Loop type thermosyphon assembly

Abstract

The utility model discloses a loop type thermosyphon assembly. The loop type thermosyphon assembly comprises a thermal interface element, a channel, a first steam channel and one or more cooling flow pipes, wherein the thermal interface element is used for being coupled to a heat source to be cooled; the channel is coupled to the thermal interface element; the channel includes a vapor barrier and a second vapor channel. The first vapor channel is in communication with the thermal interface element through the second vapor channel. The one or more cooling flow tubes are in communication with the thermal interface element through a vapor isolator. The second vapor channel and the first vapor channel direct vaporized liquid coolant upward and away from the thermal interface element and the heat source, and the one or more cooling flow tubes and the vapor barrier direct liquefied vapor coolant downward and toward the thermal interface element and the heat source.

Description

Technical Field

[0001] This utility model relates to heat transfer elements and assemblies, and particularly to, but not limited to, loop-type thermosiphon assemblies. Background Technology

[0002] Loop thermosiphons (LTS) are passive, closed-loop two-phase thermal management systems in which the liquid coolant undergoes a phase change (vaporization and condensation), and the system is driven by the pressure difference between hot and cold zones and gravity to sustain its movement. Vaporized liquid coolant and liquefied vapor coolant move in opposite directions through opposing cooling paths, forming a circulating flow of liquid coolant from the hot zone to the cold zone and back.

[0003] Generally, a loop thermosiphon system includes an evaporator, a condenser, a riser, and a downcomer. The evaporator absorbs heat from a heat source to vaporize the liquid coolant within it. The vaporized liquid coolant is then transported to the condenser via the riser. The vaporized liquid coolant releases heat in the condenser, typically to radiators or other cooling mechanisms. As the vapor cools in the condenser, it condenses back into a liquid state. The liquefied vapor coolant is then transported to the evaporator via the downcomer.

[0004] The properties of the liquid coolant, filling ratios, aspect ratio, heat load, internal pressure, material properties, and the dimensions of the thermosiphon can all negatively impact the thermal performance of a thermosiphon. At high heat flux and low filling ratios, drying out is likely to occur. At high filling ratios, flooding may occur, limiting the maximum heat flux. Therefore, improving the filling ratio and coolant flow rate to enhance the efficiency of the thermosiphon while preventing drying out and flooding remains a challenge. Utility Model Content

[0005] This invention provides a loop-type thermosiphon assembly with a high heat transfer rate.

[0006] A first embodiment of a loop-type thermosiphon assembly includes a thermal interface element, a channel, a first vapor channel, and one or more cooling pipes. The thermal interface element contains a liquid coolant and is coupled to a heat source to be cooled. The channel includes a vapor barrier and a second vapor channel coupled to the thermal interface element. The first vapor channel is coupled to the channel, and the one or more cooling pipes are coupled to the first vapor channel. The first vapor channel communicates with the thermal interface element through the second vapor channel. Each of the one or more cooling pipes has an input end and an output end. The input end of the one or more cooling pipes communicates with the second vapor channel through the first vapor channel. The vapor barrier is coupled to the output end of the one or more cooling pipes. The thermal interface element communicates with the output end of the one or more cooling pipes through the vapor barrier. The second vapor channel and the first vapor channel guide the vaporized liquid coolant upwards and away from the thermal interface element and the heat source, while the one or more cooling pipes and the vapor barrier guide the liquefied vapor coolant downwards and towards the thermal interface element and the heat source.

[0007] In one embodiment, the technology described in this utility model relates to a loop-type thermosiphon assembly, wherein the thermal interface element includes a flat interface surface and a heat exchange chamber. The heat exchange chamber is opposite to the flat interface surface. The flat interface surface is in thermal communication with the heat source.

[0008] In some embodiments, the technology described in this invention relates to a loop-type thermosiphon assembly, wherein the thermal interface element comprises a cold plate formed of metal.

[0009] In some embodiments, the technology described in this invention relates to a loop-type thermosiphon assembly, wherein the heat exchange chamber contains multiple heat transfer fins.

[0010] In some embodiments, the technology described herein relates to a loop-type thermosiphon assembly, wherein the heat transfer fins comprise one or more pin fins. One or more pin fins are substantially perpendicular to the heat source.

[0011] In some embodiments, the technology described herein relates to a loop-type thermosiphon assembly, further comprising a heat exchanger coupled to one or more cooling flow tubes, the heat exchanger comprising multiple stacked horizontal fins.

[0012] In one embodiment, the technology described in this invention relates to a loop-type thermosiphon assembly, wherein the one or more cooling pipes comprise fourteen cooling pipes.

[0013] In one embodiment, the present invention relates to a loop-type thermosiphon assembly, wherein a first vapor channel and a channel defining a vapor chamber. The vapor chamber includes a first side, a second side, a third side, and a fourth side. The first side is coupled to the second side at its peripheral edge. The first side is coupled to the fourth side at its peripheral edge opposite to the peripheral edge coupled to the second side. The second side is coupled to the third side at its peripheral edge opposite to the peripheral edge coupled to the first side. The third side is coupled to the fourth side at its peripheral edge opposite to the peripheral edge coupled to the second side. Two of the fourteen cooling pipes are coupled to at least one of the first, second, third, and fourth sides. Each of the two cooling pipes includes two bends in the horizontal direction, such that the two cooling pipes protrude in opposite directions beyond the plane of the opposing peripheral edges of at least one of the first, second, third, and fourth sides.

[0014] In some embodiments, the technology described in this invention relates to a loop-type thermosiphon assembly, wherein the one or more cooling flow tubes comprise one or more sections, and the one or more sections substantially vertically guide liquefied vapor coolant to a thermal interface element.

[0015] In one embodiment, the technology described in this invention relates to a loop-type thermosiphon assembly, wherein the vapor barrier includes a porous liner. The porous liner contains multiple pores, and these pores are configured to allow liquefied vapor coolant to be guided from the output end to the thermal interface element through the porous liner.

[0016] In one embodiment, the technology described in this invention relates to a loop-type thermosiphon assembly, wherein the porous liner includes a metal foam liner.

[0017] In one embodiment, the technology described in this invention relates to a loop-type thermosiphon assembly, wherein the heat exchange chamber includes a capillary wicking layer. The capillary wicking layer covers the heat transfer fins and the surface of the heat exchange chamber. The capillary fluid-conducting layer contains multiple capillary pores.

[0018] In one embodiment, the technology described in this invention relates to a loop-type thermosiphon assembly, wherein a porous liner is coupled to a capillary wicking layer, allowing liquefied vapor coolant to flow through the pores of the porous liner to the capillary pores of the capillary wicking layer.

[0019] In some embodiments, the technology described in this invention relates to a loop-type thermosiphon assembly, wherein the capillary wicking layer comprises a sintered metal core structure.

[0020] In some embodiments, the technology described in this invention relates to a loop-type thermosiphon assembly, wherein the capillary pores have a pore size smaller than that of the pores.

[0021] In one embodiment, the technology described herein relates to a loop-type thermosiphon assembly, wherein the vapor barrier comprises a solid barrier. The solid barrier is lined with a porous liner opposite the output end and serves to separate the vaporized liquid coolant from the output end and the porous liner.

[0022] In one embodiment, the technology described herein relates to a third embodiment of a loop-type thermosiphon assembly, wherein the vapor barrier comprises a solid barrier and a chamber bag. The chamber bag is used to guide liquefied vapor coolant from the output end to the thermal interface element. The solid barrier is used to separate the vaporized liquid coolant from the output end and the chamber bag.

[0023] In one embodiment, the technology described herein relates to a fourth embodiment of a loop-type thermosiphon assembly, wherein the vapor barrier comprises a modified solid barrier and a plurality of chamber bags. Each of these chamber bags includes a plurality of flow channel structures coupled to the modified solid barrier, and these flow channel structures are used to guide liquefied vapor coolant from the output end to a thermal interface element. The modified solid barrier is used to separate the vaporized liquid coolant from the output end and from these chamber bags.

[0024] The above description of the present utility model and the following description of the embodiments are used to demonstrate and explain the principle of the present utility model, and to provide a further explanation of the scope of the patent application of the present utility model. Attached Figure Description

[0025] Unless otherwise specified, the accompanying drawings are intended to illustrate the innovative objectives of this invention. Referring to the drawings, in which similar element symbols represent similar parts in different views, examples of multiple loop thermosiphon assemblies incorporating the principles disclosed in this invention are illustrated by way of example, and not as a limitation thereof.

[0026] Figure 1A This is a perspective view illustrating a loop-type thermosiphon assembly according to various embodiments of the present invention.

[0027] Figure 1B This illustration depicts various embodiments according to the present invention. Figure 1A Another three-dimensional schematic diagram of the loop-type thermosiphon assembly shown.

[0028] Figure 1C This illustration depicts various embodiments according to the present invention. Figure 1A The diagram shows an exploded view of a loop-type thermosiphon assembly.

[0029] Figure 1D This illustration depicts various embodiments according to the present invention. Figure 1A Another exploded view of the loop-type thermosiphon assembly shown.

[0030] Figure 2A This illustration depicts various embodiments according to the present invention. Figure 1A The diagram shows a three-dimensional schematic of the loop-type thermosiphon assembly and the B-B' cross-section line.

[0031] Figure 2B This illustration depicts various embodiments according to the present invention. Figure 2A The shown is a side sectional view of the loop-type thermosiphon assembly along the B-B' section line.

[0032] Figure 3 This illustration depicts various embodiments according to the present invention. Figure 1A A three-dimensional schematic diagram of the vapor chamber and one or more cooling pipes of the loop-type thermosiphon assembly shown.

[0033] Figure 4A This illustration depicts various embodiments according to the present invention. Figure 1A The diagram shows a three-dimensional schematic of the loop-type thermosiphon assembly and the A-A' section line.

[0034] Figure 4B This illustration depicts various embodiments according to the present invention. Figure 4A The above-view sectional view of the loop-type thermosiphon assembly along section line A-A'.

[0035] Figure 5 This illustration depicts various embodiments according to the present invention. Figure 2A The diagram shows a side sectional view of the loop-type thermosiphon assembly along the B-B' section line and the flow of liquid coolant.

[0036] Figure 6 This is an exploded view illustrating another loop thermosiphon assembly according to various embodiments of the present invention.

[0037] Figure 7A This illustration depicts various embodiments according to the present invention. Figure 6 A three-dimensional schematic diagram of another loop-type thermosiphon assembly and a C-C' cross-section line are shown.

[0038] Figure 7B This illustration depicts various embodiments according to the present invention. Figure 7A The image shows a top sectional view of another loop-type thermosiphon assembly along the C-C' section line.

[0039] Figure 8A This illustration depicts various embodiments according to the present invention. Figure 6 A three-dimensional schematic diagram of another loop-type thermosiphon assembly and the D-D' section line are shown.

[0040] Figure 8B This illustration depicts various embodiments according to the present invention. Figure 8AThe image shows a side sectional view of another loop-type thermosiphon assembly along the D-D' section line.

[0041] Figure 9 This is an exploded view illustrating yet another loop thermosiphon assembly according to various embodiments of the present invention.

[0042] Figure 10A This illustration depicts various embodiments according to the present invention. Figure 9 The diagram shows a three-dimensional schematic of another loop-type thermosiphon assembly and the E-E' section line.

[0043] Figure 10B This illustration depicts various embodiments according to the present invention. Figure 10A The image shows a top sectional view of another loop-type thermosiphon assembly along the E-E' section line.

[0044] Figure 11A This illustration depicts various embodiments according to the present invention. Figure 9 The diagram shows a three-dimensional schematic of another loop-type thermosiphon assembly and the F-F' cross-section line.

[0045] Figure 11B This illustration depicts various embodiments according to the present invention. Figure 11A The image shows a side sectional view of another loop-type thermosiphon assembly along the F-F' section line.

[0046] Figure 12 This is an exploded view illustrating another loop thermosiphon assembly according to various embodiments of the present invention.

[0047] Figure 13 This illustration depicts various embodiments according to the present invention. Figure 12 The image shows another type of vapor barrier for a thermosiphon assembly.

[0048] Figure 14 This illustration depicts various embodiments according to the present invention. Figure 12 The diagram shows another type of loop thermosiphon assembly with cooling pipes and vapor insulation components.

[0049] Figure 15A This illustration depicts various embodiments according to the present invention. Figure 12 The diagram shows a three-dimensional schematic of another loop-type thermosiphon assembly and the G-G' cross-section line.

[0050] Figure 15B This illustration depicts various embodiments according to the present invention. Figure 15A The image shown is a top sectional view of another loop-type thermosiphon assembly along the G-G' section line.

[0051] Figure 16A This illustration depicts various embodiments according to the present invention. Figure 12 The diagram shows a three-dimensional schematic of another loop-type thermosiphon assembly and the H-H' cross-section.

[0052] Figure 16B This illustration depicts various embodiments according to the present invention. Figure 16A The image shown is a side sectional view of another loop-type thermosiphon assembly along the H-H' section line.

[0053] In the attached figures, the following labels are used:

[0054] 10: Loop-type thermosiphon assembly

[0055] 10B: Loop-type thermosiphon assembly

[0056] 10C: Loop-type thermosiphon assembly

[0057] 10D: Loop-type thermosiphon assembly

[0058] 100: Thermal interface element

[0059] 110: Capillary wicking layer

[0060] 119: Top protrusion

[0061] 150: Heat exchange chamber

[0062] 155: Heat transfer fins

[0063] 300: Channel

[0064] 310: Vapor barrier

[0065] 310A: Porous Liner

[0066] 310B: Porous Liner

[0067] 310C: Chamber bag

[0068] 310D: Chamber bag

[0069] 315: Flow channel structure

[0070] 319: Solid Isolation Component

[0071] 319D: Improved solid isolator

[0072] 350: Second steam passage

[0073] 500: Steam chamber

[0074] 510: First side

[0075] 519: Internal protrusion

[0076] 520: Second side

[0077] 530: Third side

[0078] 540: Fourth side

[0079] 550: First steam passage

[0080] 620: Heat exchanger

[0081] 700: Cooling pipe

[0082] 710: Input terminal

[0083] 713: Bending section

[0084] 715: Bending section

[0085] 750: Vertical section

[0086] 790: Output terminal

[0087] 791: Incision

[0088] 793: Bending section

[0089] 795: Bending section

[0090] 900: Mounting bracket

[0091] G: Gasket Detailed Implementation

[0092] The following description, with reference to examples of specific loop-type thermosiphon assemblies, illustrates various principles of elements and components related to processor cooling, including specific configurations and examples of thermal interface elements and cooling flow channels with particular innovative concepts. More specifically, but not limited to, these innovative principles relate to selected examples of insulators and channels that guide vaporized liquid coolant upwards and away from the thermal interface element, and guide liquefied vapor coolant downwards and towards the thermal interface element. For the sake of brevity and clarity, existing functions or structures are not described in detail. Nevertheless, one or more of the disclosed principles can be applied to various other embodiments of different insulators and channels that guide vaporized liquid coolant upwards and away from the thermal interface element, and guide liquefied vapor coolant downwards and towards the thermal interface element to achieve various desired effects, characteristics, and / or performance standards.

[0093] Therefore, thermal interface elements and cooling conduits having properties different from those specific examples discussed in this invention can embody one or more innovative principles and can be used in applications not described in detail in this invention. Therefore, embodiments of insulating elements and channels not described in detail in this invention also fall within the scope of this invention, and will be understood by those skilled in the art upon reading this disclosure.

[0094] The exemplary embodiments disclosed in this utility model pertain to a loop-type thermosiphon assembly that can be used in a cooling system to dissipate high heat loads. The loop-type thermosiphon can be used to cool electronic components such as high-performance processors used in data center servers or other types of electronic components that generate high heat loads during operation. The processor may include a central processing unit (CPU), a graphics processing unit (GPU), a neural network processing unit (NPU), a tensor processing unit (TPU), etc.

[0095] Figures 1A to 2B This illustration depicts a loop-type thermosiphon assembly 10 according to various embodiments of the present invention. The loop-type thermosiphon assembly 10 includes a thermal interface element 100, a channel 300, a first vapor channel 550, and one or more cooling pipes 700. The thermal interface element 100 includes a liquid coolant and is coupled to a heat source (not shown) to be cooled. The liquid coolant may include water, inhibited ethylene glycol and aqueous solutions, dielectric fluids, customized heat transfer fluids, antifreeze, etc. The channel 300 includes a vapor barrier 310 and a second vapor channel 350 and is coupled to the thermal interface element 100. The first vapor channel 550 is coupled to the channel 300, and the one or more cooling pipes 700 are coupled to the first vapor channel 550. The first vapor channel 550 communicates with the thermal interface element 100 through the second vapor channel 350. Each of the one or more cooling pipes 700 has an input end 710 and an output end 790. The one or more cooling channels 700 comprise channels formed of a metallic material. For example, the material forming each of the one or more cooling channels 700 may comprise a metal with high thermal conductivity, such as aluminum, copper, and alloys thereof. The inlet 710 of the one or more cooling channels 700 is connected to a second vapor channel 350 via a first vapor channel 550. A vapor barrier 310 is coupled to the outlet 790 of the one or more cooling channels 700. A thermal interface element 100 is connected to the outlet 790 of the one or more cooling channels 700 via the vapor barrier 310. The second vapor channel 350 and the first vapor channel 550 guide the vaporized liquid coolant upward and away from the thermal interface element 100 and the heat source, while the one or more cooling channels 700 and the vapor barrier 310 guide the liquefied vapor coolant downward and toward the thermal interface element 100 and the heat source.

[0096] In some embodiments, the thermal interface element 100 includes a flat interface surface 180 and a heat exchange chamber 150. The heat exchange chamber 150 is opposite to the flat interface surface 180. The flat interface surface 180 is in thermal communication with a heat source. In some embodiments, the heat source is a processor. For example, the processor may include a central processing unit, an image processing unit, a neural network processing unit, and a tensor processing unit.

[0097] In some embodiments, the thermal interface element 100 includes a cold plate formed of metal. In some embodiments, the thermal interface element 100 includes a bulk material formed of metal. For example, the material forming the thermal interface element 100 may include a metal with high thermal conductivity, such as aluminum, copper, and alloys thereof.

[0098] In some embodiments, the loop-type thermosiphon assembly 10 includes a mounting bracket 900 for mounting the flat interface surface 180 of the thermal interface element 100 to a processor or a processor heatsink via fasteners. In some embodiments, the thermal interface element 100 includes a top projection 119 and the mounting bracket 900 includes an opening. The mounting bracket 900 is coupled to the top projection 119 and surrounds the channel 300.

[0099] In some embodiments, the loop thermosiphon assembly 10 includes a thermal interface material (not shown) between the flat interface surface 180 and the processor or between the flat interface surface 180 and the heat sink to achieve efficient heat transfer between them.

[0100] In some embodiments, the heat exchange chamber 150 includes a plurality of heat transfer fins 155. In some embodiments, these heat transfer fins 155 include one or more columnar fins. The one or more columnar fins are substantially perpendicular to the heat source and are used to achieve low thermal resistance. For example, the cross-sectional shape of the one or more columnar fins may include circular, elliptical, rhomboid, square, and triangular shapes.

[0101] In some embodiments, the loop thermosiphon assembly 10 further includes a heat exchanger 620 coupled to the one or more cooling ducts 700. The heat exchanger 620 includes a plurality of stacked horizontal fins arranged in a tower-like structure to increase the rate of heat transfer to the environment by increasing convection. Each of these stacked horizontal fins has a large surface area to dissipate heat and maintain airflow through the heat exchanger 620. For example, these stacked horizontal fins are coupled to a vertical portion 750 of the one or more cooling ducts 700. These stacked horizontal fins extend from the vertical portion 750 of the one or more cooling ducts 700. These stacked horizontal fins are stacked on top of each other to transfer heat from the one or more cooling ducts 700 at different heights. The heat exchanger 620 dissipates the heat of the liquefied vapor coolant within the one or more cooling ducts 700 to the air flowing through these stacked horizontal fins. In some embodiments, one or more fans (not shown) may be used to blow air through the heat exchanger 620. The heat exchanger 620 can be formed using metals with high thermal conductivity, such as aluminum, copper, and their alloys.

[0102] In some embodiments, the one or more cooling flow channels 700 include fourteen cooling flow channels. In some embodiments, the one or more cooling flow channels 700 include one or more portions (or vertical portions 750) that substantially vertically guide the liquefied vapor coolant to the thermal interface element 100 and the heat source.

[0103] In some embodiments, the first vapor passage 550 and the passage 300 define the vapor chamber 500. Figure 3 This illustration depicts various embodiments according to the present invention. Figure 1A The diagram shows a perspective view of the vapor chamber 500 of the loop-type thermosiphon assembly 10 and the one or more cooling pipes 700. The vapor chamber 500 includes a first side 510, a second side 520, a third side 530, and a fourth side 540. The first side 510 is coupled to the second side 520 at its peripheral edge. The first side 510 is coupled to the fourth side 540 at its peripheral edge opposite to the peripheral edge coupled to the second side 520. The second side 520 is coupled to the third side 530 at its peripheral edge opposite to the peripheral edge coupled to the first side 510. The third side 530 is coupled to the fourth side 540 at its peripheral edge opposite to the peripheral edge coupled to the second side 520. The input end 710 and output end 790 of the one or more cooling pipes 700 are coupled to the first side 510, the second side 520, the third side 530 and the fourth side 540 respectively through through holes corresponding to the first side 510, the second side 520, the third side 530 and the fourth side 540.

[0104] In some embodiments, the one or more cooling flow pipes 700 include at least two curved portions 713, 793 extending from opposite ends of each of the vertical portions 750 toward a first side 510, a second side 520, a third side 530, and a fourth side 540, such that an input end 710 and an output end 790 can be coupled to the first side 510, the second side 520, the third side 530, and the fourth side 540.

[0105] In some embodiments, two of the fourteen cooling pipes are coupled to at least one of a first side 510, a second side 520, a third side 530, and a fourth side 540. Each of the two cooling pipes includes two bends 715, 795 in the horizontal direction, allowing the two cooling pipes to protrude in opposite directions beyond the plane of the relative peripheral edges of one of the first side 510, the second side 520, the third side 530, and the fourth side 540. For example, the two cooling pipes coupled to the third side 530 bend in two opposite directions, forming two opposing upside-down L-shapes in top view, so that air can flow over the vertical portion 750 of each of the one or more cooling pipes 700 as it flows along the direction from the first side 510 to the third side 530 through the stacked horizontal fins.

[0106] In some embodiments, the vapor chamber 500 includes an internal protrusion 519 projecting inwardly from a first side 510, a second side 520, a third side 530, and a fourth side 540. The top of the vapor barrier 310 is coupled to the bottom of the internal protrusion 519, and the width of the internal protrusion 519 is greater than the width of the vapor barrier 310. The internal protrusion 519 prevents liquefied vapor coolant from the first vapor passage 550 from flowing down to the output end 790 of the one or more cooling flow tubes 700.

[0107] In some embodiments, the vapor chamber 500 is coupled to the thermal interface element 100 via a top protrusion 119. In some embodiments, the loop thermosiphon assembly 10 further includes a plurality of gaskets G. For example, these gaskets G form a waterproof seal at the coupling between the vapor chamber 500 and the top protrusion 119, and at the coupling between the inlet 710 and outlet 790 of the one or more cooling flow tubes 700 and the first side 510, the second side 520, the third side 530, and the fourth side 540.

[0108] Figure 4AFigure 4B shows a cross-sectional view of the loop-type thermosiphon assembly 10. In some embodiments, the vapor barrier 310 includes a porous liner 310A. The porous liner 310A includes a plurality of pores, which are used to guide liquefied vapor coolant from the outlet 790 through the porous liner 310A to the thermal interface element 100. In some embodiments, the porous liner 310A includes a metal foam liner. For example, the material forming the foam liner may include a high thermal conductivity metal, such as aluminum, copper, and alloys thereof.

[0109] In some embodiments, the heat exchange chamber 150 includes a capillary wicking layer 110. The capillary wicking layer 110 covers the surfaces of the plurality of heat transfer fins 155 and the heat exchange chamber 150 to reduce thermal resistance and improve the ability to handle higher heat fluxes. The capillary wicking layer 110 includes a plurality of capillary pores. In some embodiments, the capillary wicking layer 110 can be formed by 3D printing, electroplating, sintering, or any other suitable process to control the pore size of the capillary wicking layer 110. In some embodiments, the capillary wicking layer 110 includes a sintered metal core structure. For example, the material forming the sintered metal core structure can include a highly thermally conductive metal, such as aluminum, copper, and alloys thereof.

[0110] In some embodiments, the porous liner 310A is coupled to the capillary wicking layer 110, allowing liquefied vapor coolant to flow through the plurality of pores in the porous liner 310A to the capillary pores in the capillary wicking layer 110. In some embodiments, the pore size of these capillary pores is smaller than that of the porous liner, thereby generating higher capillary pressure in these capillary pores to prevent liquefied vapor coolant from flowing back into the pores of the porous liner and to prevent liquid coolant from flowing into the pores of the porous liner.

[0111] Figure 5This is a side sectional view along section line B-B' illustrating a loop thermosiphon assembly 10 according to various embodiments of the present invention. As an example, when the loop thermosiphon assembly of the present invention is in use, heat enters the heat exchange chamber 150 of the heat interface element 100 from a heat source (not shown) through the inner wall of the flat interface surface 180 and a plurality of heat transfer fins 155. Heat is transferred from the inner wall and these heat transfer fins 155 to the capillary wicking layer 110 and then to the liquid coolant within the heat exchange chamber 150. The heat causes the liquid coolant to vaporize. The vaporized liquid coolant flows through the second vapor passage 350 and the first vapor passage 550 to the inlet 710 of the one or more cooling pipes 700. The temperature difference within the one or more cooling pipes 700 causes the vaporized coolant to liquefy. The heat exchanger 620 dissipates heat from the liquefied vapor coolant to the air flowing through the one or more cooling pipes 700 and these stacked horizontal fins. The liquefied vapor coolant flows through the output end 790 of the one or more cooling flow pipes 700 and the vapor barrier 310 to the heat exchange chamber 150 of the thermal interface element 100. The heat transfer rate of the loop thermosiphon assembly of this invention is higher than that of similar or analogous loop thermosiphon assemblies that do not include the channel 300 and related embodiments and features.

[0112] Figures 6 to 8B This illustration depicts another loop thermosiphon assembly 10 according to various embodiments of the present invention. This yet other loop thermosiphon assembly 10B may be similar in some respects to... Figures 1A to 4B The loop-type thermosiphon assembly 10 shown can therefore be understood with reference to elements of the same element symbol, and will not be described in detail again. In some embodiments, the vapor barrier 310 of the second embodiment of the loop-type thermosiphon assembly 10 includes a solid barrier 319, a plurality of support pillars (not shown), and a plurality of gaps (not shown). The solid barrier 319 is lined with a porous liner 310B opposite to the output end 790 and is used to separate the vaporized liquid coolant from the output end 790 and the porous liner 310B. The solid barrier 319 is coupled to the top protrusion 119 of the thermal interface element 100 via these support pillars. Each of these gaps is located between adjacent support pillars. A capillary wicking layer 110 is located within these gaps and is used to guide the liquefied vapor coolant from the output end 790 to the thermal interface element 100.

[0113] Figures 9 to 11B This illustration depicts yet another loop thermosiphon assembly 10 according to various embodiments of the present invention. This yet another loop thermosiphon assembly 10 may be similar in some respects to... Figures 1A to 4BThe loop-type thermosiphon assembly 10 shown can therefore be understood with reference to elements of the same element symbol, and will not be described in detail again. In some embodiments, the vapor barrier 310 of the third embodiment of the loop-type thermosiphon assembly 10 includes a solid barrier 319, a chamber bag 310C, and a plurality of support pillars (not shown) and a plurality of gaps (not shown). The solid barrier 319 is used to separate the vaporized liquid coolant from the output end 790 and the chamber bag 310C. The solid barrier 319 is coupled to the top protrusion 119 of the thermal interface element 100 via these support pillars. Each of these gaps is located between adjacent support pillars. A capillary wicking layer 110 is located within these gaps, and the chamber bag 310C and the capillary wicking layer 110 are used to guide the liquefied vapor coolant from the output end 790 to the thermal interface element 100.

[0114] Figures 12 to 16B This illustration depicts another loop thermosiphon assembly 10 according to various embodiments of the present invention. The other loop thermosiphon assembly 10 may be similar in some respects to... Figures 1A to 4B The loop-type thermosiphon assembly 10 shown can therefore be understood by referring to components with the same element symbols, and will not be described in detail again. In some embodiments, the vapor barrier 310 of the fourth embodiment of the loop-type thermosiphon assembly 10D includes a modified solid barrier 319D, a plurality of chamber bags 310D, a plurality of support pillars (not shown), and a plurality of gaps (not shown). The modified solid barrier 319D is used to separate the vaporized liquid coolant from the output end 790 and these chamber bags 310D. The modified solid barrier 319D is coupled to the top protrusion 119 of the thermal interface element 100 via these support pillars. Each of these gaps is located between adjacent support pillars. Each of these chamber bags 310D includes a plurality of flow channel structures 315 coupled to the modified solid barrier 319D. The output end 790 of the one or more cooling flow tubes 700 includes a cutout 791. The capillary wicking layer 110 is located within these gaps, and the flow channel structures 315 of these chamber bags 310D and the capillary wicking layer 110 are used to guide the liquefied vapor coolant from the cutout 791 of the output end 790 to the thermal interface element 100.

[0115] The heat transfer rate of the loop-type thermosiphon assemblies 10, 10B, 10C, and 10D of this invention is higher than that of similar or related loop-type thermosiphon assemblies that do not include channel 300 and related embodiments and features. The output end 790 of the one or more cooling pipes 700 is coupled to a vapor barrier 310 instead of the heat exchange chamber 150 to achieve turbulent filling of the heat exchange chamber 150 by gravity, thereby improving the evaporation rate. When the vaporized liquid coolant flows through the second vapor channel 350, the vapor barrier 310 relieves and prevents the vaporized liquid coolant from flowing to the output end 790, thereby increasing the vapor flow rate. Furthermore, the internal protrusion 519 prevents liquefied vapor coolant from the first vapor channel 550 from flowing down to the output end 790 of the one or more cooling pipes 700, thereby ensuring that the liquefied vapor coolant flows from the output end 790 to the heat exchange chamber 150. Multiple stacked horizontal fins coupled to the vertical portions 750 of the one or more cooling pipes 700 efficiently dissipate heat from the liquefied vapor coolant within the one or more cooling pipes 700 into the air flowing through these stacked horizontal fins. Furthermore, the pore size of the multiple capillary pores in the capillary wicking layer 110 is smaller than that of the porous liner 310A, creating higher capillary pressure within these pores. This prevents the liquefied vapor coolant flowing to the heat exchange chamber 150 from flowing back into these pores, maximizing the filling effect of the heat exchange chamber 150. When the output end 790 is coupled to the vapor barrier 310, turbulent filling occurs in the heat exchange chamber 150. Separation of the output end 790 from the second vapor passage 350 improves the evaporation rate and filling ratio, thereby mitigating and preventing dry-out phenomena at high heat fluxes and mitigating and preventing the limitation of maximum heat flow due to flooding. The filling ratio and coolant flow rate are increased, which increases the heat transfer rate and improves the efficiency of the loop thermosiphon components 10, 10B, 10C, and 10D of this invention, while preventing drying out and flooding.

[0116] Therefore, the embodiments disclosed herein are well adapted to achieve the stated purposes and advantages, as well as those inherent therein. The specific embodiments disclosed above are merely illustrative, as those skilled in the art who benefit from the teachings of this invention can modify and implement the disclosed embodiments in different but equivalent ways. Furthermore, no limitation is intended on the details of the construction or design shown in this invention, except as described in the following scope of the invention. It is thus apparent that the specific illustrative embodiments described above can be altered, combined, or modified, and all such changes are considered to be within the scope and spirit of this invention. Exemplary embodiments disclosed herein may be practiced without any elements not specifically disclosed herein and / or any optional elements disclosed herein. While compositions and methods are described as “comprising,” “containing,” or “including” various elements or steps, compositions and methods may also “substantially consist of” or “comprise” various elements and steps. All numbers and ranges disclosed may vary. Whenever a numerical range with a lower and upper limit is disclosed, any number falling within that range and any included range are specifically disclosed. In particular, each numerical range disclosed in this utility model (in the form of "from about a to about b" or equivalently "from about a to b" or equivalently "about a to b") should be understood to list each number and range contained within a broader numerical range. Furthermore, unless the patentee clearly and explicitly defines otherwise, the terms in the utility model scope have their simple, ordinary meaning. Additionally, the antecedent "a" or "an" as used in the utility model scope is defined in this utility model as indicating one or more elements introduced therein.

Claims

1. A loop-type thermosiphon assembly, characterized in that, Include: A thermal interface element for coupling to a heat source to be cooled by the thermal interface element, the thermal interface element comprising a liquid coolant; A channel coupled to the thermal interface element, the channel including a vapor barrier and a second vapor channel, the channel being coupled to the thermal interface element through the vapor barrier and the second vapor channel; A first vapor passage is coupled to the passage, and the first vapor passage is connected to the thermal interface element through the second vapor passage; as well as One or more cooling pipes are coupled to the first vapor passage and the vapor barrier. The one or more cooling pipes include an input end and an output end. The one or more cooling pipes are coupled to the first vapor passage through the input end and to the vapor barrier through the output end. The output end is connected to the thermal interface element through the vapor barrier. The second vapor passage and the first vapor passage guide the vaporized liquid coolant upward and away from the thermal interface element and the heat source, while the one or more cooling pipes and the vapor barrier guide the liquefied vapor coolant downward and toward the thermal interface element and the heat source.

2. The loop-type thermosiphon assembly as described in claim 1, characterized in that, The thermal interface element includes a flat interface surface and a heat exchange chamber, which is opposite to the flat interface surface and is in thermal communication with the heat source.

3. The loop-type thermosiphon assembly as described in claim 2, characterized in that, The heat exchange chamber contains multiple heat transfer fins.

4. The loop-type thermosiphon assembly as described in claim 3, characterized in that, These heat transfer fins comprise one or more columnar fins, which are substantially perpendicular to the heat source.

5. The loop-type thermosiphon assembly as described in claim 3, characterized in that, The vapor barrier includes a porous liner containing a plurality of pores that allow a liquefied vapor coolant to be guided from the output end to the thermal interface element through the porous liner.

6. The loop-type thermosiphon assembly as described in claim 5, characterized in that, The porous liner contains a metal foam liner.

7. The loop-type thermosiphon assembly as described in claim 5, characterized in that, The heat exchange chamber includes a capillary wicking layer that covers the heat transfer fins and the surface of the heat exchange chamber, and the capillary wicking layer includes a plurality of capillary pores.

8. The loop-type thermosiphon assembly as described in claim 7, characterized in that, The porous liner is coupled to the capillary wicking layer, allowing liquefied vapor coolant to flow through the pores of the porous liner to the capillary pores of the capillary wicking layer.

9. The loop-type thermosiphon assembly as described in claim 7, characterized in that, The capillary wicking layer comprises a sintered metal core structure.

10. The loop-type thermosiphon assembly as described in claim 7, characterized in that, These capillary pores have a diameter smaller than that of the pores themselves.

11. The loop-type thermosiphon assembly as described in claim 1, characterized in that, It further includes a heat exchanger coupled to the one or more cooling flow tubes, the heat exchanger comprising a plurality of stacked horizontal fins.

12. The loop-type thermosiphon assembly as described in claim 1, characterized in that, The one or more cooling pipes contain fourteen cooling pipes.

13. The loop-type thermosiphon assembly as described in claim 12, characterized in that, The first steam passage defines a steam chamber including a first side, a second side, a third side, and a fourth side. The first side is coupled to the second side at one peripheral edge, and the first side is coupled to the fourth side at a peripheral edge opposite to the peripheral edge coupled to the second side. The second side is coupled to the third side at a peripheral edge opposite to the peripheral edge coupled to the first side, and the third side is coupled to the fourth side at a peripheral edge opposite to the peripheral edge coupled to the second side. Two of the fourteen cooling pipes are coupled to at least one of the first side, the second side, the third side, and the fourth side. Each of the two cooling pipes includes two bends in the horizontal direction, such that the two cooling pipes protrude in opposite directions beyond the plane of the first side, the second side, the third side, and the fourth side relative to the peripheral edges.

14. The loop-type thermosiphon assembly as described in claim 2, characterized in that, The vapor barrier includes a solid barrier and a chamber bag, the chamber bag being used to guide liquefied vapor coolant from the output end to the thermal interface element, and the solid barrier being used to separate the vaporized liquid coolant from the output end and the chamber bag.

15. The loop-type thermosiphon assembly as described in claim 2, characterized in that, The vapor barrier includes a modified solid barrier and a plurality of chamber bags, each of which includes a plurality of flow channel structures coupled to the modified solid barrier to allow liquefied vapor coolant to be directed from the output end to the thermal interface element. The modified solid barrier is used to separate the vaporized liquid coolant from the output end and the chamber bags.

16. The loop-type thermosiphon assembly as described in claim 5, characterized in that, The vapor barrier includes a solid barrier lining the porous liner opposite the output end, the solid barrier separating the vaporized liquid coolant from the output end and the porous liner.

17. The loop-type thermosiphon assembly as described in claim 1, characterized in that, The one or more cooling flow channels include one or more sections that substantially direct the liquefied vapor coolant to the thermal interface element.

18. The loop-type thermosiphon assembly as described in claim 1, characterized in that, The thermal interface element includes a cold plate formed of metal.

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