Polishing fixing device and polishing machining device for ultrathin element

Abstract

The utility model relates to a polishing fixing device and a polishing machining device for an ultrathin element. The polishing fixing device comprises a fixing tool and an adhesive used for adhering the ultrathin element. A glue pouring cavity is formed in the fixing tool, the adhesive is injected into the glue pouring cavity, the ultrathin element is placed in the adhesive, and the ultrathin element and the fixing tool form a whole to be combined into the ultra-thick element. According to the utility model, the ultra-thick element is formed by pouring the ultra-thin element on the fixing tool through the adhesive, so that the ultra-thin element can always keep the self-state without deformation in the polishing process, and can effectively resist the external force in the polishing process without causing the displacement or vibration of the ultra-thin element. The polishing device is used for polishing the ultra-thick element, vibration, deformation and displacement of the ultra-thin element in the polishing process are reduced, the problem of warping of the ultra-thin element is effectively solved, and therefore the polishing precision of the element is remarkably improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to workpiece polishing technical field especially is a kind of polishing fixing device and polishing processing device of ultrathin component. BACKGROUND

[0002] With the rapid development of electronic and precision manufacturing industry, the processing precision requirement of ultrathin component is higher and higher. Ultrathin component, such as silicon wafer, ceramic sheet, glass sheet and the like, due to its thin type characteristics, light weight, prone to deformation, difficult to achieve sub-micron flatness, and easily cause damage to the surface of component during polishing fixation, these problems seriously affect the performance and service life of component. At present, the polishing processing device used in market mostly adopts traditional fixed tooling, these tooling mostly adopts mechanical clamping or adsorption mode to fix component, these modes cannot solve the flatness problem caused by the warping form of ultrathin component itself, or may cause damage to ultrathin component, or cause component displacement or deformation due to uneven pressure during polishing process, poor stability, cannot effectively resist external force during polishing process, affect the precision and quality of polishing. SUMMARY

[0003] Therefore, the utility model wants to overcome the technical problems in prior art, provide a kind of polishing fixing device and polishing processing of ultrathin component, by pouring combination into ultrathin component in fixed tooling through adhesive, in the polishing processing process, ultrathin component can always keep its own state, will not deform, and can effectively resist external force during polishing process, will not cause displacement or vibration of ultrathin component. Polishing processing device polishes ultrathick component, reduces the vibration, deformation and displacement of ultrathin component during polishing process, effectively solves the warping of ultrathin component itself, thereby significantly improves the polishing precision of component.

[0004] First, to solve the above technical problems, the utility model provides a kind of polishing fixing device of ultrathin component, including: fixed tooling and the adhesive for sticking ultrathin component;The fixed tooling is equipped with glue pouring cavity, the adhesive is injected into the glue pouring cavity, and ultrathin component is placed into the adhesive, forms a whole with the fixed tooling, and is combined into ultrathick component.

[0005] In an embodiment of the utility model, the glue pouring cavity of the fixed tooling is equipped with honeycomb structure, for supporting ultrathin component.

[0006] In an embodiment of the utility model, the adhesive is optical yellow glue. The optical yellow glue has the characteristics of rapid curing and high temperature resistance to adapt to temperature change during polishing process.

[0007] In an embodiment of the utility model, the fixed tooling is square or rectangular.

[0008] In a second aspect, to solve the above technical problems, the utility model provides a kind of polishing processing device of ultra-thin element, including the polishing fixing device of the ultra-thin element of first aspect.

[0009] In an embodiment of the utility model, process detection device is further included, for detecting the polishing process of ultra-wave element.

[0010] The process detection device includes sensor and control unit, the sensor is used to detect parameter change in polishing process, and the control unit is used to receive sensor signal and judge whether polishing is completed.

[0011] In an embodiment of the utility model, the sensor is optical sensor, for measuring the gloss or reflectivity of ultra-thin element surface.

[0012] In an embodiment of the utility model, the control unit includes comparator, for comparing the parameter detected in real time with preset completion standard.

[0013] In an embodiment of the utility model, heating device is further included, and the heating device is used to heat adhesive in ultra-thin element fixing device, and separates ultra-thin element from fixed tooling.

[0014] The above technical solution of the utility model has the following beneficial effects compared with prior art:

[0015] The polishing fixing device of the ultra-thin element of the utility model, ultra-thin element is combined into ultra-thick element by adhesive pouring in fixed tooling, in polishing processing process, ultra-thin element can always maintain own state, and deformation does not occur, and in polishing process, effective resistance to external force can be achieved, and the displacement or vibration of ultra-thin element is not caused;Polishing processing device is used to polish ultra-thick element, reduces the vibration and displacement of ultra-thin element in polishing process, to significantly improve the polishing precision of element. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to make the content of the utility model more easily be clearly understood, the utility model is further explained in detail below according to specific embodiment of the utility model and combining with drawings, wherein

[0017] Figure 1 It is the structure schematic view of the polishing fixing device of ultra-thin element in the embodiment one of the utility model;

[0018] Figure 2 It is Figure 1 The structure schematic view of the fixed tooling of the polishing fixing device of ultra-thin element shown in the figure;

[0019] Figure 3 is Figure 2 the structure diagram of the fixed tool and the honeycomb structure is shown in the figure;

[0020] Description of the drawings: 1, fixed tool; 2, adhesive; 3, ultra-thin element; 11, glue filling cavity; 12, honeycomb structure. DETAILED DESCRIPTION

[0021] The utility model will be further described below in combination with the drawings and specific embodiments, so that the person skilled in the art can better understand the utility model and can be implemented, but the embodiment is not as the limitation of the utility model. Example one

[0022] Referring to Figures 1-3 The polishing fixing device of the ultra-thin element provided by the application comprises a fixed tool 1 and an adhesive 2 for bonding the ultra-thin element 3. The fixed tool 1 is provided with a glue filling cavity, the adhesive 2 is injected into the glue filling cavity 11, and the ultra-thin element 3 is placed into the adhesive 2 to form a whole with the fixed tool 1 and be combined into an ultra-thick element.

[0023] Based on the above structure, the ultra-thin element 3 and the fixed tool 1 are combined into an ultra-thick element, which can keep the state of the ultra-thin element during the polishing process, avoid deformation and displacement, and improve the polishing precision.

[0024] Further, the glue filling cavity of the fixed tool 1 is provided with a honeycomb structure 12 for supporting the ultra-thin element 3. The honeycomb structure 12 increases the support of the ultra-thin element 3, further ensures the stability of the ultra-thin element 3 during the polishing process, and reduces the deformation or damage caused by insufficient support.

[0025] In the embodiment, the adhesive 2 is optical yellow glue. The optical yellow glue has the characteristics of rapid curing and high temperature resistance, so as to adapt to the temperature change during the polishing process, improve the stability of the polishing process and the durability of the element.

[0026] Preferably, the fixed tool 1 is square or rectangular. The fixed tool is designed to be square or rectangular, which simplifies the structure of the tool, is convenient for manufacturing and use, and is also convenient for placing and polishing the ultra-thin element 3, and improves the processing efficiency. Example two

[0027] The utility model provides a kind of polishing processing device of ultra-thin element 3, including the polishing fixing device of ultra-thin element 3 described in example one, process detection device and heating device, for detecting the polishing process of ultra-wave element, the heating device is used to heat the adhesive 2 in the ultra-thin element 3 fixing device, and ultra-thin element 3 is separated from fixed tool 1.

[0028] The polishing processing device realizes efficient polishing processing of the ultra-thin element 3 by integrating the polishing processing device, improves production efficiency and element quality. The heating device is used for heating the adhesive, so that the ultra-thin element can be separated from the fixed tooling, providing a simple separation method, avoiding damage to the element, and improving production efficiency.

[0029] Further, the process detection device includes a sensor for detecting parameter changes in the polishing process and a control unit for receiving sensor signals and determining whether the polishing is complete. Through the cooperation of the sensor and the control unit, accurate detection and control of parameter changes in the polishing process are realized, making the polishing process more automated and intelligent, and improving the consistency and reliability of the polishing.

[0030] The sensor in the embodiment is an optical sensor for measuring the glossiness or reflectivity of the surface of the ultra-thin element 3. The optical sensor is used to measure the glossiness or reflectivity of the surface of the ultra-thin element, providing a non-contact detection method that avoids physical damage to the element surface while accurately measuring the polishing effect.

[0031] Specifically, the control unit includes a comparator for comparing the real-time detected parameters with the preset completion standard. The comparator in the control unit compares the real-time detected parameters with the preset completion standard, realizing accurate control of the polishing process and ensuring the consistency of the polishing quality.

[0032] Obviously, the above embodiments are only examples for clarity and do not limit the embodiments. For those skilled in the art, other different forms of changes or variations can be made on the basis of the above description. Here, it is not necessary and impossible to enumerate all the embodiments. The obvious changes or variations derived therefrom are still within the protection scope of the present application.

Claims

1. A polishing fixture for ultra-thin components, characterized by: The utility model relates to a polishing device for ultra-thin element, comprising: a fixing tool and an adhesive for bonding the ultra-thin element; a glue filling cavity is arranged in the fixing tool, the adhesive is injected into the glue filling cavity, the ultra-thin element is placed into the adhesive, and the fixing tool and the ultra-thin element form an integral whole to be combined into an ultra-thick element.

2. A polishing fixture for ultrathin elements according to claim 1, characterized in that: A honeycomb structure is arranged in the glue filling cavity of the fixing tool to support the ultra-thin element.

3. The polishing fixture for ultrathin elements according to claim 1, characterized in that: The adhesive is optical yellow glue.

4. The polishing fixture for ultrathin elements according to claim 1, characterized in that: The fixing tool is square or rectangular.

5. A polishing apparatus for ultra-thin components, characterized in that: The polishing device for ultra-thin element comprises the fixing tool and the adhesive.

6. An apparatus for polishing an ultrathin element according to claim 5, wherein: A process detection device is further arranged to detect the polishing process of the ultra-thin element.

7. An apparatus for polishing an ultrathin element according to claim 6, wherein: The process detection device comprises a sensor and a control unit, the sensor is used to detect the parameter change in the polishing process, and the control unit is used to receive the sensor signal and judge whether the polishing is completed.

8. The apparatus for polishing an ultrathin element according to claim 7, wherein: The sensor is an optical sensor used to measure the glossiness or reflectivity of the surface of the ultra-thin element.

9. The apparatus for polishing an ultrathin element according to claim 8, wherein: The control unit comprises a comparator used to compare the real-time detected parameter with the preset completion standard.

10. The apparatus for polishing an ultrathin element according to claim 9, wherein: A heating device is further arranged to heat the adhesive in the fixing device for the ultra-thin element and separate the ultra-thin element from the fixing tool.

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