Liquid cooling structure and heat dissipation system

Abstract

The utility model discloses a liquid cooling structure which comprises a middle frame, a first vapor chamber and a second vapor chamber. The middle frame is provided with a first surface and a second surface which are opposite to each other, a liquid inlet and a liquid outlet are formed in the side wall between the first surface and the second surface, the middle frame is further provided with a flow channel communicated with the liquid inlet and the liquid outlet, and the flow channel penetrates through the first surface and the second surface; the first vapor chamber and the second vapor chamber are connected to the first surface and the second surface in a sealed mode correspondingly so as to seal the flow channel and form a liquid cooling channel for cooling liquid to flow. The first vapor chamber and the second vapor chamber are both used for sealing the flow channel and forming a liquid cooling channel, and both the first vapor chamber and the second vapor chamber can make contact with cooling liquid, so that both the first vapor chamber and the second vapor chamber can be used for dissipating heat of a heat source. Thus, heat dissipation of the two heat sources can be achieved only by arranging one liquid cooling structure between the two adjacent heat sources, the overall thickness cannot be increased, and the heat dissipation efficiency is high. The utility model further discloses a heat dissipation system.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of heat dissipation components, and specifically designs a liquid cooling structure and heat dissipation system. BACKGROUND

[0002] The liquid cooling plate is one of the most widely used heat dissipation components at present, and the existing liquid cooling plate is usually single-sided refrigeration. When applied to the heat dissipation of power batteries, the power batteries usually need to form a battery pack, and in order to improve the heat dissipation capacity, a liquid cooling plate can also be arranged between two adjacent power batteries. However, since the existing liquid cooling plate is single-sided refrigeration, two liquid cooling plates need to be arranged between two adjacent power batteries, resulting in an increase in the thickness of the battery pack. UTILITY MODEL CONTENTS

[0003] The technical problem to be solved by the utility model is that the existing liquid cooling plate is single-sided refrigeration, and in order to solve the above technical problem, a liquid cooling structure and heat dissipation system capable of double-sided heat dissipation are provided.

[0004] The technical scheme provided by the utility model is:

[0005] A liquid cooling structure comprises

[0006] A middle frame has opposite first and second surfaces, a side wall between the first and second surfaces is provided with a liquid inlet and a liquid outlet, the middle frame is also provided with a flow channel communicating with the liquid inlet and the liquid outlet, and the flow channel penetrates the first and second surfaces;

[0007] A first and a second vapor chamber are respectively sealed to the first and second surfaces to seal the flow channel and form a liquid cooling channel for the cooling liquid.

[0008] Further, the flow channel extends in a zigzag manner.

[0009] Further, the liquid cooling structure further comprises two sealing modules, and the two sealing modules are respectively arranged between the first vapor chamber and the middle frame and between the second vapor chamber and the middle frame.

[0010] Further, the first and second surfaces are both provided with a sealing groove, the sealing groove is staggered with the flow channel, and the sealing module is arranged in the sealing groove.

[0011] Further, the sealing module is waterproof glue, the waterproof glue is arranged on the first and second surfaces and is staggered with the flow channel; or

[0012] The sealing module is a rubber ring.

[0013] Further, the liquid cooling structure further comprises a plurality of first locking members and a plurality of second locking members, one end of the plurality of first locking members is arranged in the first vapor chamber and connected to the first surface, and the other end of the plurality of first locking members abuts against the first vapor chamber, one end of the plurality of second locking members is arranged in the second vapor chamber and connected to the second surface, and the other end of the plurality of second locking members abuts against the second vapor chamber.

[0014] Further, the first surface and the second surface are both provided with a solder groove, the solder groove is staggered with the flow channel, and the solder groove is used for accommodating solder capable of forming a solder layer, and the solder layer is used for sealing and connecting the vapor chamber and the middle frame.

[0015] Further, the middle frame and the vapor chamber are connected by diffusion welding or brazing.

[0016] Further, the first vapor chamber and the second vapor chamber are provided with a matching part on the side away from the middle frame, the matching part is used for contacting the heat source and is matched with the heat source.

[0017] A heat dissipation system comprises the liquid cooling structure.

[0018] By using the liquid cooling structure, the first vapor chamber and the second vapor chamber are both used for sealing the flow channel and forming a liquid cooling channel, and the first vapor chamber and the second vapor chamber can both contact the cooling liquid, so that the first vapor chamber and the second vapor chamber can both be used for dissipating heat of the heat source. In this way, only one liquid cooling structure needs to be arranged between two adjacent heat sources to dissipate heat of the two heat sources, and the overall thickness is not increased, and the heat dissipation efficiency is high. BRIEF DESCRIPTION OF DRAWINGS

[0019] The accompanying drawings are included to provide a further understanding of the present application, and constitute a part of the specification, illustrate the present application and explain the principles of the present application, and do not constitute a limitation of the present application.

[0020] Figure 1 FIG. 1 is a structural schematic view of a liquid cooling structure provided by an embodiment of the present application;

[0021] Figure 2 FIG. 2 is a structural schematic view of a liquid cooling structure provided by another embodiment of the present application;

[0022] Figure 3 FIG. 3 is a structural schematic view of a liquid cooling structure provided by another embodiment of the present application.

[0023] Label explanation:

[0024] 100, liquid cooling structure; 110, middle frame; 111, first surface; 112, flow channel; 113, sealing groove; 121, first vapor chamber; 122, second vapor chamber; 131, liquid inlet connector; 132, liquid outlet connector; 140, sealing module; 150, first locking member. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present application will be clearly and completely described in connection with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application.

[0026] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0027] In one aspect, the present application provides a liquid cooling structure capable of double-sided heat dissipation, so as to not increase the distance between heat sources and the overall thickness while simultaneously dissipating heat from two adjacent heat sources. The heat sources can be power batteries, and the overall structure can be a battery pack or a battery pack, etc., which is not limited here.

[0028] As shown in FIG. 1, the liquid cooling structure 100 includes a middle frame 110, a first vapor chamber 121, and a second vapor chamber 122. Figure 1

[0029] The middle frame 110 has opposite first and second surfaces, and a side wall between the first and second surfaces is provided with a liquid inlet and a liquid outlet. The middle frame 110 is also provided with a flow channel 112 that communicates with the liquid inlet and the liquid outlet, and the flow channel 112 penetrates the first and second surfaces.

[0030] The first and second vapor chambers 121 and 122 are respectively sealed and connected to the first and second surfaces to seal the flow channel 112 and form a liquid cooling channel for the cooling liquid to flow.

[0031] ​With the liquid cooling structure, the first and second vapor chambers 121 and 122 are used to seal the flow channel 112 and form the liquid cooling passage, and the first and second vapor chambers 121 and 122 can be in contact with the cooling liquid, so that the first and second vapor chambers 121 and 122 can be used to dissipate heat of the heat sources. In this way, only one liquid cooling structure needs to be arranged between two adjacent heat sources to dissipate heat of the two heat sources, without increasing the overall thickness, and the heat dissipation efficiency is high.

[0032] It should be noted that, in order to improve the heat dissipation effect, the vapor chamber can be made of a high-thermal-conductivity material based on the principle of phase change heat transfer, such as copper-based, aluminum-based, stainless steel-based, or alloy material. At the same time, the middle frame 110 is preferably made of the same material as the vapor chamber. Of course, the middle frame 110 can also be made of another material different from the vapor chamber among the copper-based, aluminum-based, stainless steel-based, and alloy materials, which is not limited here.

[0033] In one embodiment, the liquid cooling structure further comprises an inlet joint 131 and an outlet joint 132, the inlet joint 131 is connected to the inlet of the middle frame 110, and the outlet joint 132 is connected to the outlet of the middle frame 110. Preferably, the inlet and the outlet are provided with internal threads, and the inlet joint 131 and the outlet joint 132 are respectively screwed with the inlet and the outlet. Of course, in other embodiments, the inlet joint 131 and the outlet joint 132 can be connected to the inlet and the outlet by welding or gluing.

[0034] Specifically Figure 1 In the embodiment shown, the inlet and the outlet are located on the same side wall of the middle frame 110 to facilitate disassembly of the inlet joint 131 and the outlet joint 132 and connection of the cooling pipeline. Of course, the positions of the inlet and the outlet can also be arranged according to actual conditions, for example, on different side walls to facilitate connection of the cooling pipeline. The cooling pipeline is used to input the cooling liquid into the liquid cooling passage.

[0035] In one embodiment, the flow channel 112 extends in a zigzag manner to extend the flow path of the cooling liquid and increase the cooling area. Specifically Figure 2 In the embodiment shown, the flow channel 112 includes a plurality of straight channels arranged at intervals and arc-shaped passages connecting adjacent two straight channels, and the two arc-shaped passages connected with the same straight channel are located at both ends thereof and on both sides of the straight channel. Of course, in other embodiments, the flow channel 112 can also have other shapes, for example, including a plurality of straight channels, and the included angle between any two connected straight channels is 90°, as shown in Figure 1

[0036] ​In one embodiment, the liquid cooling structure further comprises two sealing modules 140, which are respectively arranged between the first vapor chamber 121 and the middle frame 110 and between the second vapor chamber 122 and the middle frame 110 to ensure the sealing between the vapor chambers and the middle frame 110.

[0037] In one embodiment, the first surface 111 and the second surface are both provided with sealing grooves 113, which are staggered with the flow channels 112, and the sealing modules 140 are arranged in the sealing grooves 113. As can be understood, the sealing modules 140 are used to ensure the sealing between the vapor chambers and the middle frame 110 to seal the flow channels 112, so the first surface 111 and the second surface are both provided with the sealing grooves 113 except the flow channels 112, as shown in FIG. 2. Figure 2 Figure 2 As shown in the embodiment shown in FIG. 3, the sealing modules 140 are rubber rings.

[0038] As shown in FIG. 4, in another embodiment, the sealing modules 140 can also be waterproof glue, which is arranged on the first surface 111 and the second surface and staggered with the flow channels 112. In this embodiment, the first surface 111 and the second surface do not need to be provided with the sealing grooves 113, and the waterproof glue is directly applied on the first surface 111 and the second surface, then the vapor chambers and the middle frame 110 are connected, and then the waterproof glue is cured. Of course, the waterproof glue can be accelerated to cure in a high-temperature environment. Figure 3

[0039] It should be explained that the sealing modules 140 are used to seal the middle frame 110 and the vapor chambers, which have the same effect, so the same reference numerals are used. In addition, the sealing grooves 113 described above can also be arranged on the vapor chambers.

[0040] In one embodiment, the liquid cooling structure further comprises a plurality of first locking members 150 and a plurality of second locking members. One end of the first locking members 150 is arranged in the first vapor chamber 121 and connected to the first surface 111, and the other end abuts against the first vapor chamber 121 to lock and fix the first vapor chamber 121 to the first surface 111. One end of the second locking members is arranged in the second vapor chamber 122 and connected to the second surface, and the other end abuts against the second vapor chamber 122 to lock and fix the second vapor chamber 122 to the second surface. Optionally, the locking members are bolts or rivets, etc. At the same time, when the locking members are bolts, the first surface 111 and the second surface are both provided with threaded holes.

[0041] ​​In another embodiment, the first surface 111 and the second surface are both provided with solder grooves, the solder grooves are staggered with the flow channel 112, and are used to accommodate solder capable of forming a solder layer for sealing and connecting the vapor chamber and the middle frame 110. Similarly, it can be understood that the solder grooves are also provided in other areas of the first surface 111 and the second surface except the flow channel 112. In this embodiment, after the solder is placed in the solder groove, the solder layer can be formed by sintering. Alternatively, the solder contains brazing filler metal.

[0042] In yet another embodiment, the connection between the vapor chamber and the middle frame 110 can also be achieved by diffusion welding, that is, the middle frame 110 and the vapor chamber are fixed and placed in a graphite mold, and then placed in a diffusion welding furnace for sintering to achieve the connection between the middle frame 110 and the vapor chamber.

[0043] It can be understood that, in addition to the above connection methods, the middle frame 110 and the vapor chamber can also be connected in other ways capable of achieving sealed connection, such as placing brazing filler metal in the gap between the middle frame 110 and the vapor chamber without providing a solder groove, and achieving the connection between the middle frame 110 and the vapor chamber by brazing, which is not limited herein. In addition, the solder groove described above can also be provided in the vapor chamber.

[0044] In one embodiment, the side of the vapor chamber away from the middle frame 110 is provided with a matching part, which is used to contact and match the heat source. It should be explained that the part of the heat source in contact with the vapor chamber has certain characteristics, and the matching part is matched with the characteristics of the part, for example, the matching part can be a boss or a groove matched with the heat source.

[0045] On the other hand, the application also provides a heat dissipation system, which comprises the liquid cooling structure in the above embodiments. Of course, it can be determined that the heat dissipation system also comprises a liquid supply mechanism for providing cooling liquid, and the liquid supply mechanism is connected with the liquid inlet connector 131 and the liquid outlet connector 132 to make the cooling liquid circulate in the liquid cooling channel.

[0046] In summary, the liquid cooling structure 100 and the heat dissipation system provided by the application have at least the following advantages:

[0047] 1. It can dissipate heat from two adjacent heat sources at the same time, thereby reducing the distance between the two heat sources and not increasing the overall thickness;

[0048] 2. The vapor chamber is directly in contact with the cooling liquid, and the heat exchange efficiency is high, thereby improving the cooling efficiency;

[0049] 3. The structure is simple and the cost is low.

[0050] While embodiments of the application have been shown and described, it is to be understood that the embodiments described are merely exemplary and that changes can be made in detail without departing from the principles and spirit of the application. The scope of the application is therefore defined by the appended claims and their equivalents.

Claims

1. A liquid cooling structure characterized by, The liquid cooling structure comprises a middle frame, a first vapor chamber and a second vapor chamber. The middle frame has opposite first and second surfaces, and a side wall between the first and second surfaces is provided with a liquid inlet and a liquid outlet. The middle frame is further provided with a flow channel communicating with the liquid inlet and the liquid outlet, and the flow channel penetrates the first and second surfaces.

2. The liquid cooling structure according to claim 1, characterized by, The first and second vapor chambers are respectively sealed to the first and second surfaces to seal the flow channel and form a liquid cooling passage for cooling liquid.

3. The liquid cooling structure according to claim 1, characterized by, The flow channel extends in a zigzag manner.

4. The liquid cooling structure according to claim 3, characterized by The liquid cooling structure further comprises two sealing modules, which are respectively arranged between the first vapor chamber and the middle frame and between the second vapor chamber and the middle frame.

5. The liquid cooling structure according to claim 3, characterized by The first and second surfaces are both provided with a sealing groove, and the sealing groove is staggered with the flow channel. The sealing module is waterproof glue, which is arranged on the first and second surfaces and is staggered with the flow channel.

6. The liquid cooling structure according to claim 1, characterized by The sealing module is a rubber ring.

7. The liquid cooling structure according to claim 1, characterized by The liquid cooling structure further comprises a plurality of first locking members and a plurality of second locking members.

8. The liquid cooling structure of claim 1, wherein, The first and second surfaces are both provided with a solder groove, which is staggered with the flow channel and is used for accommodating solder capable of forming a solder layer.

9. The liquid cooling structure of claim 1, wherein, The solder layer is used for sealing the vapor chamber and the middle frame.

10. A heat dissipation system characterized by, The middle frame and the vapor chamber are connected by diffusion welding or soldering. The first and second vapor chambers are provided with a matching part on the side away from the middle frame, which is used for contacting and matching with a heat source. The liquid cooling structure comprises any one of claims 1-9. The liquid cooling structure comprises any one of claims 1-9.

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