Double-sided circuit board

Abstract

The utility model belongs to the technical field of circuit boards, in particular to a double-sided circuit board, which is characterized by comprising a circuit board body, and a flame-retardant layer is arranged in the circuit board body; the heat dissipation mechanism is arranged below the circuit board body; the heat conduction mechanism is arranged between the heat dissipation mechanism and the circuit board body, the heat conduction mechanism comprises a heat conduction layer and heat conduction particles, the heat conduction layer is arranged at the top of the heat dissipation mechanism, the top of the heat conduction layer is in contact with the bottom of the circuit board body, and the heat conduction particles are arranged in the heat conduction layer. The beneficial effects of the utility model are that the heat of the double-sided circuit board can be effectively dissipated during working, the double-sided circuit board is prevented from being damaged due to overhigh temperature, and the high temperature resistance and the working efficiency of the double-sided circuit board are improved.

Description

Technical Field

[0001] This utility model belongs to the field of circuit board technology, and specifically refers to a double-sided circuit board. Background Technology

[0002] A printed circuit board (PCB), also known as a circuit board, is an essential component of electronic devices. It's a circuit board made of non-conductive material used to support and connect electronic components. Circuits are fabricated on a copper-clad substrate using printing technology, enabling electrical connections and physical support between electronic components. PCBs are classified into three types based on the number of layers: single-sided, double-sided, and multilayer. Double-sided PCBs are an extension of single-sided PCBs. When single-layer wiring cannot meet the needs of electronic products, double-sided PCBs are used. Both sides of a double-sided PCB have conductive patterns, allowing electrical connections between the two sides through vias or pads. The design of double-sided PCBs makes wiring more flexible, as it allows wiring on both surfaces of the board, thereby increasing the board's density and performance.

[0003] However, because double-sided circuit boards have conductive patterns on both sides and have a high degree of integration, they generate a lot of heat during operation. If they cannot be effectively cooled, the temperature of the double-sided circuit board will become too high, causing damage to the double-sided circuit board. Utility Model Content

[0004] The purpose of this invention is to address the aforementioned technical problems by providing a double-sided circuit board that can effectively dissipate heat during operation, preventing damage caused by excessive temperature and improving the high-temperature resistance and working efficiency of the double-sided circuit board.

[0005] The purpose of this utility model is achieved as follows: a double-sided circuit board, comprising:

[0006] The circuit board body has a flame-retardant layer inside it.

[0007] A heat dissipation mechanism is located below the circuit board body;

[0008] A heat-conducting mechanism is disposed between the heat dissipation mechanism and the circuit board body. The heat-conducting mechanism includes a heat-conducting layer and heat-conducting particles. The heat-conducting layer is disposed on the top of the heat dissipation mechanism, and the top of the heat-conducting layer is in contact with the bottom of the circuit board body. The heat-conducting particles are disposed within the heat-conducting layer.

[0009] The present invention is further configured such that the heat dissipation mechanism includes:

[0010] The housing is located below the circuit board body;

[0011] A cavity is provided within the housing;

[0012] Multiple fins are arranged in the cavity in the Z direction, with the top of the fins connected to the top of the cavity, and the multiple fins are arranged in a cross pattern in the cavity.

[0013] The present invention is further configured such that the heat dissipation mechanism also includes:

[0014] The heat dissipation mechanism also includes:

[0015] An air inlet is provided at one end of the housing in the X direction, and the air inlet communicates with the cavity;

[0016] An air outlet is provided at the end of the housing away from the air inlet, and the air outlet communicates with the cavity;

[0017] A fan is disposed inside the cavity, and the fan faces the air outlet;

[0018] The air inlet and the air outlet are both provided with multiple holes along the Y direction of the housing.

[0019] The present invention is further configured such that the heat dissipation mechanism also includes:

[0020] A filter frame is disposed outside the air inlet. The filter frame has a snap-fit ​​protrusion at one end facing the housing. The housing has a snap-fit ​​groove that mates with the snap-fit ​​protrusion. The snap-fit ​​protrusion snaps into the snap-fit ​​groove.

[0021] A filter screen is installed inside the filter frame.

[0022] The present invention is further configured such that: the top of the heat dissipation mechanism is provided with a groove, and the heat-conducting layer is disposed in the groove.

[0023] The present invention is further configured such that the circuit board body is provided with heat dissipation holes.

[0024] The present invention is further configured such that: a bolt is provided on the circuit board body, the bolt passes through the circuit board body and is connected to the heat dissipation mechanism.

[0025] By adopting the above technical solution, this utility model has at least the following beneficial effects:

[0026] 1. A heat dissipation mechanism is installed at the bottom of the circuit board body, and a heat conduction mechanism is installed between the heat dissipation mechanism and the circuit board body. Through the cooperation of the heat conduction layer and heat conduction particles, the heat generated by the circuit board during operation can be quickly transferred to the heat dissipation mechanism, and the heat is dissipated through the heat dissipation mechanism to prevent the circuit board from being damaged due to overheating. A flame retardant layer is installed inside the circuit board body, which can reduce the risk of the circuit board catching fire in the event of a fire or electrical fault, improve the high temperature resistance and working efficiency of the circuit board, and extend the service life of the circuit board.

[0027] 2. The shell has a cavity with multiple fins inside. The fins can increase the heat transfer area and introduce heat into the cavity, thereby improving the heat exchange efficiency of the heat dissipation mechanism.

[0028] 3. The radiator has air inlet and exhaust vents on both sides of the X direction. The fins work in conjunction with the fan inside the cavity. The fan can bring outside air into the cavity through the air inlet. Multiple fins are arranged in a cross pattern inside the cavity, which can disturb the gas entering the cavity, thereby breaking the boundary layer of gas flow, improving the heat exchange efficiency between air and fins, and thus improving the heat dissipation effect of the heat dissipation mechanism.

[0029] 4. A filter frame is installed outside the air inlet, and a filter screen is installed inside the filter frame. The filter screen can reduce the amount of dust in the air entering the cavity through the air inlet and adhering to the fins when the heat dissipation mechanism is working, which affects the heat transfer and heat dissipation capacity of the fins.

[0030] 5. The top of the heat dissipation mechanism is provided with a groove, and the heat-conducting layer is placed in the groove, which can increase the contact area between the heat-conducting layer and the heat dissipation mechanism, thereby further improving the heat conduction effect of the heat-conducting mechanism. Attached Figure Description

[0031] Figure 1 This is one of the structural schematic diagrams of the double-sided circuit board of this utility model;

[0032] Figure 2 This is the second schematic diagram of the structure of the double-sided circuit board of this utility model;

[0033] Figure 3 This is a schematic diagram of the casing of this utility model;

[0034] Figure 4 This is a schematic diagram of the fin of this utility model;

[0035] Figure 5 This is a cross-sectional view of the housing of this utility model along the X direction;

[0036] Figure 6 This is an enlarged view of part A of this utility model;

[0037] Figure 7 This is a schematic diagram of the filter frame of this utility model;

[0038] The attached figures are labeled as follows: 1-Circuit board body, 2-Heat dissipation mechanism, 3-Heat conduction mechanism, 11-Flame retardant layer, 12-Heat dissipation hole, 13-Bolt, 21-Shell, 22-Cavity, 23-Fins, 24-Air inlet, 25-Air outlet, 26-Fan, 27-Filter frame, 28-Filter screen, 29-Snap-on slot, 210-Groove, 31-Heat conduction layer, 32-Heat conduction particles. Detailed Implementation

[0039] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0040] In the description of this application, it should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. For ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items, and therefore, once an item is defined in one drawing, it need not be further described in subsequent drawings.

[0041] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. See also: Figure 1-7 :

[0042] Example 1:

[0043] This embodiment provides a double-sided circuit board, including:

[0044] The circuit board body 1 has a flame-retardant layer 11 inside the circuit board body 1.

[0045] Heat dissipation mechanism 2 is located below the circuit board body 1;

[0046] The heat conduction mechanism 3 is disposed between the heat dissipation mechanism 2 and the circuit board body 1. The heat conduction mechanism 3 includes a heat conduction layer 31 and heat conduction particles 32. The heat conduction layer 31 is disposed on the top of the heat dissipation mechanism 2, and the top of the heat conduction layer 31 is in contact with the bottom of the circuit board body 1. The heat conduction particles 32 are disposed inside the heat conduction layer 31.

[0047] like Figure 1-6 As shown, the circuit board body 1 includes a top layer, a bottom layer and a flame retardant layer 11. The flame retardant layer 11 is disposed between the top layer and the bottom layer. The top layer, the bottom layer and the flame retardant layer 11 are connected by heat pressing.

[0048] The flame-retardant layer 11 can significantly reduce the risk of the circuit board catching fire in the event of a fire or electrical failure, protecting users and equipment from fire hazards, thereby extending the service life of the circuit board.

[0049] The flame retardant layer 11 can be made of materials such as silicates. In this invention, epoxy resin and glass fiber cloth are preferred. The flame retardant layer 11 has good electrical insulation properties and can prevent or delay the combustion process to a certain extent.

[0050] A heat dissipation mechanism 2 is disposed below the circuit board body 1, and a heat conduction mechanism 3 is disposed between the heat dissipation mechanism 2 and the circuit board body 1. The heat conduction mechanism 3 includes a heat conduction layer 31 and heat conduction particles 32. The heat conduction layer 31 is made of silicone gel, which has excellent electrical properties, chemical stability, and weather resistance. It can fill the tiny gaps between the heat dissipation mechanism 2 and the double-sided circuit board, providing an effective heat conduction path and reducing thermal resistance. The heat conduction particles 32 are evenly distributed within the heat conduction layer 31. The heat conduction particles 32 have high thermal conductivity, which can improve the thermal conductivity of the heat conduction layer 31, allowing the heat conduction layer 31 to quickly transfer the heat generated by the circuit board during operation to the heat dissipation mechanism 2, and then dissipate the heat through the heat dissipation mechanism 2, preventing the circuit board from being damaged due to overheating.

[0051] The heat-conducting particles 32 can be made of materials such as boron nitride and bismuth oxide. In this invention, aluminum nitride is preferred. Aluminum nitride has high thermal conductivity, which can effectively improve the thermal conductivity of the heat-conducting mechanism 3, enhance the high temperature resistance of the circuit board, and extend the service life of the circuit board.

[0052] Example 2:

[0053] This embodiment provides a double-sided circuit board, which, in addition to the technical solutions of the above embodiments, also has the following technical features.

[0054] Heat dissipation mechanism 2 includes:

[0055] Housing 21 is located below the circuit board body 1;

[0056] Cavity 22 is disposed within housing 21;

[0057] Multiple fins 23 are arranged in the Z direction within the cavity 22, with the top of the fins 23 connected to the top of the cavity 22, and the multiple fins 23 are arranged in a cross pattern within the cavity 22.

[0058] like Figure 1-6 As shown, the fins 23 and the housing 21 are integrated into one piece. The top of the fins 23 is connected to the top of the cavity 22. Multiple fins 23 are arranged in a cross pattern in the cavity 22, which can introduce the heat transferred by the heat conduction mechanism 3 into the cavity 22, increase the heat dissipation area, optimize the heat dissipation effect of the heat dissipation mechanism 2, ensure the stability of the circuit board operation, and improve the service life of the circuit board.

[0059] Both the fins 23 and the shell 21 are made of aluminum. Aluminum has strong thermal conductivity and low density, which can effectively reduce the mass of the heat dissipation mechanism 2 and facilitate transportation and processing.

[0060] The heat dissipation mechanism 2 also includes:

[0061] An air inlet 24 is located at one end of the housing 21 in the X direction, and the air inlet 24 is connected to the cavity 22.

[0062] An air outlet 25 is located at the end of the housing 21 away from the air inlet 24, and the air outlet 25 is connected to the cavity 22.

[0063] Fan 26 is disposed inside cavity 22, and fan 26 faces air outlet 25;

[0064] Multiple air inlets 24 and air outlets 25 are provided along the Y direction of the housing 21.

[0065] like Figure 1-6 As shown, the air inlet 24 and air outlet 25 work together with the fan 26. The fan 26 can bring outside air into the cavity 22 through the air inlet 24. The air flows towards the air outlet 25 in the cavity 22 and leaves the cavity 22 through the air outlet 25 after contacting the fins 23. This can carry the heat transferred from the fins 23 into the cavity 22 out of the cavity 22, effectively improving the heat dissipation effect of the heat dissipation mechanism 2.

[0066] The gas entering the cavity 22 is disturbed by the cross-arranged fins 23, which can disrupt the boundary layer of the gas flow, improve the heat exchange efficiency between the air and the fins 23, thereby further improving the heat dissipation effect of the heat dissipation mechanism 2, preventing the double-sided circuit board from being damaged due to excessive temperature, and improving the high temperature resistance and working efficiency of the double-sided circuit board.

[0067] Multiple air inlets 24 and multiple air outlets 25 are provided along the Y direction of the housing 21. Multiple air inlets 24 and multiple air outlets 25 can increase the air flow area in the cavity 22 and effectively improve the heat dissipation efficiency of the heat dissipation mechanism 2.

[0068] Multiple fans 26 are positioned facing the air outlet 25. The fans 26 are located at the bottom of the cavity 22. The fans 26 are existing products and their power supply wiring method is also a conventional design. The power supply wires can be passed through the housing 21 for centralized power supply, etc.

[0069] The filter frame 27 is located outside the air inlet 24. The filter frame 27 has a snap-fit ​​protrusion 271 at the end facing the housing 21. The housing 21 has a snap-fit ​​groove 29 that mates with the snap-fit ​​protrusion 271. The snap-fit ​​protrusion 271 snaps into the snap-fit ​​groove 29.

[0070] The filter screen 28 is located inside the filter holder 27.

[0071] like Figure 1 , 5As shown in Figure 7, the filter frame 27 is located outside the air inlet 24. The filter frame 27 has a snap-fit ​​protrusion 271 at one end facing the housing 21. The housing 21 has a snap-fit ​​groove 29 that cooperates with the snap-fit ​​protrusion 271. The snap-fit ​​protrusion 271 is inserted into the snap-fit ​​groove 29 and snaps into the snap-fit ​​groove 29, thereby fixing the filter frame 27 to the housing 21.

[0072] The filter screen 28 is glued to the filter frame 27. The filter screen 28 is located between the filter frame 27 and the housing 21. The end of the filter screen 28 away from the filter frame 27 is in contact with the housing 21. When the heat dissipation mechanism 2 is working, the filter screen 28 can reduce the amount of dust in the air that enters the cavity 22 through the air inlet 24 and adheres to the fins 23, thus affecting the heat transfer and heat dissipation capacity of the fins 23.

[0073] The filter frame 27 is detachably connected to the housing 21, which facilitates installation and disassembly. When the filter screen 28 is damaged, the filter frame 27 can be directly removed and the filter screen 28 replaced, which facilitates maintenance and reduces maintenance costs.

[0074] The filter frame 27 is made of plastic, which is lightweight and reduces operating costs. The filter screen 28 is made of fiber material, which has high strength and can effectively block dust and dirt from entering the heat dissipation mechanism 2. It is also lightweight and easy to install and remove.

[0075] Example 3:

[0076] This embodiment provides a double-sided circuit board, which, in addition to the technical solutions of the above embodiments, also has the following technical features.

[0077] The top of the heat dissipation mechanism 2 is provided with a groove 210, and the heat-conducting layer 31 is disposed in the groove 210.

[0078] like Figure 3 , 5 As shown in Figure 6, the top of the heat dissipation mechanism 2 is provided with a groove 210. The groove 210 is located at the end of the housing 21 facing the circuit board body 1. The heat-conducting layer 31 is located in the groove 210, which can increase the contact area between the heat-conducting layer 31 and the heat dissipation mechanism 2, thereby further improving the heat conduction effect of the heat-conducting mechanism 3.

[0079] The circuit board body 1 is provided with heat dissipation holes 12.

[0080] like Figure 1-2 As shown, multiple heat dissipation holes 12 can be provided according to the distribution of electronic components. The heat dissipation holes 12 can dissipate some of the heat from the top of the circuit board body 1 during operation, increase the heat dissipation area of ​​the circuit board body 1, reduce thermal resistance, expand the heat dissipation path of the circuit board body 1, further improve the heat dissipation capacity of the double-sided circuit board, prevent the double-sided circuit board from being damaged due to excessive temperature, and improve the high temperature resistance and working efficiency of the double-sided circuit board.

[0081] The circuit board body 1 is provided with bolts 13, which pass through the circuit board body 1 and are connected to the heat dissipation mechanism 2.

[0082] like Figure 1-2 As shown, bolts 13 are set on the four corners of the circuit board body 1. The circuit board body 1 has countersunk holes, and the housing 21 has threaded holes. Bolts 13 pass through the countersunk holes and are inserted into the threaded holes to fix the circuit board body 1 to the heat dissipation mechanism 2, thereby improving the stability of the circuit board fixation.

[0083] Countersunk holes can hide the bolt heads after the circuit board is installed and fixed, protecting the integrity and aesthetics of the circuit board. At the same time, they can save space, as no additional space is needed to accommodate the bolt heads during the circuit board installation process, making assembly easier.

[0084] Countersunk hole design also helps optimize heat dissipation. The gap between the bolt head and the working surface can be reduced by countersunk holes, thereby improving heat conduction efficiency. Countersunk holes can also act as part of a heat dissipation channel, helping to conduct heat to the surrounding environment more quickly.

[0085] The above embodiments are merely preferred embodiments of the present utility model and are not intended to limit the scope of protection of the present utility model. Therefore, all equivalent changes made to the structure, shape, and principle of the present utility model should be covered within the scope of protection of the present utility model.

Claims

1. A double-sided circuit board, characterized in that, include: The circuit board body (1) has a flame-retardant layer (11) inside. A heat dissipation mechanism (2) is disposed below the circuit board body (1); A heat conduction mechanism (3) is disposed between the heat dissipation mechanism (2) and the circuit board body (1). The heat conduction mechanism (3) includes a heat conduction layer (31) and heat conduction particles (32). The heat conduction layer (31) is disposed on the top of the heat dissipation mechanism (2). The top of the heat conduction layer (31) is in contact with the bottom of the circuit board body (1). The heat conduction particles (32) are disposed inside the heat conduction layer (31).

2. The double-sided circuit board according to claim 1, characterized in that, The heat dissipation mechanism (2) includes: The housing (21) is disposed below the circuit board body (1); A cavity (22) is disposed within the housing (21); Multiple fins (23) are arranged in the Z direction within the cavity (22), with the top of the fins (23) connected to the top of the cavity (22), and the multiple fins (23) are arranged crosswise within the cavity (22).

3. The double-sided circuit board according to claim 2, characterized in that, The heat dissipation mechanism (2) further includes: An air inlet (24) is provided at one end of the housing (21) in the X direction, and the air inlet (24) communicates with the cavity (22); An air outlet (25) is provided at one end of the housing (21) away from the air inlet (24), and the air outlet (25) communicates with the cavity (22); A fan (26) is disposed in the cavity (22) and the fan (26) faces the air outlet (25); The air inlet (24) and the air outlet (25) are both provided with multiple holes along the Y direction of the housing (21).

4. The double-sided circuit board according to claim 3, characterized in that, The heat dissipation mechanism (2) further includes: A filter frame (27) is provided on the outside of the air inlet (24). The filter frame (27) has a snap-fit ​​protrusion (271) at one end facing the housing (21). The housing (21) has a snap-fit ​​groove (29) that cooperates with the snap-fit ​​protrusion (271). The snap-fit ​​protrusion (271) snaps into the snap-fit ​​groove (29). A filter screen (28) is disposed within the filter frame (27).

5. The double-sided circuit board according to claim 1, characterized in that, The heat dissipation mechanism (2) has a groove (210) on its top, and the heat-conducting layer (31) is disposed in the groove (210).

6. The double-sided circuit board according to claim 1, characterized in that, The circuit board body (1) is provided with heat dissipation holes (12).

7. The double-sided circuit board according to claim 1, characterized in that, The circuit board body (1) is provided with bolts (13), which penetrate the circuit board body (1) and are connected to the heat dissipation mechanism (2).

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