Slurry stirring paddle, stirring device and coating trolley
By introducing a semiconductor temperature control module and temperature control system into the slurry mixing paddle, precise control of the slurry temperature is achieved using thermoelectric cooling semiconductor components. This solves the problems of downtime and manpower consumption caused by temperature fluctuations in coating production, and improves production quality and efficiency.
Patent Information
- Application Number
- CN202423254241.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-27
- Publication Date
- 2025-12-09
- Estimated Expiration
- 2034-12-27
AI Technical Summary
Temperature fluctuations during the transport of coating slurry can cause production downtime and manpower losses. Existing technologies struggle to effectively control slurry temperature, impacting production efficiency and quality.
A semiconductor temperature control module is installed inside the blades of the slurry mixing paddle. Combined with a temperature control system, the thermoelectric cooling semiconductor component is used to achieve precise control of the slurry temperature. The cooling or heating effect is controlled by the direction of the current, and the temperature is stabilized during the mixing process.
It achieves precise control of slurry temperature, reduces coating defects caused by temperature fluctuations, improves production quality and efficiency, and reduces manpower and time consumption.
Smart Images
Figure CN223641652U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of coating production technology, and in particular relates to a slurry mixing paddle, a mixing device and a coating trolley. Background Technology
[0002] The coating process is a crucial step in battery production. Currently, after production, the coating slurry is transported to a storage tank on the coating cart. During this process, the slurry generates heat due to friction caused by the screw pump, leading to a temperature rise. Therefore, it's usually necessary to cool the slurry in the storage tank until its temperature returns to normal before coating. However, during cooling, the slurry temperature may drop below the preset value. In this case, the machine must be stopped and the slurry reheated to reach the target temperature. If the slurry temperature is too high, it cannot be controlled. Production can only resume after the high-temperature slurry is consumed through coating adjustments, or manual slurry recovery can be performed, both of which consume significant manpower and time. Utility Model Content
[0003] The purpose of this invention is to address the aforementioned technical problems by providing a slurry mixing paddle, mixing device, and coating trolley to solve these problems.
[0004] In view of this, the present invention provides a slurry mixing impeller, an impeller shaft and impeller blades connected to the impeller shaft, and further includes:
[0005] A semiconductor temperature control module is located inside the propeller blade;
[0006] The temperature control system has wires that pass through the propeller shaft and connect to the semiconductor temperature control module.
[0007] Furthermore, the semiconductor temperature control module includes thermoelectric cooling semiconductor components.
[0008] Furthermore, the blades are downward-pressing blades.
[0009] Furthermore, the blades also include:
[0010] A heat-conducting layer is disposed inside the blade and located on the lower side of the semiconductor temperature control module in the first direction.
[0011] Furthermore, the blades also include:
[0012] The insulation layer is disposed inside the blade and located on the upper side of the semiconductor temperature control module in the first direction.
[0013] Furthermore, the blades also include:
[0014] The stainless steel housing serves as the outer structure of the propeller and covers the semiconductor temperature control module.
[0015] A mixing device, comprising the slurry mixing paddle of any one of the above, further comprising:
[0016] The mixing tank contains a slurry mixing paddle.
[0017] The drive mechanism is located outside the mixing tank and is used to drive the paddle shaft to rotate.
[0018] Furthermore, it also includes:
[0019] A liquid level sensor is installed inside the mixing tank and is used to detect and identify the slurry height.
[0020] Furthermore, it also includes:
[0021] A temperature sensor is installed inside the mixing tank and is used to detect the temperature of the slurry.
[0022] A coating cart includes the aforementioned mixing device.
[0023] The beneficial effects of this utility model are:
[0024] A semiconductor temperature control module is installed inside the blades of the slurry mixing paddle. The semiconductor temperature control module is electrically connected to the temperature control system. The semiconductor temperature control module includes multiple PN junctions. When current flows through the PN junctions in the forward or reverse direction, the PN junctions will generate heat release or heat absorption, so that the blades have a heating or cooling effect. While mixing the slurry, the temperature of the slurry is precisely controlled, thereby reducing the occurrence of coating defects caused by temperature fluctuations and improving the production quality level. Attached Figure Description
[0025] Figure 1 This is a schematic diagram of the slurry mixing paddle in this utility model;
[0026] Figure 2 This is a circuit diagram showing the connection between the semiconductor temperature control module and the temperature control system in this utility model;
[0027] Figure 3 This is a schematic diagram of the blade structure in this utility model;
[0028] Figure 4 This is a schematic diagram of the thermoelectric refrigeration semiconductor component in this utility model;
[0029] Figure 5 This is a schematic diagram of the connection between the P-pole and the N-pole in this utility model;
[0030] The markings in the diagram are as follows:
[0031] 1. Propeller shaft; 2. Propeller blade; 21. Thermoelectric refrigeration semiconductor assembly; 211. Insulating substrate; 212. P-pole; 213. N-pole; 214. Copper sheet; 215. Ceramic sheet; 22. Thermally conductive layer; 23. Thermally insulating layer; 24. Stainless steel housing; X, First direction. Detailed Implementation
[0032] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0033] In the description of this application, it should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. For ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.
[0034] Example 1:
[0035] This embodiment provides a slurry mixing impeller, including an impeller shaft 1 and impeller blades 2 connected to the impeller shaft 1, and further comprising:
[0036] A semiconductor temperature control module is located inside the blade 2;
[0037] The temperature control system has wires that pass through the propeller shaft 1 and are connected to the semiconductor temperature control module.
[0038] Furthermore, the semiconductor temperature control module includes 21 thermoelectric cooling semiconductor components.
[0039] In this technical solution, the semiconductor temperature control module includes a thermoelectric cooling semiconductor component 21 and a circuit connected to the thermoelectric cooling semiconductor component 21. The temperature control system is connected to this circuit. The circuit diagram is shown below. Figure 2As shown, when the temperature of the stirred slurry is lower than the preset temperature, the first, second, third, fifth, and sixth switches are open, and the fourth switch is closed. The output current of the first power supply flows in the forward direction through the thermoelectric cooling semiconductor component 21, which then functions as a cooling device. Combined with the rotation of the stirring paddle, this lowers the slurry temperature. When the temperature of the stirred slurry is higher than the preset temperature, the second, third, fourth, fifth, and sixth switches are open, and the first switch is closed. The output current of the second power supply flows in the reverse direction through the thermoelectric cooling semiconductor component 21, which then functions as a heating device. Combined with the rotation of the stirring paddle, this raises the slurry temperature.
[0040] Thermoelectric cooling semiconductor component 21, such as Figure 4 As shown, it consists of an insulating substrate 211, several P-type electrodes 212, several N-type electrodes 213, several copper sheets 214, and two ceramic sheets 215. The insulating substrate 211 is made of epoxy resin. The P-type electrodes 212 and N-type electrodes 213 can be made of bismuth telluride semiconductor material. Several mounting holes for mounting the P-type electrodes 212 and N-type electrodes 213 are formed on the insulating substrate 211. The P-type electrodes 212 and N-type electrodes 213 are arranged alternately. Then, as... Figure 5 As shown, several copper plates 214 connect adjacent P-terminals 212 and N-terminals 213 to form a PN junction, creating a thermocouple pair. Ceramic plates 215 are then installed on both sides, ensuring an insulated contact between the thermoelectric cooling semiconductor assembly 21 and the impeller 2. When current flows through the PN junction, a Peltier effect occurs at the thermocouple junction, resulting in heat absorption and release, thus achieving cooling and heating effects. This allows the slurry agitator to precisely control the slurry temperature while agitating it, reducing the occurrence of defective coatings due to temperature fluctuations and improving production quality.
[0041] Furthermore, the impeller 2 is a downward-pressing impeller 2. The impeller 2 has a spiral plate structure. During the rotation of the mixing paddle, the impeller 2 generates a downward-pressing force, which causes the slurry to flow downward, enhancing the mixing effect. Especially when the material is more viscous or has more sediment, it can improve the mixing uniformity and efficiency.
[0042] Furthermore, the blade 2 also includes a heat-conducting layer 22, which is disposed inside the blade 2 and located below the semiconductor temperature control module in the first direction X. The cooling or heating effect generated by the semiconductor temperature control module can be transferred to the surface of the blade 2 in a timely manner through the heat-conducting layer 22, thereby achieving a cooling or heating effect on the slurry.
[0043] The blade 2 also includes a heat insulation layer 23, which is disposed inside the blade 2 and located on the upper side of the semiconductor temperature control module in the first direction X. When electricity is applied to the thermoelectric cooling semiconductor component 21, the side closest to the heat-conducting layer 22 exhibits heat absorption or release, while the other side exhibits the opposite phenomenon, i.e., heat release or absorption. Therefore, by providing the heat insulation layer 23, the side of the thermoelectric cooling semiconductor component 21 away from the heat-conducting layer 22 will not transfer heat to the surface of the blade 2, preventing the blade 2 from simultaneously cooling and heating, and ensuring precise temperature control of the slurry.
[0044] Furthermore, the impeller 2 also includes a stainless steel housing 24, which serves as the outer structure of the impeller 2 and covers the semiconductor temperature control module. This structural design gives the impeller 2 high strength and hardness, enabling it to withstand greater pressure and friction during stirring, ensuring that the impeller 2 is not easily deformed or damaged, and extending its service life.
[0045] Example 2:
[0046] This embodiment provides a stirring device, which, in addition to the slurry stirring paddle of Embodiment 1 described above, also includes:
[0047] A mixing tank (not shown in the figure) contains a slurry mixing paddle.
[0048] A drive mechanism (not shown in the figure) is located outside the mixing tank and is used to drive the paddle shaft 1 to rotate.
[0049] In this technical solution, the mixing tank is used to hold the slurry. The output end of the drive mechanism is connected to the shaft 1 of the slurry mixing paddle. The wires of the temperature control system are connected to the semiconductor temperature control module inside the blade 2 through an electric slip ring. The electric slip ring is used to transmit the external power to the semiconductor temperature control module inside the blade 2, ensuring that the semiconductor temperature control module inside the blade 2 will not lose electrical connection when the drive mechanism drives the blade 2 to rotate and stir the slurry.
[0050] Furthermore, it also includes a level sensor (not shown in the figure), which is installed inside the mixing tank and used to detect and identify the slurry height. For example... Figure 1 As shown, the propeller blade 2 is spiral-shaped and can be divided into multiple segments along the height direction. Each segment of the propeller blade 2 is equipped with a semiconductor temperature control module. The electrical connection relationship between the various semiconductor temperature control modules is as follows: Figure 2 As shown, the liquid level sensor detects and identifies the slurry height in the mixing tank and feeds the detected parameters back to the temperature control system. Based on the slurry height, the temperature control system shuts off the circuit switch corresponding to the semiconductor temperature control module in the blade 2 that is not submerged in slurry, so that current does not flow through it, thereby effectively reducing energy consumption and saving production costs.
[0051] Furthermore, it also includes a temperature sensor (not shown in the figure), which is installed inside the mixing tank and used to detect the temperature of the slurry. The temperature sensor can detect the slurry temperature and feed the temperature data back to the temperature control system in real time. The temperature control system controls the opening and closing of the first and second switches in the circuit according to the temperature parameters, thereby controlling the direction of the current and realizing the switching between cooling and heating of the semiconductor temperature control module.
[0052] Example 3:
[0053] This embodiment provides a coating cart, including the stirring device of Embodiment 2 above.
[0054] The embodiments of this application have been described above with reference to the accompanying drawings. Unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other. This application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.
Claims
1. A slurry mixing impeller, comprising an impeller shaft (1) and impeller blades (2) connected to the impeller shaft (1), characterized in that, Also includes: A semiconductor temperature control module is disposed inside the blade (2); Temperature control system, wherein the wires of the temperature control system pass through the propeller shaft (1) and are connected to the semiconductor temperature control module.
2. The slurry mixing paddle according to claim 1, characterized in that, The semiconductor temperature control module includes a thermoelectric cooling semiconductor component (21).
3. The slurry mixing paddle according to claim 1, characterized in that, The blade (2) is a downward-pressing blade (2).
4. The slurry mixing paddle according to claim 3, characterized in that, The blade (2) also includes: A heat-conducting layer (22) is disposed inside the blade (2) and located on the lower side of the semiconductor temperature control module along the first direction (X).
5. The slurry mixing paddle according to claim 3, characterized in that, The blade (2) also includes: The heat insulation layer (23) is disposed inside the blade (2) and located on the upper side of the semiconductor temperature control module along the first direction (X).
6. The slurry mixing paddle according to claim 1, characterized in that, The blade (2) also includes: A stainless steel housing (24) serves as the outer structure of the blade (2) and covers the semiconductor temperature control module.
7. A stirring device, characterized in that, The slurry mixing paddle according to any one of claims 1-6 further includes: A mixing tank, wherein the slurry mixing paddle is disposed inside the mixing tank; A drive mechanism is provided outside the mixing tank and is used to drive the paddle shaft (1) to rotate.
8. The stirring device according to claim 7, characterized in that, Also includes: A liquid level sensor is installed inside the mixing tank and is used to detect and identify the slurry height.
9. The stirring device according to claim 7, characterized in that, Also includes: A temperature sensor is installed inside the mixing tank and is used to detect the temperature of the slurry.
10. A coating cart, characterized in that, Includes the stirring device described in any one of claims 7-9.