Vacuum sheet box
By setting up multi-layer wafer support grooves and fixing components inside the vacuum wafer cassette, combined with sensor detection and adjustment, the problem of wafer position misalignment was solved, achieving wafer position stability and safety, and avoiding damage.
Patent Information
- Application Number
- CN202422716130.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-07
- Publication Date
- 2025-12-09
- Estimated Expiration
- 2034-11-07
AI Technical Summary
In semiconductor manufacturing, wafer misalignment within the vacuum wafer cassette can cause damage to the wafer and the transfer arm.
A vacuum wafer cassette was designed, comprising a multi-layer wafer support groove and a fixing structure. The fixing structure consists of multiple fixing components for fixing the wafer. At the same time, sensors are set on the support wall to detect the wafer position in real time and make adjustments to ensure positional stability.
It effectively reduces wafer offset within the vacuum wafer cassette, avoids damage to the wafers and the transfer arm, and ensures the safety and stability of the handling process.
Smart Images
Figure CN223651375U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor manufacturing technology, and in particular to a vacuum wafer cassette. Background Technology
[0002] Various devices are used in semiconductor manufacturing processes, among which vacuum wafer cassettes are mainly used to safely and efficiently handle and fix wafers during semiconductor manufacturing, playing a key role in the process.
[0003] During the wafer transfer process on the AMAT machine, the wafer may shift due to vibration within the vacuum wafer cassette. If the wafer is then moved at this time, it is highly likely that it will be scratched or impacted by the transfer arm, resulting in damage to both the wafer and the transfer arm.
[0004] Therefore, how to prevent the wafer from shifting position within the vacuum wafer cassette has become a technical problem that urgently needs to be solved by those skilled in the art. Utility Model Content
[0005] Therefore, it is necessary to provide a vacuum wafer cassette for preventing wafers from shifting position within the cassette.
[0006] To achieve the above objectives, on the one hand, this utility model provides a vacuum tablet cassette, characterized in that it comprises:
[0007] The housing contains multiple wafer support grooves, each including a support wall.
[0008] A fixing structure, comprising multiple fixing components, wherein the multiple fixing components are respectively located at different positions on the support wall, for fixing the wafer;
[0009] At least one sensor is located on the support wall within the wafer support groove, and the sensor is used to detect the position of the wafer.
[0010] In one embodiment, the wafer support trench includes a first sub-trench and a second sub-trench disposed opposite to each other, and the support wall includes a first sub-support wall and a second sub-support wall, wherein the first sub-support wall is a sidewall of the first sub-trench and the second sub-support wall is a sidewall of the second sub-trench.
[0011] The plurality of fixing components are respectively located on the first sub-support wall and the second sub-support wall.
[0012] In one embodiment, the plurality of the fixing components are arranged in a centrally symmetrical manner along the center of the wafer.
[0013] In one embodiment, the fixing component includes a first fixing part and a second fixing part; the second fixing part is located on the support wall, and the first fixing part protrudes from the surface of the second fixing part in a direction away from the support wall. The second fixing part is used to place the wafer, and the first fixing part is used to limit the position of the wafer.
[0014] In one embodiment, the side of the first fixing portion facing the wafer is an arc surface, and the arc surface is recessed in a direction away from the center of the wafer.
[0015] In one embodiment, the fixing component further includes a third fixing part connected to the second fixing part for fixing the fixing structure to the support wall.
[0016] In one embodiment, the vacuum cassette further includes a connecting assembly for connecting the fixing structure to the support wall.
[0017] In one embodiment, the vacuum wafer cassette includes a plurality of sensors arranged in a centrally symmetrical manner along the center of the wafer.
[0018] In one embodiment, the sensor includes a position sensor.
[0019] In one embodiment, the sensor is located on the side of the fixing assembly away from the centerline of the wafer.
[0020] Compared with existing technologies, the above technical solution has the following advantages:
[0021] The vacuum wafer cassette provided in this application includes a cassette body with multiple layers of wafer support slots inside. Each wafer support slot has a support wall, and a fixing structure is provided on the support wall. The fixing structure includes multiple fixing components, which are located at different positions on the support wall to fix the wafer, thereby reducing wafer misalignment. At least one sensor is also provided on the support wall to detect the wafer's position, ensuring that the wafer's position is adjusted in a timely manner when misalignment occurs, thus ensuring wafer stability and preventing wafer damage. Attached Figure Description
[0022] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0023] Figure 1This application provides a schematic diagram of the structure of a vacuum cartridge;
[0024] Figure 2 A top view of a vacuum cassette provided in an embodiment of this application;
[0025] Figure 3 This is a partial structural diagram of a vacuum cassette provided in an embodiment of this application;
[0026] Figure 4 This is a schematic diagram of another part of the structure of a vacuum cassette provided in an embodiment of this application;
[0027] Figure 5 This is another top view of a vacuum cassette provided in an embodiment of this application;
[0028] Figure 6 This is another top view of a vacuum cassette provided in an embodiment of this application;
[0029] Figure 7 This is another top view of a vacuum cassette provided in an embodiment of this application.
[0030] Explanation of reference numerals in the attached drawings: 01-Box body; 02-Wafer support groove; 02a-First sub-groove; 02b-Second sub-groove; 03-Support wall; 03a-First sub-support wall; 03b-Second sub-support wall; 04-Fixing structure; 05-Fixing component; 05a-First fixing part; 05b-Second fixing part; 05c-Third fixing part; 06-Wafer; 07-Sensor; 08-Connection component. Detailed Implementation
[0031] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.
[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
[0033] It should be understood that when a layer is referred to as "on," "adjacent to," or "connected to" other layers, it can be directly on, adjacent to, or connected to other layers, or there can be intervening layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," or "directly connected to" other layers, there are no intervening layers.
[0034] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising,” “including,” or “having,” etc., specify the presence of the stated feature, whole, step, operation, component, part, or combination thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof.
[0035] Based on the content in the background art, the vacuum wafer cassette is a very critical part of the ion implanter. Its function is not only to place wafers, but also to transport wafers in atmospheric or high vacuum conditions by changing the vacuum pressure environment of the vacuum wafer cassette. The wafer transport requires that the wafer position is very fixed. If the position is deviated during transport, the wafer is very likely to be scratched or impacted by the transport arm, resulting in damage to the wafer and the transport arm.
[0036] Based on this, this application provides a vacuum wafer cassette, including a cassette body with multiple layers of wafer support slots inside. Each wafer support slot has a support wall, and a fixing structure is provided on the support wall. The fixing structure includes multiple fixing components, which are located at different positions on the support wall to fix the wafer, thereby reducing wafer misalignment. At least one sensor is also provided on the support wall to detect the wafer's position, ensuring that the wafer's position is adjusted in a timely manner when it deviates, thus ensuring wafer stability and preventing wafer damage.
[0037] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, this application will be further described in detail below with reference to the accompanying drawings and specific embodiments.
[0038] refer to Figure 1 , Figure 1 This application provides a schematic diagram of the structure of a vacuum cartridge; see reference. Figure 2 , Figure 2 A top view of a vacuum cassette provided in this application embodiment; comprising:
[0039] The box body 01 has multiple wafer support grooves 02 inside, and the wafer support grooves 02 include support walls 03.
[0040] The fixing structure 04 includes multiple fixing components 05, which are located at different positions on the support wall 03 and are used to fix the wafer 06.
[0041] At least one sensor 07 is located on the support wall 03 within the wafer support groove 02, and the sensor 07 is used to detect the position of the wafer 06.
[0042] Specifically, the multi-layer wafer support grooves 02 in the housing 01 are arranged sequentially in the vertical direction, and the thickness of the wafer support grooves 02 is uniform in the vertical direction. For example, there are 25 layers of wafer support grooves 02 in the housing 01. The wafer support grooves 02 include support walls 03. It should be noted that the support walls 03 are connected to the side walls of the housing 01, and the plane of the support walls 03 is perpendicular to the side wall surface of the housing 01.
[0043] The vacuum wafer cassette also includes a fixing structure 04 for fixing the wafer 06. The fixing structure 04 includes multiple fixing components 05, which are located at different positions on the support wall 03. These fixing components 05 collectively fix the position of the wafer 06, reducing positional offset. It should be noted that the multiple fixing components 05 include two or more fixing components 05. In this embodiment, for example… Figure 2 As shown, the explanation can be given using four fixed components 05 as an example.
[0044] like Figure 2 As shown, at least one sensor 07 is also provided on the support wall 03 inside the wafer support groove 02. The sensor 07 is used to detect the position of the wafer 06. Since the position of the fixing component 05 cannot completely cover the edge of the wafer 06, the position of the wafer 06 may also be partially offset in the direction where the fixing component 05 is not set. In order to further reduce the offset of the wafer 06, the sensor 07 is designed to detect the position of the wafer 06. When the offset of the wafer 06 is detected, the fixing component 05 can be adjusted to adjust the position of the wafer to ensure that the wafer 06 will not be gripped when it is offset, thereby avoiding damage to the wafer 06 and the conveyor arm.
[0045] In this application, multiple fixing components 05 are located at different positions on the support wall 03 to jointly fix the wafer 06, thereby reducing wafer 06 offset. At least one sensor 07 is also set on the support wall 03 to detect the position of the wafer 06, so as to ensure that the position of the wafer 06 is adjusted in time when the wafer position is offset, ensuring the stability of the wafer 06 position and avoiding damage to the wafer 06.
[0046] Optionally, in another embodiment of this application, such as Figure 1As shown, the wafer support trench 02 includes a first sub-trench 02a and a second sub-trench 02b disposed opposite to each other, and the support wall 03 includes a first sub-support wall 03a and a second sub-support wall 03b. The first sub-support wall 03a is the side wall of the first sub-trench 02a, and the second sub-support wall 03b is the side wall of the second sub-trench 02b.
[0047] Multiple fixing components 05 are located on the first sub-support wall 03a and the second sub-support wall 03b, respectively.
[0048] Specifically, the wafer support trench 02 includes a first sub-trench 02a and a second sub-trench 02b arranged opposite to each other. It should be noted that the first sub-trench 02a and the second sub-trench 02b are located on the same layer, and are described separately only for better description. The first sub-support wall 03a is the sidewall of the first sub-trench 02a, and the second sub-support wall 03b is the sidewall of the second sub-trench 02b. The first sub-support wall 03a and the second sub-support wall 03b are located on the same plane.
[0049] The fixing components 05 are located on the first sub-support wall 03a and the second sub-support wall 03b, respectively. It should be noted that the number of fixing components 05 on the first sub-support wall 03a and the second sub-support wall 03b is not specifically limited, as long as they can fix the wafer 06 and reduce the offset of the wafer 06. For example, the number of fixing components 05 set on the first sub-support wall 03a is the same as the number of fixing components 05 set on the second sub-support wall 03b.
[0050] Optionally, in another embodiment of this application, such as Figure 2 As shown, multiple fixed components 05 are arranged in a centrally symmetrical manner along the center of wafer 06.
[0051] Specifically, the fixing components 05 can be arranged symmetrically around the center of the wafer 06. For example, two fixing components 05 can be set on the first sub-support wall 03a, and two fixing components 05 can be set on the second sub-support wall 03b. These four fixing components 05 are symmetrically arranged around the center of the wafer 06. This symmetrical arrangement of the fixing components 05 makes the wafer 06 more securely fixed, further reducing offset. It should be noted that the symmetrical arrangement is only an example; the positions of the fixing components 05 can be set according to specific needs. When the size of the wafer 06 is different, the positions of the fixing components 05 can also be set accordingly.
[0052] Optionally, in another embodiment of this application, reference is made to... Figure 3 , Figure 3 This is a partial structural schematic diagram of a vacuum cassette provided in an embodiment of this application; see reference. Figure 4 , Figure 4This is a schematic diagram of another part of the structure of a vacuum wafer cassette provided in an embodiment of this application; the fixing component 05 includes a first fixing part 05a and a second fixing part 05b; the second fixing part 05b is located on the support wall 03, the first fixing part 05a protrudes from the surface of the second fixing part 05b in a direction away from the support wall 03, the second fixing part 05b is used to place the wafer 06, and the first fixing part 05a is used to limit the wafer 06.
[0053] Specifically, the fixing component 05 includes a first fixing part 05a and a second fixing part 05b. The second fixing part 05b is located on the support wall 03, and the first fixing part 05a is located on the upper surface of the second fixing part 05b away from the support wall 03 and protrudes upward. Figure 3 and Figure 4 As shown, the sidewall of the first fixing part 05a facing the center of the wafer 06 is not specifically limited. For example, it can be perpendicular to the plane where the second fixing part 05b is located, or it can have an angle with the plane where the second fixing part 05b is located. At this time, the first fixing part 05a and the second fixing part 05b form a stepped structure, so that the wafer 06 is placed on the second fixing part 05b, and the first fixing part 05a holds the wafer 06, that is, limits the position of the wafer 06. At this time, the fixing component 05 with the stepped structure can prevent the crystal from shifting significantly, further avoiding damage to the wafer 06.
[0054] It should be noted that, in the vertical direction, the height of the first fixing part 05a can be 1mm and the height of the second fixing part 05b can be 2mm. There are no specific limitations on this, and it is only for illustrative purposes.
[0055] Optionally, in another embodiment of this application, reference is made to... Figure 2 The side of the first fixing part 05a facing the wafer 06 is an arc surface, and the arc surface is recessed in the direction away from the center of the wafer 06.
[0056] Specifically, in this embodiment, the side of the first fixing part 05a facing the wafer 06 is curved, and the curved surface is concave in the direction away from the center of the wafer 06. At this time, the curvature of the wafer 06 is the same as the curvature of the side of the first fixing part 05a facing the wafer 06. That is to say, when the wafer 06 is placed on the second fixing part 05b, it is essentially nested on the fixing component 05. At this time, even if there is significant shaking, the offset of the wafer 06 will be very small, thus avoiding large-distance offset.
[0057] Optionally, in another embodiment of this application, reference is made to... Figure 5 , Figure 5 This is another top view of a vacuum cassette provided in an embodiment of this application; the fixing component 05 also includes a third fixing part 05c, which is connected to the second fixing part 05b and is used to fix the fixing structure 04 to the support wall 03.
[0058] Specifically, the fixing component 05 also includes a third fixing part 05c connected to the second fixing part 05b, wherein the third fixing part 05c is also connected to the wafer support groove 02, thereby fixing the entire fixing structure 04 on the wafer support groove 02, ensuring that the fixing component 05 will not move, thereby reducing the offset of the crystal.
[0059] Optionally, in another embodiment of this application, such as Figure 5 As shown, the vacuum cassette also includes a connecting component 08, which is used to connect the fixing structure 04 and the support wall 03.
[0060] Specifically, the connecting component 08 can be a screw and a nut. The screw and nut install the third fixing part 05c on the fixing structure 04 onto the support wall 03. At this time, the third fixing part 05c has multiple first through holes, and the support wall 03 also has multiple second through holes. The first through holes and the second through holes are connected by screws and nuts to connect the fixing structure 04 and the support wall 03.
[0061] Optionally, in another embodiment of this application, reference is made to... Figure 6 , Figure 6 This is another top view of a vacuum wafer cassette provided in an embodiment of this application; the vacuum wafer cassette includes multiple sensors 07, which are arranged in a centrally symmetrical manner along the center of the wafer 06.
[0062] Optionally, in another embodiment of this application, sensor 07 includes a position sensor.
[0063] Specifically, the sensors 07 can be arranged in a centrally symmetrical manner along the center of wafer 06. For example, two sensors 07 are set on the first sub-support wall 03a, and two sensors 07 are set on the second sub-support wall 03b. These four sensors 07 are centrally symmetrical along the center of wafer 06. The centrally symmetrical arrangement of the sensors 07 allows the position of wafer 06 to be detected in multiple directions, ensuring detection accuracy. It should be noted that the centrally symmetrical arrangement is only an example; the positions of the sensors 07 can be set according to specific needs. It should also be noted that since the sensors 07 are used to detect the position of wafer 06, they can be position sensors 07.
[0064] Optionally, in another embodiment of this application, the sensor 07 is located on the side of the fixing assembly 05 away from the center line of the wafer 06.
[0065] Specifically, along the direction perpendicular to the second sub-support wall 03b from the first sub-support wall 03a, the wafer 06 is provided with a centerline, and the sensor 07 is located on the side of the fixing assembly 05 away from the centerline of the wafer 06. For example, when two fixing assemblies 05 are provided on the first sub-support wall 03a, and the sensor 07 is located on the side of one fixing assembly 05 away from the other, the orientation detected by the sensor 07 is different for the fixing assemblies 05, which can detect whether other orientations are offset, thus preventing damage to the transfer arm and the wafer 06.
[0066] Based on the above embodiments, this application also uses a 150mm wafer 06 as an example to present the data of the wafer support groove 02 to illustrate the vacuum wafer cassette. (Reference) Figure 7 , Figure 7 This is another top view schematic diagram of a vacuum wafer cassette provided in an embodiment of this application. In the direction perpendicular to the first sub-support wall 03a and pointing vertically to the second sub-support wall 03b, the diameter R of the wafer 06 can be 150mm, the length d of the first fixing part 05a can be 30mm, the length L of the wafer 06 plus the fixing components 05 on both sides can be 206mm, and the length X of the third fixing part 05c can be 10mm. In the direction perpendicular to the first sub-support wall 03a and pointing vertically to the second sub-support wall 03b, the width Y of the fixing component 05 can be 30mm. Furthermore, in the direction perpendicular to the wafer support groove 02, the height of the first fixing part 05a can be 1mm, and the height of the second fixing part 05b can be 2mm. It should be noted that the above data are only illustrative examples to present the actual structure. No specific limitations are made; when the wafer 06 is larger, adjustments can be made according to the size of the wafer 06. Further details will not be elaborated here.
[0067] In the description of this specification, references to terms such as "some embodiments," "another embodiment," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples.
[0068] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features of the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0069] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.
Claims
1. A vacuum tablet cassette, characterized in that, include: The housing contains multiple wafer support grooves, each including a support wall. A fixing structure, comprising multiple fixing components, wherein the multiple fixing components are respectively located at different positions on the support wall, for jointly fixing the wafer; At least one sensor is located on the support wall within the wafer support groove, and the sensor is used to detect the position of the wafer.
2. The vacuum cassette according to claim 1, characterized in that, The wafer support trench includes a first sub-trench and a second sub-trench arranged opposite to each other, and the support wall includes a first sub-support wall and a second sub-support wall, wherein the first sub-support wall is the side wall of the first sub-trench and the second sub-support wall is the side wall of the second sub-trench. The plurality of fixing components are respectively located on the first sub-support wall and the second sub-support wall.
3. The vacuum cassette according to claim 1, characterized in that, The plurality of the fixing components are arranged in a centrally symmetrical manner along the center of the wafer.
4. The vacuum cassette according to claim 1, characterized in that, The fixing component includes a first fixing part and a second fixing part; the second fixing part is located on the support wall, and the first fixing part protrudes from the surface of the second fixing part in a direction away from the support wall. The second fixing part is used to place the wafer, and the first fixing part is used to limit the position of the wafer.
5. The vacuum cassette according to claim 4, characterized in that, The side of the first fixing part facing the wafer is an arc surface, and the arc surface is recessed in a direction away from the center of the wafer.
6. The vacuum cassette according to claim 4, characterized in that, The fixing component further includes a third fixing part, which is connected to the second fixing part and is used to fix the fixing structure to the support wall.
7. The vacuum cassette according to claim 1, characterized in that, The vacuum cassette also includes a connecting assembly for connecting the fixing structure and the supporting wall.
8. The vacuum cassette according to claim 1, characterized in that, The vacuum wafer cassette includes multiple sensors, which are arranged in a centrally symmetrical manner along the center of the wafer.
9. The vacuum cassette according to claim 8, characterized in that, The sensors include position sensors.
10. The vacuum cassette according to claim 1, characterized in that, The sensor is located on the side of the fixing assembly away from the centerline of the wafer.