Sensor packaging structure and electronic equipment

Abstract

The utility model provides a sensor packaging structure and an electronic device. The sensor packaging structure comprises a substrate, an ASIC chip embedded in the substrate, and an MEMS chip sealed on the substrate through glue. Wherein a welding point is arranged on the substrate, and the MEMS chip is connected and conducted with the substrate through the welding point; plastic packaging glue is arranged on the substrate, and the welding points and the side wall of the MEMS chip are wrapped by the plastic packaging glue. According to the utility model, the product packaging difficulty and the product size can be reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to sensor technical field more specifically, relate to a sensor packaging structure and electronic equipment. BACKGROUND

[0002] With the progress of society and the development of technology, sensor application scene is more and more extensive, and the function requirement of sensor is higher and higher.But, at present, most sensors, for example, the structure of pressure sensor is relatively complex, needs to set up the shell structure on the substrate, and fills the colloid covering chip in the shell structure, not only product overall size is larger, and packaging process is difficult, in the colloid filling process, still can cause the emergence of bubble problem, influence sensor detection quality.

[0003] Therefore, at present, urgently needed a sensor packaging structure can effectively simplify product structure, reduce product size and reduce packaging difficulty under the condition of ensuring detection quality. UTILITY MODEL CONTENT

[0004] In view of above problem, the utility model aims at providing a sensor packaging structure and electronic equipment to solve the problems of complex structure, large size and difficult packaging process of existing sensor packaging, and to prevent bubbles from appearing.

[0005] The sensor packaging structure provided by the utility model comprises a substrate, an ASIC chip embedded in the substrate and a MEMS chip glued on the substrate, wherein a welding point is arranged on the substrate, the MEMS chip is connected and conducted through the welding point and the substrate, and plastic sealing glue is arranged on the substrate, which wraps the welding point and the side wall of the MEMS chip.

[0006] In addition, the optional technical solution is that the MEMS chip comprises a support part and a sensing film arranged on the support part, the sensing film and the support part form a sealed detection cavity, and the plastic sealing glue wraps the support part.

[0007] In addition, the optional technical solution is that a soft glue layer is covered on the side of the sensing film away from the substrate.

[0008] In addition, the optional technical solution is that the input and output end of the MEMS chip is arranged at the bottom of the sealed detection cavity, and the input and output end is connected and conducted with the welding point.

[0009] In addition, the optional technical solution is that the welding point is provided with at least one.

[0010] In addition, the optional technical solution is that the welding point comprises a tin paste point, a silver paste point and a conductive glue point.

[0011] In addition, the cross section of the substrate is circular or rectangular.

[0012] In addition, at least one pad is arranged on the substrate, and the pad is arranged on the bottom surface or the side surface of the substrate.

[0013] In another aspect, the utility model also provides a kind of electronic equipment, including above-mentioned sensor packaging structure.

[0014] Utilize above-mentioned sensor packaging structure and electronic equipment, ASIC chip is buried in substrate inside, and MEMS chip is directly glued on substrate, and the conduction of MEMS chip and substrate and ASIC chip is realized by the welding point on substrate, can be fixed to MEMS chip by plastic encapsulation glue, save shell structure in existing sensor packaging, can reduce material input while reducing product packaging difficulty, reduce the overall height of product, meet the smaller size sensor packaging requirement. BRIEF DESCRIPTION OF DRAWINGS

[0015] Other objects and advantages of the present application can be more fully understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0016] Figure 1 It is a structural schematic view of sensor packaging structure according to the utility model embodiment.

[0017] The reference signs include: substrate 1, ASIC chip 2, plastic encapsulation glue 3, soft glue layer 4, MEMS chip 5, welding point 6, pad 7.

[0018] The same reference numbers in all the drawings indicate similar or corresponding features or functions. DETAILED DESCRIPTION

[0019] In the following description, for the purpose of providing a thorough understanding of one or more embodiments, numerous specific details are set forth. It should be understood, however, that these embodiments can be practiced without these specific details. In other instances, well-known structures and devices are shown in block diagram form in order to facilitate describing one or more embodiments.

[0020] In the description of the utility model, it is understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" is the orientation or positional relationship shown based on the drawings, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the utility model.

[0021] In order to describe the sensor packaging structure of the utility model in detail, the specific embodiments of the utility model will be described in detail below in combination with the drawings.

[0022] Figure 1 The schematic structure of the sensor packaging structure according to the embodiment of the utility model is shown.

[0023] As Figure 1 shown, the sensor packaging structure of the embodiment of the utility model comprises a substrate 1, an ASIC chip 2 embedded in the substrate 1 and a MEMS chip 5 encapsulated on the substrate 1; wherein a welding point 6 is arranged on the substrate 1, the MEMS chip 5 is connected and conducted with the substrate 1 through the welding point 6, a plastic encapsulation glue 3 is arranged on the substrate 1, the plastic encapsulation glue 3 wraps the welding point 6 and at least part of the MEMS chip 5, the arrangement of the plastic encapsulation glue 3 can play the role of the traditional shell, thereby saving the traditional shell structure, which not only can reduce the shell material cost, but also can reduce the overall thickness of the sensor, and realize the sensor packaging structure with smaller size.

[0024] The MEMS chip 5 further comprises a support part and a sensing film arranged on the support part, an inner cavity is arranged in the support part, the sensing film is arranged on the upper end of the support part through the inner cavity, and the sensing film cooperates with the support part to form a sealed detection cavity; wherein, in order to facilitate the connection and conduction between the MEMS chip 5 and the substrate 1, the signal input and output end of the MEMS chip 5 is arranged at the bottom of the sealed detection cavity (close to one side of the substrate 1), and is connected and conducted with the welding point 6, when the sensing film is deformed due to the influence of external pressure and other signals, the air pressure in the sealed detection cavity will change, and the change can be directly transmitted to the substrate 1 through the input and output end, and the change signal is analyzed and processed through the substrate 1 and the ASIC chip 2, thereby realizing the signal detection effect.

[0025] Specifically, to realize the protection of the MEMS chip 5, the plastic sealing glue 3 can be arranged on the outer side of the support part, that is, the plastic sealing glue 3 arranged on the substrate 1 completely wraps the soldering points 6 and the outer side of the support part, forms a glue body structure with the same height as or slightly higher than the support part, and the sensing film directly contacts the external environment and plays a role of signal detection. Further, since the sensing film is relatively weak, while ensuring the detection accuracy of the sensing film, to ensure the performance stability and reliability, a soft glue layer 4 can be arranged on the side of the sensing film away from the substrate 1, and the thickness of the soft glue layer 4 can be flexibly set according to the size of the sensing film and the detection requirement, so that the soft glue layer 4 can play a certain protection role without affecting the detection effect of the sensing film.

[0026] In one specific embodiment of the present application, the soldering points 6 are provided with at least one soldering point, and the soldering points can adopt various structural forms such as solder paste points, silver paste points and conductive glue points, and can realize the connection and conduction of the MEMS chip 5 and the substrate 1. When the plastic sealing glue 3 is used to protect the MEMS chip 5, the plastic sealing glue 3 can be filled in the pores between the soldering points 6, that is, the plastic sealing glue 3 is used to completely wrap the MEMS chip 5 except the soldering points 6 and the sensing film.

[0027] The shape of the plastic sealing glue 3 can be the same as that of the substrate 1, the substrate 1 can adopt a PCBA assembly, the cross-sectional shape of the substrate 1 can be circular, rectangular or square, and the like, when the shape of the plastic sealing glue 3 is the same as that of the substrate 1, the size of the entire sensor packaging structure can be 1*1*0.6mm, the equipment space can be saved, and the demand of more use scenarios can be met.

[0028] In addition, at least one solder pad 7 is arranged on the substrate 1, the solder pad 7 can be distributed on the bottom surface of the substrate 1 (the side away from the MEMS chip 5), can be arranged on the side surface of the substrate 1, or the solder pad structure can be arranged on the bottom surface and the side surface of the substrate 1 at the same time, so as to improve the flexibility of the sensor packaging structure in the installation process, and the electronic equipment can flexibly select the position of the solder pad 7 on the substrate 1 for mounting according to the position and space requirement.

[0029] Corresponding to the above sensor packaging structure, the present application also provides an electronic equipment comprising the above sensor packaging structure. The embodiments of the electronic equipment can refer to the description of the sensor packaging structure, which will not be repeated here.

[0030] It can be known from the above embodiment that the sensor packaging structure and the electronic equipment bury the ASIC chip in the inside of the substrate, simultaneously seal the MEMS chip on the substrate by glue, realize the conduction of the MEMS chip and the substrate and the ASIC chip through the welding points on the substrate, can complete the fixation of the MEMS chip through the plastic sealing glue, save the shell structure in the existing sensor packaging, reduce the product packaging difficulty, wherein when the MEMS chip senses the change of the external air pressure, the state of the sensing film changes with the air pressure, the sensing film can form a capacitor with the sealed detection cavity, the change of the capacitor is output to the ASIC chip, and the ASIC chip sends to the substrate output after processing, the sensor packaging structure can reduce the material input, reduce the overall height of the product, meet the smaller size sensor packaging requirement.

[0031] The sensor packaging structure and the electronic equipment according to the utility model are described above with reference to the drawings in an exemplary manner. However, it should be understood by those skilled in the art that various improvements can be made to the above-mentioned sensor packaging structure and the electronic equipment of the utility model without departing from the content of the utility model. Therefore, the protection scope of the utility model should be determined by the content of the appended claims.

Claims

1. A sensor package structure, characterized by, The sensor packaging structure comprises: a substrate, an ASIC chip embedded in the substrate, and a MEMS chip encapsulated on the substrate; wherein, a soldering point is arranged on the substrate, and the MEMS chip is connected and conducted with the substrate through the soldering point; a plastic encapsulation glue is arranged on the substrate, and the plastic encapsulation glue wraps the soldering point and the sidewall of the MEMS chip.

2. The sensor packaging structure according to claim 1, wherein, the MEMS chip comprises a support part and a sensing film arranged on the support part, and the sensing film and the support part form a sealed detection cavity; the plastic encapsulation glue wraps the support part.

3. The sensor packaging structure according to claim 2, wherein, a soft glue layer is arranged on the side of the sensing film away from the substrate.

4. The sensor packaging structure according to claim 2, wherein, an input and output end of the MEMS chip is arranged at the bottom of the sealed detection cavity; the input and output end is connected and conducted with the soldering point.

5. The sensor packaging structure according to claim 1, wherein, the soldering point is arranged with at least one.

6. The sensor packaging structure according to claim 1, wherein, the soldering point comprises a tin paste point, a silver paste point and a conductive glue point.

7. The sensor packaging structure according to claim 1, wherein, the cross section of the substrate is circular or rectangular.

8. The sensor packaging structure according to claim 1, wherein, at least one pad is arranged on the substrate; the pads are distributed on the bottom surface or the side surface of the substrate.

9. An electronic device, comprising: The sensor packaging structure comprises any one of claims 1 to 8.

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