Wafer cutting device

Abstract

The utility model relates to the technical field of wafer cutting, and provides a wafer cutting device. The wafer cutting device comprises a workbench, a mechanical arm and a proofreading assembly. Wherein the workbench comprises a carrying plate, and the carrying plate is used for carrying a wafer; the mechanical arm comprises a guide rail, a driving motor, a spindle and a cutter, the cutter is installed on the spindle and used for cutting wafers, the guide rail is perpendicular to the carrying plate, the spindle is slidably connected with the guide rail, and the driving motor can drive the spindle to get close to or away from the carrying plate along the guide rail; the proofreading assembly comprises a first sensor and a second sensor, the first sensor is installed on the workbench, the second sensor is installed on the mechanical arm, and when the tool makes contact with the carrying plate, the first sensor and the second sensor are electrically connected to generate an electric signal. Thus, through the correction assembly, the original point position of the mechanical arm can be rapidly and accurately determined, and then the machining precision can be improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer cutting technical field especially relates to a wafer cutting device. BACKGROUND

[0002] Wafer is the silicon wafer used for making silicon semiconductor circuit, mainly applied to semiconductor industry, is the basis for manufacturing integrated circuit, microprocessor, memory chip and various semiconductor devices.

[0003] When cutting equipment is used to cut wafer, the distance between the machining end face of the cutter and the object plate used to carry wafer increases continuously because the cutter wears continuously in the machining operation, therefore, in order to ensure machining precision, the position correction of the cutter and the object plate reference needs to be carried out after a period of operation.

[0004] As shown in Figure 1 The current common correction scheme is to make the cutter 230 away from the object plate 110 first, place the gap piece 500 between the cutter 230 and the object plate 110, drive the cutter 230 to approach the object plate 110, and when the cutter 230 abuts against the gap piece 500 and the gap piece 500 cannot be pulled out from between the cutter 230 and the object plate 110 by pulling, it is determined that the cutter 230 moves to the specified position. Since the thickness of the gap piece 500 is known, the thickness of the gap piece 500 is recorded as the distance between the cutter 230 and the object plate 110 at this time, and the origin position of the cutter 230 is obtained.

[0005] Therefore, a wafer cutting device is needed to solve the above technical problems. UTILITY MODEL CONTENTS

[0006] The utility model aims at providing a wafer cutting device, which can quickly and accurately determine the origin position of the mechanical arm, and thus improve the machining precision.

[0007] To achieve this purpose, the utility model adopts the following technical solutions:

[0008] The wafer cutting device comprises:

[0009] A workbench, the workbench comprises an object plate, and the object plate is used to carry wafer;

[0010] A mechanical arm, the mechanical arm comprises a guide rail, a main shaft and a cutter, the cutter is installed on the main shaft and used to cut wafer, the guide rail is perpendicular to the object plate, the main shaft is in sliding connection with the guide rail and can approach or move away from the object plate along the guide rail;

[0011] The proofreading assembly comprises a first sensor and a second sensor, the first sensor is installed on the workbench, the second sensor is installed on the mechanical arm, and the first sensor and the second sensor are electrically connected to generate an electric signal when the cutter contacts the object plate.

[0012] As a preferred technical scheme of the wafer cutting device, the driving member is in transmission connection with the mechanical arm and is used for driving the mechanical arm to rotate around the axis of the object plate.

[0013] As a preferred technical scheme of the wafer cutting device, the driving member is in transmission connection with the workbench and is used for driving the object plate to rotate around the axis.

[0014] As a preferred technical scheme of the wafer cutting device, the driving member is a motor, is installed on the side of the object plate opposite to the wafer, the output shaft of the driving member is coaxially arranged with the object plate, and the first sensor is insulated from the driving member.

[0015] As a preferred technical scheme of the wafer cutting device, the workbench further comprises an insulating plate, and the output shaft of the driving member is connected with the object plate through the insulating plate.

[0016] As a preferred technical scheme of the wafer cutting device, the driving member is connected with the insulating plate through a flange plate.

[0017] As a preferred technical scheme of the wafer cutting device, the workbench further comprises a base, the base is fixed opposite to the supporting surface, and the driving member is fixed to the base.

[0018] As a preferred technical scheme of the wafer cutting device, vacuum adsorption is formed between the object plate and the wafer.

[0019] As a preferred technical scheme of the wafer cutting device, electrostatic adsorption is formed between the object plate and the wafer.

[0020] As a preferred technical scheme of the wafer cutting device, the object plate is horizontally placed, the guide rail is perpendicular to the object plate, and the mechanical arm is located above the object plate.

[0021] The utility model discloses beneficial effects:

[0022] The utility model provides a kind of wafer cutting device including workbench, mechanical arm and proofreading component. Among them, workbench includes object plate, and object plate is used to carry wafer;Mechanical arm includes guide rail, drive motor, main shaft and cutter, cutter is installed in main shaft, for cutting wafer, guide rail is perpendicular to object plate, main shaft is slidably connected with guide rail, drive motor can drive main shaft to approach or away from object plate along guide rail;Proofreading component includes first sensor and second sensor, first sensor is installed in workbench, second sensor is installed in mechanical arm, when cutter contacts with object plate, first sensor and second sensor are electrically connected to generate electric signal.

[0023] Specifically, when the origin position of the mechanical arm is re-calibrated according to the wear condition of the cutter, the main shaft of the mechanical arm first carries the cutter to move away from the object plate along the guide rail. At this time, the first sensor and the second sensor are not connected and do not generate an electric signal. The drive motor then drives the main shaft to carry the cutter to move towards the object plate until the cutter contacts with the object plate. The first sensor and the second sensor are electrically connected through the cutter and the object plate to generate an electric signal. After obtaining the electric signal, the drive motor stops and the point is calibrated as the origin of the mechanical arm. In the next stage of the working operation on the wafer, the origin is used as a position reference to adjust the movement amount of the cutter relative to the object plate. In this way, whether the cutter contacts with the object plate is determined by the electric signal generated between the first sensor and the second sensor. The degree of automation is high, the reaction is sensitive and the accuracy is high. The origin position of the mechanical arm can be quickly and accurately determined, and the machining precision can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the utility model, the drawings needed to be used in the description of the embodiments of the utility model will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the utility model. Those skilled in the art can obtain other drawings according to the contents of the embodiments of the utility model and these drawings without creating any creative labor.

[0025] Figure 1 is the structure diagram of wafer cutting device in prior art;

[0026] Figure 2 is the structure diagram of wafer cutting device provided by the embodiments of the utility model Figure 1 ;

[0027] Figure 3 is the structure diagram of wafer cutting device provided by the embodiments of the utility model Figure 2 ;

[0028] Figure 4 is the top view of wafer cutting device provided by the embodiments of the utility model.

[0029] Fig.:

[0030] 100, workbench; 110, object plate; 120, insulating plate; 130, flange plate; 140, base; 150, metal plate;

[0031] 200, mechanical arm; 210, guide rail; 220, main shaft; 230, cutter;

[0032] 320, second sensor;

[0033] 400, driving piece;

[0034] 500, gap piece. DETAILED DESCRIPTION

[0035] The utility model will be further explained in detail below in combination with the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the utility model, and not limited to the utility model. In addition, it should be noted that, in order to facilitate the description, only the part related to the utility model is shown in the drawings, not all structures.

[0036] In the description of the utility model, unless otherwise explicitly specified and limited, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated, it can be mechanically connected, or it can be electrically connected, it can be directly connected, or it can be indirectly connected through an intermediate medium, it can be the internal communication of two elements or the interaction relationship of two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0037] In the utility model, unless otherwise explicitly specified and limited, the first feature is "on" or "below" the second feature, which can include that the first and second features are in direct contact, or the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the first feature "on", "above" and "above" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0038] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0039] like Figures 2 to 4 As shown, this utility model provides a wafer dicing device including a worktable 100, a robotic arm 200, and a calibration assembly. The worktable 100 includes a carrier plate 110 for holding wafers. The robotic arm 200 includes a guide rail 210, a drive motor, a spindle 220, and a cutting tool 230. The cutting tool 230 is mounted on the spindle 220 for dicing wafers. The guide rail 210 is perpendicular to the carrier plate 110, and the spindle 220 is slidably connected to the guide rail 210. The drive motor can drive the spindle 220 to move closer to or away from the carrier plate 110 along the guide rail 210. The calibration assembly includes a first sensor and a second sensor 320. The first sensor is mounted on the worktable 100, and the second sensor 320 is mounted on the robotic arm 200. When the cutting tool 230 contacts the carrier plate 110, the first sensor and the second sensor 320 are electrically connected to generate an electrical signal.

[0040] Specifically, when recalibrating the origin position of the robotic arm 200 based on the wear condition of the tool 230, the spindle 220 of the robotic arm 200 first carries the tool 230 along the guide rail 210 away from the carrier plate 110. At this time, the first sensor and the second sensor 320 do not generate electrical signals because they are not connected. The drive motor then drives the spindle 220 to move the tool 230 towards the carrier plate 110 until the tool 230 contacts the carrier plate 110. The first sensor and the second sensor 320 are electrically connected to the carrier plate 110 through the tool 230, generating electrical signals. After acquiring the electrical signals, the drive motor stops and marks this point as the origin of the robotic arm 200. In the next stage of wafer processing, this origin is used as a position reference to adjust the amount of movement of the tool 230 relative to the carrier plate 110. Thus, by judging whether the tool 230 is in contact with the carrier plate 110 through the electrical signal generated between the first sensor and the second sensor 320, the system has a high degree of automation, is highly responsive and accurate, and can quickly and accurately determine the origin position of the robotic arm 200, thereby improving the processing accuracy.

[0041] Optionally, in other embodiments, the wafer dicing apparatus further includes a drive unit 400, which is connected to the robotic arm 200 for driving the robotic arm 200 to rotate around the axis of the carrier plate 110.

[0042] For example, the output shaft of the driving member 400 is coaxially arranged with the axis of the wafer plate 110, and the output shaft of the driving member 400 is connected with the guide rail 210 of the mechanical arm 200 through a connecting member, and the guide rail 210 is radially spaced apart from the output shaft of the driving member 400 to form an eccentric structure.

[0043] In the embodiment, the wafer cutting device further comprises a driving member 400, which is in driving connection with the workbench 100 and used to drive the wafer plate 110 to rotate around the axis. In this way, the degrees of freedom required by the mechanical arm 200 can be reduced, the stability of the cutter 230 during the cutting operation can be maintained, and the machining precision can be improved.

[0044] Optionally, the driving member 400 is a motor, which is installed on the side of the wafer plate 110 away from the wafer, the output shaft of the driving member 400 is coaxially arranged with the wafer plate 110, and the first sensor is insulated from the driving member 400. In this way, the motor-driven structure is simple and easy to maintain, and the insulation between the first sensor and the driving member 400 avoids the electrical connection between them to generate an electrical signal, which causes the relative position between the cutter 230 and the wafer plate 110 to be misjudged.

[0045] Optionally, the workbench 100 further comprises an insulating plate 120, and the output shaft of the driving member 400 is connected with the wafer plate 110 through the insulating plate 120. In this way, the first sensor and the driving member 400 are insulated by the insulating plate 120, which avoids the electrical connection between them to generate an electrical signal, which causes the relative position between the cutter 230 and the wafer plate 110 to be misjudged.

[0046] Further, the workbench 100 comprises a metal plate 150, the first sensor is installed on the metal plate 150, the metal plate 150 is fixed with the wafer plate 110, and located on the side of the insulating plate 120 away from the driving member 400.

[0047] Optionally, the driving member 400 is connected with the insulating plate 120 through a flange 130.

[0048] Exemplarily, the driving member 400, the flange plate 130 and the insulation plate 120 are arranged in sequence in the axial direction of the output shaft of the driving member 400, and the insulation plate 120 and the flange plate 130 are coaxially arranged with the output shaft of the driving member 400. The flange plate 130 is provided with a plurality of first connecting holes around the axis thereof, and the insulation plate 120 is provided with a plurality of second connecting holes around the axis thereof. The flange plate 130 and the insulation plate 120 are connected through threaded fasteners. The threaded fasteners are provided in plurality, and can be simultaneously inserted into the first connecting holes and the second connecting holes. In this way, the plurality of threaded fasteners can share the stress, prolonging the service life of a single threaded fastener. The driving member 400 and the insulation plate 120 are connected through the flange plate 130, which can make the connection between the two reliable and the motion synchronization high, thereby ensuring the precision of the driving member 400 driving the rotation of the object plate 110 and ensuring the processing quality.

[0049] In use, when the driving member 400 drives the object plate 110 to rotate, the centrifugal force generated by the wafer and / or the object plate 110, and the force exerted on the object plate 110 by the cutter 230 during the cutting operation of the wafer by the cutter 230, will cause the object plate 110 to shake with the motor. Although the shaking is slight, it will still affect the processing precision. Therefore, in the embodiment, the workbench 100 further comprises a base 140, which is fixed relative to the support surface, and the driving member 400 is fixed to the base 140. The base 140 is fixedly installed on the support surface, which can be the ground or other supports with relatively large mass and not easy to shake. In this way, the driving member 400 can transmit the force causing the shaking to the base 140. According to Newton's second law, the greater the mass of an object, the less likely its motion state will change, thereby keeping the driving member 400 stable. Optionally, a vacuum adsorption is formed between the object plate 110 and the wafer.

[0050] Exemplarily, the wafer cutting device further comprises a vacuum pump, and the object plate 110 is provided with an adsorption hole comprising an air inlet end and an air outlet end. The wafer can cover the air inlet end of the adsorption hole, and the vacuum pump is in communication with the air outlet end of the adsorption hole to extract the gas in the adsorption hole and reduce the air pressure in the adsorption hole. The atmosphere will fix the wafer against the object plate 110, thereby reducing the need for mechanical clamps.

[0051] Optionally, an electrostatic adsorption is formed between the object plate 110 and the wafer.

[0052] For example, the carrier plate 110 includes an insulating area and a conductive area, the insulating area is provided with an adsorption surface made of insulating material, an electrode and a power supply. The electrode is embedded below the adsorption surface, and the insulating material is used to isolate the electrode and the wafer. By applying voltage to the electrode, an electric field is generated. The electric field passes through the adsorption surface and is induced on the wafer, so that electrostatic attraction is generated between the wafer and the adsorption surface. The free charge on the wafer is attracted to one side of the electric field, thereby generating attraction to the adsorption surface, so that the setting of the mechanical clamp can be reduced.

[0053] Optionally, the carrier plate 110 is horizontally placed, the guide rail 210 is perpendicular to the carrier plate 110, and the mechanical arm 200 is located above the carrier plate 110. In this way, the direction of the gravity of the wafer is consistent with the direction of the pressure of the wafer on the carrier plate 110, so that the wafer can be stably placed on the carrier plate 110.

[0054] In addition, the above is only the preferred embodiment of the present application and the technical principle applied. Those skilled in the art will understand that the present application is not limited to the specific embodiments described herein, and those skilled in the art can make various obvious changes, re-adjustments and substitutions without departing from the scope of the present application. Therefore, although the present application has been described in more detail through the above embodiments, the present application is not limited to the above embodiments, and can include more other equivalent embodiments without departing from the concept of the present application, and the scope of the present application is determined by the scope of the appended claims.

Claims

1. A wafer cutting apparatus characterized by comprising: The utility model relates to a wafer cutting device, including: A workbench (100) including a carrier plate (110) for carrying a wafer; A mechanical arm (200) including a guide rail (210), a driving motor, a spindle (220) and a cutter (230), the cutter (230) is installed to the spindle (220) for cutting the wafer, the guide rail (210) is perpendicular to the carrier plate (110), the spindle (220) is slidably connected with the guide rail (210), and the driving motor can drive the spindle (220) to approach or away from the carrier plate (110) along the guide rail (210); A proofreading assembly including a first sensor and a second sensor (320), the first sensor is installed to the workbench (100), the second sensor (320) is installed to the mechanical arm (200), when the cutter (230) contacts the carrier plate (110), the first sensor and the second sensor (320) are electrically connected to generate an electric signal.

2. The wafer cutting apparatus according to claim 1, wherein Further including a driving member (400) in transmission connection with the mechanical arm (200) for driving the mechanical arm (200) to rotate around the axis of the carrier plate (110).

3. The wafer cutting apparatus according to claim 1, wherein Further including a driving member (400) in transmission connection with the workbench (100) for driving the carrier plate (110) to rotate around the axis.

4. The wafer cutting apparatus according to claim 3, wherein The driving member (400) is a motor installed to the side of the carrier plate (110) opposite to the wafer, the output shaft of the driving member (400) is coaxially arranged with the carrier plate (110), and the first sensor is insulated from the driving member (400).

5. The wafer cutting apparatus according to claim 4, wherein The workbench (100) further includes an insulating plate (120), and the output shaft of the driving member (400) is connected with the carrier plate (110) through the insulating plate (120).

6. The wafer cutting apparatus according to claim 5, wherein The driving member (400) is connected with the insulating plate (120) through a flange (130).

7. The wafer cutting apparatus according to claim 3, wherein The workbench (100) further includes a base (140) fixed opposite to a support surface, and the driving member (400) is fixed to the base (140).

8. The wafer cutting apparatus according to claim 1, wherein Vacuum adsorption is formed between the carrier plate (110) and the wafer.

9. The wafer cutting apparatus according to claim 1, wherein Electrostatic adsorption is formed between the carrier plate (110) and the wafer.

10. The wafer dicing apparatus according to any one of claims 1 to 9, wherein The carrier plate (110) is horizontally placed, the guide rail (210) is perpendicular to the carrier plate (110), and the mechanical arm (200) is located above the carrier plate (110).

Images