Temperature and humidity sensor connected by using elastic sheet
By using a spring-loaded connection and mold injection molding integrated design, the solder connection problem of traditional temperature and humidity sensors is solved, achieving optimization of the product's environmental friendliness, reliability, and appearance dimensions, while enhancing sealing performance and manufacturing efficiency.
Patent Information
- Application Number
- CN202423154580.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-20
- Publication Date
- 2025-12-09
- Estimated Expiration
- 2034-12-20
AI Technical Summary
The solder connection method of traditional temperature and humidity sensors results in poor product stability and reliability, prominent environmental problems, and limits the optimization of product appearance and size.
The use of spring contacts instead of solder connections, by attaching spring contacts to the upper surface of the printed circuit board and forming elastic contact with the PIN pins of the housing, combined with mold injection molding and a sealed structure design, avoids the problem of poor soldering and enhances sealing performance and structural strength.
It improves the product's environmental friendliness and reliability, reduces its size, enhances its waterproof and dustproof performance, simplifies the assembly process, and improves manufacturing efficiency and sealing performance.
Smart Images

Figure CN223649943U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of sensor assembly technology, and in particular to a temperature and humidity sensor using spring contact connection. Background Technology
[0002] With the development of technology, temperature and humidity sensors have been widely used in industrial production, environmental monitoring, smart homes, and other fields. Traditional temperature and humidity sensors typically use soldering to connect the printed circuit board to the housing's pins. While this method can meet the functional requirements of the product to a certain extent, it also has some shortcomings. For example, immature soldering processes or improper operation can lead to cold solder joints, affecting the product's stability and reliability. Furthermore, improper selection of solder wire can cause environmental problems. Most importantly, soldering requires a large operating space for the soldering head, which necessitates more space in the product design, thus limiting the optimization of the product's overall dimensions. Utility Model Content
[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a temperature and humidity sensor using a spring contact connection. By directly surface mounting the spring contact on the printed circuit board and forming an elastic contact connection with the PIN pins of the housing, it is not necessary to leave space for the soldering head as required by the traditional solder connection method, so that the product size can be made smaller.
[0004] To achieve the above objectives, this utility model provides a temperature and humidity sensor using a spring contact connection, comprising:
[0005] The housing has pins mounted on its side walls;
[0006] The printed circuit board is disposed inside the housing and is provided with temperature sensing circuit elements and humidity sensing circuit elements.
[0007] The spring is conductive, S-shaped, with one end surface attached to the printed circuit board and the other end abutting against the end of the PIN pin, forming an elastic contact between the spring and the PIN pin.
[0008] Furthermore, the lower end of the printed circuit board is provided with a groove structure, and a sealing plug is fitted on the groove structure to isolate the external medium.
[0009] Furthermore, it also includes:
[0010] The top cover is located above the printed circuit board section. The top cover is fixed to the housing by a snap fastener and together with the housing, forms the outer shell of the sensor.
[0011] Furthermore, the housing is provided with a glue groove, which is filled with glue to solidify the printed circuit board and the housing.
[0012] Furthermore, glue is injected between the top cover and the housing to secure the top cover and the housing.
[0013] Furthermore, the PIN pin and the housing are integrally formed by injection molding.
[0014] Furthermore, an O-ring is fitted at the lower end of the housing to achieve a seal with the client's product.
[0015] Compared with the prior art, the beneficial effects achieved by this utility model are as follows:
[0016] (1) This utility model directly attaches a spring sheet to the printed circuit board and forms an elastic contact with the PIN pin of the housing, which effectively avoids the problem of poor soldering that may occur in traditional soldering connection methods, thereby improving the environmental protection and reliability of the product. At the same time, since there is no need to reserve space for the soldering head operation, the appearance size of the product can be significantly reduced, which is conducive to the appearance design and size optimization of the product.
[0017] (2) By setting a groove structure at the lower end of the printed circuit board and fitting a sealing plug, this utility model can effectively isolate the influence of external media on the internal circuit of the sensor, enhance the waterproof and dustproof performance of the sensor, and improve the working stability of the sensor in harsh environments.
[0018] (3) By setting a top cover and fixing it to the housing with a buckle, and injecting glue between the top cover and the housing, this utility model not only simplifies the assembly process, but also further enhances the sealing performance and structural strength of the sensor, ensuring the safe and stable operation of the internal components of the sensor.
[0019] (4) This utility model improves the overall integrity and manufacturing efficiency of the product by molding the PIN pin and the housing into one piece, while also ensuring the connection strength and sealing between the PIN pin and the housing.
[0020] (5) By fitting an O-ring at the lower end of the housing, this utility model can effectively achieve a sealed fit with the client's product, further improving the sealing performance of the sensor and ensuring the reliability and accuracy of the sensor in practical applications.
[0021] In summary, the temperature and humidity sensor using a spring-loaded connection provided by this utility model not only improves the stability and reliability of the product, but also optimizes the product's appearance, dimensions, and manufacturing process, thus possessing significant practical value and market prospects. Attached Figure Description
[0022] Figure 1 This is a schematic diagram of the structure of a temperature and humidity sensor using a spring-loaded connection provided in an embodiment of this utility model;
[0023] Figure 2 This is a cross-sectional schematic diagram of a temperature and humidity sensor using a spring-loaded connection provided in an embodiment of this utility model;
[0024] Labeling Explanation: 1. Top Cover; 2. Spring; 3. Printed Circuit Board; 4. Sealing Plug; 5. Glue; 6. Housing; 7. O-ring; 8. Pin. Detailed Implementation
[0025] The present invention will be further described below with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and should not be used to limit the scope of protection of the present invention.
[0026] In the description of this utility model, it should be understood that the terms "upper," "lower," "horizontal," etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.
[0027] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0028] like Figures 1-2 As shown, this embodiment provides a temperature and humidity sensor using a spring contact connection, including:
[0029] The housing 6 has a PIN pin 8 installed on its side wall, and a PIN pin is installed inside the PIN pin 8;
[0030] The printed circuit board 3 is disposed inside the housing 6, and temperature sensing circuit elements and humidity sensing circuit elements are disposed thereon.
[0031] The spring 2 is conductive and S-shaped. One end of its surface is attached to the printed circuit board 3, and the other end is abutted against the end of the PIN pin. The spring 2 and the PIN pin 8 form an elastic contact. As an example, the connection between the spring 2 and the printed circuit board 3 is achieved by SMT automatic press-fit tooling.
[0032] Specifically, the lower end of the printed circuit board section 3 is provided with a groove structure, and a sealing plug 4 is fitted on the groove structure to isolate the external medium.
[0033] Furthermore, the temperature and humidity sensor also includes:
[0034] The upper cover 1 is located above the printed circuit board section 3. The upper cover 1 is fixed to the housing 6 by a snap fastener and together with the housing 6 forms the outer shell of the sensor.
[0035] Specifically, the housing 6 has a glue tank, which is filled with glue 5 to solidify the printed circuit board 3 and the housing 6.
[0036] Optionally, glue 5 is injected between the top cover 1 and the housing 6 to fix the top cover 1 and the housing 6.
[0037] Preferably, the PIN pin 8 and the housing 6 are integrally formed by injection molding.
[0038] Optionally, an O-ring 7 is fitted at the lower end of the housing 6 to achieve a seal with the client's product.
[0039] In use, the spring 2 is fabricated onto the printed circuit board 3 using SMT technology. The sealing plug 4 is directly fitted into the groove structure on the printed circuit board 3. The PIN pin 8 and the housing 6 are integrally molded using a mold. The printed circuit board 3 and the sealing plug 4 are directly inserted into the housing 6 using a tooling, achieving an elastic abutment connection between the spring 2 and the PIN pin 8. There is no need to leave an operating space for the solder gun tip on the housing 6 for soldering the PIN pins on the printed circuit board 3 and the PIN pin 8. After the glue 5 is poured into the glue groove inside the housing 6, the top cover 1 is directly assembled with the housing 6 and secured with clips. Then, the entire assembly is placed in a high-temperature oven for glue curing. Finally, the O-ring 7 is fitted into the groove of the O-ring 7 in the housing 6, completing the assembly of the entire device. Assembly can be automated using tooling.
[0040] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.
Claims
1. A temperature and humidity sensor using a spring contact connection, comprising: The housing (6) has pins (8) mounted on its sidewall; A printed circuit board (3) is disposed within the housing (6), and temperature sensing circuit elements and humidity sensing circuit elements are disposed thereon; characterized in that it further includes: The spring (2) is conductive and S-shaped. One end of the spring is attached to the printed circuit board (3), and the other end is abutted against the end of the PIN pin (8). The spring (2) and the PIN pin (8) form an elastic contact.
2. The temperature and humidity sensor according to claim 1, characterized in that, The lower end of the printed circuit board (3) is provided with a groove structure, and a sealing plug (4) is fitted on the groove structure to isolate the external medium.
3. The temperature and humidity sensor according to claim 1, characterized in that, Also includes: The upper cover (1) is disposed above the printed circuit board (3). The upper cover (1) is fixed to the housing (6) by a snap fastener and together with the housing (6) forms the outer shell of the sensor.
4. The temperature and humidity sensor according to claim 1, characterized in that, The housing (6) has a glue tank, which is filled with glue (5) to solidify the printed circuit board (3) and the housing (6).
5. The temperature and humidity sensor according to claim 3, characterized in that, Adhesive (5) is injected between the upper cover (1) and the shell (6) to fix the upper cover (1) and the shell (6).
6. The temperature and humidity sensor according to claim 1, characterized in that, The PIN pin (8) and the housing (6) are integrally formed by injection molding.
7. The temperature and humidity sensor according to claim 1, characterized in that, An O-ring (7) is fitted at the lower end of the housing (6) to achieve a seal with the client's product.