LED light source

Abstract

The utility model relates to the technical field of semiconductor light emitting, and discloses an LED light source. The LED light source comprises a substrate, an LED light-emitting chip, a light-transmitting glue layer and a fluorescent glue layer. The LED light-emitting chip is arranged on the substrate. The light-transmitting glue layer covers the front face and the side face of the LED light-emitting chip. A reflecting surface is arranged on the side surface of the light-transmitting glue layer. The fluorescent glue layer at least covers the upper surface of the light-transmitting glue layer. The manufacturing method is simple, five light-emitting surfaces can be converted into one light-emitting surface, and the light energy utilization rate is greatly improved. Due to the arrangement of the double light-transmitting adhesive layers, the thickness difference of supplied materials can be made up, edge yellowing is effectively avoided, and the product quality is stable; manufacturing errors can be made up, and the yield is greatly improved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of semiconductor light emission, specifically relates to a LED light source. BACKGROUND

[0002] At present, the CSP package mainly has two package forms of five-face light emission and single-face light emission on the market, and the existing RGB single-color five-face light emission flip chip is used for realizing single-face emission of white light, and the prior art usually has two methods:

[0003] Prior art one: the fluorescent adhesive layer 5 covers the front surface and the four peripheral sides of the LED light emitting chip 2, the four peripheral sides of the fluorescent adhesive layer 5 are arranged as vertical planes, referring to Figure 7 The light emitted by the side surface of the light emitting chip 2 is reflected to the side surface of the light emitting chip 2 after being incident to the vertical plane of the fluorescent adhesive layer 5. The emitted light of the side surface propagates between the side surface of the fluorescent adhesive layer 5 and the side surface of the light emitting chip 2, and the light is absorbed by the material after several times of back and forth, so that the light energy of the side surface of the light emitting chip 2 is less to reach the front surface, the light energy utilization rate is low, and the light emission brightness is low. At the same time, the edge light emitted from the front surface is prone to yellowing phenomenon around due to excessive excitation of fluorescent powder, and the color consistency of the light spot is poor.

[0004] Prior art two: the fluorescent adhesive layer 5 covers the front surface of the LED light emitting chip 2, and the high-reflection adhesive layer 6 covers the fluorescent adhesive layer 5 and the four peripheral sides of the LED light emitting chip 2, referring to Figure 8 The light of the four peripheral sides of the fluorescent adhesive layer 5 and the LED light emitting chip 2 is absorbed by the high-reflection adhesive layer 6, so that only the front surface emits light, and since the light of the four peripheral sides of the LED light emitting chip 2 is not utilized, the brightness of the prior art two is lower than that of the prior art one.

[0005] Based on the above, the problems to be solved at present are to provide a LED light source with front surface light emission, high light energy utilization rate and high light spot quality, and a method for manufacturing the LED light source. INVENTION CONTENTS

[0006] The utility model aims at providing a LED light source, and aims at solving the problems of complex manufacturing method, low production efficiency, low light energy utilization rate, low light emission brightness and unstable light spot quality of the LED light source in the prior art.

[0007] The utility model is realized in this way, a manufacturing method of a LED light source, comprising the following steps:

[0008] Step S1, point the light-transmitting adhesive on the carrier plate; invert the LED light emitting chip, so that the light emitting surface of the front surface of the LED light emitting chip faces the light-transmitting adhesive, and press the LED light emitting chip to the light-transmitting adhesive of the carrier plate;

[0009] Step S2, after curing, the carrier plate is removed, the LED light emitting chip is upright, and the transparent adhesive layer covers the front surface and the four peripheral side surfaces of the LED light emitting chip;

[0010] Step S3, the non-light emitting surface of the LED light emitting chip is fixed on the substrate;

[0011] Step S4, the fluorescent adhesive is pressed on the light emitting surface of the front surface of the LED light emitting chip; after curing, the fluorescent adhesive layer covers the transparent adhesive layer.

[0012] Further, step S4 further comprises step S5, the high-reflective adhesive is point-injected or molded around the transparent adhesive layer, so that the high-reflective adhesive layer covers the four peripheral side surfaces of the transparent adhesive layer.

[0013] Further, in step S2, the four peripheral side surfaces of the transparent adhesive layer form a reflection surface in the shape of an inverted cone.

[0014] Further, in step S2, the upper surface of the transparent adhesive layer is a plane or a curved surface.

[0015] Further, in step S4, the upper surface of the fluorescent adhesive layer is a plane or a curved surface.

[0016] An LED light source is manufactured by the manufacturing method of the present application, comprising:

[0017] a substrate;

[0018] an LED light emitting chip arranged on the substrate;

[0019] a transparent adhesive layer covering the front surface and the side surface of the LED light emitting chip, and the side surface of the transparent adhesive layer is provided with a reflection surface;

[0020] a fluorescent adhesive layer covering at least the upper surface of the transparent adhesive layer.

[0021] Further, the thickness of the transparent adhesive layer is less than or equal to 20 microns.

[0022] Further, the four peripheral side surfaces of the transparent adhesive layer are surrounded by a high-reflective adhesive layer.

[0023] Further, the reflection surface is a plane or a curved surface in the shape of an inverted cone.

[0024] Further, the upper surface of the transparent adhesive layer is a plane or a curved surface.

[0025] Further, the upper surface of the fluorescent adhesive layer is a plane or a curved surface.

[0026] Compared with the prior art, the manufacturing method of the LED light source and the LED light source of the present application have the following beneficial effects:

[0027] The LED light source is characterized in that: the LED light source comprises a carrier plate 1, a LED light emitting chip 2, a light-transmitting glue layer 3, a base plate 4, a fluorescent glue layer 5 and a high-reflection glue layer 6.

[0028] The double-layer light-transmitting glue layer of the light-transmitting glue layer 3 and the fluorescent glue layer 5 is characterized in that: 1, the light-transmitting glue layer 3 can compensate for the thickness difference of the LED light emitting chip 2, so that the thickness of the fluorescent glue layer 5 pressed on the light-transmitting glue layer 3 is uniform, the edge yellowing is avoided, the light-emitting color is uniform, and the product quality is stable; 2, when the preset thickness of the light-transmitting glue layer 3 is thin, the manufacturing error is large, and the thickness of the fluorescent glue layer 5 can compensate for the manufacturing error, thereby greatly improving the yield. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 is a schematic diagram of the implementation process of step S1 of the manufacturing method of the LED light source provided by the utility model;

[0030] Figure 2 is a schematic diagram of the state after step S1 of the manufacturing method of the LED light source provided by the utility model is implemented;

[0031] Figure 3 is a schematic diagram of the state after step S2 of the manufacturing method of the LED light source provided by the utility model is implemented;

[0032] Figure 4 is a schematic diagram of the state after step S3 of the manufacturing method of the LED light source provided by the utility model is implemented;

[0033] Figure 5 is a schematic diagram of the state after step S4 of the manufacturing method of the LED light source provided by the utility model is implemented;

[0034] Figure 6 is a schematic diagram of the state after step S5 of the manufacturing method of the LED light source provided by the utility model is implemented;

[0035] Figure 7 is a schematic diagram of the cross-sectional structure of the LED light source of the prior art 1;

[0036] Figure 8 is a schematic diagram of the cross-sectional structure of the LED light source of the prior art 2;

[0037] In the drawing: 1-carrier plate; 2-LED light emitting chip; 3-light-transmitting glue layer; 31-reflective surface; 4-base plate; 5-fluorescent glue layer; 6-high-reflection glue layer. DETAILED DESCRIPTION

[0038] In order to make the purpose, technical scheme and advantages of the utility model clearer and more apparent, the utility model will be described in further detail below in combination with the drawings and examples. It should be understood that the specific examples described herein are only used to explain the utility model and not to limit the utility model.

[0039] The implementation of the utility model will be described in detail below in combination with specific examples.

[0040] In the drawings of the present embodiment, the same or similar reference numerals correspond to the same or similar components; in the description of the utility model, it should be understood that if the orientations or positional relationships indicated by the terms "upper", "lower", "left", "right" and the like are based on the orientations or positional relationships shown in the drawings, they are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore the terms describing the positional relationships in the drawings are only used for exemplary illustration and cannot be understood as limiting the present patent, for those skilled in the art, the specific meanings of the above terms can be understood according to the specific circumstances.

[0041] Referring to Figures 1-6 The preferred embodiment provided by the utility model is shown in the drawings.

[0042] The method for manufacturing the LED light source comprises the following steps:

[0043] Step S1, the carrier plate 1 is placed horizontally, and the transparent adhesive is dotted on the carrier plate 1 for forming a transparent adhesive layer, referring to Figures 1-2 The LED light emitting chip 2 emits light from five surfaces, i.e. the front surface and the four peripheral surfaces. The LED light emitting chip 2 is inverted, so that the light emitting surface of the front surface of the LED light emitting chip 2 faces the transparent adhesive, and the LED light emitting chip 2 is pressed to the transparent adhesive of the carrier plate 1. The transparent adhesive covers the front surface and the four peripheral surfaces of the LED light emitting chip 2, i.e. covers the five light emitting surfaces, through the extrusion of the LED light emitting chip 2 and the carrier plate 1.

[0044] Step S2, after curing, the carrier plate 1 is removed. The LED light emitting chip 2 is placed upright, referring to Figure 3 , the transparent adhesive layer 3 covers the front surface and the four peripheral surfaces of the LED light emitting chip 2.

[0045] Step S3, die bonding. The bottom surface (non-light emitting surface away from the front surface) of the LED light emitting chip 2 is fixed to the substrate 4, referring to Figure 4 .

[0046] Step S4, the fluorescent adhesive is pressed to the transparent adhesive layer 3 by using the mold pressing or the like. After curing, the fluorescent adhesive layer 5 covers at least the upper surface of the transparent adhesive layer 3, referring to Figure 5 The wavelength conversion particles and the diffusion particles or the like can be arranged in the fluorescent adhesive layer 5.

[0047] Step S1, S2 form light transmission glue layer 3, adopt the inverted LED light emitting chip 2, press the light transmission glue to the LED light emitting chip 2 and carrier plate 1 between, solidify after the mode of the right LED light emitting chip 2. Light transmission glue covers the front and four sides of LED light emitting chip 2 under the action of extrusion pressure, and naturally forms reflecting surface 31. Reflecting surface 31 can reflect the incident light of the four sides of LED light emitting chip 2 to the direction close to optical axis, and emit by the front of LED light emitting chip 2, so that five light emitting surfaces are converted into one light emitting surface, which can improve the utilization of light energy and improve the brightness of emitted light. In addition, the thickness of the light transmission glue layer 3 formed by the inverted pressing method can be thin enough, and the light transmission glue layer 3 with the preset thickness can be accurately formed.

[0048] The function of the double-layer light transmission glue layer of light transmission glue layer 3+fluorescent glue layer 5: first, the setting of light transmission glue layer 3 can make up for the thickness difference of the incoming LED light emitting chip 2, so that the thickness of the fluorescent glue layer 5 pressed on the light transmission glue layer 3 is consistent, avoiding yellowing at the edge and inconsistent light color, and improving product quality stability. Second, when the preset thickness of light transmission glue layer 3 is thin, the manufacturing error is large, and the thickness of fluorescent glue layer 5 can make up for the manufacturing error, greatly improving the yield.

[0049] Further, step S4 further includes step S5. Step S5, the high-reflective glue is set on the four sides of light transmission glue layer 3 by dispensing natural leveling or molding filling, so that the four sides of light transmission glue layer 3 and fluorescent glue layer 5 are covered with high-reflective glue layer 6, referring to Figure 6 By setting high-reflective glue layer 6, the reflecting effect of the four sides of light transmission glue layer 3 and fluorescent glue layer 5 is ensured, and the light is further ensured to emit from the upper surface (front) of light transmission glue layer 3 and fluorescent glue layer 5.

[0050] Preferably, in step S2, the four sides of light transmission glue layer 3 form inverted conical reflecting surface 31. The upper surface of light transmission glue layer 3 is a plane or a curved surface.

[0051] Preferably, in step S4, the upper surface of fluorescent glue layer 5 is a plane or a curved surface.

[0052] The LED light source made by the manufacturing method of the present application comprises a substrate 4, an LED light emitting chip 2, a light transmission glue layer 3 and a fluorescent glue layer 5, referring to Figure 5 .

[0053] The LED light emitting chip 2 is fixed on the substrate 4. The light transmission glue layer 3 covers the front and side of the LED light emitting chip 2, and the side of the light transmission glue layer 3 is provided with reflecting surface 31. The upper surface of the light transmission glue layer 3 is preferably a plane or a curved surface. The fluorescent glue layer 5 covers at least the upper surface of the light transmission glue layer 3. The four sides of the light transmission glue layer 3 and the fluorescent glue layer 5 are surrounded by high-reflective glue layer 6, referring to Figure 6The thickness of the light-transmitting adhesive layer 3 is preferably less than or equal to 20 microns. The reflecting surface 31 is preferably a plane or a curved surface in the shape of an inverted cone. The LED light source of the present application has uniform light color, no yellowing at the edges, high brightness, simple manufacture, and high product yield.

[0054] Without limiting the present application, any modification, equivalent replacement, and improvement within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An LED light source, characterized by Comprise: a substrate (4); an LED light emitting chip (2) disposed on the substrate (4); a light-transmitting glue layer (3) covering the front and side surfaces of the LED light emitting chip (2), the side surface of the light-transmitting glue layer (3) being provided with a reflecting surface (31); a fluorescent glue layer (5) covering at least the upper surface of the light-transmitting glue layer (3); the front and side surfaces of the LED light emitting chip (2) being light emittingly arranged; the four side surfaces of the light-transmitting glue layer (3) and the fluorescent glue layer (5) being surrounded by a high-reflecting glue layer (6).

2. The LED light source of claim 1, wherein, The thickness of the light-transmitting glue layer (3) is ≤20μm.

3. The LED light source of claim 1, wherein, The reflecting surface (31) is a plane or a curved surface in inverted conical shape.

4. The LED light source of claim 1, wherein, The upper surface of the light-transmitting glue layer (3) is a plane or a curved surface.

5. The LED light source of claim 1, wherein, The upper surface of the fluorescent glue layer (5) is a plane or a curved surface.

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