Chip unit, heat exchange core body and plate heat exchanger

Abstract

The utility model relates to the technical field of heat exchangers, in particular to a chip unit, a heat exchange core and a plate heat exchanger. The chip unit comprises a first chip and a second chip, the first chip is provided with a first annular cylinder, and a first heat exchange through hole is formed in the first annular cylinder; the second chip and the first chip are in sealed connection, and a first heat exchange flow channel is formed between the first chip and the second chip; the second chip is provided with a second annular cylinder, and a second heat exchange through hole is formed in the second annular cylinder; the first heat exchange through holes and the second heat exchange through holes are communicated to form first circulation runners; wherein the first annular cylinder is sleeved with the second annular cylinder, a circulation gap is formed between the first annular cylinder and the second annular cylinder, and the first circulation runner, the circulation gap and the first heat exchange runner are sequentially communicated. The chip unit can improve the distribution uniformity of a heat exchange medium, so that the heat exchange efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of heat exchanger technology, and more specifically, to a chip unit, a heat exchange core, and a plate heat exchanger. Background Technology

[0002] Plate heat exchangers are highly efficient heat exchange devices widely used in liquid-liquid and vapor-liquid heat exchange processes. A plate heat exchanger consists of multiple parallel metal plates, with flow channels formed between the plates. The heat transfer medium and the heat exchange medium flow through these channels and exchange heat. Heat is transferred from the heat transfer medium to the heat exchange medium, causing the temperature of the heat exchange medium to rise, while the temperature of the heat transfer medium decreases.

[0003] However, existing plate heat exchangers suffer from uneven distribution of the heat exchange medium. Utility Model Content

[0004] The purpose of this invention is to provide a chip unit, a heat exchange core, and a plate heat exchanger, which can improve the uniformity of heat exchange medium distribution, thereby improving heat exchange efficiency.

[0005] The embodiments of this utility model can be implemented as follows:

[0006] In a first aspect, this utility model provides a chip unit, comprising:

[0007] A first chip, the first chip having a first annular cylinder, the first annular cylinder having a first heat exchange through-hole; and

[0008] The second chip is sealed to the first chip, and a first heat exchange channel is formed between the first chip and the second chip; the second chip is provided with a second annular cylinder, and the second annular cylinder is formed with a second heat exchange through hole; the first heat exchange through hole and the second heat exchange through hole are connected to form a first flow channel;

[0009] The second annular cylinder is fitted onto the first annular cylinder, and a flow gap is formed between the first annular cylinder and the second annular cylinder. The first flow channel, the flow gap, and the first heat exchange channel are connected in sequence.

[0010] In an optional embodiment, the first annular cylinder has a first notch; and / or, the second annular cylinder has a second notch.

[0011] In an optional embodiment, the first notch is formed by a recess at the end of the first annular cylinder away from the first chip; and / or, the second notch is formed by a recess at the end of the second annular cylinder away from the second chip.

[0012] In an optional embodiment, the first notch corresponds to the interior of the second annular cylinder, and the second notch corresponds to the interior of the first annular cylinder;

[0013] The first gap and the second gap are set to correspond to each other, so that the first flow channel, the first gap, the second gap and the first heat exchange channel are connected in sequence; or, the first gap and the second gap are set to be staggered, so that the first flow channel, the first gap, the flow gap, the second gap and the first heat exchange channel are connected in sequence.

[0014] In an optional embodiment, the first annular cylinder is formed by stamping and folding a portion of the wall surface of the first chip at the position corresponding to the first heat exchange through hole; and / or,

[0015] The second annular cylinder is formed by stamping and folding a portion of the wall surface of the second chip at the position corresponding to the second heat exchange through hole.

[0016] In an optional embodiment, the first annular cylinder includes a first partition portion and a first fitting portion connected to each other; the first partition portion extends in a direction away from the second chip, the inner edge of the first partition portion is connected to the outer edge of the first fitting portion, the outer edge of the first partition portion is connected to the first chip, and a first heat exchange through hole is formed in the first fitting portion; the side of the first partition portion away from the second chip is used for a sealing fit with the second partition portion of another chip unit; a first transition channel is formed on the side of the first partition portion near the second chip; and / or,

[0017] The second annular cylinder includes a second partition portion and a second fitting portion connected to each other; the second partition portion extends along the direction of the first chip, the inner edge of the second partition portion is connected to the outer edge of the second fitting portion, the outer edge of the first partition portion is connected to the first chip, and a second heat exchange through hole is formed in the second fitting portion; the side of the second partition portion away from the first chip is used for sealing with the first partition portion of another chip unit; a second transition flow channel is formed on the side of the second partition portion close to the first chip.

[0018] The first assembly is fitted onto the second assembly, and a flow gap is formed between the first assembly and the second assembly; the first flow channel, the flow gap, the first transition channel, the second transition channel, and the first heat exchange channel are connected in sequence.

[0019] In an optional embodiment, the first chip is further provided with a third partition portion; the second chip is further provided with a fourth partition portion; the third partition portion protrudes toward the second chip, and the fourth partition portion protrudes toward the first chip;

[0020] The side of the third partition closest to the second chip is used for a sealing fit with the fourth partition of another chip unit; the side of the fourth partition closest to the first chip is used for a sealing fit with the third partition of another chip unit.

[0021] Secondly, this utility model provides a heat exchange core, comprising a plurality of the aforementioned chip units stacked sequentially; a second heat exchange channel is formed between two adjacent chip units;

[0022] The first chip is also provided with a first heat exchange through hole, and the second chip is also provided with a second heat exchange through hole. The first heat exchange through hole and the second heat exchange through hole are connected to form a second flow channel.

[0023] The second flow channel is connected to the second heat exchange channel.

[0024] In an optional implementation, the height of the first heat exchange channel is H1; the height of the second heat exchange channel is H2; wherein, H1≤H2.

[0025] Thirdly, this utility model provides a plate heat exchanger, including a top plate, a bottom plate, and the aforementioned heat exchange core, wherein the top plate and the bottom plate are respectively fixedly connected to both sides of the heat exchange core.

[0026] The beneficial effects of the chip unit, heat exchange core, and plate heat exchanger provided in this embodiment of the invention include:

[0027] The chip unit includes a first chip and a second chip. The first chip is provided with a first annular cylinder, and the first annular cylinder forms a first heat exchange through hole. The second chip is sealed to the first chip, and a first heat exchange channel is formed between the first chip and the second chip. The second chip is provided with a second annular cylinder, and the second annular cylinder forms a second heat exchange through hole. The first heat exchange through hole and the second heat exchange through hole are connected to form a first flow channel. The second annular cylinder is fitted into the first annular cylinder, and a flow gap is formed between the first annular cylinder and the second annular cylinder. The first flow channel, the flow gap, and the first heat exchange channel are connected in sequence. This allows the heat exchange medium in the first flow channel to enter the first heat exchange channel through the flow gap, thereby preventing a large amount of heat exchange medium from accumulating at the bottom of the plate heat exchanger, improving the uniformity of heat exchange medium distribution, and thus improving heat exchange efficiency. Attached Figure Description

[0028] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a schematic diagram of the plate heat exchanger provided in this embodiment;

[0030] Figure 2 This is a cross-sectional view of the heat exchange core provided in this embodiment from a first perspective.

[0031] Figure 3 This is a cross-sectional schematic diagram of the heat exchange core from a second perspective provided in this embodiment;

[0032] Figure 4 This is a cross-sectional schematic diagram of the chip unit provided in this embodiment;

[0033] Figure 5 This is a schematic diagram of the structure of the first chip provided in this embodiment;

[0034] Figure 6 for Figure 5 A magnified view of a section at point A in the middle;

[0035] Figure 7 This is a schematic diagram of the structure of the second chip provided in this embodiment;

[0036] Figure 8 for Figure 7 A magnified view of a section at point B in the middle;

[0037] Figure 9 This is a schematic diagram of the top plate provided in this embodiment;

[0038] Figure 10 This is a schematic diagram of the base plate provided in this embodiment.

[0039] Icons: 100 - Chip unit; 110 - First chip; 111 - First heat exchange through-hole; 112 - First annular cylinder; 1121 - First partition; 1122 - First fitting part; 113 - First notch; 114 - First sealing part; 115 - First heat exchange through-hole; 116 - Third partition; 120 - Second chip; 121 - Second heat exchange through-hole; 122 - Second annular cylinder; 1221 - Second partition; 1222 - Second fitting part; 123 - Second notch; 124 - Second sealing part; 125 - Second heat exchange through-hole; 12 6-Fourth partition section; 101-First heat exchange channel; 102-First flow channel; 103-Flow gap; 104-Second heat exchange channel; 105-Second flow channel; 106-First transition channel; 107-Second transition channel; 200-Heat exchange core; 300-Plate heat exchanger; 310-Top plate; 311-Third heat exchange through hole; 312-Third heat exchange through hole; 313-Fifth partition section; 314-Third sealing section; 320-Bottom plate; 321-Fourth heat exchange through hole; 322-Sixth partition section; 323-Fourth sealing section. Detailed Implementation

[0040] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0041] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0042] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0043] In the description of this utility model, it should be noted that if terms such as "upper," "lower," "inner," or "outer" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the utility model product is usually placed during use, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0044] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0045] It should be noted that, where there is no conflict, the features in the embodiments of this utility model can be combined with each other.

[0046] Please refer to Figures 1-4 , Figure 1 This is a schematic diagram of the plate heat exchanger 300 provided in this embodiment; Figure 2 This is a cross-sectional view of the heat exchange core 200 provided in this embodiment from a first perspective. Figure 3 This is a cross-sectional view of the heat exchange core 200 provided in this embodiment from a second perspective. Figure 4 This is a cross-sectional schematic diagram of the chip unit 100 provided in this embodiment.

[0047] This utility model provides a plate heat exchanger 300, which includes a top plate 310, a bottom plate 320, and a heat exchange core 200. The top plate 310 and the bottom plate 320 are respectively fixedly connected to both sides of the heat exchange core 200. The heat exchange core 200 includes a plurality of stacked chip units 100, and a second heat exchange channel 104 is formed between two adjacent chip units 100. The chip unit 100 includes a first chip 110 and a second chip 120 sealed together, and a first heat exchange channel 101 is formed between the first chip 110 and the second chip 120.

[0048] In this embodiment, the top plate 310, heat exchange core 200, and bottom plate 320 are fixedly connected together by welding. In other embodiments, the top plate 310, heat exchange core 200, and bottom plate 320 can also be fixedly connected together by screws. It should be noted that the top plate 310, heat exchange core 200, and bottom plate 320 are sealed together to prevent the heat exchange medium and the medium to be exchanged from flowing to the outside.

[0049] Understandably, the heat exchange core 200 comprises multiple stacked heat exchange cores 200, and each chip unit 100 has a first heat exchange channel 101 formed by a first chip 110 and a second chip 120. A second heat exchange channel 104 is formed between two adjacent chip units 100. Therefore, the heat exchange core 200 has multiple alternating first heat exchange channels 101 and multiple second heat exchange channels 104. The medium to be heat exchanged flows in the second heat exchange channel 104, while the heat exchange medium flows in the first heat exchange channel 101. The medium to be heat exchanged and the heat exchange medium exchange heat through the first chip 110 and the second chip 120.

[0050] It should be noted that in this embodiment, the heat exchange medium is a high-temperature medium, which can be a gas or a liquid; the heat exchange medium is a low-temperature medium, which can also be a gas or a liquid; the high-temperature medium transfers heat to the low-temperature medium, thereby achieving heat exchange.

[0051] In other embodiments, the heat exchange medium can be a low-temperature medium, and the heat exchange medium can be a high-temperature medium. Different heat exchange media can be selected to exchange heat with different heat exchange media according to the actual situation.

[0052] Based on the above, please refer to... Figures 1-10 , Figure 5 This is a schematic diagram of the structure of the first chip 110 provided in this embodiment; Figure 6 for Figure 5 A magnified view of a section at point A in the middle; Figure 7 This is a schematic diagram of the structure of the second chip 120 provided in this embodiment; Figure 8 for Figure 7 A magnified view of a section at point B in the middle; Figure 9 This is a structural schematic diagram of the top plate 310 provided in this embodiment; Figure 10 This is a structural schematic diagram of the base plate 320 provided in this embodiment.

[0053] In this embodiment, the first chip 110 is provided with a first annular cylinder 112, and the first annular cylinder 112 forms a first heat exchange through hole 111; the second chip 120 is provided with a second annular cylinder 122, and the second annular cylinder 122 forms a second heat exchange through hole 121; the first heat exchange through hole 111 and the second heat exchange through hole 121 are connected to form a first flow channel 102; the first flow channel 102 is connected to the first heat exchange channel 101. The first chip 110 is also provided with a first heat exchange through hole 115, and the second chip 120 is also provided with a second heat exchange through hole 125; the first heat exchange through hole 115 and the second heat exchange through hole 125 are connected to form a second flow channel 105, and the second flow channel 105 is connected to the second heat exchange channel 104.

[0054] In this embodiment, the first chip 110 and the first annular cylinder 112 are integrally formed, which simplifies the molding process of the chip unit 100 and ensures a stable connection between the first chip 110 and the first annular cylinder 112. Similarly, the second chip 120 and the second annular cylinder 122 are integrally formed, which also simplifies the molding process of the chip unit 100 and ensures a stable connection between the second chip 120 and the second annular cylinder 122.

[0055] In other embodiments, the first chip 110 and the first annular cylinder 112 can also be separate structures that are then welded together, and the second chip 120 and the second annular cylinder 122 can also be separate structures that are then welded together.

[0056] Understandably, in order to prevent the heat exchange medium and the medium to be exchanged from flowing to the outside, the first chip 110 and the second chip 120 should be sealed together so that the inside of the chip unit 100 is a closed space.

[0057] It should be noted that, in this embodiment, the top plate 310 is provided with a third heat exchange through hole 311 and a third heat exchange through hole 312. The third heat exchange through hole 311 is connected to the first flow channel 102, and the third heat exchange through hole 312 is connected to the second flow channel 105. The top plate 310 is also connected to a first pipe and a second pipe. The first pipe is connected to the third heat exchange through hole 311, thereby connecting the first pipe and the first flow channel 102, allowing the heat exchange medium to be introduced into the first flow channel 102 through the first pipe. The second pipe is connected to the third heat exchange through hole 312, thereby connecting the second pipe and the second flow channel 105, allowing the heat exchange medium to be introduced into the second flow channel 105 through the second pipe.

[0058] Understandably, the heat exchange medium flows into the first flow channel 102 from the first pipe, and then into the first heat exchange channel 101. The medium to be heat exchanged flows into the second flow channel 105 from the second pipe, and then into the second heat exchange channel 104. Each first heat exchange channel 101 is located between two second heat exchange channels 104, so that the heat exchange medium, during its flow in the first heat exchange channel 101, exchanges heat with the medium to be heat exchanged flowing in the second heat exchange channel 104, thereby exchanging heat with the medium to be heat exchanged.

[0059] It should be noted that in this embodiment, each first chip 110 has two first heat exchange through holes 111, and each second chip 120 has two second heat exchange through holes 121; each first heat exchange through hole 111 is connected to a second heat exchange through hole 121 to form a first flow channel 102; therefore, this embodiment has two first flow channels 102.

[0060] A first flow channel 102 is connected to the same end of a plurality of first heat exchange channels 101; therefore, two first flow channels 102 are located at both ends of the first heat exchange channels 101; and the two first flow channels 102 can be divided into a heat exchange medium inlet channel and a heat exchange medium outlet channel.

[0061] Understandably, the heat exchange medium flows into the heat exchange medium inlet channel from the first pipe, and then enters the first heat exchange channel 101 through the heat exchange medium inlet channel. After flowing out of the first heat exchange channel 101, the heat exchange medium enters the heat exchange medium outlet channel. When the heat exchange medium flows out of the first heat exchange channel 101, since the heat exchange medium has already completed heat exchange with the medium to be exchanged, the temperature of the heat exchange medium located in the heat exchange medium outlet channel is higher than the temperature of the heat exchange medium located in the heat exchange medium inlet channel.

[0062] Similarly, in this embodiment, each first chip 110 is provided with two first heat exchange holes 115, and each second chip 120 is provided with two second heat exchange holes 125; each first heat exchange hole 115 corresponds to a second heat exchange hole 125 and is connected to form a second flow channel 105; therefore, this embodiment has two second flow channels 105.

[0063] A second flow channel is connected to the same end of a plurality of second heat exchange channels 104; therefore, two second flow channels 105 are located at both ends of the second heat exchange channels 104; and the two second flow channels 105 can respectively have one heat exchange medium flowing into the channel and one heat exchange medium flowing out of the channel.

[0064] Understandably, the heat exchange medium flows into the heat exchange medium inlet channel through the second pipe, and then enters the second heat exchange channel 104. After flowing out of the second heat exchange channel 104, the heat exchange medium enters the heat exchange medium inlet / outlet channel. When the heat exchange medium flows out of the second heat exchange channel 104, since the heat exchange medium has already completed heat exchange with the heat exchange medium, the temperature of the heat exchange medium located in the heat exchange medium outlet channel is lower than the temperature of the heat exchange medium located in the heat exchange medium inlet channel.

[0065] In other embodiments, the number of the first heat exchange through hole 111, the second heat exchange through hole 121, the first heat exchange through hole 115, and the second heat exchange through hole 125 can be adjusted according to the actual situation.

[0066] According to the above, the base plate 320 is provided with a fourth heat exchange through hole 321, which is connected to a first heat exchange through hole 111 of the first chip 110 at the bottom of the heat exchange core 200 or a second heat exchange through hole 121 of the second chip 120; and the fourth heat exchange through hole 321 is connected to the third pipe, so that after the heat exchange medium completes the heat exchange with the medium to be exchanged, it flows out through the fourth heat exchange through hole 321 and then flows into the third pipe.

[0067] Understandably, the fourth heat exchange through-hole 321 is connected to the heat exchange medium outflow so that the heat exchange medium can flow out after the heat exchange is completed.

[0068] In this embodiment, the top plate 310 is provided with two third heat exchange through holes 311. One third heat exchange through hole 311 is connected to the first pipe and the heat exchange medium inflow channel, and the other third heat exchange through hole 311 is connected to the third pipe and the heat exchange medium outflow channel. This allows the heat exchange medium to flow out through the third heat exchange through hole 311 connected to the heat exchange medium outflow channel after heat exchange is completed, thereby preventing the heat exchange medium from remaining inside the heat exchange core 200 after heat exchange is completed.

[0069] Further, please refer to Figures 1-10 The first chip 110 is provided with a first annular cylinder 112, and the first annular cylinder 112 forms a first heat exchange through hole 111; the second chip 120 is provided with a second annular cylinder 122, and the second annular cylinder 122 forms a second heat exchange through hole 121; it is understood that the periphery of the first heat exchange through hole 111 extends towards the side of the second chip 120 to form the first annular cylinder 112; the periphery of the second heat exchange through hole 121 extends towards the side of the first chip 110 to form the second annular cylinder 122; the second annular cylinder 122 is fitted into the first annular cylinder 112, and a flow gap 103 is formed between the first annular cylinder 112 and the second annular cylinder 122, and the first flow channel 102, the flow gap 103 and the first heat exchange channel 101 are connected in sequence.

[0070] Specifically, in this embodiment, the first chip 110 is located above the second chip 120, and the diameter of the first annular cylinder 112 is smaller than the diameter of the second annular cylinder 122. Therefore, the second annular cylinder 122 located below is fitted onto the first annular cylinder 112 located above.

[0071] In other embodiments, the first chip 110 may also be located below the second chip 120, so that the upper second annular cylinder 122 is fitted onto the lower first annular cylinder 112.

[0072] It should be noted that the first annular cylinder 112 is formed by stamping and folding a portion of the wall surface of the first chip 110 at the position corresponding to the first heat exchange through hole 111; the second annular cylinder 122 is formed by stamping and folding a portion of the wall surface of the second chip 120 at the position corresponding to the second heat exchange through hole 121. Understandably, in this embodiment, the first annular cylinder 112 and the second annular cylinder 122 are formed by stamping. The diameter of the first annular cylinder 112 and the second annular cylinder 122 can be adjusted by adjusting the diameter of the stamping die, so that the second annular cylinder 122 fits onto the first annular cylinder 112.

[0073] In other embodiments, the first annular cylinder 112 or the second annular cylinder 122 can also be formed by other methods, and the forming method can be selected according to the actual situation.

[0074] The first annular cylinder 112 includes a first fitting portion 1122, and the second annular cylinder 122 includes a second fitting portion 1222. The first fitting portion 1122 is fitted onto the second fitting portion 1222, and the first fitting portion 1122 and the second fitting portion 1222 are not in contact, so as to form a flow gap 103. The first flow channel 102, the flow gap 103, and the first heat exchange channel 101 are sequentially connected. It can be understood that the heat exchange medium flows into the first flow channel 102 from the first pipe, flows through the flow gap 103 from the first flow channel 102 to enter the first heat exchange channel 101, thereby exchanging heat with the heat exchange medium in the second heat exchange channel 104.

[0075] Since the heat exchange core 200 is composed of multiple first chips 110 and second chips 120 stacked alternately in the vertical direction, after the heat exchange medium is introduced into the first flow channel 102, it will accumulate at the bottom of the heat exchange core 200 under the action of gravity. In this embodiment, a flow gap 103 is set so that only a portion of the heat exchange medium accumulated at the bottom can enter the first heat exchange medium located below through the flow gap 103 located below. However, the first pipe keeps introducing heat exchange medium into the first flow channel 102, resulting in too much heat exchange medium in the first flow channel 102, causing some heat exchange medium to flow into the flow gap 103 located above, and thus enter the first heat exchange medium located above.

[0076] Therefore, by setting the flow gap 103, this embodiment avoids the heat exchange medium from accumulating at the bottom of the heat exchange core 200, thereby making the flow rate of the heat exchange medium in the multiple first heat exchange channels 101 more consistent and improving the uniformity of the heat exchange medium distribution.

[0077] It should be noted that, in this embodiment, a first heat exchange through hole 111 in the first chip 110 is provided with a first fitting part 1122, and a second heat exchange through hole 121 in the second chip 120 is provided with a second fitting part 1222; the first heat exchange through hole 111 provided with the first fitting part 1122 and the second heat exchange through hole 121 provided with the second fitting part 1222 are connected to form a heat exchange medium flow channel.

[0078] In other embodiments, a plurality of first heat exchange holes 111 on the first chip 110 may be provided with a first fitting portion 1122, and a plurality of heat exchange holes in the second chip 120 may be provided with a second fitting portion 1222.

[0079] Understandably, to ensure the uniformity of the heat exchange medium distribution, the heat exchange medium needs to enter the first heat exchange channel 101 from the first flow channel 102 through the flow gap 103. However, when the heat exchange medium flows out of the first heat exchange channel 101 and enters another first heat exchange channel 101, the flow gap 103 may not be provided, allowing the heat exchange medium to flow directly from the first heat exchange channel 101 into the other first heat exchange channel 101.

[0080] Furthermore, the first partition portion 1121 extends in a direction away from the second chip 120, the inner edge of the first partition portion 1121 is connected to the outer edge of the first assembly portion 1122, the outer edge of the first partition portion 1121 is connected to the first chip 110, and the first heat exchange through hole 111 is formed in the first assembly portion 1122; the side of the first partition portion 1121 away from the second chip 120 is used for sealing and cooperating with the second partition portion 1221 of another chip unit 100; the side of the first partition portion 1121 close to the second chip 120 forms a first transition channel 106. The second annular cylinder 122 also includes a second partition portion 1221 extending along the direction of the first chip 110. The inner edge of the second partition portion 1221 is connected to the outer edge of the second assembly portion 1222. The outer edge of the first partition portion 1121 is connected to the first chip 110. A second heat exchange through hole 121 is formed in the second assembly portion 1222. The side of the second partition portion 1221 away from the first chip 110 is used for sealing with the first partition portion 1121 of another chip unit 100. A second transition channel 107 is formed on the side of the second partition portion 1221 close to the first chip 110.

[0081] Specifically, in this embodiment, the first chip 110 of the same chip unit 100 is located above the second chip 120. The first partition portion 1121 protrudes upward, while the second partition portion 1221 protrudes downward. The first partition portion 1121 is sealed to the second partition portion 1221 of another chip unit 100 located above it, thereby isolating the second heat exchange channel 104 formed between the two chip units 100 and preventing the heat exchange medium in the second heat exchange channel 104 from flowing into the first flow channel 102. The second partition portion 1221 is sealed to the first partition portion 1121 of another chip unit 100 located below it, thereby isolating the second heat exchange channel 104 formed between the two chip units 100 and preventing the heat exchange medium in the second heat exchange channel 104 from flowing into the first flow channel 102.

[0082] A first transition channel 106 is formed on the side of the first partition 1121 near the second chip 120; a second transition channel 107 is formed on the side of the second partition 1221 near the first chip 110; the first flow channel 102, the flow gap 103, the first transition channel 106, the second transition channel 107 and the first heat exchange channel 101 are connected in sequence.

[0083] Understandably, because the first partition 1121 protrudes upward, a first transition channel 106 is formed below the first partition 1121; similarly, because the second partition 1221 protrudes downward, a second transition channel 107 is formed above the second partition 1221; the heat exchange medium enters the first flow channel 102 through the first pipe, and then flows sequentially through the gap, the first transition channel 106 and the second transition channel 107 to enter the first heat exchange channel 101.

[0084] In this embodiment, the second annular cylinder 122 is fitted onto the first annular cylinder 112. Therefore, the heat exchange medium flows from bottom to top in the flow gap 103. So, after the heat exchange medium flows out of the flow gap 103, it will first flow through the first transition channel 106 and then through the second transition channel 107.

[0085] In other embodiments, if the first annular cylinder 112 is fitted onto the first annular cylinder 112, the heat exchange medium will first flow through the second transition channel 107 and then through the first transition channel 106.

[0086] According to the above, in this embodiment, the first chip 110 is provided with a third partition portion 116; the second chip 120 is provided with a fourth partition portion 126; the third partition portion 116 protrudes toward the second chip 120, and the fourth partition portion 126 protrudes toward the first chip 110; the side of the third partition portion 116 near the second chip 120 is used for sealing cooperation with the fourth partition portion 126 of another chip unit 100; the side of the fourth partition portion 126 near the first chip 110 is used for sealing cooperation with the third partition portion 116 of another chip unit 100.

[0087] Specifically, the third partition 116 protrudes towards the second chip 120 around the first heat exchange through hole 115; the fourth partition 126 protrudes towards the first chip 110 around the second heat exchange through hole 125. The first chip 110 is located above the second chip 120. The third partition 116 protrudes downward, while the fourth partition 126 protrudes upward, thereby isolating the second flow channel 105 and the first heat exchange channel 101, preventing the heat exchange medium from entering the first heat exchange channel 101, and simultaneously preventing the heat exchange medium from entering the second flow channel 105.

[0088] In this embodiment, the third heat exchange through hole 311 or the third heat exchange through hole 312 is provided with a fifth partition 313, which protrudes toward the heat exchange core 200.

[0089] Specifically, in this embodiment, the fifth partition 313 protrudes downward. When the third heat exchange through hole 311 is provided with the fifth partition 313, the topmost part of the heat exchange core 200 is the first chip 110. The fifth partition 313 and the first partition 1121 are sealed together to isolate the second heat exchange channel 104.

[0090] The fifth partition 313 protrudes downward. When the third heat exchange through hole 312 is provided with the fifth partition 313, the top of the heat exchange core 200 is the second chip 120. The fifth partition 313 and the second partition 1221 are sealed together to isolate the first heat exchange channel 101.

[0091] The base plate 320 is provided with a fourth heat exchange through hole 321, and a sixth partition part 322 is provided on the fourth heat exchange through hole 321. The sixth partition part 322 is sealed and cooperates with the first partition part 1121 or the second partition part 1221 to isolate the first heat exchange channel 101 or the second heat exchange channel 104.

[0092] In this embodiment, both first heat exchange through holes 111 are provided with first partition portions 1121, both second heat exchange through holes 121 are provided with second partition portions 1221, both first heat exchange through holes 115 are provided with third partition portions 116, both second heat exchange through holes 125 are provided with fourth partition portions 126, both third heat exchange through holes 311 or both third heat exchange through holes 312 are provided with fifth partition portions 313; the fourth heat exchange through hole 321 is provided with a sixth partition portion 322; and a sixth partition portion 322 is also provided on the plate body of the base plate 320; thereby preventing cross-flow between the heat exchange medium and the heat exchange medium, and thus improving the heat exchange efficiency.

[0093] Further, please refer to Figures 1-10 In this embodiment, the first annular cylinder 112 has a first notch 113, which is formed by a recess at the end of the first annular cylinder 112 away from the first chip 110; the second annular cylinder 122 has a second notch 123, which is formed by a recess at the end of the second annular cylinder 122 away from the second chip 120.

[0094] Specifically, in this embodiment, the first notch 113 corresponds to the interior of the second annular cylinder 122, and the second notch 123 corresponds to the interior of the first annular cylinder 112; the first notch 113 and the second notch 123 are correspondingly arranged so that the first flow channel 102, the first notch 113, the second notch 123 and the first heat exchange channel 101 are connected in sequence.

[0095] Understandably, since the heat exchange medium can be either gas or liquid, when the heat exchange medium is liquid, the flow channel of the flow gap 103 is relatively small, making it difficult for the liquid to flow quickly into the first heat exchange channel 101, thus affecting the heat exchange efficiency. Therefore, this embodiment provides a first notch 113 and a second notch 123 to allow the liquid to flow into the first heat exchange channel 101 through the first notch 113 and the second notch 123, ensuring the flow rate of the heat exchange medium in the first heat exchange channel 101, thereby improving the heat exchange efficiency.

[0096] It should be noted that in this embodiment, the height of the first notch 113 is h1, the height of the second notch 123 is h2, the height of the first annular cylinder 112 is l1, and the height of the second annular cylinder 122 is l2; wherein, h1 < l2; h2 < l1. This allows the heat exchange medium to first pass through the first notch 113 and the second notch 123, and then through the flow gap 103 into the first heat exchange channel 101, thereby preventing the heat exchange medium from directly entering the first heat exchange channel 101 through the first notch 113 and the second notch 123; thus preventing a large amount of heat exchange from flowing into the bottom of the first heat exchange channel 101 due to the heat exchange medium accumulating at the bottom of the heat exchange core 200; and improving the uniformity of the heat exchange medium distribution.

[0097] In other embodiments, the first notch 113 and the second notch 123 may be staggered, so that the first flow channel 102, the first notch 113, the flow gap 103, the second notch 123 and the first heat exchange channel 101 are connected in sequence.

[0098] In other embodiments, only the first notch 113 or the second notch 123 may be provided, so that the heat exchange medium located in the first flow channel 102 flows into the first heat exchange channel 101 through the first notch 113 or the second notch 123.

[0099] In other embodiments, the first annular cylinder 112 may have a first notch 113 directly formed, rather than a recess. Similarly, the second annular cylinder 122 may have a second notch 123 directly formed, rather than a recess.

[0100] In other embodiments, the first notch 113 may also be provided on the side wall of the first annular cylinder 112, and the first notch 113 is in the shape of an annular through hole; the second notch 123 may also be provided on the side wall of the second annular cylinder 122, and the second notch 123 is also in the shape of an annular through hole.

[0101] Based on the above, please refer to... Figures 1-10 In this embodiment, the height of the first heat exchange channel 101 is H1, and the height of the second heat exchange channel 104 is H2; wherein, H1≤H2. Specifically, 0.25≤H1:H2≤1.

[0102] It should be noted that, in order to prevent the heat exchange medium from accumulating at the bottom of the heat exchange core 200 under the influence of gravity, causing a large amount of heat exchange core 200 to flow into the bottom of the first heat exchange channel 101, the height of the first heat exchange channel 101 needs to be reduced to control the flow rate of the heat exchange medium flowing into the first heat exchange channel 101, thereby improving the uniformity of the heat exchange medium distribution. Therefore, the height of the first heat exchange channel 101 is smaller than the height of the second heat exchange channel 104.

[0103] However, if the height of the first heat exchange channel 101 is too small, the heat exchange efficiency will decrease. Therefore, the ratio between the height of the first heat exchange channel 101 and the height of the second heat exchange channel 104 needs to be greater than or equal to 0.25.

[0104] Furthermore, a first sealing portion 114 is provided around the periphery of the first chip 110, and a second sealing portion 124 is provided around the periphery of the second chip 120; when the first chip 110 and the second chip 120 are stacked, the first sealing portion 114 and the second sealing portion 124 are sealed together so that the space inside the first chip 110 and the second chip 120 is a sealed space.

[0105] Specifically, the first sealing portion 114 is formed by bending the periphery of the first chip 110 upwards; the second sealing portion 124 is formed by bending the periphery of the second chip 120 upwards; when the first chip 110 and the second chip 120 are stacked, the first sealing portion 114 and the second sealing portion 124 are sealed together; while other parts of the first chip 110 and other parts of the second chip 120 are spaced together to form the first heat exchange channel 101 or the second heat exchange channel 104. In this embodiment, by setting the sealingly fitted first sealing portion 114 and the second sealing portion 124, the internal space of the heat exchange core 200 is a sealed space, thereby allowing the heat exchange medium and the medium to be exchanged to flow within the internal space of the heat exchange core 200, preventing the heat exchange medium and the medium to be exchanged from flowing into the outside.

[0106] According to the above, in this embodiment, the top plate 310 is provided with a third sealing part 314 to seal and cooperate with the first sealing part 114 of the first chip 110 or the second sealing part 124 of the second chip 120 at the top of the heat exchange core 200, so that the heat exchange medium and the heat exchange medium to be exchanged flow inside the plate heat exchanger 300, and prevent the heat exchange medium and the heat exchange medium to be exchanged from flowing to the outside.

[0107] The base plate 320 is provided with a fourth sealing part 323 to seal and cooperate with the first sealing part 114 of the first chip 110 or the second sealing part 124 of the second chip 120 at the bottom of the heat exchange core 200, so that the heat exchange medium and the heat exchange medium to be exchanged flow inside the plate heat exchanger 300 and prevent the heat exchange medium and the heat exchange medium to be exchanged from flowing to the outside.

[0108] In summary, the plate heat exchanger 300 includes a heat exchange core 200 composed of multiple stacked chip units 100, with a second heat exchange channel 104 formed between two adjacent chip units 100. Each chip unit 100 includes a first chip 110 and a second chip 120, which are stacked to form a first heat exchange channel 101. This allows heat exchange between the heat exchange medium in the second heat exchange channel 104 and the heat exchange medium in the first heat exchange channel 101, transferring heat from the heat exchange medium to the heat exchange medium. Because the chip unit 100 has a flow gap 103 for the heat exchange medium to enter the first heat exchange channel 101 from the first flow channel 102, the uniformity of the heat exchange medium distribution is improved, ensuring consistency in heat exchange efficiency within each second heat exchange channel 104 and the first heat exchange channel 101, thereby improving the heat exchange efficiency of the plate heat exchanger 300.

[0109] The above description is only a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model.

Claims

1. A chip unit, characterized in that, include: A first chip (110), the first chip (110) being provided with a first annular cylinder (112), the first annular cylinder (112) being formed with a first heat exchange through hole (111); and A second chip (120) is sealed to the first chip (110), and a first heat exchange channel (101) is formed between the first chip (110) and the second chip (120); the second chip (120) is provided with a second annular cylinder (122), and the second annular cylinder (122) is formed with a second heat exchange through hole (121); the first heat exchange through hole (111) and the second heat exchange through hole (121) are connected to form a first flow channel (102); The second annular cylinder (122) is fitted onto the first annular cylinder (112), and a flow gap (103) is formed between the first annular cylinder (112) and the second annular cylinder (122). The first flow channel (102), the flow gap (103), and the first heat exchange channel (101) are connected in sequence.

2. The chip unit according to claim 1, characterized in that, The first annular cylinder (112) has a first notch (113); and / or, the second annular cylinder (122) has a second notch (123).

3. The chip unit according to claim 2, characterized in that, The first notch (113) is formed by a recess at one end of the first annular cylinder (112) away from the first chip (110); and / or, the second notch (123) is formed by a recess at one end of the second annular cylinder (122) away from the second chip (120).

4. The chip unit according to claim 3, characterized in that, The first notch (113) corresponds to the interior of the second annular cylinder (122), and the second notch (123) corresponds to the interior of the first annular cylinder (112); The first gap (113) and the second gap (123) are respectively arranged so that the first flow channel (102), the first gap (113), the second gap (123) and the first heat exchange channel (101) are connected in sequence; or, the first gap (113) and the second gap (123) are staggered so that the first flow channel (102), the first gap (113), the flow gap (103), the second gap (123) and the first heat exchange channel (101) are connected in sequence.

5. The chip unit according to any one of claims 1-4, characterized in that, The first annular cylinder (112) is formed by stamping and folding a portion of the wall surface of the first chip (110) at the position corresponding to the first heat exchange through hole (111); and / or, The second annular cylinder (122) is formed by stamping and folding a portion of the wall surface of the second chip (120) at the position corresponding to the second heat exchange through hole (121).

6. The chip unit according to any one of claims 1-4, characterized in that, The first annular cylinder (112) includes a first partition portion (1121) and a first fitting portion (1122) connected to each other; the first partition portion (1121) extends in a direction away from the second chip (120), the inner edge of the first partition portion (1121) is connected to the outer edge of the first fitting portion (1122), the outer edge of the first partition portion (1121) is connected to the first chip (110), and the first heat exchange through hole (111) is formed in the first fitting portion (1122); the side of the first partition portion (1121) away from the second chip (120) is used for sealing cooperation with the second partition portion (1221) of another chip unit (100); the side of the first partition portion (1121) near the second chip (120) forms a first transition channel (106); and / or, The second annular cylinder (122) includes a second partition portion (1221) and a second fitting portion (1222) connected to each other; the second partition portion (1221) extends along the direction of the first chip (110), the inner edge of the second partition portion (1221) is connected to the outer edge of the second fitting portion (1222), the outer edge of the first partition portion (1121) is connected to the first chip (110), and the second heat exchange through hole (121) is formed in the second fitting portion (1222); the side of the second partition portion (1221) away from the first chip (110) is used for sealing cooperation with the first partition portion (1121) of another chip unit (100); the side of the second partition portion (1221) close to the first chip (110) forms a second transition channel (107); The first fitting part (1122) is fitted onto the second fitting part (1222), and the flow gap (103) is formed between the first fitting part (1122) and the second fitting part (1222); the first flow channel (102), the flow gap (103), the first transition channel (106), the second transition channel (107) and the first heat exchange channel (101) are connected in sequence.

7. The chip unit according to any one of claims 1-4, characterized in that, The first chip (110) is further provided with a third partition (116); the second chip (120) is further provided with a fourth partition (126); the third partition (116) protrudes toward the second chip (120), and the fourth partition (126) protrudes toward the first chip (110); The third partition (116) is located on the side of the second chip (120) for sealing cooperation with the fourth partition (126) of another chip unit (100); the fourth partition (126) is located on the side of the first chip (110) for sealing cooperation with the third partition (116) of another chip unit (100).

8. A heat exchange core, characterized in that, It includes a plurality of chip units (100) arranged in sequence according to any one of claims 1-7; a second heat exchange channel (104) is formed between two adjacent chip units (100); The first chip (110) is further provided with a first heat exchange through hole (115), and the second chip (120) is further provided with a second heat exchange through hole (125). The first heat exchange through hole (115) and the second heat exchange through hole (125) are connected to form a second flow channel (105). The second flow channel (105) is connected to the second heat exchange channel (104).

9. The heat exchange core according to claim 8, characterized in that, The height of the first heat exchange channel (101) is H1; the height of the second heat exchange channel (104) is H2; wherein, H1≤H2.

10. A plate heat exchanger, characterized in that, It includes a top plate (310), a bottom plate (320), and a heat exchange core (200) as described in claim 8 or 9, wherein the top plate (310) and the bottom plate (320) are respectively fixedly connected to both sides of the heat exchange core (200).

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