Liquid drop electric sorting chip and single cell sorting device

Abstract

The utility model discloses a liquid drop electric sorting chip and a single cell sorting device, and relates to the technical field of micro-fluidic chip manufacturing. The liquid drop electric sorting chip comprises a substrate, and a micro-channel is arranged on the surface of the substrate; the cover plate covers the substrate, the cover plate is provided with an electrode hole penetrating through the cover plate, and the electrode hole is filled with a conductive material; an electrode lead is arranged on the surface of the cover plate, one end of the electrode lead corresponds to the electrode hole, and the other end of the electrode lead extends to the edge of the cover plate to form an electrode pin; the single cell sorting device comprises a control circuit board and a liquid drop electric sorting chip. According to the utility model, the production efficiency of the liquid drop electric separation chip as well as the reliability and the safety in use can be improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to micro -fluidic chip manufacturing technical field especially, relates to a kind of droplet electric sorting chip and single cell sorting device. BACKGROUND

[0002] Droplet electric sorting chip is a type of microfluidic chip, which has important applications in biomedical, material science, chemistry, etc. For example, in the field of biomedicine, droplet electric sorting chip can be used for cell sorting, protein separation, nucleic acid extraction, etc. The working principle of droplet electric sorting chip is as follows: when the droplets flow in the microchannel, by setting electrodes on the droplet electric sorting chip and applying electric field, the substances in the droplets will produce electrophoresis or dielectrophoresis under the action of electric field. According to the difference of electrical properties (such as charge, dielectric constant, etc.) of the substances in the droplets, the droplets are subjected to different electric field forces, thereby realizing the sorting of the droplets.

[0003] The manufacturing of droplet electric sorting chip electrodes is usually through low-temperature alloy infusion. After infusion, the electrode wire is inserted into the copper wire or other material, and the electrode is led out to connect with the external circuit board. However, this method of manufacturing electrodes is complex and tedious, and is mostly operated manually, which has low production efficiency and is not suitable for mass production. Moreover, the electrode wire as a connecting device with the external circuit board makes the control loop complex and susceptible to interference, affecting the reliability of the droplet electric sorting chip. In addition, due to the high sorting voltage, the exposed electrode wire poses a certain safety hazard during operation. SUMMARY

[0004] The utility model provides a kind of droplet electric sorting chip and single cell sorting device, to improve the production efficiency of droplet electric sorting chip, and reliability, safety when using.

[0005] The droplet electric sorting chip provided by the utility model comprises:

[0006] A substrate having a microfluidic channel on its surface;

[0007] A cover plate is arranged on the substrate. The cover plate has electrode holes penetrating through it, and the electrode holes are filled with conductive material.

[0008] The surface of the cover plate is provided with electrode leads, one end of the electrode leads corresponds to the electrode holes, and the other end of the electrode leads extends to the edge of the cover plate to form electrode pins.

[0009] Optionally, the electrode leads are prepared by screen printing conductive paint or conductive metal paste.

[0010] Optionally, the electrode leads are prepared by magnetron sputtering metal material.

[0011] Optionally, the cover plate is ITO glass; a surface of the ITO glass has a patterned ITO coating, and the patterned ITO coating constitutes the electrode lead.

[0012] Optionally, the cover plate is further provided with a flow channel hole penetrating through the cover plate, and the flow channel hole is arranged correspondingly to the liquid inlet and the liquid outlet of the micro flow channel.

[0013] Optionally, the substrate is made of PDMS, and the cover plate is made of glass.

[0014] Optionally, the conductive material filled in the electrode hole is a low-temperature alloy.

[0015] Optionally, the substrate is provided with a through hole arranged correspondingly to the electrode hole; and the low-temperature alloy is poured into the electrode hole through the through hole.

[0016] Optionally, the electrode hole and the flow channel hole are prepared by laser drilling, and the through hole is prepared by mechanical drilling.

[0017] The utility model further provides a single cell sorting device, the single cell sorting device includes control circuit board and above-mentioned droplet electric sorting chip;

[0018] The electrode pin of the droplet electric sorting chip is electrically connected with the control circuit board.

[0019] The utility model has the following beneficial effects:

[0020] 1, the utility model discloses a cover plate is provided with an electrode hole, and the electrode hole is filled with conductive material to constitute the working electrode of droplet electric sorting chip, and the electrode hole is communicated to the electrode lead on the surface of the cover plate, and the control circuit board is connected to the electrode lead on the surface of the cover plate, and the control circuit board is connected to the electrode lead on the surface of the cover plate.

[0021] 2, the utility model discloses that the electrode lead is prepared on the surface of the cover plate, and the wiring design of the electrode lead is convenient, and the electrode lead is communicated with the corresponding electrode hole, and the control loop is simple, avoids the mutual interference between control passages, and is convenient for packaging, avoids the interference of external electromagnetic environment to control passage, and improves the use reliability of droplet electric sorting chip.

[0022] 3、The utility model discloses a cover plate surface preparation electrode lead, facilitate external control circuit board to pack, avoid the security risk of traditional manual insertion electrode silk lead electrode method in electrode silk bare, and the connection place resistance between electrode silk and the electrode pad of chip surface, external control circuit board in traditional method is big, the conductive path of electrode hole of the utility model has greater cross -section area, and the conductive material in electrode hole is convenient and the electrode lead on the plane forms good ohmic contact, therefore the overall resistance of the circuit of the utility model reduces, and the loss reduces when voltage is added, can improve the efficiency of drop electric separation and proper reduce the separation voltage, promote the security when using. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or prior art, the following will briefly introduce the drawings needed to be used in the embodiment or prior art description, obviously, the drawings in the following description only some embodiments of the utility model, for ordinary skilled person in the art, under the premise of not paying the creative labor, still can obtain other drawings according to these drawings.

[0024] Figure 1 It is a stereoscopic structure schematic view of the embodiment of the utility model liquid drop electric separation chip;

[0025] Figure 2 It is a top view of the embodiment of the utility model liquid drop electric separation chip;

[0026] Figure 3 It is a side view of the embodiment of the utility model liquid drop electric separation chip.

[0027] Mark explanation:

[0028] 1, substrate;2, cover plate;3, electrode hole;4, electrode lead;41, electrode pin;5, flow channel hole;6, through hole. DETAILED DESCRIPTION

[0029] In order to make the utility model purposes, features, advantages of the utility model more obvious and easy to understand, the following will be combined with the drawings in the embodiment of the utility model, the technical scheme in the embodiment of the utility model is clearly and completely described, obviously, the following described embodiment only is a part of the embodiment of the utility model, rather than all the embodiments. Based on the embodiment in the utility model, all other embodiments obtained by ordinary skilled person in the art without making creative labor belong to the scope of the utility model protection.

[0030] The English professional terms involved in the application are explained as follows:

[0031] PDMS: polydimethylsiloxane;ITO: indium tin oxide.

[0032] The utility model provides a kind of droplet electric sorting chip, to improve the production efficiency of droplet electric sorting chip, and reliability, security when using.

[0033] Referring to Figure 1 In an embodiment, the utility model provides a kind of droplet electric sorting chip, comprising:

[0034] Substrate 1, surface is equipped with microfluidic channel;

[0035] Cover plate 2, cover is in substrate 1;The cover plate 2 is equipped with electrode hole 3 passing through the cover plate 2, and the electrode hole 3 is filled with conductive material;

[0036] The surface of the cover plate 2 is equipped with electrode lead 4, one end of the electrode lead 4 is correspondingly arranged with the electrode hole 3, and the other end of the electrode lead 4 extends to the edge of the cover plate 2 to form electrode lead 41.

[0037] It can be understood that, in the embodiment, the cover plate 2 is also provided with flow channel hole 5 passing through the cover plate 2, and the flow channel hole 5 is correspondingly arranged with the liquid inlet and liquid outlet of the microfluidic channel.

[0038] In the embodiment, the flow channel hole 5 is usually provided with a plurality of; the droplet electric sorting chip at least includes one liquid inlet, for mixed solution to enter, and the mixed solution usually includes target droplet and non-target droplet and continuous phase;In addition to the droplet inlet, interval oil phase inlet can also be arranged, and continuous phase is injected to make the mixed solution flow further forward, and the spacing of droplet and the flow rate of droplet can be adjusted;The droplet electric sorting chip at least includes two liquid outlets, and the liquid outlet of target droplet and the liquid outlet of waste liquid are respectively;The positions of the above liquid inlet, interval oil phase inlet and liquid outlet are all provided with corresponding through flow channel hole 5 in the cover plate.

[0039] In the embodiment, the working electrode of the droplet electric sorting chip is usually provided with a plurality of, including a plurality of high-voltage sorting electrodes, for generating non-uniform electric field, so that the target droplet is subjected to dielectrophoresis force in the microfluidic channel to change flow direction, to realize droplet sorting;In addition to the high-voltage sorting electrode, shielding electrode can also be arranged, for shielding the non-uniform electric field generated by high-voltage electrode, to prevent the electric field from interfering with non-target area;The above electrode is at the preset position on the surface of the substrate, and the cover plate 2 is all provided with corresponding through electrode hole 3.

[0040] It can be understood that, after the electrode hole 3 is filled with conductive material, the conductive material located in the electrode hole 3 directly constitutes the working electrode of the above-mentioned droplet electric sorting chip.

[0041] The utility model discloses an electrode hole is arranged in the cover plate, and the working electrode of liquid drop electric sorting chip is constituted by filling the conductive material in the electrode hole, and the electrode lead of electrode hole is communicated to the surface of cover plate, and the control circuit board is connected through the electrode lead on the surface of cover plate, because the process of preparing electrode lead and electrode hole on the cover plate is relatively controllable, and its preparation process is convenient for accurate and standardization, compared with the method of traditional manual electrode wire insertion electrode lead, the utility model reduces manual operation steps, and the shape of chip is regular and is convenient for fixing, is favorable for batch processing of liquid drop electric sorting chip, and production efficiency is improved.

[0042] In addition, the utility model discloses an electrode lead is prepared on the surface of cover plate, and the wiring design of electrode lead is convenient, and electrode lead is communicated with corresponding electrode hole, and control loop is simple, avoids the mutual interference between control passage, and is convenient for packaging, avoids the interference of external electromagnetic environment to control passage, and improves the use reliability of liquid drop electric sorting chip.

[0043] In addition, the utility model discloses an electrode lead is prepared on the surface of cover plate, and the wiring design of electrode lead is convenient, and electrode lead is communicated with corresponding electrode hole, and control loop is simple, avoids the mutual interference between control passage, and is convenient for packaging, avoids the interference of external electromagnetic environment to control passage, and improves the use reliability of liquid drop electric sorting chip.

[0044] Based on the above embodiment, in some embodiments, the material of the substrate is PDMS, and the material of the cover plate is glass.

[0045] PDMS is a commonly used substrate material in the field of microfluidic chips, and glass is a commonly used cover plate material in the field of microfluidic chips. After plasma treatment, the surfaces of PDMS and glass are both rich in silicon hydroxyl groups. When the two are bonded together, the silicon hydroxyl groups will condense together, causing the PDMS and glass to be tightly bonded.

[0046] Since the high-temperature resistance of PDMS material is limited, in the embodiment based on the PDMS substrate, the conductive material filled in the electrode hole can be selected from low-temperature alloys.

[0047] It should be noted that the low-temperature alloy used in these embodiments refers to an alloy material that can melt under the temperature conditions in which the PDMS does not experience significant performance degradation. For example, if the maximum working temperature of the PDMS material is 200°C, the selected low-temperature alloy should have a melting point below 200°C.

[0048] In some embodiments, the material of the low-temperature alloy can be tin-bismuth alloy, gallium-based alloy, lead-tin-cadmium alloy, etc. according to specific conditions.

[0049] Referring to Figure 1 In some embodiments, the substrate is provided with through holes 6 corresponding to the electrode holes; the low-temperature alloy is filled into the electrode holes 3 through the through holes 6.

[0050] The way of filling the electrode holes with the low-temperature alloy is a low-cost and controllable way to fill the electrode holes with conductive material; in these embodiments, the plurality of through holes and the plurality of electrode holes are one-to-one corresponding, and when filling the low-temperature alloy, the substrate provided with the through holes and the cover plate provided with the electrode holes are usually bonded first, a layer of adhesive tape is pasted on the cover plate to seal the hole positions of the electrode holes, then the low-temperature alloy wire is inserted from the back through hole position of the PDMS substrate, then the cover plate is placed with the adhesive surface facing down on the hot plate for heating, and the heating is stopped until the electrode is filled with the electrode holes and the through holes, then the droplet electrical sorting chip is taken off for cooling, and the adhesive tape is torn off to complete the filling of the low-temperature alloy. This way can make the low-temperature alloy filled in the electrode holes form a flat contact surface on the upper surface of the cover plate, which is convenient for forming a good ohmic contact with the electrode leads on the surface of the cover plate.

[0051] It should be noted that since the through holes on the PDMS substrate will expand when heated, the diameter of the heating wire should be slightly larger than the diameter of the through hole, so that the low-temperature alloy wire can still be closely attached to the inner wall of the through hole when heated, preventing air from entering the molten low-temperature alloy liquid to generate bubbles, and preventing the molten low-temperature alloy liquid from flowing out.

[0052] In addition, the diameters of the through holes and the electrode holes can be selected to be different values so that the through holes and the electrode holes can be accurately aligned when the substrate and the cover plate are bonded.

[0053] In the embodiments based on the PDMS substrate and the glass cover plate, since the high-temperature resistance of PDMS is limited, while the high-temperature resistance of glass is strong but the impact resistance is weak, the electrode holes and the flow channel holes of the cover plate can be prepared by laser drilling, and the through holes of the substrate can be prepared by mechanical drilling.

[0054] In some other embodiments, the materials of the substrate and the cover plate can also be selected from other materials. For example, when the substrate is selected from PDMS material, the cover plate can also be selected from PDMS material, and correspondingly, the processing method of the electrode holes and the flow channel holes in the cover plate can refer to the processing method of the through holes of the PDMS substrate in the above embodiments; in addition to PDMS material, the substrate can also be selected from thermoplastic polymer material, and correspondingly, the cover plate can also be selected from thermoplastic polymer material, and the bonding between the substrate and the cover plate can be completed by thermal bonding, ultrasonic sealing, etc. The processing method of the corresponding electrode holes, through holes and flow channel holes needs to be reasonably selected according to the thermal physical and chemical properties of different polymers.

[0055] In the above embodiments of the droplet electrical sorting chip, the electrode leads on the surface of the cover plate can be prepared in various ways. For example, in some embodiments, the electrode leads can be prepared by screen printing conductive paint or conductive metal paste. The conductive paste can be selected from conductive silver paste, conductive carbon paste, copper paste, nickel paste, etc., and the conductive paint can be selected from thermosetting transparent conductive paint composed of high molecular polymer and transparent conductive resin, etc. The screen printing method is simple to operate and the cost of the material is relatively low.

[0056] In some other embodiments, the electrode leads can be prepared by magnetron sputtering of metal materials, which can include gold, platinum, silver, copper, etc. The metal film prepared by magnetron sputtering is resistant to wear and has good uniformity. The precision of magnetron sputtering based on a mask is also relatively high, and a relatively low line width (less than 20 μm) can be achieved.

[0057] In some other embodiments, the cover plate can be directly selected from ITO glass, and the surface of the ITO glass is provided with a patterned ITO coating according to the wiring requirements of the electrode leads. The patterned ITO coating can directly constitute the electrode leads on the surface of the cover plate. The ITO coating has good wear resistance, and the droplet electrical sorting chip usually needs to collect fluorescent signals. Since the ITO coating is a transparent coating, the arrangement of the electrode lead circuit does not need to worry about affecting the collection of fluorescent signals. In addition, the cover plate can also be selected from other types of transparent conductive glass, such as AZO (aluminum-doped zinc oxide) glass, GZO (gallium-doped zinc oxide) glass, FTO (fluorine-doped tin oxide) glass, etc., which can achieve the same or similar effect as ITO glass.

[0058] The utility model also proposes some specific embodiments for further detailing the preparation process of the droplet electrical sorting chip provided by the utility model in combination with the scheme of any of the above embodiments. The following embodiments are not a limitation of the utility model, and a person skilled in the art can adjust them according to actual production conditions in practical application.

[0059] Embodiment 1

[0060] Preparation of the substrate:

[0061] The PDMS is mixed at a ratio of 10:1 of prepolymer and curing agent, stirred at 700 rpm for 3 min using a stirrer, and then degassed under vacuum. After degassing, the mixture is poured into a mold, cured at 80℃ for 30 min, and then the cured PDMS block (chip) is removed. The structured side of the PDMS is then turned upward and a 0.75 mm through hole is punched at the electrode hole site using a punch, obtaining a PDMS substrate with target microchannel structure and target through hole.

[0062] Preparation of the cover plate:

[0063] The cover plate is made of glass with a thickness of 1 mm to 3 mm. The target electrode hole corresponding to the working electrode hole and the flow channel hole corresponding to the liquid inlet and liquid outlet are prepared on the cover plate by laser drilling.

[0064] Bonding of the substrate and the cover plate:

[0065] The PDMS substrate with the microfluidic channel is placed in the plasma surface treatment machine together with the cover plate. The substrate is treated with oxygen plasma for 40 seconds. Then, the through hole of the substrate is aligned with the electrode hole of the cover plate. The PDMS substrate and the plasma-treated surface of the glass cover plate are bonded together and placed in a 120°C oven for 5 minutes to complete the bonding of the substrate and the cover plate.

[0066] Filling of the low-temperature alloy:

[0067] A layer of adhesive tape is attached to the upper surface of the cover plate to seal the hole (including the electrode hole and the flow channel hole). Then, a 0.8 mm low-temperature alloy wire is inserted from the back through hole position of the PDMS substrate. Subsequently, the cover plate is placed adhesive side down on a hot plate and heated at 85°C until the low-temperature alloy melts and fills the electrode hole and the through hole. Then, the heating is stopped and the adhesive tape is removed after cooling.

[0068] Preparation of electrode leads:

[0069] A 300-mesh screen and quick-drying conductive paint / silver paste are used to print the circuit on the punched glass surface to ensure the connection of the electrode hole and the electrode lead. The printed circuit is dried at 25°C for 24 hours. After drying, the electrode leads can be connected to the control circuit at the edge of the electrode leads.

[0070] In this embodiment, after the bonding of the cover plate and the substrate and the filling of the low-temperature alloy into the electrode hole, the electrode leads are prepared on the surface of the cover plate by screen printing.

[0071] Example 2

[0072] Preparation of the substrate:

[0073] The PDMS is mixed at a ratio of 10:1 of prepolymer and curing agent. After stirring at 700 rpm for 3 minutes, the mixture is degassed using a vacuum. After degassing, the mixture is poured into a mold and cured at 80°C for 30 minutes. Then, the cured PDMS block (chip) is removed. The structured side of the PDMS is turned upward and a 0.75 mm through hole is punched at the electrode hole position using a puncher. Thus, a PDMS substrate with target microfluidic channel structure and target through hole is obtained.

[0074] Preparation of the cover plate:

[0075] The cover plate is made of glass with a thickness of 1 mm to 3 mm. The cover plate glass is soaked in acetone for 30 minutes, then washed with anhydrous ethanol and dried with compressed nitrogen.

[0076] Spin-coat 3 pm thickness of SPR220 3.0 photoresist on the surface of the electrode lead, heat it on a hot plate at 115 °C for 90 s, remove the cover mask after cooling and expose it to i-line light with 310 mJ, and then develop it with 10% NaOH for about 5 min, at which time the electrode lead deposition position is exposed and the other positions are covered with positive photoresist.

[0077] Put the cover plate glass into a magnetron sputtering device, use gold or platinum as the target material for sputtering film deposition, after deposition, take out the cover plate glass, wash it with pure water, and then dry it, soak the cover plate glass in acetone for 15 min, then take it out, wash it with anhydrous ethanol, and dry it, use laser to punch holes on the reserved electrode hole position to prepare the electrode hole, and use laser to punch holes on the reserved flow channel hole position to prepare the flow channel hole.

[0078] Bonding of the substrate and the cover plate:

[0079] Put the PDMS substrate with the microfluidic channel on the top and the cover plate into a plasma surface treatment machine, treat it with oxygen plasma for 40 s, then align the through hole of the substrate with the electrode hole of the cover plate, and then bond the plasma treated surface of the PDMS substrate and the glass cover plate together, put them into a 120 °C oven for 5 min, and complete the bonding of the substrate and the cover plate.

[0080] Filling of the low-temperature alloy:

[0081] Put a layer of adhesive tape on the top surface of the cover plate to seal the hole position (including the electrode hole and the flow channel hole), then insert a 0.8 mm low-temperature alloy wire from the back through hole position of the PDMS substrate, then place the cover plate with the adhesive side down on the hot plate and heat it at 85 °C until the low-temperature alloy melts and fills the electrode hole and the through hole, then stop heating, and after cooling, remove the adhesive tape.

[0082] This example prepares the electrode lead of gold or platinum material by magnetron sputtering in the step of preparing the cover plate.

[0083] Example 3

[0084] Preparation of the substrate:

[0085] Mix the PDMS according to the ratio of 10:1 of prepolymer and curing agent, stir it with a stirrer at 700 rpm for 3 min, then remove the bubbles with vacuum, after the bubbles are removed, pour the mixture into a mold, cure it at 80 °C for 30 min, then take out the cured PDMS block (chip), turn the PDMS with structure upside down, and punch a 0.75 mm through hole at the electrode hole position with a puncher, to obtain a PDMS substrate with the target microfluidic channel structure and the target through hole.

[0086] Preparation of the cover plate:

[0087] The cover plate is made of ITO glass, the ITO glass is soaked in acetone for 30 minutes, and then cleaned with anhydrous ethanol, and then dried by compressed nitrogen.

[0088] A 3-micron-thick SPR220 3.0 photoresist is spin-coated on the ITO coating of the cover plate, heated by a hot plate at a temperature of 115 DEG C for 90 seconds, and then removed after cooling to cover the mask and i-line exposure of 310 mJ, and then developed with 10% NaOH for about 5 minutes, and then washed with pure water and dried.

[0089] The cover plate is placed in an etching solution composed of concentrated hydrochloric acid, concentrated nitric acid and water in a ratio of 50:3:50, etched at a temperature of 85 DEG C for 3-7 minutes, and then removed and washed with pure water and dried, then soaked in acetone for 15 minutes, and then removed and washed with anhydrous ethanol and dried, and then the electrode hole is prepared by laser drilling at the reserved electrode hole position, and the flow channel hole is prepared by laser drilling at the reserved flow channel hole position.

[0090] Bonding of the substrate and the cover plate:

[0091] The PDMS substrate with a microfluidic channel is placed in a plasma surface treatment machine with the cover plate, treated with oxygen plasma for 40 seconds, and then the through hole of the substrate is aligned with the electrode hole of the cover plate, and then the PDMS substrate and the ITO glass cover plate are bonded together by plasma treatment, and then placed in a 120 DEG C oven for 5 minutes to complete the bonding of the substrate and the cover plate.

[0092] Filling of low-temperature alloy:

[0093] A layer of adhesive tape is attached to the upper surface of the cover plate to seal the hole position (including the electrode hole and the flow channel hole), and then a 0.8mm low-temperature alloy wire is inserted from the back through hole position of the PDMS substrate, and then the cover plate is placed adhesive side down on the hot plate and heated at 85 DEG C until the low-temperature alloy melts and fills the electrode hole and the through hole, and then the heating is stopped, and the adhesive tape is removed after cooling.

[0094] In this embodiment, ITO glass is directly used as the cover plate of the droplet electrical sorting chip, and the ITO glass has an ITO coating on one side, and the electrode lead pattern is formed by wet etching.

[0095] Based on the above-mentioned embodiments of the droplet electrical sorting chip, the utility model also provides a single cell sorting device, which comprises a control circuit board and the droplet electrical sorting chip provided in the above embodiments; the electrode pin of the droplet electrical sorting chip is electrically connected with the control circuit board, and the control circuit board is used for controlling the loading voltage of the working electrode to realize the specific droplet electrical sorting function.

[0096] In some embodiments, the single cell sorting device can also be provided with a fluorescence signal collection device; the fluorescence signal collection device can be used for identification and sorting of the target droplet by combining the cell with the fluorescent label; in these embodiments, the electrode lead of the cover plate surface is preferably coated with a transparent conductive material such as ITO; if the electrode lead is made of metal or other opaque material, the wiring of the electrode lead needs to be specifically designed to avoid affecting the fluorescence signal collection.

[0097] The beneficial effects of the above droplet electric sorting chip embodiments, the single cell sorting device provided by the utility model can all be realized, and here is not described.

[0098] The above-described embodiments are only used to illustrate the technical solutions of the present application, rather than limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A droplet electroporation chip, characterized by, The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device.

2. The droplet electrosorting chip of claim 1, wherein, The application relates to a single-cell sorting device.

3. The droplet electrosorting chip of claim 1, wherein, The application relates to a single-cell sorting device.

4. The droplet electrosorting chip of claim 1, wherein, The application relates to a single-cell sorting device.

5. The droplet electrosorting chip of claim 1, wherein, The application relates to a single-cell sorting device.

6. The droplet electrosorting chip of claim 5, wherein, The application relates to a single-cell sorting device.

7. The droplet electrosorting chip of claim 6, wherein, The application relates to a single-cell sorting device.

8. The droplet electrosorting chip of claim 7, wherein, The application relates to a single-cell sorting device.

9. The droplet electrosorting chip of claim 8, wherein, The application relates to a single-cell sorting device.

10. A single cell sorting device, characterized by, The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device. The application relates to a single-cell sorting device.

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