Electronic device

Abstract

The embodiment of the utility model relates to the technical field of heat dissipation, and discloses electronic equipment, the electronic equipment comprises a case, a mainboard, a heat conduction part and a hard disk assembly, the case comprises a first heat dissipation cover plate, a second heat dissipation cover plate and a side wall, the mainboard is arranged in a mounting cavity and is parallel to the first heat dissipation cover plate, and the heat conduction part is arranged in the second heat dissipation cover plate; the heating device on the first face of the main board is attached to the first heat dissipation cover plate so that heat dissipation can be conducted on the heating device on the first face through the first heat dissipation cover plate, and the first attaching face and the second attaching face of the heat conduction piece are attached to the heating device on the second face of the main board and the side wall respectively. The heat conduction part is used for conducting heat of the heating device to the side wall so as to dissipate heat of the heating device on the second face through the side wall, and the hard disk assembly is arranged between the mainboard and the second heat dissipation cover plate and attached to the second heat dissipation cover plate so as to dissipate heat of the hard disk assembly through the second heat dissipation cover plate. By means of the mode, rapid heat dissipation of the electronic equipment is achieved.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, specifically to an electronic device. Background Technology

[0002] Electronic devices possess strong computing and data processing capabilities, enabling them to perform complex tasks. Therefore, they are widely used in fields such as highway lane control, mechanical inspection equipment, and industrial automation control. However, for electronic devices used in special environments (such as industrial environments), external factors such as dust, vibration, and temperature changes can affect internal components. Therefore, electronic devices typically do not have fan cooling systems requiring ventilation holes in the chassis. Instead, they utilize heat sinks, heat pipes, or vapor chambers on the outer surface of the chassis to dissipate heat from the processor, which generates significant heat. This reduces potential points of mechanical failure and effectively improves system reliability and stability.

[0003] However, heat generated by components other than the processor accumulates continuously inside the chassis. Furthermore, due to changes in the current market ecosystem and increasingly demanding configuration requirements, electronic devices are increasingly compatible with more and more modules, leading to greater heat accumulation inside the chassis and higher device temperatures. This increases the risks faced by industrial computers. Current heat dissipation designs for electronic devices are no longer sufficient to meet their cooling needs, necessitating urgent improvements to the heat dissipation structures. Utility Model Content

[0004] In view of the above problems, this application provides an electronic device to solve the problem that the heat dissipation structure design of current electronic devices cannot meet the heat dissipation requirements of the device.

[0005] According to one aspect of the embodiments of this application, an electronic device is provided, the electronic device comprising: a chassis, including a first heat dissipation cover, a second heat dissipation cover, and a sidewall surrounding the first heat dissipation cover and the second heat dissipation cover, the first heat dissipation cover, the second heat dissipation cover, and the sidewall together forming a mounting cavity; a motherboard, disposed within the mounting cavity and parallel to the first heat dissipation cover, wherein heat-generating devices are disposed on both sides of the motherboard, wherein the heat-generating devices on the first side of the motherboard are in contact with the first heat dissipation cover to dissipate heat from the heat-generating devices on the first side; a heat-conducting component, having a first contact surface and a second contact surface perpendicular to each other, the first contact surface being in contact with the heat-generating devices on the second side of the motherboard, and the second contact surface being in contact with the sidewall, the heat-conducting component being used to conduct heat from the heat-generating devices to the sidewall through the first contact surface and the second contact surface to dissipate heat from the heat-generating devices on the second side; and a hard disk assembly, disposed between the motherboard and the second heat dissipation cover and in contact with the second heat dissipation cover to dissipate heat from the hard disk assembly through the second heat dissipation cover.

[0006] In one alternative approach, the heat-generating device on the first surface includes a processor, a fixing part is provided around the processor on the motherboard, and a through hole is provided on the first heat sink cover for fasteners to pass through and connect to the fixing part, so as to press the first heat sink cover toward the motherboard by the fasteners, so that the first heat sink cover and the processor are in close contact.

[0007] In one alternative embodiment, the fixing part is a fixing bracket, which is fixedly connected to the motherboard. The fixing bracket has a fixing hole on the side facing away from the motherboard, which is used to connect with a fastener so that the first heat sink cover and the processor are in close contact.

[0008] In one alternative approach, the heat-conducting component is at least partially located between the hard drive assembly and the motherboard. The heat-conducting component is a heat-conducting plate that is vertically bent to form multiple heat-conducting segments, with a first contact surface and a second contact surface each located on one of the heat-conducting segments.

[0009] In one alternative embodiment, both the first heat dissipation cover and the second heat dissipation cover are detachably connected to the side wall; the first heat dissipation cover is provided with a guide hole, and the side wall facing the first heat dissipation cover is provided with a guide pin, which is used to be inserted into the guide hole when the first heat dissipation cover covers one end of the side wall, so that the first heat dissipation cover is pre-positioned on the side wall.

[0010] In one alternative embodiment, a power board is also provided inside the mounting cavity. The power board is parallel to the side wall, and a power heating device is provided on the side of the power board facing the side wall. The power heating device is attached to the side wall to dissipate heat from the power heating device through the side wall.

[0011] In one alternative embodiment, other devices are also provided on the side of the power board facing the side wall, and the height of the power heating device is lower than at least some of the other devices; a power heat conduction component is provided between the power board and the side wall, and the two opposite sides of the power heat conduction component are respectively attached to the power heating device and the side wall, and the power heat conduction component is used to conduct the heat of the power heating device to the side wall.

[0012] In one alternative embodiment, the first heat sink cover has a protrusion and / or groove on the side facing the mounting cavity that is height-adapted to the heat-generating device on the first surface, and the protrusion and / or groove is in contact with the heat-generating device on the first surface.

[0013] In one alternative embodiment, both the first and second heat dissipation covers are provided with heat dissipation fins on the side opposite to the mounting cavity.

[0014] In one alternative embodiment, a mounting bracket is formed by extending outward from one end of the sidewall facing the second heat sink cover. The mounting bracket is used to connect with the mounting plane to fix the electronic device on the mounting plane. The side of the second heat sink cover away from the mounting cavity is used to face the mounting plane. The heat sink fins on the second heat sink cover are obliquely disposed on the second heat sink cover. And / or, the sidewall of the heat sink fins on the first heat sink cover is wavy.

[0015] This embodiment of the application conducts heat generated by heat-generating components on the motherboard evenly to the first heat dissipation cover and side walls of the chassis, and conducts heat generated by the hard drive assembly to the second heat dissipation cover. On the one hand, this allows all the walls of the chassis to participate in the heat dissipation of the electronic device, making full use of the chassis's heat conduction and fully considering the heat generation of all power consumption heat sources inside the chassis, effectively avoiding heat accumulation inside the chassis. On the other hand, it allows the heat generated by the hard drive assembly to be conducted to the external environment through the second heat dissipation cover, ensuring that the hard drives in the hard drive assembly, whether SSDs or mechanical hard drives, can operate normally within the electronic device, resulting in higher compatibility of the electronic device.

[0016] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description

[0017] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0018] Figure 1A perspective view of the electronic device provided in an embodiment of the present invention is shown;

[0019] Figure 2 A cross-sectional view of an electronic device provided in an embodiment of the present invention is shown;

[0020] Figure 3 A partial structural schematic diagram of the electronic device provided in an embodiment of the present invention is shown;

[0021] Figure 4 A partial explosion diagram of the electronic device provided in an embodiment of the present invention is shown;

[0022] Figure 5 An exploded view of the electronic device provided in an embodiment of the present invention is shown;

[0023] Figure 6 This diagram shows an exploded view of the electronic device provided in an embodiment of the present invention from another angle;

[0024] Figure 7 An exploded view of a portion of the structure of the electronic device provided in this embodiment of the present invention is shown.

[0025] Figure 8 It shows Figure 2 Enlarged view of point D in the middle;

[0026] Figure 9A It shows Figure 1 Enlarged view of point E in the middle;

[0027] Figure 9B It shows Figure 4 Enlarged schematic diagram at point F in the middle.

[0028] The reference numerals in the detailed embodiments are as follows:

[0029] 1. Electronic equipment; 2. Heat dissipation equipment;

[0030] 10. Chassis; 20. Motherboard; 30. Thermal conductive components; 40. Hard drive assembly; 50. Fasteners; 60. Studs; 70. Power supply board; 80. Power supply thermal conductive components;

[0031] 11. First heat dissipation cover; 12. Second heat dissipation cover; 13. Side wall; 14. Mounting cavity; 15. Heat dissipation fins; 16. Mounting bracket; 17. Heat dissipation channel;

[0032] 111. Guide hole; 112. Through hole; 113. Protrusion;

[0033] 121. Thermally conductive protrusions;

[0034] 131. Guide pin;

[0035] 21. Heating element; 22. First side; 23. Second side;

[0036] 221. Processor; 222. Memory; 223. MOS device; 224. 5G module; 225. M.2 module; 226. Mounting component;

[0037] 2261. Fixing bracket; 2262. Fixing hole; 2263. Opening;

[0038] 231. I / O module; 232. Chip; 233. Interface; 234. Msata module; 235. WIFI module;

[0039] 31. First bonding surface; 32. Second bonding surface; 33. Heat-conducting plate;

[0040] 331. Heat conduction section;

[0041] 41. Hard drive; 42. Hard drive bracket;

[0042] 411. Hard drive heat source;

[0043] 71. Power supply heating device; 72. Other devices. Detailed Implementation

[0044] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.

[0045] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0046] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0047] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0048] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A exists, A and B exist simultaneously, and B exists. In addition, the character " / " in this document generally indicates that the related objects before and after it have an "or" relationship.

[0049] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces).

[0050] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0051] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0052] Electronic devices used in special environments, such as industrial computers, are affected by factors like dust, vibration, and temperature fluctuations. Therefore, industrial computer chassis typically do not include fan-based cooling systems. Instead, they dissipate heat from the processor by using heat sinks, heat pipes, and vapor chambers on the outer surface of the chassis. This cooling structure reduces potential points of mechanical failure, effectively improving system reliability and stability, especially in dusty, vibrating, and temperature-volatile industrial environments.

[0053] Currently, industrial computers are widely used in highway lane control, mechanical inspection equipment, intelligent transportation, industrial automation control, and visual inspection due to their high reliability and stability. However, since industrial computers do not have internal fan cooling systems, components that generate a lot of heat (such as processors) are usually mounted close to the computer chassis so that the chassis can dissipate heat from these components to meet their cooling requirements.

[0054] However, the heat dissipation requirements of low-heat-generating components (such as M.2, mSATA, Mini PCIe, Wi-Fi modules, 4G / 5G modules, etc.) are generally not considered. This leads to the continuous accumulation of heat generated by these components inside the chassis, causing the chassis temperature to rise continuously. Consequently, most components inside the chassis operate under overheating conditions. Prolonged operation under overheating conditions will affect the operational status and lifespan of the industrial computer. In particular, changes in the market ecosystem and the continuous improvement of configuration requirements have resulted in more and more compatible modules inside industrial computers, leading to greater heat accumulation inside the chassis and increasingly higher temperatures for the industrial computers.

[0055] Based on this, this application proposes an electronic device. The device's chassis houses a motherboard and a hard drive assembly. Heat-generating devices are located on both sides of the motherboard. The motherboard and hard drive assembly are vertically stacked between a first and a second heat dissipation cover of the chassis, parallel to the first heat dissipation cover. This vertical stacking structure better utilizes the space within the chassis, effectively improving space utilization and reducing the size of the electronic device. Furthermore, the heat-generating devices on the side of the motherboard facing away from the hard drive assembly (the first side) are cooled by the first heat dissipation cover, while the heat generated by the heat-generating devices on the side of the motherboard facing the hard drive assembly (the second side) is conducted through a heat-conducting component to the sidewall between the first and second heat dissipation covers for cooling. The hard drive assembly is cooled by the second heat dissipation cover.

[0056] Specifically, the heat-generating components on the first surface are attached to the first heat dissipation cover and dissipate heat through the first heat dissipation cover; the heat-conducting component has a first and a second perpendicular contact surface. The first contact surface is attached to the heat-generating components on the second surface, and the second contact surface is attached to the side wall of the chassis. The heat-conducting component conducts the heat generated by the heat-generating components to the side wall through the first and second contact surfaces to dissipate heat from the heat-generating components on the second surface; the hard drive assembly is attached to the second heat dissipation cover and dissipates heat through the second heat dissipation cover. This heat dissipation method not only considers the heat dissipation needs of all heat-generating components inside the chassis, effectively preventing the accumulation of heat generated by the components inside the chassis, but also conducts the heat generated by the components to each surface of the chassis, making full use of each surface of the chassis to dissipate heat from the electronic equipment, effectively improving the heat dissipation efficiency of the electronic equipment.

[0057] Please see Figure 1 , Figure 2 , Figure 3 and Figure 4 , Figure 1 A perspective view of the electronic device provided in an embodiment of the present invention is shown. Figure 2 A cross-sectional view of an electronic device provided in an embodiment of the present invention is shown. Figure 3 A partial structural schematic diagram of the electronic device provided in an embodiment of the present invention is shown. Figure 4 A partial exploded view of the electronic device provided in an embodiment of the present invention is shown. The electronic device 1 may be an industrial computer, or a device similar to an industrial computer that does not have an internal heating system. In this embodiment, only an industrial computer is used as an example for illustration. The electronic device 1 includes a chassis 10, a motherboard 20, a heat-conducting component 30, and a hard disk assembly 40.

[0058] like Figure 1 and Figure 2 As shown, the chassis 10 includes a first heat dissipation cover 11, a second heat dissipation cover 12, and a side wall that surrounds the first heat dissipation cover 11 and the second heat dissipation cover 12. The first heat dissipation cover 11, the second heat dissipation cover 12, and the side wall 13 together form an installation cavity 14.

[0059] like Figure 2 As shown, the motherboard 20 is disposed in the mounting cavity 14 and parallel to the first heat dissipation cover 11. Both sides of the motherboard 20 are provided with heat-generating devices 21. The heat-generating devices 21 on the first side 22 of the motherboard 20 are in contact with the first heat dissipation cover 11 so that the heat-generating devices 21 on the first side 22 can be dissipated through the first heat dissipation cover 11.

[0060] Figure 2 and Figure 3As shown, the heat-conducting component 30 has a first contact surface 31 and a second contact surface 32 that are perpendicular to each other. The first contact surface 31 is in contact with the heat-generating device 21 on the second surface 23 of the motherboard 20, and the second contact surface 32 is in contact with the side wall 13. The heat-conducting component 30 is used to conduct the heat of the heat-generating device 21 to the side wall 13 through the first contact surface 31 and the second contact surface 32, so as to dissipate heat from the heat-generating device 21 on the second surface 23 through the side wall 13.

[0061] like Figure 2 and Figure 4 As shown, the hard disk assembly 40 is disposed between the motherboard 20 and the second heat sink 12 and is in contact with the second heat sink 12 so as to dissipate heat from the hard disk assembly 40 through the second heat sink 12.

[0062] The chassis 10 forms a mounting cavity 14 to house various functional components of the electronic device 1 (e.g., motherboard 20, hard disk assembly 40, etc.) and to dissipate heat from heat-generating components such as the heat-generating device 21 and hard disk assembly 40 within the mounting cavity 14. The chassis 10 includes a first heat dissipation cover 11, a second heat dissipation cover 12, and side walls 13, such as... Figure 1 As shown, the vertical wall in the chassis 10 is called the side wall 13, and the horizontal walls located above and below the side wall 13 are called the first heat dissipation cover 11 and the second heat dissipation cover 12. The side wall 13 can be integrally formed or it can be made of multiple parts fixedly connected by means of adhesion, welding, etc. The first heat dissipation cover 11 can be integrally formed with the side wall 13, or it can be connected to the side wall 13 by means of detachable means such as snap-fit ​​or threaded connection, or it can be connected to the side wall 13 by means of non-detachable means such as adhesion or welding. The second heat dissipation cover 12 is arranged in a similar manner to the first heat dissipation cover 11, and will not be described in detail here.

[0063] It should be noted that, in order to facilitate the maintenance of the functional components within the mounting cavity 14, at least one of the multiple walls in the chassis 10 is detachably connected to the other walls of the chassis 10. For example, when the side wall 13 is integrally formed, at least one of the first heat dissipation cover 11 and the second heat dissipation cover 12 is detachably connected to the side wall 13; or each wall of the side wall 13 is detachably connected.

[0064] Furthermore, since components are located on both sides of the motherboard 20, to facilitate maintenance of the components on the first side 22 and the second side 23 of the motherboard 20, both the first heat sink 11 and the second heat sink 12 can be detachably connected to the side wall 13. When maintenance is required on the components on the first side 22, only the first heat sink 11 needs to be removed from the side wall 13; when maintenance is required on the hard drive assembly 40 or the components on the second side 23, only the second heat sink 12 needs to be removed from the side wall 13. Using this structure, when maintaining the components inside the chassis 10, only the corresponding heat sink needs to be removed from the side wall 13, without needing to remove the motherboard 20 from the chassis 10. Maintenance of the components on the motherboard 20 is more convenient, and repeated disassembly and reassembly of the motherboard 20 can be avoided, effectively improving the stability of the motherboard 20 within the chassis 10.

[0065] Furthermore, to facilitate the connection between the first heat dissipation cover 11 and the side wall 13, please refer to the specific structure. Figure 5 and Figure 6 , Figure 5 An exploded view of the electronic device provided in an embodiment of the present invention is shown. Figure 6 This diagram shows an exploded view of the electronic device provided in another embodiment of the present invention. A guide pin 131 can be provided at one end of the side wall 13 facing the first heat dissipation cover 11 (e.g., Figure 5 As shown), and guide holes 111 are provided on the first heat dissipation cover 11 (as shown). Figure 6 (As shown). When installing the first heat dissipation cover 11, first insert the guide pin 131 into the guide hole 111, and preposition the first heat dissipation cover 11 on the side wall 13. Then, fix the first heat dissipation cover 11 and the side wall 13 together through a connecting structure (e.g., a snap-fit ​​structure such as a hook or buckle, a threaded connection structure composed of a screw and a threaded hole).

[0066] Specifically, in this embodiment, as an example, assuming the first heat dissipation cover 11 and the side wall are connected by fasteners 50 such as screws and threaded rods, when the first heat dissipation cover 11 is placed over the side wall 13, the guide pin 131 is inserted into the guide hole 111, so that the hole on the first heat dissipation cover 11 for the fastener 50 to pass through is aligned with the hole on the side wall 13 for connecting with the fastener 50. Therefore, when fixing the first heat dissipation cover 11, on the one hand, the first heat dissipation cover 11 can remain stationary during the fixing process; on the other hand, the fastener 50 can be directly passed through the hole on the first heat dissipation cover 11 and connected with the hole on the side wall 13, making the installation of the first heat dissipation cover 11 more convenient. In particular, when the first heat dissipation cover 11 is also provided with heat dissipation fins 15, the problem of the holes on the first heat dissipation cover 11 being difficult to align with the holes on the side wall 13 due to the heat dissipation fins 15 obstructing the view can be effectively avoided.

[0067] like Figure 2 As shown, heat-generating devices 21 are provided on both the first side 22 and the second side 23 of the motherboard 20. The first side 22 is the side of the motherboard 20 that directly faces the chassis 10, that is, the first side 22 directly faces the first heat sink 11. Therefore, the heat-generating devices 21 located on the first side 22 can directly contact the first heat sink 11, thereby conducting heat to the first heat sink 11 for heat dissipation. Figure 5 As shown, the heat-generating devices 21 on the first surface 22 may include a processor 221, memory 222, MOS device 223, 5G module 224, etc., and the heights of these heat-generating devices 21 are different. Therefore, in order for the first heat sink 11 to better fit with the heat-generating devices 21 on the first surface 22, such as... Figure 6 As shown, a protrusion 113 that is height-matched to the heating device 21 on the first surface 22 can be provided on the side of the first heat dissipation cover 11 facing the mounting cavity 14, so that when the first heat dissipation cover 11 covers the side wall 13, it fits against the heating device 21 through the protrusion 113.

[0068] The protrusion 113 can be integrally formed with the first heat sink cover 11, or it can be fixedly connected to the first heat sink cover 11 by screws, threaded rods, or other devices. Of course, when there is a relatively tall heat-generating device 21 (e.g., M.2 module 225) on the first surface 22, if the protrusion 113 on the first heat sink cover 11 contacts the corresponding heat-generating device 21, the M.2 module 225 can directly contact the surface of the first heat sink cover 11, and therefore the position on the first heat sink cover 11 corresponding to the M.2 module 225 does not need to have a protrusion 113. Furthermore, if the protrusion 113 on the first heat sink cover 11 cannot contact the corresponding heat-generating device 21 when the first heat sink cover 11 contacts the M.2 module 225, then a slot needs to be provided on the position on the first heat sink cover 11 corresponding to the M.2 module 225 so that the protrusion 113 can contact the corresponding heat-generating device 21. Therefore, by setting a protrusion 113 or groove on the first heat dissipation cover 11 that is adapted to the height of the heat-generating device 21 and used to contact the heat-generating device 21, the heat-generating devices 21 on the first surface 22 can all contact the first heat dissipation cover 11, thereby further ensuring that each heat-generating device 21 on the first surface 22 can dissipate heat through the first heat dissipation cover 11.

[0069] like Figure 4As shown, the hard disk assembly 40 is positioned between the motherboard 20 and the second heat sink 12, and is vertically stacked. This allows for a more compact structure within the mounting cavity 14, improving the utilization of space within the cavity and helping to reduce the size of the electronic device 1. The hard disk assembly 40 may include a hard disk 41 and a hard disk bracket 42. The hard disk assembly 40 is installed by fixing the hard disk bracket 42 to the side wall 13 and then mounting the hard disk 41 onto the bracket 42. The hard disk 41 may be a mechanical hard disk, an SSD, etc. Furthermore, as... Figure 4 and Figure 5 As shown, when a hard drive enclosure is also installed on the hard drive 41, the surface of the hard drive 41 will form a structure with different heights. Since the main heat-generating structure on the hard drive 41 is the heat source 411 in the middle, a heat-conducting protrusion 121 can be provided on the side of the second heat dissipation cover 12 facing the mounting cavity 14, so that when the second heat dissipation cover 12 covers the side wall 13, the heat-conducting protrusion 121 can fit against the heat source 411 on the hard drive 41.

[0070] Furthermore, since the hard disk assembly 40 is located between the motherboard 20 and the second heat sink 12, it prevents the heat-generating device 21 on the second side 23 of the motherboard 20 from directly contacting the second heat sink 12. Therefore, the heat-generating device 21 on the second side 23 cannot dissipate heat directly through contact with the second heat sink 12. Thus, a heat-conducting component 30 can be installed within the mounting cavity 14 to conduct the heat generated by the heat-generating device 21 on the second side 23 to the side wall 13 for heat dissipation. Specifically, the first contact surface 31 of the heat-conducting component 30 is attached to the heat-generating device 21 on the second side 23, and the second contact surface 32 of the heat-conducting component 30 is attached to the side wall 13. This allows the heat generated by the heat-generating device 21 on the second side 23 to be conducted through the first contact surface 31 to the heat-conducting component 30, and then through the second contact surface 32 to the side wall 13.

[0071] Specifically, heat-conducting components 30 can be individually provided for each heating element 21 on the second surface 23, or a single heat-conducting component 30 can be provided for heating elements 21 of the same height or in close proximity, in order to reduce the number of parts in the electronic device 1. The heat-conducting component 30 can be a relatively tall block. In this case, the first bonding surface 31 can be the bottom surface of the heat-conducting component 30, and the second bonding surface 32 can be any side surface of the heat-conducting component 30. Of course, when the heat-conducting component 30 needs to conduct heat to multiple heating elements 21 simultaneously, and these heating elements 21 have different heights, protrusions or grooves adapted to the height of the heating elements 21 can also be provided on the first bonding surface 31.

[0072] like Figure 4As shown, a portion of the heat-conducting component 30 is located between the hard disk assembly 40 and the motherboard 20. If the heat-conducting component 30 is still a relatively tall block, it will result in a relatively tall and large overall size of the electronic device 1. Therefore, in order to reduce the size of the electronic device 1, such as... Figure 4 As shown, the heat-conducting component 30 can be a heat-conducting plate 33, and the heat-conducting plate 33 is vertically bent to form multiple heat-conducting segments 331. The first bonding surface 31 and the second bonding surface 32 are each located on one of the heat-conducting segments 331. The heat-conducting component 30 with this structure occupies less space in the height direction of the electronic device 1, which helps to reduce the overall height of the electronic device 1 and thus reduce the volume of the electronic device 1.

[0073] When the heating element 21 that is attached to the first contact surface 31 is located near one of the side walls 13 on the chassis 10, and there are no other components between them or the other components are of low height, the heat-conducting plate 33 can be bent to form two heat-conducting sections 331. If the height of other components between the heating element 21 that is attached to the first contact surface 31 and the side wall 13 is higher than the height of the heating element, the heat-conducting plate 33 can be bent to form two or more heat-conducting sections 331, so that the heat-conducting plate 33 can avoid other components and attach the second contact surface 32 to the side wall 13.

[0074] In this application embodiment, as an example, such as Figure 3 As shown, if the heat-generating device 21 bonded to the first bonding surface 31 is a chip 232 of an I / O module 231 (e.g., an I226 chip, a bridge chip, etc.), and an interface 233 is provided on the sidewall closest to the chip 232, the heat-conducting plate 33 can be bent to form four heat-conducting segments 331. The first bonding surface 31 is located on the lowest and horizontally arranged heat-conducting segment 331, and the second bonding surface 32 is located on the highest and vertically arranged heat-conducting segment 331. Furthermore, when the heat-conducting plate 33 is used to conduct heat to multiple heat-generating devices 21 simultaneously, and these heat-generating devices 21 have different heights, the heat-conducting plate 33 can also be bent to form multiple heat-conducting segments 331 with heights adapted to the heat-generating devices 21, so that the first bonding surface 31 on the heat-conducting segment 331 can simultaneously bond to multiple heat-generating devices 21. For example, when... Figure 3 When the interface 233 in the middle also needs to dissipate heat through the heat-conducting plate 33, the first contact surface can also be located on the horizontally arranged heat-conducting section 331 in the middle, so that the two horizontally arranged heat-conducting sections 331 in the heat-conducting plate 33 are respectively in contact with the chip 232 and the interface 233.

[0075] When the second side 23 is equipped with an IO module 231, a Msata module 234, and a WIFI module 235, these modules can be placed on the motherboard 20 near different side walls, so that the heat generated by the IO module 231, Msata module 234, and WIFI module 235 can be dissipated through different side walls 13, thereby making the heat generated by the heat-generating device 21 on the second side 23 evenly conducted to multiple side walls 13 of the chassis 10, accelerating the heat dissipation speed of the electronic device 1.

[0076] In this application embodiment, as an example, such as Figure 7 As shown, Figure 7 This diagram shows an exploded view of a portion of the structure of an electronic device provided in an embodiment of the present invention. An I / O module 231 is positioned on the motherboard 20 near sidewall A. The first contact surface 31 of the heat-conducting component 30 is attached to the heat-generating device 21 of the I / O module 231, and the second contact surface 32 is attached to sidewall A, to conduct the heat generated by the heat-generating device 21 of the I / O module 231 to sidewall A. A Msata module 234 is positioned on the motherboard 20 near sidewall B. The first contact surface 31 of the heat-conducting component 30 is attached to... The heating element 21 of the Msata module 234 is attached to the motherboard 20, and the second attachment surface 32 is attached to the B side wall to conduct the heat generated by the heating element 21 of the Msata module 234 to the B side wall; the WIFI module 235 is placed on the motherboard 20 near the C side wall, and the first attachment surface 31 of the heat-conducting component 30 is attached to the heating element 21 of the WIFI module 235, and the second attachment surface 32 is attached to the C side wall to conduct the heat generated by the heating element 21 of the WIFI module 235 to the C side wall.

[0077] In the above embodiment, by uniformly conducting the heat generated by the heat-generating device 21 on the motherboard 20 to the first heat dissipation cover 11 and side wall 13 of the chassis 10, and conducting the heat generated by the hard disk assembly 40 to the second heat dissipation cover 12, on the one hand, the walls of the chassis 10 all participate in the heat dissipation of the electronic device 1, making full use of the heat conduction of the chassis 10, and fully considering the heat generation of all power consumption heat sources inside the chassis 10, effectively avoiding heat accumulation inside the chassis 10. On the other hand, the heat generated by the hard disk assembly 40 can be conducted to the external environment through the second heat dissipation cover 12, ensuring that both SSD hard disks and mechanical hard disks in the hard disk assembly 40 can operate normally inside the electronic device 1, and the compatibility of the electronic device 1 is higher. In addition, the processor 221, memory 222, MOS device 223, 5G module 224 and other components that generate a lot of heat are all located on the first side 22 of the motherboard 20 and are dissipated by direct contact with the first heat dissipation cover 11. Most of the heat generated by these components can be conducted to the external environment through the first heat dissipation cover 11, maximizing the heat dissipation capacity of the first heat dissipation cover 11 and effectively reducing the system temperature inside the chassis 10.

[0078] The processor 221 is the brain of the electronic device 1, responsible for performing most of the computing tasks. During task execution, it needs to process large amounts of data and perform high-speed calculations, making it typically the heat-generating component in the electronic device 1. Its heat dissipation can directly affect the overall temperature of the electronic device 1. Therefore, in order to ensure a tight fit between the processor 221 and the first heat sink 11, thereby guaranteeing the processor 221's heat dissipation efficiency, some embodiments of this application, such as... Figure 8 As shown, Figure 8 It shows Figure 2 The enlarged schematic diagram at point D shows that the heat-generating device 21 on the first surface 22 includes a processor 221. A fixing part 226 is provided around the processor 221 on the motherboard 20. A through hole 112 is provided on the first heat dissipation cover 11. The through hole 112 is used for the fastener 50 to pass through and connect with the fixing part 226, so that the first heat dissipation cover 11 is pressed towards the motherboard 20 by the fastener 50, so that the first heat dissipation cover 11 and the processor 221 are in close contact.

[0079] The fixing part 226 can be a stud 60 directly mounted on the motherboard 20. When installing the first heat sink 11, the fastener 50 passes through the through hole 112 and connects to the fixing hole on the stud 60. Then, the fastener 50 is tightened, causing the first heat sink 11 to press against the motherboard 20, thereby making the first heat sink 11 fit tightly against the processor 221, ensuring that the first heat sink 11 can stably dissipate heat from the processor 221. By setting the stud 60 on the motherboard to form the fixing part 226, the first heat sink 11 can be pressed against the motherboard 20. The fixing part 226 is not only simple in structure, but also has fewer parts, making installation more convenient.

[0080] Of course, the fixing part 226 can also be a fixing bracket 2261. When installing the first heat sink cover 11, the fixing bracket 2261 is first set around the processor 221 and fixedly connected to the motherboard 20. Specifically, it can be fixed to the motherboard 20 by means of threaded connection, adhesion, welding, etc. Then, a fixing hole 2262 is set on the side of the fixing bracket 2261 away from the motherboard 20. Finally, the fastener 50 is passed through the through hole 112 and connected to the fixing hole 2262 on the fixing bracket 2261 and the fastener 50 is locked, so that the first heat sink cover 11 is close to the processor 221.

[0081] In this application embodiment, as an example, such as Figure 6 As shown, the mounting bracket 2261 can be connected to the studs 60 on the motherboard 20 via fasteners 50, thereby securing it to the motherboard 20. When disassembling or assembling the first heat sink cover 11, it is only necessary to separate the fasteners 50 from the mounting bracket 2261; there is no need to remove the mounting bracket 2261 from the motherboard 20. This ensures the stability of the connection between the mounting bracket 2261 and the motherboard 20, thereby ensuring the stability of the electronic device 1. In particular, when the motherboard 20 is connected to other components via the studs 60, frequent disassembly and reassembly of the fasteners 50 connected to the studs 60 can be avoided, ensuring the stability of the connection between the studs 60 and the motherboard 20.

[0082] It should be particularly noted that when the first heat sink 11 does not have a protrusion 113 adapted to the height of the processor 221, after the mounting bracket 2261 is installed on the motherboard 20, the height of the mounting bracket 2261 must be lower than the height of the processor 221. This ensures that after the fastener 50 is connected to the mounting bracket 2261, the mounting bracket 2261 will not obstruct the first heat sink 11 from fitting against the processor 221. Furthermore, when the first heat sink 11 has a protrusion 113 adapted to the height of the processor 221, although the height of the mounting bracket 2261 can be higher than the height of the processor 221, the mounting bracket 2261 must have an opening or notch for the protrusion 113 to pass through. In this embodiment, as an example, such as... Figure 6 and Figure 8 As shown, the fixed bracket 2261 has an opening 2263 in the middle. At this time, the fixed bracket 2261 can be higher than the height of the processor 221. When the first heat dissipation cover 11 covers the side wall 13, the protrusion 113 on the first heat dissipation cover 11 will pass through the opening 2263 and fit against the processor 221.

[0083] In the above embodiment, by providing a fixing part 226 around the processor 221 on the motherboard 20, the fastener 50 can press the first heat dissipation cover 11 toward the motherboard 20 when it is connected to the fixing part 226, so that the first heat dissipation cover 11 is close to the processor 221, ensuring that the first heat dissipation cover 11 can stably dissipate heat from the processor 221, and effectively improving the heat dissipation efficiency of the electronic device 1.

[0084] To further improve the heat dissipation efficiency of electronic device 1, in some embodiments of this application, such as... Figure 2 As shown, both the first heat dissipation cover 11 and the second heat dissipation cover 12 are provided with heat dissipation fins 15 on the side opposite to the mounting cavity 14. The heat dissipation fins 15 can increase the contact area between the first heat dissipation cover 11 and the second heat dissipation cover 12 and the external environment, so that the first heat dissipation cover 11 and the second heat dissipation cover 12 can have sufficient contact with the air in the external environment, thereby improving the heat dissipation efficiency of the first heat dissipation cover 11 and the second heat dissipation cover 12 for the electronic device 1 and avoiding excessive temperature inside the electronic device 1.

[0085] Furthermore, such as Figure 9A As shown, Figure 9A It shows Figure 1 In the enlarged schematic diagram at point E, the sidewalls of the heat dissipation fins 15 on the first heat dissipation cover 11 are wavy. This increases the surface area of ​​the heat dissipation fins 15, allowing them to have more sufficient contact with the external environment. In particular, when the first heat dissipation cover 11 has through holes for fasteners 50 to pass through and connect to the sidewall 13 or the fixing part 226, and these through holes are located between the heat dissipation fins 15, in order to avoid the heat dissipation fins 15 interfering with the fasteners 50 passing through the through holes, the heat dissipation fins 15 must be set perpendicular to the first heat dissipation cover 11. With the overall height of the electronic device 1 remaining unchanged, although the surface area of ​​the vertically set heat dissipation fins 15 is smaller than that of the inclined heat dissipation fins 15, the area of ​​the wavy sidewalls is larger than that of the planar sidewalls. The wavy sidewalls can still effectively increase the contact area between the heat dissipation fins 15 and the air, thereby improving the heat dissipation efficiency of the first heat dissipation cover 11.

[0086] Furthermore, such as Figure 4As shown, a mounting bracket 16 extends outward from one end of the sidewall 13 facing the second heat sink cover 12. The mounting bracket 16 is used to connect with the mounting plane to fix the electronic device 1 on the mounting plane. After the electronic device 1 is mounted on the mounting plane, the side of the second heat sink cover 12 facing away from the mounting cavity 14 will face the mounting plane. At this time, the distance between the second heat sink cover 12 and the mounting plane is limited, and this distance also limits the vertical distance between the end of the heat dissipation fins 15 on the second heat sink cover 12 and the second heat sink cover 12.

[0087] Therefore, as Figure 9B As shown, Figure 9B It shows Figure 4 The enlarged schematic diagram at point F shows that the heat dissipation fins 15 on the second heat dissipation cover 12 are inclinedly arranged. Distance M is the vertical distance from the end of the heat dissipation fin 15 away from the second heat dissipation cover 12 to the surface of the second heat dissipation cover 12, and distance N is the distance from the end of the heat dissipation fin 15 away from the second heat dissipation cover 12 along its extension direction to the surface of the second heat dissipation cover 12. From geometric principles (i.e., the shortest distance from a point to a plane is the length of the perpendicular segment from that point to the plane), distance M will be less than distance N. This means that the length of the inclined heat dissipation fin 15 in its extension direction will be greater than the length of the vertically arranged heat dissipation fin 15 in its extension direction. Therefore, the surface area of ​​the inclined heat dissipation fin 15 will be greater than that of the vertically arranged heat dissipation fin 15. When the distance between the second heat dissipation cover 12 and the mounting plane is limited, the inclined heat dissipation fins 15 can effectively increase the contact area between the second heat dissipation cover 12 and the air in the external environment, thereby improving the heat dissipation efficiency of the second heat dissipation cover 12. Of course, in order to further increase the contact area between the heat dissipation fins 15 and the air, the sidewalls of the heat dissipation fins 15 on the second heat dissipation cover plate 12 can also be made into a wave shape.

[0088] In addition, to further meet the requirements of the processor's 221 Turbo Boost frequency, such as Figure 1 and Figure 2As shown, a heat dissipation device 2 can also be provided on the first heat dissipation cover 11, and the heat dissipation device 2 is detachably connected to the first heat dissipation cover 11. The heat dissipation device 2 is used to drive gas to the outer surface of the first heat dissipation cover 11 so that the gas contacts the first heat dissipation cover 11 and carries away the heat on the first heat dissipation cover 11. Of course, when the first heat dissipation cover 11 is also provided with heat dissipation fins 15, the heat dissipation device 2 is also used to drive gas into the heat dissipation channel 17 between the heat dissipation fins 15, and drive the gas to flow along the extension direction of the heat dissipation channel 17 to carry away the heat on the first heat dissipation cover 11 and the heat dissipation fins 15. The heat dissipation device 2 can be a fan, such as an axial fan, a mixed-flow fan, a turbine fan, etc., which can drive gas to blow on the outer surface of the first heat dissipation cover 11 or drive gas to flow in the heat dissipation channel 17 to carry away the heat of the electronic device 1 through the gas. By setting up the heat dissipation device 2, on the one hand, the flow rate of gas on the outer surface of the first heat dissipation cover 11 can be increased, thereby improving the heat dissipation efficiency of the first heat dissipation cover 11. On the other hand, as an optional accessory, the heat dissipation device 2 allows the electronic device 1 to use different configuration combinations according to its operating requirements, thus improving the applicability of the electronic device 1.

[0089] In electronic device 1, such as Figure 6 As shown, the length of the hard drive assembly 40 is usually less than the length of the motherboard 20. When the motherboard 20 contacts the side wall 13, there will still be a certain distance between the hard drive assembly 40 and the side wall 13. Since the hard drive assembly 40 also has a certain height, this means that after the hard drive assembly 40 and the motherboard 20 are stacked, a portion of the space on the side of the motherboard 20 facing the second heatsink 12 is not utilized by the hard drive assembly 40, resulting in a waste of this space.

[0090] Therefore, in order to further improve the space utilization of the mounting cavity 14, in some embodiments of this application, such as Figure 3 and Figure 7 As shown, a power board 70 is also provided in the mounting cavity 14. The power board 70 is parallel to the side wall 13, and a power heating device 71 is provided on the side of the power board 70 facing the side wall 13. The power heating device 71 is attached to the side wall 13 so as to dissipate heat from the power heating device 71 through the side wall 13.

[0091] In addition to the power heating device 71, the power board 70 is usually equipped with other devices 72. When the height of at least some of the other devices 72 is higher than the height of the power heating device 71, the other devices 72 and the power heating device 71 can be respectively set on the two sides of the power board 70, or only the other devices 72 with a height lower than the power heating device 71 can be set on the same side of the power board 70 as the power heating device 71, so that the power heating device 71 can be directly attached to the side wall 13, thereby allowing the heat generated by the power heating device 71 to be directly conducted to the side wall 13.

[0092] like Figure 7 As shown, if the power supply heating device 71 and at least some of the other devices 72 are all located on the same side of the power board 70, then when the height of the power supply heating device 71 is lower than the height of the other devices 72, the other devices 72 will prevent the side wall 13 from contacting the power supply heating device 71. Therefore, a power supply heat-conducting component 80 can be provided between the power board 70 and the side wall 13, with the opposite sides of the power supply heat-conducting component 80 respectively contacting the power supply heating device 71 and the side wall 13. This allows the heat generated by the power supply heating device 71 to be conducted to the side wall 13 through the power supply heat-conducting component 80, thereby achieving heat dissipation for the power supply heating device 71. The power supply heating device 71 can be a power inductor, a power MOSFET device, etc. By providing the power supply heat-conducting component 80, even when the height of the power supply heating device 71 is lower than at least some of the other devices 72, heat can still be conducted to the side wall 13 through the power supply heat-conducting component 80, thus ensuring that the power supply heating device 71 can dissipate heat normally.

[0093] When installing the power supply heat conductor 80, it can be pre-positioned on the side wall 13, and then the power board 70 can be fixedly connected to the side wall 13. Fasteners 50, such as screws and threaded rods, can be used to press the power board 70 and side wall 13 together, ensuring the power supply heat conductor 80 is in close contact with the power supply heating device 71. Furthermore, to enhance the heat conduction between the power supply heat conductor 80 and the side wall 13, thermal paste, thermal grease, thermal gel, or other materials with good thermal conductivity can be filled between them. Similarly, to enhance the heat conduction between the power supply heating device 71 and the power supply heat conductor 80, thermal paste, thermal grease, thermal gel, or thermal pads can be sandwiched between them.

[0094] In the above embodiments, by independently setting the power module in the electronic device 1 on the power board 70 and setting the power board 70 parallel to the side wall 13, not only can the volume of the motherboard 20 be reduced, but the space in the mounting cavity 14 in the height direction of the electronic device 1 is also utilized, which improves the utilization rate of the space in the mounting cavity 14 and helps to reduce the volume of the electronic device 1.

[0095] Furthermore, in order to enable the heat-generating components within the mounting cavity 14 (e.g., heat-generating components 21 on the motherboard 20, hard disk 41 in the hard disk assembly 40, power supply heat-generating components 71 on the power board 70, etc.) to better conduct heat to the first heat dissipation cover 11, the second heat dissipation cover 12, or the side wall 13, thermal paste, thermal grease, thermal gel, or other materials with good thermal conductivity can be filled between the components and the first heat dissipation cover 11, the second heat dissipation cover 12, the side wall 13, or the thermal conductive component 30. This allows for more sufficient contact between the components within the mounting cavity 14 and the first heat dissipation cover 11, the second heat dissipation cover 12, the side wall 13, or the thermal conductive component 30, thereby better conducting the heat generated by the components to the walls of the chassis 10 for heat dissipation.

[0096] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application, and they should all be covered within the scope of the claims and specification of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any way. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. An electronic device, characterized in that, The electronic device includes: The chassis includes a first heat dissipation cover, a second heat dissipation cover, and a side wall that surrounds the first heat dissipation cover and the second heat dissipation cover, wherein the first heat dissipation cover, the second heat dissipation cover, and the side wall together form a mounting cavity. The motherboard is disposed in the mounting cavity and parallel to the first heat dissipation cover plate. Both sides of the motherboard are provided with heat-generating devices. The heat-generating devices on the first side of the motherboard are in contact with the first heat dissipation cover plate so that the heat-generating devices on the first side can be dissipated through the first heat dissipation cover plate. A heat-conducting component has a first contact surface and a second contact surface that are perpendicular to each other. The first contact surface is in contact with a heat-generating device on the second surface of the motherboard, and the second contact surface is in contact with the sidewall. The heat-conducting component is used to conduct the heat of the heat-generating device to the sidewall through the first contact surface and the second contact surface, so as to dissipate heat from the heat-generating device on the second surface through the sidewall. A hard disk assembly is disposed between the motherboard and the second heat sink and is in contact with the second heat sink to dissipate heat from the hard disk assembly through the second heat sink.

2. The electronic device according to claim 1, characterized in that, The heat-generating device on the first surface includes a processor. A fixing part is provided around the processor on the motherboard. A through hole is provided on the first heat sink cover. The through hole is used for fasteners to pass through and connect to the fixing part, so that the first heat sink cover is pressed towards the motherboard by the fasteners, so that the first heat sink cover and the processor are in close contact.

3. The electronic device according to claim 2, characterized in that, The fixing part is a fixing bracket, which is fixedly connected to the motherboard. The fixing bracket has a fixing hole on the side away from the motherboard. The fixing hole is used to connect with the fastener so that the first heat sink cover and the processor are in close contact.

4. The electronic device according to claim 1, characterized in that, The heat-conducting component is located at least partially between the hard disk assembly and the motherboard. The heat-conducting component is a heat-conducting plate, which is vertically bent to form multiple heat-conducting segments. The first contact surface and the second contact surface are each located on one of the heat-conducting segments.

5. The electronic device according to claim 1, characterized in that, Both the first heat dissipation cover and the second heat dissipation cover are detachably connected to the side wall; The first heat dissipation cover is provided with a guide hole, and the side wall facing the first heat dissipation cover is provided with a guide pin. The guide pin is used to be inserted into the guide hole when the first heat dissipation cover covers one end of the side wall, so that the first heat dissipation cover is pre-positioned on the side wall.

6. The electronic device according to any one of claims 1-5, characterized in that, The mounting cavity is also provided with a power board, which is parallel to the side wall. A power heating device is provided on the side of the power board facing the side wall. The power heating device is attached to the side wall to dissipate heat through the side wall.

7. The electronic device according to claim 6, characterized in that, Other devices are also provided on the side of the power board facing the side wall, and the height of the power heating device is lower than at least part of the other devices; A power heat-conducting component is provided between the power board and the side wall. The two opposite sides of the power heat-conducting component are respectively attached to the power heating device and the side wall. The power heat-conducting component is used to conduct the heat of the power heating device to the side wall.

8. The electronic device according to any one of claims 1-5, characterized in that, The first heat dissipation cover plate has a protrusion and / or groove on the side facing the mounting cavity that is adapted to the height of the heat-generating device on the first surface, and the protrusion and / or the groove are in contact with the heat-generating device on the first surface.

9. The electronic device according to any one of claims 1-5, characterized in that, Both the first heat dissipation cover and the second heat dissipation cover are provided with heat dissipation fins on the side opposite to the mounting cavity.

10. The electronic device according to claim 9, characterized in that, The sidewall extends outward from one end facing the second heat dissipation cover to form a mounting bracket. The mounting bracket is used to connect with the mounting plane to fix the electronic device on the mounting plane. The side of the second heat dissipation cover away from the mounting cavity faces the mounting plane. The heat dissipation fins on the second heat dissipation cover are inclinedly arranged on the second heat dissipation cover. And / or, the sidewalls of the heat dissipation fins on the first heat dissipation cover are wavy.

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