Novel conductive slip ring structure
By employing a printed circuit board structure and inorganic materials in the conductive slip ring, simple conductivity between the copper ring and the wire is achieved, solving the problems of complex structure and high cost of traditional slip rings, and improving production efficiency and product quality.
Patent Information
- Application Number
- CN202423082414.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-13
- Publication Date
- 2025-12-02
- Estimated Expiration
- 2034-12-13
AI Technical Summary
The existing conductive slip ring structure has a complex manufacturing process, high cost, and traditional welding process is prone to producing defective products.
The printed circuit board structure simplifies the installation process of the slip ring by nesting copper ring pads and wire pads, and the use of printed circuit boards made of inorganic materials improves structural stability and mechanical strength, replacing the traditional injection molding process.
This significantly simplifies the installation process of slip rings, reduces production costs, and improves product quality and reliability.
Smart Images
Figure CN223625389U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of conductive slip ring technology and relates to a novel conductive slip ring structure. Background Technology
[0002] Currently available conductive slip ring structures on the market require relatively fixed and conductive soldering between the slip ring and the wire. Therefore, the fabrication of slip ring assemblies is roughly as follows:
[0003] 1. Solder the wires of different colors to the inner wall of the copper ring. During the soldering process, it is necessary to ensure that the solder joint is not too large, otherwise it may cause subsequent assembly failure or the production of defective products.
[0004] 2. Place copper rings of different colors into the cavity of the injection mold according to a certain positional relationship, and each wire needs to pass through the copper ring;
[0005] 3. Inject the copper rings arranged in the mold cavity to fix the relative position of each copper ring;
[0006] 4. Finally, trim and strip the insulation from the connecting wires to complete all processing steps.
[0007] In actual processing, when processing according to the above process and requirements, the manufacturing process of slip ring components is complex, time-consuming, and costly. Utility Model Content
[0008] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:
[0009] A novel conductive slip ring structure includes: a printed circuit board and a complex array of conductive copper rings soldered onto the printed circuit board;
[0010] The printed circuit board has a columnar structure. One end of the printed circuit board is a copper ring welding end. Each set of conductive copper rings is nested in the copper ring welding end of the printed circuit board and is independently set along the length of the printed circuit board.
[0011] Furthermore, copper ring pads are provided at the mounting positions of each group of conductive copper rings on the printed circuit board.
[0012] The other end of the printed circuit board is the wire soldering end, which has wire pads formed on it that correspond to the number of copper ring pads.
[0013] The copper ring pads correspond one-to-one with the wire pads, and the printed circuit board is provided with printed circuit lines that connect the corresponding copper ring pads and wire pads.
[0014] As a further aspect of this invention, the printed circuit board is made of inorganic materials.
[0015] The beneficial effects of this utility model are as follows: the nested installation structure of the copper ring pads is realized through the printed circuit board structure, and the copper ring pads, wire pads and printed circuits on the printed circuit board achieve the effect of simple conductive connection between the conductive copper ring and the wire; it can greatly simplify the slip ring installation process, effectively reduce the overall production cost and improve the production quality. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of the structure of this utility model.
[0017] Figure 2 This is another structural schematic diagram of this utility model. Detailed Implementation
[0018] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. It should be understood that this application is not limited to the exemplary embodiments disclosed herein. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.
[0019] In the description of this utility model, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0020] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.
[0021] In the embodiments of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.
[0022] Please see Figures 1-2 In this embodiment of the present invention, a novel conductive slip ring structure includes: a printed circuit board 1 and a plurality of conductive copper rings 3 soldered on the printed circuit board 1.
[0023] The printed circuit board 1 has a columnar structure. One end of the printed circuit board 1 is a copper ring welding end 4. Each set of conductive copper rings 3 is nested at the copper ring welding end 4 of the printed circuit board 1 and is independently set along the length of the printed circuit board 1.
[0024] Furthermore, each set of conductive copper rings 3 is provided with a copper ring pad 41 at the installation position of the printed circuit board 1. The copper ring pad 41 contacts the corresponding conductive copper ring 3 to achieve conductivity.
[0025] The other end of the printed circuit board 1 is a wire soldering end 2, on which wire soldering end 2 is formed wire solder pads 21 corresponding to the number of copper ring solder pads 41.
[0026] The copper ring pad 41 corresponds one-to-one with the wire pad 21, and the printed circuit board 1 is provided with printed circuits (not shown) that connect the corresponding copper ring pad 41 and the wire pad 21. During processing, wires of different colors are directly soldered to the corresponding wire pad 21. The electrical connection between the wire (external device) and the conductive copper ring 3 is realized through the conductive structure formed by the wire pad 21, the printed circuit and the copper ring pad 41.
[0027] During processing, the conductive copper ring 3 only needs to be inserted into the corresponding position on the printed circuit board 1, which can greatly simplify the slip ring installation process, effectively reduce the overall production cost and improve the production quality.
[0028] Furthermore, the printed circuit board 1 is made of inorganic materials, which have the effects of high melting point and strong thermal stability, and can maintain the stability of the structure during the welding process. Secondly, it has high hardness and mechanical strength, and has high resistance to deformation and damage in mechanics, which can well replace the injection molding structural parts in the traditional slip ring structure.
[0029] It should also be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
[0030] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A novel conductive slip ring structure, characterized in that, include: Printed circuit board and multiple conductive copper rings soldered onto the printed circuit board; The printed circuit board has a columnar structure. One end of the printed circuit board is a copper ring welding end. Each set of conductive copper rings is nested in the copper ring welding end of the printed circuit board and is independently set along the length of the printed circuit board. Furthermore, copper ring pads are provided at the mounting positions of each group of conductive copper rings on the printed circuit board. The other end of the printed circuit board is the wire soldering end, which has wire pads formed on it that correspond to the number of copper ring pads. The copper ring pads correspond one-to-one with the wire pads, and the printed circuit board is provided with printed circuit lines that connect the corresponding copper ring pads and wire pads.
2. The novel conductive slip ring structure according to claim 1, characterized in that, Printed circuit boards are made of inorganic materials.