexible solar cell array includes a flexible substrate (500), on which a battery current output terminal (600) and a battery array busbar (700) are disposed; the cover plate (300) is connected to the flexible substrate (500) on the underside; the lead (200) on the positive electrode of the chip (100) is connected to the battery current output terminal (600), and the lead (200) on the negative electrode of the chip (100) is connected to the battery array busbar (700).