Chip testing jig

Abstract

The utility model relates to the fields of manufacturing and testing of chip component production equipment in the electronic core industry, manufacturing and testing of special equipment for semiconductor devices and the like, in particular to a chip testing jig. The chip testing jig comprises a base, the middle part of the upper surface of the base is provided with a pressing groove, and the middle part of the pressing groove is provided with a chip groove; the covering piece comprises a covering body; the pressing sheet is arranged below the covering body; the temperature adjusting element is arranged in the pressing piece or the base; the temperature measuring element is arranged in the pressing piece or the base; in the covering state, the covering body is arranged on the upper surface of the base in a pressing mode, and the pressing piece at least partially extends into the pressing groove and is arranged above the chip groove in a pressing mode. In the open state, the covering body is separated from the upper surface of the base, and the pressing pieces are separated from the pressing grooves where the pressing pieces are located. According to the utility model, the signal response of the chip to be tested at different temperatures can be tested, and the chip test range is expanded.

Description

Technical Field

[0001] This utility model relates to the fields of manufacturing and testing equipment for chip components in the core electronics industry, manufacturing and testing equipment for semiconductor devices, and in particular to a chip testing fixture. Background Technology

[0002] Chip test fixtures are standard testing equipment used to test the electrical performance and electrical connections of chips to check for manufacturing defects and component malfunctions. It is a static connector between an IC and a PCB, which makes chip replacement and testing more convenient, eliminating the need for repeated soldering and removal of the chip. This avoids damage to the chip and PCB, thus achieving fast and efficient testing.

[0003] In the process of developing this utility model, the applicant discovered that different types of chips, and different batches of the same type of chip in the research / trial production stage, have different thicknesses. During testing, insufficient pressure often leads to probe mis-connection, while excessive pressure causes chip breakage. Furthermore, for piezoelectric MEMS chips, external force causes substrate deformation, which is transmitted to the piezoelectric MEMS, generating stress that can lead to malfunctions or failures. Therefore, the chip's performance under different pressure environments warrants further investigation.

[0004] Furthermore, temperature control of microchips at the millimeter scale is often achieved through temperature chambers, but this process is slow, difficult to control precisely, and even more difficult to measure and control chip temperature in real time. In particular, different rates of temperature change generate corresponding pyroelectric signals for piezoelectric MEMS devices. To meet the testing requirements for chip functionality under different rates of temperature change, real-time temperature measurement and control of the chip are necessary. MEMS electronic cigarette chips are relatively small, generally between 1.8 and 6 mm in length and width, with vent diameters typically between 0.2 and 0.5 mm. Sealing the test airway is one of the challenges in testing. This is often achieved by reflow soldering the chip onto a PCB measurement board and then using adhesive to bond the air tubes to build the measurement airway. This process is complex, inefficient, and the PCB board is expensive, non-reusable, and the adhesive bonding sealing effect is uncertain. Therefore, creating a reusable measurement fixture that provides a good seal for the vents of the microchip, requiring only the replacement of the chip under test, is cost-effective and necessary. Utility Model Content

[0005] I. Technical problems to be solved

[0006] This invention aims to solve at least partially one of the aforementioned technical problems.

[0007] II. Technical Solution

[0008] This utility model provides a chip testing fixture. The chip testing fixture includes: a base with a pressing groove in the center of its upper surface, and a chip slot in the center of the pressing groove; a cover, including: a cover body; a pressing sheet disposed below the cover body; a temperature regulating element disposed within the pressing sheet or the base; and a temperature measuring element disposed within the pressing sheet or the base; wherein, in the closed state, the cover body is pressed against the upper surface of the base, and the pressing sheet extends at least partially into the pressing groove, pressing above the chip slot; in the open state, the cover body separates from the upper surface of the base, and the pressing sheet detaches from its pressing groove.

[0009] In some embodiments of this utility model, the pressing sheet has a temperature regulating element groove; the temperature regulating element is disposed in the temperature regulating element groove; a chip groove air passage is disposed inside the base below a preset position at the bottom of the chip groove; M probe holes are disposed at a preset position at the bottom of the chip groove, M≥1; wherein, M probes are disposed inside the base, and their front ends extend upward through the corresponding probe holes.

[0010] In some embodiments of this utility model, the pressing sheet has a temperature measuring element groove; the temperature measuring element is disposed in the temperature measuring element groove.

[0011] In some embodiments of this utility model, the temperature regulating element is filled with thermally conductive silicone grease in the temperature regulating element slot, and the temperature measuring element is encapsulated in the temperature measuring element slot and then filled in.

[0012] In some embodiments of this utility model, the temperature sensing element is filled with thermally conductive silicone grease in the temperature sensing element slot, and the temperature regulating element is encapsulated in the temperature regulating element slot and then filled in.

[0013] In some embodiments of this utility model, 0.1mm≤H6-H7≤0.5mm, where H6 and H7 are the thicknesses of the temperature regulating element groove and the temperature regulating element, respectively.

[0014] In some embodiments of this utility model, 0.1mm≤H8-H9≤0.5mm, where H8 and H9 are the thicknesses of the temperature sensing element groove and the temperature sensing element, respectively.

[0015] In some embodiments of this utility model, the pressing sheet portion on the side of the temperature regulating element slot and / or temperature measuring element slot is provided with a pressing sheet lead wire slot; the cover body is provided with a cover part lead wire hole; the cable of the temperature regulating element and / or temperature measuring element is led out from the pressing sheet lead wire slot and the cover part lead wire slot to the side of the cover body.

[0016] In some embodiments of this utility model, the temperature regulating element is a heating element or a cooling element; the heating element is one of the following: a metal wire heating plate or a ceramic heating plate; the cooling element is a Peltier element.

[0017] In some embodiments of this utility model, the temperature sensing element is one of the following: a resistance temperature sensor or a thermocouple temperature sensor.

[0018] In some embodiments of this utility model, it further includes: a circuit board fixed to the lower surface of the base; wherein the rear end of the probe is connected to the corresponding pad on the circuit board; wherein the chip slot air channel extends downward to the circuit board; or, extends downward first and then to the side of the base.

[0019] In some embodiments of this invention, the chip slot air passage is shaped like an inverted horn.

[0020] In some embodiments of this utility model, a gasket groove is provided on the top outer side of the chip slot air channel; an elastic gasket is disposed in the gasket groove between the air pressure sensing hole of the chip under test and the chip slot air channel.

[0021] In some embodiments of this utility model, the chip slot air channel extends downward to the circuit board; a circuit board air hole is provided at the corresponding position on the circuit board below the chip slot air channel; the chip testing fixture also includes: an air path connector, fixed below the circuit board, and an connector air channel is provided inside corresponding to the circuit board air hole; the chip slot air channel, the circuit board air hole, and the connector air channel together form a test air channel, and the test air channel is generally in the shape of an inverted funnel.

[0022] In some embodiments of this utility model, the base includes: an outer portion having an inlay groove formed therein; and an inner portion being detachably inlaid in the inlay groove; wherein M probes and chip slot air passages are disposed in the inner portion.

[0023] In some embodiments of this utility model, a through screw hole is provided in the middle of the cover member; the chip testing fixture also includes: a pressing height adjustment member, including: a stud member, which has a thread on its outer side that matches the through screw hole, and the stud member is screwed into the through screw hole; wherein, the front end of the stud member presses against the back of the pressing sheet, and as the depth of the stud member screwing in changes, the front end of the stud member pushes the pressing sheet to move up and down.

[0024] In some embodiments of this utility model, the periphery of the pressing sheet is provided with N threaded holes, where N≥2; the cover body is provided with N through holes corresponding to the threaded holes; it also includes: N floating bolts, for each floating bolt, its screw passes through the through hole of the cover body and is screwed into the threaded hole of the pressing sheet; a spring is provided between its screw head and the surface of the cover body; the pressing sheet includes: a connecting part and a pressing part, wherein the cross-sectional shape of the connecting part is larger than the cross-sectional shape of the stud; the cross-sectional shape of the pressing part corresponds to the cross-sectional shape of the pressing groove. When the cover is in the closed state, the pressing part extends into the pressing groove and presses against the chip slot; the surface of the cover body facing the pressing sheet is provided with a connecting part groove, the shape of which matches the shape of the connecting part; wherein, when the spring is in an unforced state, the connecting part and / or the pressing part is in the connecting part groove; when the stud is screwed into the through screw hole, the front end of the screw pushes the pressing sheet to extend downward, the spring is in a compressed state, and it pulls back the pressing sheet through N floating bolts, so that the back of the pressing sheet is attached to the front end of the screw.

[0025] In some embodiments of this utility model, a pressure sensor is provided between the front end of the screw of the stud and the pressing plate.

[0026] In some embodiments of this utility model, a pressing groove corresponding to the cross-sectional shape of the stud is formed on the middle part of the surface of the pressing sheet near the stud; the front end of the stud extends into the pressing groove.

[0027] In some embodiments of this utility model, a countersunk hole is provided on the cover body, and a through hole is provided below the countersunk hole; the floating bolt passes through the countersunk hole and the through hole and is screwed into the threaded hole on the pressing plate, and the spring is located in the countersunk hole.

[0028] In some embodiments of this utility model, 0.1mm≤H1-H2≤1mm, where H1 is the thickness of the chip to be tested and H2 is the depth of the chip slot.

[0029] In some embodiments of this utility model, 0.5mm≤H3-H4≤1.5mm, where H3 is the thickness of the pressing part and H4 is the thickness of the pressing groove.

[0030] In some embodiments of this utility model, 1.5mm≤H5≤3.0mm, where H5 is the depth of the pressure groove.

[0031] In some embodiments of this utility model, the pressing height adjustment component further includes: turning the handle to fix it to the top of the stud component.

[0032] In some embodiments of this utility model, a stop post is provided on the upper surface of the cover body; wherein, when the pressing plate has not reached the lower limit position, the stud can rotate freely, and the pressing plate moves up and down with the front end of the screw; when the pressing plate reaches the lower limit, the stop post prevents the stud from being tightened further.

[0033] In some embodiments of this utility model, the first end of the cover body is pivotally connected to the base via a pivot; the second end of the cover body is provided with a downwardly extending hook-shaped buckle; the side of the base is provided with a buckle groove corresponding to the hook-shaped buckle; wherein, in the closed state, the hook-shaped buckle is engaged in the buckle groove to lock the cover and the base; in the open state, the hook-shaped buckle disengages from the buckle groove, and the cover body rotates about the pivot axis to unscrew open from above the base.

[0034] In some embodiments of this utility model, the stud and pressing sheet are made of metal material, and the base and cover body are made of synthetic resin material.

[0035] III. Beneficial Effects

[0036] (1) In this utility model, a temperature regulating element and a temperature measuring element are added to the chip testing fixture, which can realize the signal response of the chip under test at different temperatures, thus expanding the scope of chip testing.

[0037] Furthermore, by placing the test probes and test gas paths at the bottom of the chip slot in the base, and placing the temperature control elements and temperature measuring elements on the cover, the base space can be utilized more rationally. This is more conducive to the arrangement of cables, gas paths, and heat transfer paths. The performance of the MEMS electronic cigarette chip can be monitored in real time in response to the influence of factors such as the temperature change of the temperature control element, the mechanical pressure of the stud, and the air pressure change of the test gas path. This enables multi-functional synchronous testing of temperature, shell pressure, chip vent pressure, and output signal, improving the accuracy and reliability of the test results.

[0038] (2) In this utility model, in order to improve the heat transfer efficiency, thermally conductive silicone grease is filled at the positions where the temperature regulating element and the temperature measuring element contact the bottom of the corresponding groove.

[0039] (3) In this utility model, a temperature regulating element slot and a temperature measuring element slot are provided on the pressure plate. A pressing plate lead wire slot is provided on the side of the two element slots; a cover member lead wire hole is provided on the cover body. The cables of the temperature regulating element and / or the temperature measuring element are led out from the pressing plate lead wire slot and the cover member lead wire slot to the side of the cover body. The cables of the temperature regulating element and the temperature measuring element are led out from the cover body, rather than the pressing plate, which can avoid the influence of the up and down movement of the pressing plate body on the relevant functions and also avoid damage to the cables.

[0040] (4) In this utility model, the temperature regulating element groove and the temperature measuring element groove are respectively encapsulated with temperature regulating element and temperature measuring element and then filled with encapsulating glue, and the bottom surface of the pressure groove is flat.

[0041] The present invention, through the above-mentioned design, can produce the following beneficial effects: First, it can ensure that the temperature control element and the temperature measuring element will not be damaged when the stud is pressed down; Second, it can make reasonable use of space and prevent the temperature control element and the temperature measuring element from interfering with the test probe, air passage, etc.

[0042] (5) In this utility model, the inverted flared chip slot air channel helps to avoid interference between the test air channel and the test probe, and can also improve the mechanical strength of the base itself. The inverted flared overall test air channel is conducive to the rapid and accurate transmission of air pressure, and improves the accuracy and reliability of testing under different air pressure conditions.

[0043] (6) In this utility model, the base includes: an outer portion having an inlay groove formed therein; and an inner portion detachably inlaid in the inlay groove, wherein the probe, chip slot air passage, etc., are disposed in the inner portion. Since the positions of the electrical contacts of different chips under test are different, the inner portion is made detachable, so that when testing different types of chips, only the inner portion needs to be replaced, and the probes of the inner portion can be electrically connected to the corresponding parts on the circuit board, thereby greatly expanding the testing scenarios of the chip testing fixture and reducing costs.

[0044] (7) In this utility model, a pressing groove corresponding to the cross-sectional shape of the stud is formed on the middle part of the surface of the pressing sheet near the stud; the front end of the stud extends into the pressing groove. The pressing groove enables the front end of the stud to be stably and reliably inserted into the pressing groove, and leaves sufficient space for the subsequent temperature control element slot and temperature measuring element slot.

[0045] (8) In this utility model, the front end of the screw of the stud is pressed against the pressing groove. As the screw is screwed into the groove, the front end of the screw pushes the pressing plate to move up and down. At the same time, the spring and the floating bolt pull the pressing plate tightly against the front end of the screw, so as to effectively adjust the distance between the front end of the pressing plate and the bottom of the chip groove.

[0046] Through the above-described design, this chip testing fixture can adapt to chips of different thicknesses, expanding its application scenarios and reducing user costs.

[0047] (9) In this utility model, a pressure sensor is provided between the front end of the screw of the stud and the pressing plate. The cable of the pressure sensor is led out from the side of the pressing plate and connected to the corresponding testing instrument.

[0048] In practical scenarios, the following precautions should be taken: ① Proceed gradually with the screw head forward, observing the pressure sensor output value to prevent the chip under test from being crushed due to excessive pressure caused by excessively rapid screwing. ② Perform the test only after the pressure sensor output reaches the preset pressure value to prevent incorrect test results due to loose connections.

[0049] Those skilled in the art should understand that, due to the presence of this pressure sensor, the chip testing fixture of this invention can also test the signal response of the chip under test under different pressure environments.

[0050] (10) In this utility model, N threaded holes are provided on the periphery of the connecting part, where N≥2. The cover body is provided with N countersunk holes corresponding to the threaded holes, and a through hole is provided in the countersunk hole. The cover also includes: N floating bolts, for each floating bolt, the bolt passes through the through hole of the cover body and is screwed into the threaded hole of the pressing plate; a spring is provided between the bolt head and the surface of the cover body. The spring is located in the countersunk hole to prevent interference from the external environment.

[0051] (11) In this utility model, a stop post is provided on the upper surface of the cover body; wherein, when the pressing plate has not reached the pressure limit position, the handle is turned freely and the pressing plate moves up and down with the front end of the screw; when the pressing plate reaches the lower pressure limit, the stop post blocks the further tightening of the handle to prevent the chip under test from being crushed.

[0052] (12) In summary, this utility model provides a chip testing fixture that is adaptable to various chips with different thicknesses, sizes and electrical contact positions, which can improve the convenience, accuracy and safety of testing. Attached Figure Description

[0053] Figure 1A and Figure 1B These are, respectively, a perspective view and a front view of the chip testing fixture in an open state according to an embodiment of this utility model.

[0054] Figure 2A and Figure 2B They are respectively Figure 1A The diagram shows a perspective view and a front view of the chip testing fixture in the closed state.

[0055] Figure 3A and Figure 3B They are respectively Figure 1A The diagram shows a perspective view and a front view of the base, circuit board, and air circuit connector in the chip testing fixture.

[0056] Figure 4A and Figure 4B They are respectively Figure 1A The diagram shows a perspective view and a front view of the cover and pressing height adjustment components in the chip testing fixture.

[0057] Figure 5A and Figure 5B for Figure 1A The diagram shows a 3D view and a front view of the die-crushing process in the chip testing fixture. Detailed Implementation

[0058] The purpose of this invention is to provide a chip testing fixture that can adapt to various chips with different thicknesses, sizes, and electrical contact positions, so as to improve the accuracy and safety of testing.

[0059] To make the objectives, technical solutions, and advantages of this utility model clearer, the following detailed description is provided in conjunction with specific embodiments and with reference to the accompanying drawings.

[0060] Figure 1A and Figure 1B These are, respectively, a perspective view and a front view of the chip testing fixture in an open state according to an embodiment of this utility model. Figure 2A and Figure 2B They are respectively Figure 1A The diagram shows a perspective view and a front view of the chip testing fixture in the closed state. Figure 3A and Figure 3B They are respectively Figure 1A The diagram shows a perspective view and a front view of the base, circuit board, and air circuit connector in the chip testing fixture. Figure 4A and Figure 4B They are respectively Figure 1A The diagram shows a perspective view and a front view of the cover and pressing height adjustment components in the chip testing fixture. Figure 5A and Figure 5B for Figure 1A The diagram shows a 3D view and a front view of the die-crushing process in the chip testing fixture.

[0061] It should be noted that, to more clearly illustrate the internal structure, key details in each figure are drawn using perspective, with dashed lines representing the perspective areas. Please refer to the figures; the chip testing fixture in this embodiment includes:

[0062] The base 100 has a pressing groove 101 in the middle of its upper surface, and a chip groove 102 in the middle of the pressing groove.

[0063] The cover 200 includes: a cover body 210, in which a through screw hole is provided in the middle; and a pressing piece 220, which is disposed below the cover body;

[0064] The pressing height adjustment component 300 includes: a stud 310, which has a thread on its outer side that matches the through screw hole, and the stud is screwed into the through screw hole; and a handle 320, which is fixed to the top of the stud.

[0065] Circuit board 400 is fixed to the lower surface of the base and has connection terminals 410 thereon;

[0066] The air circuit connector 500 is fixed to the bottom of the circuit board.

[0067] During testing, the chip under test is placed in the chip slot 102, and the entire chip testing fixture is placed in a closed state, i.e., the cover body 210 is pressed against the upper surface of the base 100, and the pressing plate 220 extends at least partially into the pressing groove 101, pressing above the chip under test in the chip slot 102. After testing, the entire chip testing fixture is placed in an open state, i.e., the cover body 210 separates from the upper surface of the base 100, the pressing plate 220 detaches from the pressing groove 101, the pressing groove 101 and the chip slot 102 are open, and the chip under test is removed.

[0068] The following sections will provide a detailed description of each component of the chip testing fixture in this embodiment.

[0069] In this embodiment, the chip under test is a MEMS piezoelectric electronic cigarette chip. It is necessary to test the response of the MEMS piezoelectric electronic cigarette chip under different air pressure and temperature environments. Therefore, it is necessary to set the test air channel, temperature control element, etc. of the chip under test in the chip test fixture.

[0070] In this embodiment, the test probes and test air paths are placed in the lower part of the chip slot of the base, and the temperature control element and temperature measuring element are placed on the cover. This allows for more rational use of the base space and is more conducive to the arrangement of cables, air paths, and heat transfer paths. It enables real-time monitoring of the MEMS electronic cigarette chip performance in response to factors such as temperature changes of the temperature control element, mechanical pressure of the stud, and air pressure changes of the test air path. This achieves multi-functional synchronous testing of temperature, shell pressure, chip vent pressure, and output signal, improving the accuracy and reliability of the test results.

[0071] As shown in the figure, M probe holes (M ≥ 1) are set at preset positions at the bottom of the chip slot. M probes 103 are disposed inside the base, with their front ends extending upwards through corresponding probe holes and their rear ends connected to pads on the circuit board. A connection terminal 410 is provided on the circuit board, electrically connected to the rear ends of the M probes. The positions of the probes 103 correspond to the positions of the electrical contacts on the chip under test. When testing the chip under test, the probes 103 press against the corresponding contacts on the chip under test, and the electrical signal is transmitted to the corresponding test equipment through the connection terminal 410.

[0072] It should be noted that the base 100 and the connecting terminal 410 are fixed to the middle and periphery of the upper surface of the circuit board 400, respectively. This arrangement is more conducive to the stability of the chip test fixture, and also facilitates the signal connection between the chip test fixture and the test equipment.

[0073] Please continue referring to the attached diagram. A chip slot air passage 121 in the shape of an inverted horn is provided at a preset position at the bottom of the chip slot. This chip slot air passage 121 extends downward to the circuit board 400. The inverted horn shape of the chip slot air passage 121 helps to avoid interference between the test air passage and the test probe, and can also improve the mechanical strength of the base itself.

[0074] A circuit board vent 401 is provided at a corresponding position on the circuit board below the chip slot vent 121; a connector vent 501 is provided inside the air path connector below the circuit board vent. The chip slot vent 121, circuit board vent 401, and connector vent 501 together form the test air path. The peripheral air path terminal 600 is connected to the air path connector, and its front end is connected to the test air path. The overall test air path has an inverted funnel shape. This inverted funnel shape facilitates the rapid and accurate transmission of air pressure into the chip test slot, improving the accuracy and reliability of testing under different air pressure conditions.

[0075] It should be noted that the above is only a preferred embodiment of the present invention, with the gas path terminal located at the bottom of the chip testing fixture. In other embodiments of the present invention, the gas path terminal may also be located on the side of the chip testing fixture. In this case, the test gas channel may only include the chip slot gas channel, which extends downwards and then laterally to the side of the base. This variation can also achieve the present invention; however, such a gas channel design has rigid gas path bends, and its speed and accuracy of gas pressure transmission are inferior to that of the present embodiment.

[0076] It is important to note that in this embodiment, the depths of the chip slot and the bonding slot have been specially set, specifically:

[0077] ① Chip slot depth

[0078] The depth of the chip groove is slightly less than the designed thickness of the chip under test (DUT), so that the laminating sheet can transfer pressure to the DUT. Furthermore, the thickness of the chip groove cannot be too shallow to prevent the DUT from slipping out of the groove. Specifically: 0.1mm ≤ H1 - H2 ≤ 1mm, where H1 is the thickness of the DUT and H2 is the depth of the chip groove.

[0079] ② Depth of the pressing groove

[0080] The depth of the pressing groove is slightly less than the thickness of the pressing part, meaning that when the pressing sheet is pressed down, a portion of the pressing part is always outside the pressing groove. Specifically: 0.5mm≤H3-H4≤1.5mm, where H3 is the thickness of the pressing sheet and H4 is the thickness of the pressing groove.

[0081] It is important to note that in this embodiment, the base 100 includes: an outer portion with an inlay groove formed therein; and an inner portion detachably inlaid in the inlay groove, wherein probes, chip slot air channels, etc., are disposed in the inner portion. Since the positions of the electrical contacts differ for different chips under test, making the inner portion detachable allows for testing different types of chips by simply replacing the inner portion and electrically connecting the probes of the inner portion to the corresponding parts on the circuit board. This greatly expands the testing scenarios of the chip testing fixture and reduces costs.

[0082] As previously stated, the cover 200 includes: a cover body 210, in which a through screw hole is provided in the middle; and a pressing piece 220, disposed below the cover body.

[0083] To achieve engagement with the cover, the base 100 is pivotally connected to the first end of the cover body 210 on one side via a pivot 110. The second end of the cover body is provided with a downwardly extending hook-shaped latch 211; the side of the base is provided with a latching groove corresponding to the hook-shaped latch; wherein, in the closed state, the hook-shaped latch 211 is engaged in the latching groove, locking the cover body 210 and the base 100, as shown in Figure 2; in the open state, the hook-shaped latch 211 disengages from the latching groove, and the cover body rotates about the pivot axis, unscrewing open from above the base, as shown in Figure 1.

[0084] Furthermore, the pressing sheet 220 includes a connecting portion 221 and a pressing portion 222. The connecting portion 221 is a relatively large square sheet, while the pressing portion 222 is a relatively small square sheet. The cross-sectional shape of the pressing portion 222 corresponds to the cross-sectional shape of the pressing groove. In the closed state, the pressing portion extends into the pressing groove and is pressed onto the chip slot.

[0085] In this embodiment, the cross-sectional shape of the connecting portion 221 is larger than that of the stud. A pressing groove 223, corresponding to the cross-sectional shape of the stud, is formed on the surface of the pressing sheet near the center of the stud. The front end of the stud's screw extends into this pressing groove 223. The depth H5 of the pressing groove 223 satisfies: 1.5mm ≤ H5 ≤ 3.0mm. This depth allows the front end of the stud to be stably and reliably inserted into the pressing groove, and also leaves sufficient space for the subsequent installation of the temperature regulating element slot and the temperature measuring element slot.

[0086] Those skilled in the art should understand that the shapes of the connecting part and the pressing part described above are merely illustrative and are not intended to limit the present invention. In other embodiments of the present invention, both parts can also be other shapes. For example, the connecting part can also be circular, and the pressing part can also be a circular piece corresponding to the pressing groove. These variations can also realize the present invention and are also within the protection scope of the present invention.

[0087] Please continue referring to the attached drawings. At the bottom of the pressure groove 223, a temperature regulating element groove 224 and a temperature measuring element groove 225 are provided. The temperature regulating element and the temperature measuring element are respectively disposed within the temperature regulating element groove 224 and the temperature measuring element groove 225. In this invention, the addition of a temperature regulating element and a temperature measuring element to the chip testing fixture enables the testing of the signal response of the chip under test at different temperatures, thus expanding the range of chip testing.

[0088] Please refer to the attached diagram. The sides of the two component slots are provided with pressing plate lead wire slots; the cover body is provided with cover component lead wire holes 212. The cables of the temperature regulating element and / or temperature measuring element are led out from the pressing plate lead wire slots and the cover component lead wire slots to the side of the cover body. Leading the cables of the temperature regulating element and temperature measuring element out from the cover body, rather than the pressing plate, avoids the impact of the pressing plate's vertical movement on the relevant functions and also avoids damage to the cables.

[0089] In this embodiment, the temperature regulating element can be a heating element or a cooling element. If it is a heating element, it can be a metal wire heating element or a ceramic heating element. If it is a cooling element, it can be a Peltier element. The temperature sensing element can be a resistance temperature sensor or a thermocouple temperature sensor.

[0090] When using Peltier components, a power amplifier, data acquisition system, PID servo system, and heat sink control are used in conjunction with the external components to achieve precise temperature adjustment and control of the chip.

[0091] In this embodiment, the temperature sensing element is disposed within the pressing sheet. In other embodiments of this invention, multiple temperature sensing elements can be added to the base, for example, one temperature sensing element can be installed at each of the four corners of the chip under test, which can be used to study temperature gradient-related issues of the chip under test. Furthermore, any corner of the chip under test substrate can be replaced with a temperature regulating element to study the effect of different heating directions on the chip under test. Furthermore, a temperature regulating element can be placed next to any probe in the base to study the effect of heating pins on the chip.

[0092] In addition, the depth of the temperature regulating element slot and the temperature measuring element slot is slightly greater than the height of the temperature regulating element and the temperature measuring element, specifically: ① 0.1mm≤H6-H7≤0.5mm, where H6 and H7 are the thicknesses of the temperature regulating element slot and the temperature regulating element, respectively; ② 0.1mm≤H8-H9≤0.5mm, where H8 and H9 are the thicknesses of the temperature measuring element slot and the temperature measuring element, respectively.

[0093] To improve heat transfer efficiency, thermally conductive silicone grease is filled at the contact points between the temperature regulating element and the temperature measuring element and the bottom of their respective slots. Furthermore, after encapsulating the temperature regulating element and temperature measuring element in their respective slots, they are filled with encapsulating adhesive, resulting in a flat bottom surface for the pressure groove 223. Through these measures, this embodiment achieves the following beneficial effects: First, it ensures that the temperature regulating element and temperature measuring element will not be damaged when the stud is pressed down; second, it makes efficient use of space, preventing interference between the temperature regulating element and temperature measuring element and the test probe, air passages, etc.

[0094] Furthermore, N threaded holes, where N ≥ 2, are provided on the periphery of the connecting part. The cover body has N countersunk holes 213 corresponding to the threaded holes, and through holes 214 are provided within the countersunk holes 213. The cover also includes N floating bolts 231, each with its shank passing through the through hole of the cover body and screwed into the threaded hole 233 of the pressing plate; a spring 232 is provided between the bolt head and the surface of the cover body. This spring 232 is located within the countersunk hole to prevent interference from the external environment.

[0095] Furthermore, a connecting groove is provided on the surface of the cover body facing the pressing sheet, and the shape of the connecting groove matches the shape of the connecting part 221. Wherein:

[0096] ① When the spring is in an unforced state, a portion of the connecting part 221 and / or the pressing part 222 may be located within the groove of the connecting part.

[0097] ② When the stud is screwed into the through screw hole, the front end of the screw pushes the pressing plate downward, and the spring is in a compressed state. It pulls back the pressing plate through N floating bolts, so that the back of the pressing plate is attached to the front end of the screw.

[0098] In this embodiment, the pressing height adjustment component 300 includes: a stud component 310, which has a thread on its outer side that matches the through screw hole, and the stud component is screwed into the through screw hole; and a handle 320 is turned to fix it to the rear end of the stud component.

[0099] In this embodiment, the front end of the screw of the stud 310 presses against the pressing groove 223. As the screw depth changes, the front end of the screw pushes the pressing plate 220 to move up and down. At the same time, the spring 232 and the floating bolt 231 pull the pressing plate tightly against the front end of the screw, effectively adjusting the distance between the front end of the pressing plate and the bottom of the chip slot. Through the above settings, the chip testing fixture of this embodiment can adapt to chips of different thicknesses, expanding the application scenarios and reducing user costs.

[0100] Furthermore, a pressure sensor is provided between the front end of the screw of the stud and the pressing plate. The cable of the pressure sensor extends from the side of the pressing plate and is connected to a corresponding testing instrument. In this embodiment, the pressure sensor is a piezoelectric ceramic plate type pressure sensor.

[0101] In practical scenarios, the following precautions should be taken: ① Proceed gradually with the screw head forward, observing the pressure sensor output value to prevent the chip under test from being crushed due to excessive pressure caused by excessively rapid screwing. ② Perform the test only after the pressure sensor output reaches the preset pressure value to prevent incorrect test results due to loose connections.

[0102] Those skilled in the art should understand that, due to the presence of this pressure sensor, the chip testing fixture of this embodiment can also test the signal response of the chip under test under different pressure environments.

[0103] In addition, a stop post 241 is provided on the upper surface of the cover body; when the pressing plate has not reached the pressure limit position, the handle can be turned freely and the pressing plate moves up and down with the front end of the screw; when the pressing plate reaches the lower pressure limit, the stop post prevents the handle from being tightened further to prevent the chip under test from being crushed.

[0104] It should be noted that in this embodiment, the stud 310 and the pressing sheet 220 are made of metal materials, while the base 100, the cover body 210, etc. are all made of synthetic resin materials.

[0105] Those skilled in the art should understand that the material of the pressed sheet directly determines the heating efficiency; therefore, selecting a good thermal conductor such as copper can further improve the range and precision of the controllable temperature. The base material directly determines the heat dissipation efficiency; considering the manufacturing of micro-channels, easily machinable materials should be selected. The choice depends on different experimental requirements. For example, high-temperature storage experiments may use materials such as polytetrafluoroethylene, polypropylene, or even ceramics; rapid temperature regulation experiments may use materials such as aluminum, copper, silver, platinum, or brass.

[0106] Those skilled in the art should understand that the above are merely preferred embodiments of the present invention, and the present invention is not limited thereto. In other embodiments of the present invention, various improvements can be made to the chip testing fixture according to the needs of actual scenarios, for example:

[0107] ① Without setting a counter-pressure groove, the front end of the screw of the stud is bonded and fixed to the connection part;

[0108] ② No countersunk hole is provided; the spring is directly exposed on the surface of the cover body.

[0109] ③ The cables for the temperature control element and the temperature measuring element are led out directly from the side of the pressing sheet, and no longer from the cover body;

[0110] ④ The temperature sensing element is placed on the base, and its temperature probe touches the chip under test from bottom to top, rather than placing the temperature sensing element in the pressing sheet.

[0111] ⑤ In addition to the specific types of temperature regulating elements, temperature measuring elements, and pressure sensors mentioned above, those skilled in the art can also select other types of products that can achieve the corresponding functions as needed;

[0112] ⑥ This embodiment is designed for piezoelectric MEMS electronic cigarette chip design and can test the chip response under different air pressure, temperature and pressure environments. However, for other types of chips, if the corresponding test environment is not required, the corresponding components or designs can be omitted. For example, if the air pressure environment is not required, the airway design can be cancelled; if the temperature environment is not required, the temperature control element, temperature measuring element and other related designs can be cancelled.

[0113] ⑦ Instead of using a one-sided pivot connection and a snap-fit ​​fastening method, the base and the cover body are closed using a double-sided snap-fit ​​method.

[0114] ⑧ In order to test the pressure-equalizing electronic cigarette chip, a vent can be set at the corresponding position of the cover.

[0115] Although the effect is slightly inferior to that of this embodiment, the various modifications described above can also achieve the present invention and are also within the protection scope of the present invention.

[0116] Based on the aforementioned chip testing fixture, this invention also provides a chip testing method using it. The chip testing method in this embodiment includes:

[0117] Step A: Retract the stud to a safe position;

[0118] Step B: Open the cover from the base and place the chip under test into the chip slot;

[0119] Step C: Proceed forward by gradually turning the stud until the pressing plate presses the chip under test firmly.

[0120] Step D: Begin testing the chip under test.

[0121] The following sections will provide a detailed description of each step in the chip testing method of this embodiment.

[0122] In step A, the stud is retracted to its highest position to leave enough space for the chip under test.

[0123] When a pressure sensor is installed between the front end of the screw of the stud and the pressing plate in the chip testing fixture, in step B, the value of the pressure sensor is observed while the stud is screwed in. When the pressure sensor outputs the preset pressure value, it means that the pressing plate has pressed the chip under test tightly, and the stud cannot be screwed in further to avoid crushing the chip under test.

[0124] When the chip testing fixture includes a temperature regulating element and a temperature measuring element, in step D, the temperature of the chip under test is adjusted to a preset temperature by the temperature regulating element, and the characteristics of the chip under test are tested at the preset temperature.

[0125] This concludes the description of all embodiments of this utility model. Based on the above description, those skilled in the art should have a clear understanding of this utility model.

[0126] It should be noted that, unless explicitly stated otherwise, the numerical parameters in the specification and claims of this utility model may be approximate values ​​and can be changed according to the content of this utility model. Specifically, all figures in the specification and claims indicating the content of composition, reaction conditions, etc., should be understood to be modified by the term "about" in all cases, which means that they include a specific quantity varying by ±10% in some embodiments.

[0127] The ordinal numbers used in the specification and claims, such as "first," "second," "third," "primary," "secondary," as well as Arabic numerals and letters, to modify the corresponding elements (or steps), are intended only to clearly distinguish one element (or step) with a certain name from another element (or step) with the same name, and do not imply that the element (or step) has any ordinal number, nor do they represent the order of one element (or step) with another. Furthermore, unless specifically described or steps must occur in sequence, the order of the above steps is not limited to what is listed above and can be varied or rearranged according to the desired design.

[0128] It should also be noted that the directional terms mentioned in the embodiments, such as "center," "lateral," "longitudinal," "top," "bottom," "upper," "lower," "front," "rear," "left," "right," "inner," and "outer," etc., indicate the orientation or positional relationship only based on the orientation or positional relationship shown in the accompanying drawings. They are used solely for the convenience of describing the present invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, throughout the accompanying drawings, the same elements are represented by the same or similar reference numerals. Also, the shapes and dimensions of the components in the drawings do not reflect actual size and proportion, but only illustrate the content of the embodiments of the present invention.

[0129] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms according to the specific circumstances.

[0130] Those skilled in the art will understand that in the claims and description of this utility model, the word "comprising" does not exclude the presence of elements (or steps) not listed in the claims. The word "a" or "an" preceding an element (or step) does not exclude the presence of a plurality of such elements (or steps).

[0131] For certain implementation methods, if they are not key contents of this utility model and are well known to those skilled in the art, they are not described in detail in the accompanying drawings or text due to space limitations. In such cases, they can be understood by referring to relevant prior art.

[0132] Furthermore, the purpose of providing the above embodiments is merely to enable the present invention to meet legal requirements, and the present invention can be implemented in many different forms and should not be construed as limited to the embodiments set forth herein.

[0133] Similarly, it should be understood that, for the sake of brevity, in the above description of exemplary embodiments of the present invention, various features of the present invention are sometimes grouped together in a single embodiment, figure, or description thereof. However, this approach should not be construed as reflecting an intention that the claimed invention requires more features than expressly recited in each claim. Rather, as reflected in the claims, each aspect of the invention comprises fewer than all the features of the preceding single embodiment. Furthermore, embodiments may be used in combination with each other or with other embodiments based on design and reliability considerations; that is, technical features from different embodiments can be freely combined to form more embodiments. Therefore, the claims following the detailed description are hereby expressly incorporated into that detailed description, wherein each claim itself is a separate embodiment of the present invention.

[0134] The above specific embodiments have provided a detailed description of the purpose, technical means, and beneficial effects of this utility model. It should be understood that the purpose of the detailed description is to enable those skilled in the art to understand this utility model more clearly, and it is not intended to limit this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A chip testing fixture, characterized in that, include: The base has a pressing groove in the middle of its upper surface, and a chip groove in the middle of the pressing groove. A cover assembly includes: a cover body; and a pressing sheet disposed below the cover body. Temperature regulating element, which is disposed within the pressing sheet or the base; A temperature sensing element is disposed within the pressing sheet or the base; In the closed state, the cover body is pressed against the upper surface of the base, and the pressing piece extends at least partially into the pressing groove and is pressed above the chip slot; in the open state, the cover body separates from the upper surface of the base, and the pressing piece detaches from the pressing groove.

2. The chip testing fixture according to claim 1, characterized in that, The pressing sheet has a temperature regulating element slot; the temperature regulating element is disposed in the temperature regulating element slot; The chip slot air passage is provided inside the base below the preset position at the bottom of the chip slot. M probe holes are set at a preset position at the bottom of the chip slot, M≥1; among them, M probes are set inside the base, and their front ends extend upward through the corresponding probe holes.

3. The chip testing fixture according to claim 2, characterized in that, The pressing sheet has a temperature sensing element slot; the temperature sensing element is disposed in the temperature sensing element slot.

4. The chip testing fixture according to claim 3, characterized in that, The temperature regulating element is filled with thermally conductive silicone grease in the temperature regulating element slot, and the temperature sensing element is encapsulated in the temperature sensing element slot and then filled in. And / or, the temperature sensing element is filled with thermally conductive silicone grease in the temperature sensing element slot, and the temperature regulating element is encapsulated in the temperature regulating element slot and then filled in; And / or, 0.1mm≤H6-H7≤0.5mm, where H6 and H7 are the thicknesses of the temperature control element slot and the temperature control element, respectively; And / or, 0.1mm≤H8-H9≤0.5mm, where H8 and H9 are the thicknesses of the temperature sensing element slot and the temperature sensing element, respectively; And / or, the pressing sheet portion on the side of the temperature regulating element slot and / or temperature measuring element slot is provided with a pressing sheet lead wire slot; the cover body is provided with a cover part lead wire hole; the cable of the temperature regulating element and / or temperature measuring element is led out from the pressing sheet lead wire slot and the cover part lead wire slot to the side of the cover part body. And / or, the temperature regulating element is a heating element or a cooling element; the heating element is one of the following: a metal wire heating element or a ceramic heating element; the cooling element is a Peltier element; And / or, the temperature sensing element is one of the following: a resistance temperature sensor or a thermocouple temperature sensor.

5. The chip testing fixture according to claim 2, characterized in that, Also includes: The circuit board is fixed to the lower surface of the base; The rear end of the probe is connected to a corresponding pad on the circuit board; The chip slot air passage extends downward to the circuit board; or, it extends downward first and then to the side to the side of the base.

6. The chip testing fixture according to claim 5, characterized in that, The chip slot air passage is shaped like an inverted funnel. And / or, a gasket groove is provided on the top outer side of the chip slot air passage; an elastic gasket is provided in the gasket groove between the air pressure sensing hole of the chip under test and the chip slot air passage.

7. The chip testing fixture according to claim 6, characterized in that, The chip slot air passage extends downward to the circuit board; a circuit board air hole is provided at a corresponding position on the circuit board below the chip slot air passage; the chip test fixture also includes: an air passage connector, fixed below the circuit board, with a connector air passage provided inside corresponding to the circuit board air hole; the chip slot air passage, the circuit board air hole, and the connector air passage together form a test air passage, and the test air passage is generally in the shape of an inverted funnel. And / or, the base includes: a peripheral portion having an inlay groove formed therein; and an inner portion being detachably inlaid in the inlay groove; wherein the M probes and the chip slot air passage are disposed in the inner portion.

8. The chip testing fixture according to claim 1, characterized in that, The cover has a through screw hole in the middle. The chip testing fixture also includes: The pressing height adjustment component includes: a stud with a thread on its outer side that matches the through screw hole, the stud being screwed into the through screw hole; The front end of the screw of the stud member presses against the back of the pressing plate. As the depth of the stud member screwing in changes, the front end of the screw pushes the pressing plate to move up and down.

9. The chip testing fixture according to claim 8, characterized in that, The outer periphery of the pressing sheet is provided with N threaded holes, where N≥2; The cover body is provided with N through holes corresponding to the threaded holes; It also includes: N floating bolts, for each floating bolt, the shank of which passes through the through hole of the cover body and is screwed into the threaded hole of the pressing plate; a spring is provided between the bolt head and the surface of the cover body; The pressing sheet includes: a connecting portion and a pressing portion, wherein... The cross-sectional shape of the connecting part is larger than that of the stud; The cross-sectional shape of the pressing part corresponds to the cross-sectional shape of the pressing groove. When the cover is in the closed state, the pressing part extends into the pressing groove and is pressed on the top of the chip groove. The surface of the cover body facing the pressing sheet is provided with a connecting groove, the shape of which matches the shape of the connecting part; When the spring is in an unstressed state, the connecting part and / or the pressing part is located in the groove of the connecting part; when the stud is screwed into the through screw hole, the front end of the screw pushes the pressing plate to extend downward, the spring is in a compressed state, and it pulls back the pressing plate through N floating bolts, so that the back of the pressing plate is attached to the front end of the screw.

10. The chip testing fixture according to claim 9, characterized in that, A pressure sensor is provided between the front end of the screw of the stud and the pressing plate; And / or, a pressing groove corresponding to the cross-sectional shape of the stud is formed on the middle part of the surface of the pressing sheet near the stud; the front end of the stud extends into the pressing groove; And / or, the cover body is provided with a countersunk hole, and the through hole is provided below the countersunk hole; the floating bolt passes through the countersunk hole and the through hole and is screwed into the threaded hole on the pressing plate, and the spring is located in the countersunk hole; And / or, 0.1mm≤H1-H2≤1mm, where H1 is the thickness of the chip to be tested and H2 is the depth of the chip slot; And / or, 0.5mm≤H3-H4≤1.5mm, where H3 is the thickness of the pressed part and H4 is the thickness of the pressed groove; And / or, 1.5mm≤H5≤3.0mm, where H5 is the depth of the pressure groove; And / or, the pressing height adjustment component further includes: turning a handle to fix it to the top of the stud; And / or, the upper surface of the cover body is provided with a stop post; wherein, when the pressing plate has not reached the lower limit position, the stud can rotate freely, and the pressing plate moves up and down with the front end of the screw; when the pressing plate reaches the lower limit, the stop post prevents the stud from being tightened further. And / or, the first end of the cover body is pivotally connected to the base via a pivot; the second end of the cover body is provided with a downwardly extending hook-shaped buckle; the side of the base is provided with a buckle groove corresponding to the hook-shaped buckle; wherein, in the closed state, the hook-shaped buckle engages in the buckle groove, locking the cover and the base; in the open state, the hook-shaped buckle disengages from the buckle groove, and the cover body rotates about the pivot axis, unscrewing open from above the base; And / or, the stud and pressing sheet are made of metal material, and the base and cover body are made of synthetic resin material.

Images