Optical module heat dissipation device using refrigerant

Abstract

The utility model provides an optical module heat dissipation device using a refrigerant. The heat dissipation device is of a cuboid structure. A plurality of layers of pipelines are distributed in the cuboid structure; each layer of pipeline is filled with refrigerant liquid, and each layer of pipeline is connected with a micro pump; the micro pump is used for converting electric energy into vibration of the piezoelectric vibrator, so that reciprocating change of the volume of a pump cavity is caused, and liquid flowing is carried out; cooling fins are arranged on the side face of the cooling device so that the cooling area can be increased. According to the utility model, the piezoelectric vibrator is used for conveying cooling liquid in the pipeline, the problem of soaking is avoided, the size of the device is reduced, the device is fixed on the surface of a heating device, liquid cooling heat dissipation is directly carried out on the heating device, the internal structure of the voltage pump is defined, cooling liquid flowing is carried out more quickly, and a better heat dissipation effect is realized.

Description

Technical Field

[0001] This utility model relates to the field of optical modules, and in particular to a heat dissipation device for optical modules that utilizes a refrigerant. Background Technology

[0002] With the development of communication technology, data transmission rates are constantly increasing, leading to a corresponding increase in the operating frequency and power density of optical modules. Higher data rates result in higher power consumption, generating more heat. Furthermore, while transmission speeds are improving, optical modules are becoming increasingly smaller to meet the miniaturization requirements of data centers and communication equipment. This miniaturization often limits heat dissipation space, necessitating more efficient heat dissipation technologies to ensure the stability and reliability of the optical modules.

[0003] Technological advancements have led to increasingly higher operating power for optical modules, rendering natural cooling methods ineffective. Existing technologies involve immersing the optical module in a refrigerant for heat dissipation, which inevitably damages the device due to liquid immersion. Furthermore, while liquid cooling devices are available, they are bulky, placed outside the optical module, and fail to effectively dissipate heat directly to the heat-generating components. Utility Model Content

[0004] To overcome the shortcomings of existing technologies, the purpose of this utility model is to provide a heat dissipation device for optical modules that utilizes refrigerant. It uses piezoelectric vibrators to transport coolant in pipes, avoiding the problem of immersion and reducing the size of the device. It is fixed on the surface of the heat-generating device for direct liquid cooling. Furthermore, it clarifies the internal structure of the voltage pump to achieve faster coolant flow and better heat dissipation.

[0005] To achieve the above objectives, this utility model provides the following solution:

[0006] A heat dissipation device for an optical module utilizing a refrigerant is disclosed. The heat dissipation device has a cuboid structure with multiple layers of pipes distributed inside. Each layer of pipes is filled with refrigerant liquid and connected to a micro pump. The micro pump converts electrical energy into the vibration of piezoelectric oscillators, thereby causing reciprocating changes in the pump chamber volume to transport the liquid. Heat dissipation fins are provided on the sides of the heat dissipation device to increase the heat dissipation area. The piezoelectric oscillators in the micro pump are connected to each other in series and parallel.

[0007] Preferably, the top of the heat dissipation device is in contact with the chip, and the top of the heat dissipation device is bonded to the bottom surface of the optical module chip.

[0008] Preferably, the bottom of the heat dissipation device is connected to the housing of the optical module.

[0009] Preferably, the top of the heat dissipation device is bonded to the bottom of the optical module chip using a first adhesive; the first adhesive has thermal conductivity.

[0010] Preferably, the bottom of the heat dissipation device is bonded to the optical module housing using a second adhesive; the second adhesive has thermal conductivity.

[0011] Preferably, the number of layers in the pipe is 2.

[0012] According to the specific embodiments provided by this utility model, the following technical effects are disclosed:

[0013] This invention provides a heat dissipation device for an optical module utilizing a refrigerant. The heat dissipation device has a cuboid structure with multiple layers of pipes distributed inside. Each layer of pipes contains refrigerant liquid and is connected to a micro pump. The micro pump converts electrical energy into the vibration of a piezoelectric vibrator, causing reciprocating changes in the pump chamber volume for liquid flow. Heat dissipation fins are provided on the sides of the heat dissipation device to increase the heat dissipation area. This invention utilizes piezoelectric vibrators to deliver coolant in the pipes, avoiding wetting issues, reducing the device size, fixing it to the surface of the heat-generating device for direct liquid cooling, and clearly defining the internal structure of the piezoelectric pump for faster coolant flow and better heat dissipation. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 An overall internal structure diagram provided for an embodiment of this utility model;

[0016] Figure 2 This is an overall schematic diagram of an embodiment of the present utility model;

[0017] Figure 3 Internal structure diagram of the piezoelectric pump provided in this embodiment of the utility model;

[0018] Figure 4 A structural diagram of a micro pump provided for an embodiment of this utility model. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] The purpose of this invention is to provide a heat dissipation device for optical modules that utilizes refrigerant. It uses piezoelectric vibrators to transport coolant in pipes, avoiding the problem of immersion and reducing the size of the device. It is fixed on the surface of the heat-generating device for direct liquid cooling. Furthermore, it clarifies the internal structure of the voltage pump to achieve faster coolant flow and better heat dissipation.

[0021] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0022] like Figures 1 to 4 As shown, this utility model provides a cuboid-shaped heat dissipation device for an optical module. The top of the heat dissipation device contacts the chip and is bonded to the bottom surface of the optical module chip with adhesive. The heat dissipation device has two layers of pipes, each containing refrigerant and connected to a piezoelectric pump (micro-pump). The piezoelectric pump converts electrical energy into the vibration of a piezoelectric oscillator, causing reciprocating changes in the pump chamber volume for liquid flow. Small, densely packed heat dissipation fins protrude from the sides of the heat dissipation device, increasing the heat dissipation area and allowing for faster heat dissipation and higher efficiency. The bottom of the heat dissipation device is then connected to the optical module housing. This heat dissipation device can transfer heat from the chip and its internal space to the external space through the optical module housing, providing a more stable working environment and more efficient operation for the optical module device.

[0023] Parallel pumps can increase output flow rate, while series pumps can increase output pressure. However, as the number of series stages increases, the fluid channel inside the cavity becomes longer, and the number of shut-off valves increases, which increases the resistance of the pumped fluid and the energy loss during liquid flow. Therefore, this invention adopts a series-parallel multi-cavity voltage pump.

[0024] Furthermore, due to its small size, the number of heat dissipation devices required for each optical module can be designed and manufactured according to the product requirements, the size of the optical module, and the size of the chip.

[0025] Furthermore, the adhesive used to bond the heat dissipation device to the optical module housing should have a certain thermal conductivity and should be able to withstand the temperature of the optical module chip during operation without deformation or aging.

[0026] Furthermore, the adhesive used to bond the heat dissipation device to the optical module chip should have a certain thermal conductivity and should be able to withstand the temperature of the optical module chip during operation without deformation or aging.

[0027] Furthermore, the heat dissipation device can be disassembled and replaced according to product requirements.

[0028] Specifically, in this embodiment, refrigerant is stored inside the pipe, and a miniature voltage pump is connected to the pipe to drive the refrigerant to circulate within it. During circulation, the refrigerant carries away heat transferred to the pipe, thus achieving continuous heat dissipation and cooling of the circuit board. Heat dissipation fins further dissipate heat transferred to the upper surface of the device, further improving the device's heat dissipation rate. This heat dissipation device has a box-like structure with a small thickness, allowing for refrigerant flow. The principle of cooling through refrigerant flow makes the device compact.

[0029] in, Figure 3 This describes the structure of a miniature voltage pump. Piezoelectric vibrators 1 and 2 are parallel pumps. When driven in parallel, the volumes of both chambers increase or decrease simultaneously, with the output pressure remaining constant, but the flow rate is the sum of the output flow rates of a single chamber. The parallel connection of piezoelectric vibrators 1 and 2, and the parallel and series connection of piezoelectric vibrators 3 and 4, cause the volumes of the two sets of chambers to alternately increase or decrease.

[0030] It can be arranged using the space between the bottom layer board and the circuit board, or holes can be drilled in the circuit board so that the heat dissipation structure can be embedded in the holes in the circuit board, which is convenient to connect and has excellent heat dissipation effect.

[0031] In one specific embodiment, the pipe stack consists of two layers, with a heat dissipation plate on the surface of the upper pipe facing away from the lower pipe. Each layer of pipes can be rapidly circulated with coolant by a micro-voltage pump, releasing heat energy into the air, achieving a quiet operation and enabling long-term, sustained heat dissipation, effectively improving the durability of the heat dissipation device. In this embodiment, there is a large space above the upper pipe, which can be used to further dissipate heat by arranging a heat dissipation plate. This heat dissipation plate has heat dissipation fins, which greatly improve heat dissipation efficiency.

[0032] In another specific implementation, the pipe stack has three layers, mainly used when there are still heat-generating components above the heat dissipation device that require heat dissipation. Each layer of pipe can dissipate refrigerant through a miniature voltage pump, thus eliminating the need for a traditional heat sink and avoiding poor heat dissipation due to limited fin height.

[0033] The beneficial effects of this utility model are as follows:

[0034] This utility model presents a compact and small-sized cuboid optical module heat dissipation device, which can be customized according to different optical module sizes. Internally, it employs a double-layer pipe design: each pipe contains refrigerant and is equipped with a piezoelectric pump, achieving liquid circulation through piezoelectric vibration. The heat dissipation fins on the side of the structure increase the heat dissipation area, accelerating heat transfer and providing efficient heat dissipation. To address potential issues with the pipe structure and internal components, the heat dissipation module utilizes a series-parallel pump design, effectively combining the high flow rate of a parallel pump with the high pressure of a series pump, further addressing fluid resistance. The outer layer of the heat dissipation module uses a thermally conductive adhesive to ensure a tight bond between the chip, the casing, and the heat dissipation device, achieving strong adhesion and high-temperature resistance. The design also features a detachable and replaceable structure, facilitating maintenance and upgrades. In summary, this optical module design offers the following advantages: 1. Improved optical module stability; 2. Increased working efficiency; 3. Flexible design.

[0035] Through further optimization and improvement, more efficient and reliable heat dissipation solutions can be provided for precision electronic devices such as optical modules, lasers, data center equipment (servers, storage devices), and industrial automation equipment (sensors, controllers), in the communications field.

[0036] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0037] This document uses specific examples to illustrate the principles and implementation methods of this utility model. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of this utility model. Furthermore, those skilled in the art will recognize that, based on the ideas of this utility model, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. A heat dissipation device for an optical module utilizing a refrigerant, characterized in that, The heat dissipation device has a cuboid structure; the interior of the cuboid structure has multiple layers of pipes; each layer of pipes is filled with refrigerant liquid, and each layer of pipes is connected to a micro pump; the micro pump converts electrical energy into the vibration of piezoelectric oscillators, thereby causing the pump chamber volume to change back and forth, and thus transporting the liquid; the side of the heat dissipation device is provided with heat dissipation fins to increase the heat dissipation area; the piezoelectric oscillators in the micro pump are connected to each other in series and parallel.

2. The optical module heat dissipation device utilizing a refrigerant according to claim 1, characterized in that, The top of the heat dissipation device is in contact with the chip, and the top of the heat dissipation device is bonded to the bottom surface of the optical module chip.

3. The optical module heat dissipation device utilizing a refrigerant according to claim 1, characterized in that, The bottom of the heat dissipation device is connected to the housing of the optical module.

4. The optical module heat dissipation device utilizing a refrigerant according to claim 2, characterized in that, The top of the heat dissipation device is bonded to the bottom of the optical module chip using a first adhesive; the first adhesive has thermal conductivity.

5. The optical module heat dissipation device utilizing a refrigerant according to claim 3, characterized in that, The bottom of the heat dissipation device is bonded to the optical module housing using a second adhesive; the second adhesive has thermal conductivity.

6. The optical module heat dissipation device utilizing a refrigerant according to claim 1, characterized in that, The number of layers in the pipeline is 2.

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