Cooling cold plate and electronic equipment
By introducing a combination of enhanced heat-conducting ribs and phase change materials into the heat dissipation plate, the problem of insufficient heat dissipation capacity of the heat dissipation plate is solved, achieving more efficient heat dissipation performance and cost optimization.
Patent Information
- Application Number
- CN202423155289.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-20
- Publication Date
- 2025-12-02
- Estimated Expiration
- 2034-12-20
AI Technical Summary
Existing heat dissipation plates have limited heat dissipation capacity and cannot effectively address the high heat flux density of electronic components in electronic devices.
A combination of reinforced heat-conducting ribs and phase change material is adopted. The reinforced heat-conducting ribs are arranged in the phase change cavity, and the phase change material is filled between the cavity and the heat-conducting ribs. Heat is transferred to the phase change material through the heat-conducting ribs, and the heat transfer efficiency is improved by utilizing the phase change process of the phase change material.
It improves the heat dissipation performance of the heat sink, controls the temperature rise rate of electronic components, enhances the heat dissipation effect, and reduces the cost of the heat sink.
Smart Images
Figure CN223626197U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of electronic equipment technology, and in particular to a heat dissipation plate and electronic equipment. Background Technology
[0002] Electronic devices are constantly evolving towards miniaturization, lightweight design, high power, and high heat flux density, leading to a dramatic increase in their temperatures. The performance and lifespan of electronic components within these devices are closely related to temperature; when the temperature exceeds 85°C, further increases in temperature cause a sharp decline in component performance. While electronic devices typically utilize heat sinks for cooling, current heat sinks have limited heat dissipation capabilities.
[0003] Therefore, how to improve the heat dissipation performance of heat sinks has become a technical problem that urgently needs to be solved by those skilled in the art. Utility Model Content
[0004] This application proposes a heat dissipation plate and electronic device to improve the heat dissipation performance of the heat dissipation plate.
[0005] To achieve the above objectives, this application discloses the following technical solutions:
[0006] In a first aspect, this application provides a heat dissipation plate, including a substrate, a phase change material, and a heat-conducting rib plate. The substrate includes a heat dissipation surface and a phase change cavity. The heat dissipation surface is used to dissipate heat from electronic components. The heat-conducting rib plate is arranged in the phase change cavity. The phase change material is filled in the phase change cavity and between the heat-conducting rib plates.
[0007] In some embodiments, there are two heat dissipation surfaces, namely a first heat dissipation surface and a second heat dissipation surface, which are arranged opposite to each other.
[0008] In some embodiments, the substrate further includes heat dissipation bosses disposed on the heat dissipation surface for arranging electronic components.
[0009] In some embodiments, the heat-conducting ribs extend along a preset direction, and in the preset direction, the heat-conducting ribs extend along a straight line or a curve.
[0010] In some embodiments, the heat-conducting ribs include convex and concave portions arranged in a repeating sequence.
[0011] In some embodiments, the recesses of two adjacent heat-conducting reinforcing ribs are aligned.
[0012] In some embodiments, the recesses of two adjacent heat-conducting ribs are staggered.
[0013] In some embodiments, the misalignment distance between the recesses of two adjacent heat-conducting ribs is less than 1.5 mm.
[0014] In some embodiments, the heat-conducting ribs and the substrate are integrally formed by additive manufacturing or welding to make them a single structure.
[0015] In some embodiments, the thickness of the reinforcing heat-conducting ribs is less than 0.5 mm; the distance between adjacent reinforcing heat-conducting ribs is less than 3 mm.
[0016] In some embodiments, the phase change material is paraffin.
[0017] In some embodiments, the substrate is made of aluminum alloy.
[0018] Secondly, this application provides an electronic device, including electronic components and a heat dissipation plate as described in any of the above, wherein the electronic components are in contact with the heat dissipation surface of the heat dissipation plate.
[0019] As can be seen from the above technical solution, the phase change accommodating cavity of the heat dissipation cold plate of this application is arranged with reinforced heat-conducting ribs. The heat absorbed by the heat dissipation surface can be transferred to the phase change material through the reinforced heat-conducting ribs, thereby improving the heat transfer efficiency between the heat dissipation surface and the phase change material and thus optimizing the heat dissipation performance of the heat dissipation cold plate. Attached Figure Description
[0020] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are merely some examples or embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort, and this application can be applied to other similar scenarios based on the provided drawings. Unless obvious from the linguistic context or otherwise specified, the same reference numerals in the drawings represent the same structures or operations.
[0021] Figure 1 An exploded view of a heat dissipation cold plate provided in an embodiment of this application;
[0022] Figure 2 A front view of a heat dissipation plate provided in an embodiment of this application;
[0023] Figure 3 for Figure 2 Sectional view of section AA;
[0024] Figure 4 A side view of a heat dissipation plate provided in an embodiment of this application;
[0025] Figures 5 to 6 for Figure 4 A cross-sectional view of section BB in the middle;
[0026] Figure 7A schematic diagram of an enhanced heat-conducting rib plate provided in an embodiment of this application;
[0027] Figure 8 This is a schematic diagram illustrating one arrangement of multiple heat-conducting ribs provided in an embodiment of this application.
[0028] Figure 9 A schematic diagram illustrating another arrangement of multiple heat-conducting ribs provided in an embodiment of this application;
[0029] Figures 10 to 11 for Figure 4 Another sectional view of section BB;
[0030] In the diagram: 1-Matrix; 2-Phase change material; 3-Reinforcing heat-conducting ribs
[0031] 11-Phase change cavity; 12-Heat dissipation surface; 13-Heat dissipation boss;
[0032] 31-convex part; 32-concave part;
[0033] 121 - First heat dissipation surface; 122 - Second heat dissipation surface; 131 - First heat dissipation boss; 132 - Second heat dissipation boss. Detailed Implementation
[0034] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are merely illustrative of the application and not intended to limit it. The described embodiments are only a part of the embodiments of the present application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present application without inventive effort are within the scope of protection of the present application.
[0035] See Figures 1 to 11 To achieve the above objectives, this application discloses the following technical solutions:
[0036] A heat dissipation cold plate includes a substrate 1, a phase change material 2, and reinforcing heat-conducting ribs 3. The substrate 1 includes a heat dissipation surface 12 and a phase change cavity 11. The heat dissipation surface 12 is used for heat dissipation of electronic components. The reinforcing heat-conducting ribs 3 are arranged inside the phase change cavity 11. The phase change material 2 is filled inside the phase change cavity 11 and between the reinforcing heat-conducting ribs 3. In this heat dissipation cold plate, the phase change cavity 11 is provided with reinforcing heat-conducting ribs 3. The heat absorbed by the heat dissipation surface 12 can be transferred to the phase change material 2 through the reinforcing heat-conducting ribs 3, thereby improving the heat transfer efficiency between the heat dissipation surface 12 and the phase change material 2 and optimizing the heat dissipation performance of the heat dissipation cold plate.
[0037] Both heat dissipation surfaces 12 of the phase change cold plate can be used to mount electronic components to be cooled, increasing the utilization rate of the phase change cold plate and reducing its cost. The heat generated by the electronic components is directly conducted to the heat dissipation surface 12 or indirectly conducted through the heat dissipation protrusions 13. On one hand, the heat absorbed by the heat dissipation surface 12 is manifested through its surface temperature, i.e., sensible heat. As the absorbed heat increases, the temperature of the heat dissipation surface 12 rises accordingly. On the other hand, the heat conducted to the heat dissipation surface 12 continues to be directly conducted or indirectly conducted through the reinforced heat-conducting ribs 3 to the phase change material 2. This heat is first manifested through the surface temperature of the phase change material 2, i.e., sensible heat. As the absorbed heat increases, the temperature of the phase change material 2 rises accordingly. When the surface temperature reaches the melting point of the phase change material 2, the phase change material 2 begins to melt. During this process, most of the heat absorbed by the phase change material 2 only causes it to undergo a solid-to-liquid phase transition, with a small portion... This will raise its temperature, thereby controlling the rate of temperature rise of electronic components; this process is a heat dissipation method in which both sensible and latent heat of phase change material 2 coexist; as the absorbed heat increases, the surface temperature of phase change material 2 reaches the melting termination temperature, and phase change material 2 completely changes from solid to liquid; as phase change material 2 continues to absorb more heat, it will again exhibit a sharp rise in temperature, that is, manifested in the form of sensible heat alone; the key to improving the heat dissipation effect of this heat sink for electronic components is to control the temperature of phase change material 2 between the melting start temperature and the melting termination temperature, so that it is in a heat dissipation method in which both sensible and latent heat coexist, thereby reducing the rate of temperature rise of electronic components.
[0038] Electronic components can be directly or indirectly arranged on the heat dissipation surface 12. The number of heat dissipation surfaces 12 can be two or one. When there are two, they are a first heat dissipation surface 121 and a second heat dissipation surface 122, which are arranged opposite to each other. Arranging two heat dissipation surfaces 12 can increase the area for mounting electronic components and improve the usable area of the heat dissipation plate.
[0039] To facilitate the installation of electronic components, in some examples of this application, the base 1 further includes a heat dissipation protrusion 13, which is disposed on the heat dissipation surface 12 for arranging electronic components. The number of heat dissipation protrusions 13 is at least one, and the number and shape of the heat dissipation protrusions 13 can be adjusted according to the position of the electronic components. In the illustration, there are two heat dissipation protrusions 13, namely a first heat dissipation protrusion 131 and a second heat dissipation protrusion 132. The first heat dissipation protrusion 131 is disposed on the first heat dissipation surface 121, and the second heat dissipation protrusion 132 is disposed on the second heat dissipation surface 122. The first heat dissipation protrusion 131 and the second heat dissipation protrusion 132 are rectangular in shape for ease of processing. In some other examples of this application, the first heat dissipation protrusion 131 and the second heat dissipation protrusion 132 can also be circular, elliptical, or have a shape consistent with the overall outline of the electronic components.
[0040] To improve the heat dissipation effect of electronic components, the area of the heat dissipation boss 13 is larger than the area of the electronic components.
[0041] In the above context, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.
[0042] The aforementioned heat-conducting rib 3 extends along a preset direction. This preset direction can be any direction, such as the length direction or width direction of the base 1. In the preset direction, the heat-conducting rib 3 extends along a straight line or a curve.
[0043] See Figure 7 As shown in the figure, the reinforcing heat-conducting rib plate 3 has a Z-shaped structure. Specifically, the reinforcing heat-conducting rib plate 3 includes protrusions 31 and concave portions 32 arranged in a repeating pattern. By setting the protrusions 31 and concave portions 32, the contact area between the reinforcing heat-conducting rib plate 3 and the phase change material 2 is increased, thereby improving the heat transfer efficiency between the two.
[0044] Combination Figure 5 and Figure 6 See Figure 8 In this example, the recesses 32 of two adjacent heat-conducting ribs 3 are aligned.
[0045] See Figures 9 to 11 The recesses 32 of two adjacent heat-conducting ribs 3 are staggered. In the staggered arrangement, the distance between the staggered recesses 32 of two adjacent heat-conducting ribs 3 is less than 1.5 mm in the staggered direction. It should be noted that the staggered direction coincides with the aforementioned preset direction, which can be the length or width direction of the heat dissipation plate.
[0046] The aforementioned reinforced heat-conducting rib 3 and the substrate 1 are integrally formed using additive manufacturing or welding processes to create a single structure. This integral structure of the reinforced heat-conducting rib 3 and the substrate 1 reduces the thermal resistance from the heat dissipation surface 12 to the phase change material 2.
[0047] In some embodiments, the thickness of the reinforcing heat-conducting rib 3 is less than 0.5 mm; the distance between adjacent reinforcing heat-conducting ribs 3 is less than 3 mm.
[0048] The number of the above-mentioned heat-conducting reinforcing ribs 3 is multiple. Among them, the thickness of the heat-conducting reinforcing ribs 3 is less than 0.5 mm, so as to make the volume of the phase-change accommodating cavity 11 as large as possible, and then make the phase-change material 2 filled in the phase-change accommodating cavity 11 as much as possible, and further make the heat absorbed by the phase-change material 2 as much as possible, and finally the heat dissipation effect of the electronic device is better; the distance between adjacent heat-conducting reinforcing ribs 3 is less than 3 mm, aiming to reduce the thermal resistance of heat conduction from the "zigzag" heat-conducting reinforcing ribs 3 to the central position of the paraffin, so that the heat can be quickly conducted from the "zigzag" heat-conducting reinforcing ribs 3 to the central area of the paraffin.
[0049] The base body 1 is a structure for carrying the phase-change material 2 and the heat-conducting reinforcing ribs 3. The material of the base body 1 is preferably aluminum alloy, which has good mechanical properties, high thermal conductivity, and low density; of course, copper alloy or other materials can also be selected.
[0050] The base body 1 may include a first base body 1a and a second base body 1b. Among them, the first base body 1a and the second base body 1b are spliced to form the phase-change accommodating cavity 11, and part or all of the phase-change accommodating cavity 11 is formed in the first base body 1a or the second base body 1b. Exemplarily, all of the phase-change accommodating cavity 11 is formed in the second base body 1b, that is, the second base body 1b is provided with a groove, and the first base body 1a is arranged at the notch of the groove of the first base body 1b as a sealing plate, which can reduce the packaging difficulty.
[0051] Embodiment 1
[0052] The present utility model provides a heat dissipation cold plate, which includes a base body 1, a phase-change material 2, and heat-conducting reinforcing ribs 3. Among them, the phase-change material 2 is paraffin, and the heat-conducting reinforcing ribs 3 are "zigzag" heat-conducting reinforcing ribs 3.
[0053] The base body 1 includes a first heat dissipation surface 121, a second heat dissipation surface 122, a first heat dissipation boss 131, a second heat dissipation boss 132, and a phase-change accommodating cavity 11. The first heat dissipation surface 121 and the first heat dissipation boss 131 are located on the first side of the base body 1, and the second heat dissipation surface 122 and the second heat dissipation boss 132 are located on the second side of the base body 1; the first heat dissipation surface 121, the second heat dissipation surface 122, the first heat dissipation boss 131, and the second heat dissipation boss 132 of the base body 1 are in contact with the electronic components to be cooled, and conduct the heat of the electronic components to the heat dissipation cold plate; the paraffin is filled in the phase-change accommodating cavity 11; the "zigzag" heat-conducting reinforcing ribs 3 are arranged in the phase-change accommodating cavity 11.
[0054] Both heat dissipation surfaces 12 of the phase change cold plate can be used to mount electronic components to be cooled, increasing the utilization rate of the phase change cold plate and reducing its cost. The heat generated by the electronic components on the first side is directly conducted or indirectly conducted to the first heat dissipation surface 121 through the first heat dissipation protrusion 131, and the heat generated by the electronic components on the second side is directly conducted or indirectly conducted to the second heat dissipation surface 122 through the second heat dissipation protrusion 132. On one hand, the heat absorbed by the first heat dissipation surface 121, the first heat dissipation protrusion 131, the second heat dissipation surface 122, and the second heat dissipation protrusion 132 is manifested through their surface temperature, i.e., sensible heat. As the absorbed heat increases, the temperature of the first heat dissipation surface 121, the first heat dissipation protrusion 131, the second heat dissipation surface 122, and the second heat dissipation protrusion 132 rises accordingly. On the other hand, the heat conducted to the first heat dissipation surface 121, the first heat dissipation protrusion 131, the second heat dissipation surface 122, and the second heat dissipation protrusion 132 continues to be directly conducted or indirectly conducted to the paraffin wax through the "U"-shaped reinforced heat-conducting ribs 3. This heat is first... The surface temperature of paraffin wax manifests as sensible heat. As the absorbed heat increases, the temperature of the paraffin wax rises accordingly. When the surface temperature reaches the initial melting temperature of the paraffin wax, it begins to melt. During this process, most of the heat absorbed by the paraffin wax only causes it to undergo a phase transition from solid to liquid, while a small portion causes its temperature to rise, thus controlling the rate of temperature rise in electronic components. This process represents a heat dissipation method where sensible and latent heat coexist in phase change material 2. As the absorbed heat increases, the surface temperature of the paraffin wax reaches the final melting temperature, and the paraffin wax completely transforms from a solid to a liquid state. As the heat absorbed by the paraffin wax continues to increase, it will again manifest as a rapid temperature rise, which manifests as sensible heat alone. The key to improving the heat dissipation effect of this heat sink for electronic components lies in controlling the temperature of the paraffin wax between its initial melting temperature and its final melting temperature, so that it operates in a heat dissipation method where sensible and latent heat coexist, thereby reducing the rate of temperature rise in electronic components.
[0055] This application also discloses an electronic device, including electronic components and a heat dissipation plate as described in any of the above, wherein the electronic components are in contact with the heat dissipation surface 12 of the heat dissipation plate.
[0056] The above description is merely a preferred embodiment of this application and an explanation of the technical principles employed, and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. The scope of this application is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the above-described application concept. For example, technical solutions formed by substituting the above features with (but not limited to) technical features with similar functions disclosed in this application.
Claims
1. A heat dissipation plate, characterized in that, The device includes a substrate, a phase change material, and a heat-conducting rib. The substrate includes a heat dissipation surface and a phase change cavity. The heat dissipation surface is used to dissipate heat from electronic components. The heat-conducting rib is arranged inside the phase change cavity. The phase change material is filled inside the phase change cavity and between the heat-conducting ribs.
2. The heat dissipation plate as described in claim 1, characterized in that, The number of heat dissipation surfaces is two, namely a first heat dissipation surface and a second heat dissipation surface, which are arranged opposite to each other.
3. The heat dissipation plate as described in claim 1, characterized in that, The substrate also includes heat dissipation bosses, which are disposed on the heat dissipation surface to accommodate electronic components.
4. The heat dissipation plate as described in claim 1, characterized in that, The enhanced heat-conducting rib extends along a preset direction, and in the preset direction, the enhanced heat-conducting rib extends along a straight line or a curve.
5. The heat dissipation plate as described in claim 4, characterized in that, The enhanced heat-conducting rib plate includes convex and concave portions arranged in a repeating pattern.
6. The heat dissipation plate as described in claim 5, characterized in that, The recesses of two adjacent heat-conducting ribs are aligned.
7. The heat dissipation plate as described in claim 5, characterized in that, The recesses of two adjacent heat-conducting ribs are staggered.
8. The heat dissipation plate as described in claim 7, characterized in that, The misalignment distance between the recesses of two adjacent heat-conducting ribs is less than 1.5 mm.
9. The heat dissipation plate as described in any one of claims 1 to 8, characterized in that, The enhanced heat-conducting rib plate and the substrate are integrally formed by additive manufacturing or welding to make them a single structure.
10. The heat dissipation plate as described in any one of claims 1 to 8, characterized in that, The thickness of the reinforced heat-conducting rib is less than 0.5 mm; the distance between adjacent reinforced heat-conducting ribs is less than 3 mm.
11. The heat dissipation plate as described in any one of claims 1 to 8, characterized in that, The phase change material is paraffin.
12. The heat dissipation plate as described in any one of claims 1 to 8, characterized in that, The substrate is made of aluminum alloy.
13. An electronic device, characterized in that, It includes electronic components and a heat dissipation plate as described in any one of claims 1 to 12, wherein the electronic components are in contact with the heat dissipation surface of the heat dissipation plate.