Power drive heat dissipation constant-temperature piece

Abstract

The utility model discloses a power-driven heat dissipation constant-temperature part, and belongs to the technical field of heat dissipation and constant temperature. The power drive heat dissipation constant temperature part comprises a fixed frame, a sealing frame is fixedly connected to the upper end face of the fixed frame, a mounting plate is fixedly connected to the upper portion in the sealing frame, a pair of fan sets are fixedly inserted into the mounting plate, a movable frame is arranged below the fixed frame, and a grid plate is fixedly connected into the movable frame. A constant-temperature heat dissipation assembly is arranged in the sealing frame, in the heat dissipation link, the refrigeration face at the lower end of the semiconductor refrigeration sheet slowly cools the power supply through a thermal insulation film, and the situation that the performance of the power supply is affected by temperature shock is avoided; heat generated by the heating face at the upper end is transmitted through the heat conduction plate and the heat absorption strips and exhausted through air draft of the fan set, impurities are filtered out through the filter screen plate, good heat dissipation circulation is guaranteed, the power source is kept at the constant temperature all the time, stable operation of the power source is guaranteed, and the service life is prolonged.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of heat-dissipation thermostats, in particular to a power supply driving heat-dissipation thermostat. BACKGROUND

[0002] The power supply driving heat-dissipation thermostat is a functional component for a power supply driving system, which can quickly dissipate the heat generated by the power supply driving module through the heat-dissipation fins, and the fan can accelerate the air flow to enhance the heat-dissipation effect, so as to ensure that the power supply driving works stably in a suitable temperature range, prevent performance degradation, service life shortening and even failure caused by overheating, and guarantee the reliability and stability of the whole system.

[0003] In the installation of the traditional power supply driving heat-dissipation thermostat, the power supply support structure is simple, and the wires are in disorder, which is easy to be entangled and short-circuited, and the installation process is time-consuming and laborious, lacks efficient fixing means and is easy to damage the power supply shell. In terms of heat dissipation, the power supply temperature is easy to change suddenly during refrigeration, and the heat generated during heating is difficult to discharge in time, which is easy to cause performance degradation, frequent failure and significant shortening of service life of the power supply due to overheating.

[0004] In view of this, the application provides a power supply driving heat-dissipation thermostat. CONTENT OF THE INVENTION

[0005] The application aims to provide a power supply driving heat-dissipation thermostat, which solves the technical problems in the background art.

[0006] The technical scheme of the application provides a power supply driving heat-dissipation thermostat, which comprises a fixed frame, the upper end face of the fixed frame is fixedly connected with a sealing frame, the upper part of the inside of the sealing frame is fixedly connected with a mounting plate, the inside of the mounting plate is fixedly inserted with a pair of fan groups, the lower part of the fixed frame is provided with a movable frame, the inside of the movable frame is fixedly connected with a grid plate, and the inside of the sealing frame is provided with a thermostat heat-dissipation assembly.

[0007] The thermostat heat-dissipation assembly comprises a semiconductor refrigeration fin fixedly connected to the inside of the fixed frame, the lower end face of the semiconductor refrigeration fin is a refrigeration face, the upper end face of the semiconductor refrigeration fin is a heating face, the upper end face of the semiconductor refrigeration fin is fixedly connected with a heat-conducting plate, the upper end face of the heat-conducting plate is fixedly connected with a plurality of heat-absorbing strips, and the lower end face of the semiconductor refrigeration fin is fixedly connected with a temperature insulation rubber sheet, and the temperature insulation rubber sheet extends out of the fixed frame.

[0008] Optionally, the outer wall of the semiconductor refrigeration fin is fixedly connected with a mounting frame, and the mounting frame is fixedly connected with the fixed frame.

[0009] Optionally, the four corners of the outer wall of the fixed frame are fixedly connected with extension blocks, and the four corners of the upper end face of the movable frame are fixedly connected with supporting rods.

[0010] Optionally, the outer wall of the support rod is provided with a winding groove, and the upper end surface of the support rod is fixedly connected with a threaded head.

[0011] Optionally, the threaded head penetrates an extension block, and the outer wall of the threaded head is rotationally connected with a threaded sleeve through threads.

[0012] Optionally, the outer wall of the sealing frame is symmetrically provided with a heat dissipation opening, and the inner portion of the heat dissipation opening is fixedly connected with a filter screen plate.

[0013] One or more technical solutions provided in the technical scheme have at least the following technical effects or advantages:

[0014] In the installation aspect, the grid plate on the moving frame not only provides stable support for the power supply, but also facilitates air circulation, and cooperates with the winding groove on the support rod to effectively arrange the wires and avoid disorder. The threaded head, the threaded sleeve and the extension block are used to realize quick installation and fixation, and the temperature insulation film serves as a cold quantity transmission medium and prevents damage to the power supply shell. In the heat dissipation link, the lower refrigeration surface of the semiconductor refrigeration piece slowly cools the power supply through the temperature insulation film, avoiding the influence of sudden temperature change on the performance of the power supply; the heat generated by the upper heating surface is transmitted through the heat conduction plate and the heat absorption strip, and is discharged by the fan group, and the filter screen plate filters impurities, ensuring good heat dissipation circulation, so that the power supply always maintains a constant temperature, ensuring stable operation of the power supply and prolonging the service life. BRIEF DESCRIPTION OF DRAWINGS

[0015] Fig. 1 The overall structure diagram of the power supply driving heat dissipation constant temperature piece disclosed in the embodiment of the application is disclosed.

[0016] Fig. 2 The structure expansion diagram of the power supply driving heat dissipation constant temperature piece disclosed in the embodiment of the application is disclosed.

[0017] Fig. 3 The partial sectional view of the power supply driving heat dissipation constant temperature piece disclosed in the embodiment of the application is disclosed.

[0018] Explanation of reference numerals in the drawing: 1, fixed frame; 2, sealing frame; 3, mounting plate; 4, fan group; 5, moving frame; 6, grid plate; 7, support rod; 8, winding groove; 9, threaded head; 10, threaded sleeve; 11, extension block; 12, heat dissipation opening; 13, filter screen plate; 14, constant temperature heat dissipation assembly; 1401, semiconductor refrigeration piece; 1402, heat conduction plate; 1403, heat absorption strip; 1404, mounting frame; 1405, temperature insulation film. DETAILED DESCRIPTION

[0019] The application will be further described in detail below in combination with the drawings of the specification.

[0020] Reference Figs. 1-3The embodiment of the application provides a power supply driving heat dissipation constant temperature piece, which comprises a fixed frame 1, the upper end surface of the fixed frame 1 is fixedly connected with a sealing frame 2, and staff can easily place the power supply in the grid plate 6 of the moving frame 5; the grid plate 6 provides stable support, and the grid design helps air circulation, thereby creating conditions for subsequent heat dissipation.

[0021] The upper part of the sealing frame 2 is fixedly connected with a mounting plate 3, a pair of fan groups 4 are fixedly inserted into the mounting plate 3, the lower part of the fixed frame 1 is provided with a moving frame 5, the inside of the moving frame 5 is fixedly connected with a grid plate 6, the inside of the sealing frame 2 is provided with a constant temperature heat dissipation assembly 14, the constant temperature heat dissipation assembly 14 comprises a semiconductor refrigeration sheet 1401 fixedly connected to the inside of the fixed frame 1, the lower end surface of the semiconductor refrigeration sheet 1401 is a refrigeration surface, the upper end surface of the semiconductor refrigeration sheet 1401 is a heating surface, the upper end surface of the semiconductor refrigeration sheet 1401 is fixedly connected with a heat conduction plate 1402, the upper end surface of the heat conduction plate 1402 is fixedly connected with a plurality of heat absorption strips 1403, the lower end surface of the semiconductor refrigeration sheet 1401 is fixedly connected with a temperature insulation rubber sheet 1405, and the temperature insulation rubber sheet 1405 extends out of the fixed frame 1; the lower end refrigeration surface of the semiconductor refrigeration sheet 1401 slowly cools the power supply through the temperature insulation rubber sheet 1405, so that the performance of the power supply is not affected by sudden temperature changes; the heat generated by the upper end heating surface is transmitted through the heat conduction plate 1402 and the heat absorption strips 1403, and is exhausted by the fan group 4.

[0022] The four corners of the outer wall of the fixed frame 1 are fixedly connected with extension blocks 11, the four corners of the upper end surface of the moving frame 5 are fixedly connected with support rods 7, and winding grooves 8 are formed in the outer wall of the support rods 7; the winding grooves 8 on the support rods 7 can effectively arrange long electric wires, avoid messy winding of the electric wires, and reduce safety hazards and interference to normal operation of the power supply caused by the messy electric wires.

[0023] The upper end surface of the support rod 7 is fixedly connected with a threaded head 9, the threaded head 9 penetrates the extension block 11, and the outer wall of the threaded head 9 is rotationally connected with a threaded sleeve 10 through threads; the threaded head 9 of the support rod 7 on the moving frame 5 is inserted into the extension block 11 on the fixed frame 1, and the threaded sleeve 10 is used for fastening, so that the power supply is quickly installed and fixed. The installation mode is simple to operate, can ensure the firmness of the power supply installation, and the temperature insulation rubber sheet 1405 serves as a cold quantity transmission medium and prevents damage to the power supply shell.

[0024] The outer wall of the semiconductor refrigeration sheet 1401 is fixedly connected with a mounting frame 1404, and the mounting frame 1404 is fixedly connected with the fixed frame 1. The outer wall of the sealing frame 2 is symmetrically provided with heat dissipation openings 12. The heat dissipation openings 12 are fixedly connected with filter screen plates 13. The plurality of heat absorption strips 1403 rapidly release the heat absorbed. At this time, the fan group 4 is started to draw air. The air enters the fixed frame 1 through the filter screen plates 13. The filter screen plates 13 can filter the dust and impurities in the air, prevent the dust and impurities from entering the fixed frame 1 and adhering to the power supply or other components, and affect the heat dissipation effect and the normal operation of the equipment. The air entering the fixed frame 1 carries out the heat released by the heat absorption strips 1403 under the action of the fan group 4, forms a good heat dissipation circulation, greatly improves the heat dissipation efficiency, ensures that the semiconductor refrigeration sheet 1401 continuously cools the power supply, and makes the power supply always in a constant temperature state, thereby maintaining the best working performance of the power supply.

[0025] Working principle: when the power supply needs to be installed with a heat dissipation constant temperature device, the worker first puts the power supply into the grid plate 6 on the movable frame 5, winds the longer wire into the winding groove 8 on the supporting rod 7, inserts the threaded heads 9 of the plurality of supporting rods 7 on the movable frame 5 into the extension blocks 11 on the fixed frame 1 and passes through the extension blocks 11 until the temperature insulation film 1405 on the fixed frame 1 contacts the power supply. The worker rotates and installs a plurality of threaded sleeves 10 on the threaded heads 9 until the temperature insulation film 1405 clamps the power supply and the grid plate 6.

[0026] When heat dissipation is needed, the plurality of fan groups 4 in the semiconductor refrigeration sheet 1401 and the fixed frame 1 are started at the same time. The semiconductor refrigeration sheet 1401 works. The refrigeration surface at the lower end of the semiconductor refrigeration sheet 1401 refrigerates, and the cold energy is transmitted to the power supply through the temperature insulation film 1405, thereby cooling the power supply. The temperature insulation film 1405 plays a role in slowly transmitting the cold energy to the power supply, so that the temperature of the power supply can gradually and slowly decrease, preventing the temperature of the power supply from suddenly and greatly decreasing, affecting the use effect of the power supply, and causing a fault phenomenon. The heating surface at the upper end of the semiconductor refrigeration sheet 1401 releases heat. The heat conduction plate 1402 bonded with the heating surface conducts heat to the plurality of heat absorption strips 1403. The plurality of heat absorption strips 1403 absorb heat and release heat. The plurality of fan groups 4 draw air, so that the air enters the fixed frame 1 through the filter screen plates 13, is drawn out by the fan group 4, and simultaneously transmits the heat out of the fixed frame 1, thereby achieving a good heat dissipation effect. The semiconductor refrigeration sheet 1401 continuously cools the power supply, so that the power supply can always be in a constant temperature state.

[0027] The above is only a preferred specific implementation manner of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered in the protection scope of the present application.

Claims

1. A power-driven heat-dissipating thermostat comprising a fixed frame (1), characterized in that: The upper end surface of the fixed frame (1) is fixedly connected with a sealing frame (2), the upper part of the inside of the sealing frame (2) is fixedly connected with a mounting plate (3), the inside of the mounting plate (3) is fixedly inserted with a pair of fan groups (4), the lower part of the fixed frame (1) is provided with a moving frame (5), the inside of the moving frame (5) is fixedly connected with a grid plate (6), and the inside of the sealing frame (2) is provided with a constant-temperature heat dissipation assembly (14). The constant-temperature heat dissipation assembly (14) comprises a semiconductor refrigeration sheet (1401) fixedly connected to the inside of the fixed frame (1), the lower end surface of the semiconductor refrigeration sheet (1401) is a refrigeration surface, the upper end surface of the semiconductor refrigeration sheet (1401) is a heating surface, the upper end surface of the semiconductor refrigeration sheet (1401) is fixedly connected with a heat conduction plate (1402), the upper end surface of the heat conduction plate (1402) is fixedly connected with a plurality of heat absorption strips (1403), the lower end surface of the semiconductor refrigeration sheet (1401) is fixedly connected with a temperature insulation rubber sheet (1405), and the temperature insulation rubber sheet (1405) extends out of the fixed frame (1).

2. The power-driven heat-dissipating thermostat according to claim 1, wherein: The outer wall of the semiconductor refrigeration sheet (1401) is fixedly connected with a mounting frame (1404), and the mounting frame (1404) is fixedly connected with the fixed frame (1).

3. The power-driven heat-dissipating thermostat according to claim 1, wherein: The four corners of the outer wall of the fixed frame (1) are fixedly connected with extension blocks (11), and the four corners of the upper end surface of the moving frame (5) are fixedly connected with support rods (7).

4. The power-driven heat-dissipating thermostat according to claim 3, wherein: The outer wall of the support rod (7) is provided with a winding groove (8), and the upper end surface of the support rod (7) is fixedly connected with a threaded head (9).

5. The power-driven heat-dissipating thermostat according to claim 4, wherein: The threaded head (9) penetrates the extension block (11), and the outer wall of the threaded head (9) is rotatably connected with a threaded sleeve (10) through threads.

6. The power-driven heat-dissipating thermostat according to claim 1, wherein: The outer wall of the sealing frame (2) is symmetrically provided with heat dissipation openings (12), and the inside of the heat dissipation openings (12) is fixedly connected with filter screen plates (13).

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