LED packaging structure
By introducing a ceramic powder layer into the LED packaging structure, the problem of inconsistent light emission color of LED devices under temperature changes is solved, improving the consistency of luminous efficacy and product quality, while maintaining compatibility.
Patent Information
- Application Number
- CN202423096783.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-16
- Publication Date
- 2025-12-05
- Estimated Expiration
- 2034-12-16
AI Technical Summary
Existing high-power PLCC LED devices exhibit significant temperature rise differences on the colloid surface under both room temperature and high-temperature conditions, resulting in poor thermal stability and inconsistent luminous color.
A ceramic powder layer is applied to the encapsulating colloid layer. Taking advantage of the heat storage and thermal stability of ceramic powder materials, temperature differences are improved through high-temperature curing.
It improves the consistency of the product's light effect, enhances the product quality, and maintains compatibility and usability with the original product.
Smart Images
Figure CN223639638U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to LED component technology field, concretely relates to a LED packaging structure. BACKGROUND
[0002] At present, the products of the high-power PLCC LED device such as 1016, 2016, 2835, 3030, 3535, 3537, 5050, 1414, 1515, 1919, 2020 and the like are packaged in the size, due to the characteristics of product material structure, the product works under the condition of normal temperature and high temperature, the temperature rising difference of the colloid surface is large, the product thermal stability is poor in the instant of power-on lighting, and the temperature of the product glue surface will tend to be steady after lighting. Therefore, at present, an LED packaging structure capable of solving the above problems is urgently needed. SUMMARY
[0003] The utility model discloses a kind of LED packaging structures to further improve product quality, improve product light efficiency consistency, to solve the defects and deficiencies existing in prior art.
[0004] To achieve the above object, the technical scheme adopted by the utility model is: an LED packaging structure, including the packaging support with bowl cup and LED chip, the LED chip is fixed in bowl cup, the bowl cup is equipped with the phosphor mixed glue layer covering LED chip, the upper of the phosphor mixed glue layer is provided with packaging colloid layer, and the upper surface of the packaging colloid layer is provided with ceramic powder layer.
[0005] Preferably, the LED chip is fixed in the bowl cup by conductive glue.
[0006] Preferably, the LED chip electrode is connected with the metal carrier plate of packaging support through conductive wire to form conduction.
[0007] Preferably, the metal carrier plate is selected from copper base material.
[0008] Preferably, the bowl cup is plastic material, selected from PPA, PCT, EMC or SMC.
[0009] Preferably, the packaging colloid layer is silica gel or epoxy glue.
[0010] Preferably, the ceramic powder layer is selected from aluminum nitride, aluminum oxide or silicon nitride.
[0011] Preferably, the ceramic powder layer and the open end of the bowl cup are arranged on the same horizontal line.
[0012] After the above technical scheme is adopted, the LED packaging structure provided by the utility model has the following beneficial effects:
[0013] (1) The utility model discloses a ceramic powder layer's design, because ceramic powder material has the advantage of heat storage, heat stability is good, and the product after high temperature solidification does not have the phenomenon of temperature large amplitude excursion on the colloid surface under the condition of instantaneous lighting, thereby improving the problem of product emitting color inconsistency caused by temperature difference when working.
[0014] (2) The utility model discloses the structure of LED product itself can not be changed, but can further improve the quality of product, improve the consistency of product light efficiency, and the product can be directly compatible with the original product and use, terminal does not need to do any design modification, with better practicality, better compatibility, better effect and other advantages. BRIEF DESCRIPTION OF DRAWINGS
[0015] Figure 1 It is a structure diagram of the utility model discloses a kind of LED packaging structure.
[0016] Wherein: bowl cup 1, packaging support 2, LED chip 3, fluorescent powder mixed glue layer 4, packaging colloid layer 5, ceramic powder layer 6. DETAILED DESCRIPTION
[0017] The utility model will be further clearly and completely described below in combination with the drawings and specific embodiments, obviously, the described embodiment is only a part of the embodiment of the utility model, not all embodiments. The description of the following at least one exemplary embodiment is actually only illustrative, and is by no means any limitation on the utility model and its application or use. Based on the embodiment in the utility model, all other embodiments obtained by ordinary skilled in the art without making creative labor belong to the scope of protection of the utility model.
[0018] It should be noted that the terms used here are only for describing specific embodiments, and are not intended to limit the exemplary embodiments according to the present application. As used herein, the singular form is intended to include the plural form unless the context clearly indicates otherwise, and furthermore, it should be understood that, when the terms "comprise" and / or "include" are used in the specification, it means that there is a feature, step, operation, device, component and / or its combination.
[0019] The foregoing description, for purposes of explanation, sets forth specific values and arrangements of components and steps that are subject to many options. The intent is to be accurate in describing the principles and novel features of the application. Thus, although the application has been described with reference to specific embodiments thereof, it will be apparent to those of ordinary skill in the art that a number of changes can be made to the embodiments described without departing from the spirit and scope of the application. For example, the various features of the application can be combined in any combination, where possible. Accordingly, the scope of the application is to be construed as encompassing modifications and variations of the specific examples described herein, subject only to the conditions of the prior art.
[0020] In the description of the present application, it needs to be understood that the orientation words such as "front, back, up, down, left, right", "transverse, vertical, perpendicular, horizontal" and "top, bottom" and the like indicated orientation or position relationship is usually based on the orientation or position relationship shown in the drawings, only for the convenience of describing the present application and simplifying the description, without making the opposite statement, these orientation words do not indicate and imply that the device or element referred to must have a particular orientation or be constructed and operated in a particular orientation, therefore, it cannot be understood as a limitation on the scope of protection of the present application; the orientation words "inner, outer" refer to the inner and outer of the contour of each component itself.
[0021] For the convenience of description, spatial relative terms such as "over", "above", "upper surface", "upper" and the like can be used herein to describe the spatial position relationship of one device or feature with other devices or features as shown in the drawings. It should be understood that the spatial relative terms are intended to include different orientations in use or operation in addition to the orientation of the device described in the drawings. For example, if the device in the drawings is inverted, the device described as "above" or "over" other devices or structures will be positioned "below" or "under" other devices or structures. Thus, the example term "above" can include both "above" and "below" orientations. The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative description used herein is interpreted accordingly.
[0022] In addition, it needs to be explained that the use of "first", "second" and the like to limit parts only for the convenience of distinguishing the corresponding parts, and if there is no further declaration, the above words have no special meaning, therefore, it cannot be understood as a limitation on the scope of protection of the present application.
[0023] The utility model provides a kind of LED packaging structure, as shown in Figure 1 Including the packaging support 2 with bowl cup 1 and LED chip 3, the LED chip 3 is fixed in bowl cup 1, specifically, the LED chip 3 is fixed in bowl cup 1 by conductive glue, and LED chip 3 electrode is connected with the metal carrier plate of packaging support 2 by conductive wire and forms conduction, the metal carrier plate selects copper base material, the bowl cup 1 is plastic material, selects PPA, PCT, EMC or SMC, the bowl cup 1 is equipped with the phosphor mixed glue layer 4 covering LED chip 3, the upper portion of phosphor mixed glue layer 4 is provided with packaging glue layer 5, the packaging glue layer 5 is silica gel or epoxy glue, the upper surface of packaging glue layer 5 is provided with ceramic powder layer 6, the ceramic powder layer 6 selects aluminum nitride, aluminum oxide or silicon nitride, and ceramic powder layer 6 and bowl cup 1 open end are arranged on the same horizontal line.
[0024] The utility model discloses a kind of packaging process of LED packaging structure, comprising the following steps:
[0025] S1, LED chip 3 is fixed on the metal carrier plate of packaging support 2 by conductive glue or other adhesive and is cured;
[0026] S2, LED chip 3 electrode is connected with the metal carrier plate by conductive wire and forms conduction;
[0027] S3, ceramic powder is mixed into glue with phosphor, glue is evenly spotted in the bowl cup 1 of packaging support 2 by dispensing machine equipment;
[0028] S4, the whole piece support that glue is spotted is carried out sedimentation centrifugation process, ceramic powder in glue is suspended on the upper surface of colloid, then multi-section high-temperature curing is carried out again;
[0029] S5, the whole piece support product is formed into granular LED product by blanking equipment;
[0030] S6, LED product is carried out electrical property test, then again it is packaged with ribbon.
[0031] As described above, the utility model provides a kind of LED packaging structure, on the one hand, since ceramic powder material itself has the advantages of heat storage and good thermal stability, so that the product after high-temperature curing does not have the phenomenon of temperature drift under the condition of instantaneous lighting, thereby improving the problem that the product emits different colors due to the difference in temperature during work;On the other hand, the structure of the LED product itself is not changed, but the quality of the product can be further improved, the consistency of the product light efficiency is improved, and the product can be directly compatible with the original product, the terminal does not need to be designed and modified, has the advantages of better practicability, better compatibility, better effect, etc., has great market value, and is worth widely popularizing and applying.
[0032] The above merely describes a preferred embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any skilled person in the art, according to the technical scheme and the inventive concept of the present application, can make equivalent substitutions or changes within the technical range disclosed by the present application, which should be covered within the scope of protection of the present application.
Claims
1. An LED package structure, characterized by: The application relates to a packaging support (2) with a bowl cup (1) and an LED chip (3), the LED chip (3) is fixed in the bowl cup (1), a phosphor mixed glue layer (4) covering the LED chip (3) is arranged in the bowl cup (1), a packaging glue layer (5) is arranged above the phosphor mixed glue layer (4), and a ceramic powder layer (6) is arranged on the upper surface of the packaging glue layer (5).
2. The LED package structure of claim 1, wherein: The LED chip (3) is fixed in the bowl cup (1) through conductive glue.
3. The LED package structure of claim 1, wherein: The electrode of the LED chip (3) is connected with a metal carrier plate of the packaging support (2) through a conductive wire to form conduction.
4. The LED package structure of claim 3, wherein: The metal carrier plate is made of copper.
5. The LED package structure of claim 1, wherein: The bowl cup (1) is made of plastic material, and PPA, PCT, EMC or SMC is selected.
6. The LED package structure of claim 1, wherein: The packaging glue layer (5) is made of silica gel or epoxy glue.
7. The LED package structure of claim 1, wherein: The ceramic powder layer (6) is made of aluminum nitride, aluminum oxide or silicon nitride.
8. The LED package structure of claim 1, wherein: The ceramic powder layer (6) is arranged on the same horizontal line with the opening end of the bowl cup (1).