Anti-collision device and semiconductor device

Abstract

According to the anti-collision device and the semiconductor equipment, a limiting block is arranged between a lifting sliding block and a jacking assembly, the limiting block comprises a first end and a second end in the vertical direction, the first end is fixedly arranged at the bottom of the jacking assembly, and the second end extends to the position below the lifting sliding block; and the jacking assembly is used for abutting against the bottom of the lifting sliding block in the lifting process of the jacking assembly. In the lifting process of the jacking assembly, the second end of the limiting block abuts against the bottom of the lifting sliding block, the jacking assembly is prevented from continuing to ascend, the position of the jacking assembly is limited, and therefore collision between the bearing platform and the jacking assembly is prevented, and anti-collision protection between the jacking assembly and the bearing platform is achieved. In addition, as the limiting block is arranged at the bottom of the jacking assembly and extends to the position below the lifting sliding block, anti-collision protection can be achieved on the premise that the normal lifting function is not affected, and the operation reliability of the semiconductor equipment is further improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment, and more particularly to an anti-collision device and a semiconductor device. Background Technology

[0002] With the booming development of the semiconductor industry, deposition / etching equipment plays an irreplaceable role in wafer manufacturing. Through precise deposition and etching processes on wafers, deposition / etching equipment is a key piece of equipment for manufacturing semiconductor devices. The process involves multiple steps, such as lifting and heating the wafer, and these critical processes require precise control and coordination.

[0003] Existing deposition / etching equipment mainly consists of two core components: the pedestal and the hoop. The pedestal not only heats and holds the wafer but also creates a protective atmosphere at the wafer edge, providing stable environmental conditions for the process. The hoop, by supporting the bottom of the pins and utilizing a special mushroom-shaped structure to work with the pins to prevent them from falling off, plays a crucial role in wafer transport and lifting / baking processes by precisely adjusting the pin position.

[0004] However, existing technologies have the following technical problems: In certain processes, the stage needs to move up and down to transfer wafers and adjust the coating distance; simultaneously, the ring support also needs to move up and down to transfer wafers and adjust the coating distance. This inevitably leads to an overlap between the movement strokes of the stage and the ring support. Although this problem can be avoided by adjusting the length of the ejector pins, this solution significantly increases the cavity volume, leading to increased costs and affecting the stability of the process environment. Furthermore, existing technologies primarily rely on software to detect encoder readings to limit the relative position between the stage and the ring support, but collision risks still exist in special circumstances such as zero-position offset, software reset, and manual adjustment. Utility Model Content

[0005] The problem solved by this utility model embodiment is to provide an anti-collision device and a semiconductor device for preventing collisions from occurring inside the semiconductor device.

[0006] To address the aforementioned problems, this utility model provides a position adjustment device, comprising: the anti-collision device including: a lifting slider for pushing a support platform to move vertically; a lifting assembly located below the support platform and moving vertically toward or away from the support platform, causing the wafer on the support platform to rise or fall; and a limiting block including a first end and a second end in the vertical direction, the first end being fixedly disposed at the bottom of the lifting assembly, and the second end extending below the lifting slider for abutting against the bottom of the lifting slider during the rising of the lifting assembly.

[0007] This utility model embodiment also provides a semiconductor device, including: a cavity; a support platform disposed in the cavity, the support platform being used to support a wafer and heat the wafer; a support portion disposed at the bottom of the support platform and penetrating through the bottom of the cavity, the support portion being used to support the support platform; and the anti-collision device described in any embodiment of this utility model.

[0008] Compared with the prior art, the technical solution of this utility model embodiment has the following advantages:

[0009] The anti-collision device provided in this embodiment is applied to semiconductor equipment. The device uses a limiting block between a lifting slider and a lifting assembly. The limiting block includes a first end and a second end in the vertical direction. The first end is fixedly disposed at the bottom of the lifting assembly, and the second end extends below the lifting slider, serving to abut against the bottom of the lifting slider during the lifting assembly's ascent. During the lifting assembly's ascent, the second end of the limiting block abuts against the bottom of the lifting slider, preventing the lifting assembly from continuing to rise and limiting its position, thereby preventing collisions between the support platform and the lifting assembly, achieving anti-collision protection between the lifting assembly and the support platform. Furthermore, since the limiting block is located at the bottom of the lifting assembly and extends below the lifting slider, anti-collision protection can be achieved without affecting normal lifting functions, further improving the operational reliability of the semiconductor equipment. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of the first embodiment of the anti-collision device provided by this utility model, in which the limiting block does not contact the lifting slider;

[0011] Figure 2 This is a schematic diagram of the limiting block contacting the lifting slider in the first embodiment of the anti-collision device provided by this utility model;

[0012] Figure 3 This is a schematic diagram of the lifting assembly of the anti-collision device provided in this embodiment of the utility model;

[0013] Figure 4This is a schematic diagram of the structure of the anti-collision device pin bracket provided in this embodiment of the utility model;

[0014] Figure 5 This is a schematic diagram of the structure of a limiting block of an anti-collision device provided in this utility model embodiment;

[0015] Figure 6 This is a schematic diagram of the structure of another embodiment of the limiting block of the anti-collision device provided in this utility model embodiment;

[0016] Figure 7 This is a schematic diagram of another embodiment of the anti-collision device provided in this utility model;

[0017] Figure 8 This is a schematic diagram of the second embodiment of the anti-collision device provided by this utility model, in which the limiting block does not contact the lifting slider;

[0018] Figure 9 This is a schematic diagram of the limiting block contacting the lifting slider in the second embodiment of the anti-collision device provided in this utility model;

[0019] Figure 10 This is a schematic diagram of the structure of the first embodiment of the semiconductor device provided in this utility model;

[0020] Figure 11 This is a schematic diagram of the structure of the semiconductor device support platform and support portion provided in this embodiment of the utility model;

[0021] Figure 12 This is a schematic diagram of the structure of the second embodiment of the semiconductor device provided in this utility model. Detailed Implementation

[0022] As can be seen from the background technology, existing technologies have the following technical problems: In certain processes, the stage needs to move up and down to transfer wafers and adjust the coating distance; simultaneously, the ring support also needs to move up and down to transfer wafers and adjust the coating distance. This inevitably leads to an overlap between the movement strokes of the stage and the ring support. Although this problem can be avoided by adjusting the length of the ejector pins, this solution significantly increases the cavity volume, leading to increased costs and affecting the stability of the process environment. Furthermore, existing technologies mainly rely on software to detect encoder readings to limit the relative position between the stage and the ring support, but collision risks still exist in special cases such as zero-position offset, software reset, and manual adjustment.

[0023] To address the aforementioned technical problem, the anti-collision device provided in this embodiment is applied to semiconductor equipment. The anti-collision device includes a limiting block between the lifting slider and the lifting assembly. The limiting block has a first end and a second end in the vertical direction. The first end is fixedly disposed at the bottom of the lifting assembly, and the second end extends below the lifting slider, serving to abut against the bottom of the lifting slider during the lifting assembly's ascent. During the lifting assembly's ascent, the second end of the limiting block abuts against the bottom of the lifting slider, preventing the lifting assembly from continuing to rise and limiting its position, thereby preventing collisions between the support platform and the lifting assembly, achieving anti-collision protection between the lifting assembly and the support platform. Furthermore, since the limiting block is located at the bottom of the lifting assembly and extends below the lifting slider, anti-collision protection can be achieved without affecting normal lifting functions, further improving the operational reliability of the semiconductor equipment.

[0024] To make the above-mentioned objectives, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0025] refer to Figure 1 and Figure 2 The anti-collision device provided in the first embodiment of this utility model is applied to semiconductor equipment. The anti-collision device includes: a lifting slider 100 for pushing the support platform 200 (shown as a dashed line in the figure) to move vertically; a lifting component 300 located below the support platform 200 and moving vertically towards or away from the support platform 200, causing the wafer on the support platform 200 to rise or fall; and a limiting block 400, including a first end 401a in the vertical direction (e.g., ...). Figure 5 (as shown) and the second end 402a (as shown) Figure 5 As shown, the first end 401a is fixedly disposed at the bottom of the lifting assembly 300, and the second end 402a extends to the bottom of the lifting slider 100, for contacting the bottom of the lifting slider 100 during the lifting process of the lifting assembly 300.

[0026] The anti-collision device provided in this embodiment is applied to semiconductor equipment. The device includes a limiting block 400 between the lifting slider 100 and the lifting assembly 300. The limiting block 400 includes a first end 401a and a second end 402a in the vertical direction. The first end 401a is fixedly disposed at the bottom of the lifting assembly 300, and the second end 402a extends below the lifting slider 100, serving to abut against the bottom of the lifting slider 100 during the lifting process. During the lifting process, the second end 402a of the limiting block 400 abuts against the bottom of the lifting slider 100, preventing the lifting assembly 300 from continuing to rise, thus limiting the position of the lifting assembly 300 and preventing collision between the supporting platform 200 and the lifting assembly 300, achieving anti-collision protection between the lifting assembly 300 and the supporting platform 200. In addition, since the limit block 400 is located at the bottom of the lifting assembly 300 and extends below the lifting slider 100, it can achieve anti-collision protection without affecting the normal lifting function, further improving the operational reliability of the semiconductor equipment.

[0027] It should be noted that the bearing platform 200 and the cavity 900 are not part of the anti-collision device and are represented by dashed lines in the figure.

[0028] In this embodiment, the lifting slider 100 is used to push the support platform 200 to move in the vertical direction.

[0029] The lifting slider 100, as the driving component of the support platform 200, adjusts the height of the support platform 200 through reciprocating motion in the vertical direction. This enables the transfer of wafers between different workstations and the adjustment of processing positions, thereby ensuring the smooth progress of each process step in semiconductor processing. For collision protection, the lifting slider 100 cooperates with the limiting block 400. When the lifting assembly 300 rises to a dangerous position, the second end 402a of the limiting block 400 abuts against the bottom of the lifting slider 100, preventing the lifting assembly 300 from continuing to rise and thus avoiding a collision between the lifting assembly 300 and the support platform 200.

[0030] In this embodiment, the lifting slider 100 is slidably mounted on the second linear guide rail. The second linear guide rail is a high-precision linear guide rail to ensure the smoothness of the movement and positioning accuracy of the lifting slider 100.

[0031] As an example, the lifting slider 100 is driven by a second linear module 600 and is slidably mounted on a second linear guide rail. The second linear module 600 employs a drive method involving a motor and a lead screw pair, converting the rotational motion of the lead screw into the linear motion of the lifting slider 100, thus achieving precise upward or downward control. In vertical lifting applications, a servo motor with a brake is selected to ensure position holding capability in the event of power failure.

[0032] In this embodiment, the lifting slider 100 is provided with a T-shaped internal thread. Compared with ordinary triangular threads, the T-shaped internal thread has a wider tooth profile and a larger tooth angle, resulting in a larger contact area. This better reduces stress concentration, allowing the T-shaped thread to withstand higher axial loads, which is beneficial for applications with high torque and heavy loads. In addition, the T-shaped thread also has a self-locking function to prevent the thread from rotating due to load when the motor is not working.

[0033] It should be noted that the second linear module 600 is a component of the semiconductor device and is fixedly installed at the bottom of the cavity 900.

[0034] like Figure 3 As shown, the lifting component 300 is located below the support platform 200 and moves vertically towards or away from the support platform 200, playing an important role in the wafer transfer and wafer baking process.

[0035] The lifting assembly 300 is used to realize the lifting and transfer functions of the wafer. The lifting assembly 300 pushes the ejector pin 304 in the support platform 200 to lift the wafer from the support platform 200 by moving in the vertical direction, thereby realizing precise positioning and transfer of the wafer.

[0036] In this embodiment, the lifting component 300 is slidably mounted on the first linear guide rail. The first linear guide rail is a high-precision linear guide rail to ensure the smoothness of the movement and the positioning accuracy of the lifting component 300.

[0037] As an example, the lifting assembly 300 is driven by a first linear module 700 and slidably mounted on a first linear guide rail. The first linear module 700 employs a drive method involving a motor and a lead screw pair, converting the rotational motion of the lead screw into the linear motion of the lifting assembly 300, thus achieving precise raising or lowering control. In vertical lifting applications, a servo motor with a brake is selected to ensure position holding capability in the event of power failure.

[0038] In this embodiment, the first linear module 700 is a component of the semiconductor device and is fixedly disposed at the bottom of the cavity 900.

[0039] In this embodiment, the lifting assembly 300 is provided with a T-shaped internal thread.

[0040] In this embodiment, the lifting assembly 300 includes: a lifting slider 301; a lifting column 302, which is fixedly disposed on the top of the lifting slider 301; a pin support 303, which is fixedly disposed on the top of the lifting column 302; and a pin 304, which is slidably disposed on the support platform 200 and is used to abut against the pin support 303.

[0041] The lifting assembly 300 lifts the wafer from the carrier platform 200 through the coordinated operation of the lifting slider 301, the lifting column 302, the abutment bracket 303 and the ejector pin 304, which plays an important role in wafer transfer and lifting baking processes.

[0042] The lifting slider 301 is used to support and drive the lifting column 302 and the pin support 303 to move vertically.

[0043] In this embodiment, the lifting slider 301 is connected to the motor of the first linear module 700 to achieve precise motion control of the lifting column 302 and the pin support 303 in the vertical direction, so that the pin 304 can lift the wafer from the support platform 200 under the push of the pin support 303.

[0044] In this embodiment, the lifting slider 301 is located on one side of the lifting slider 100.

[0045] By setting the lifting slider 301 on one side of the lifting slider 100, a reasonable spatial layout of the lifting slider 301 and the lifting slider 100 is achieved, avoiding interference between the lifting slider 301 and the lifting slider 100 in the planar direction, and providing the necessary space for the setting of the limiting block 400, so that the limiting block 400 can effectively achieve anti-collision protection between the lifting component 300 and the bearing platform 200.

[0046] The lifting column 302, through its fixed connection with the lifting slider 301, provides a stable support foundation for the pin bracket 303, thereby enabling reliable vertical movement of the lifting assembly 300.

[0047] In this embodiment, the lifting column 302 penetrates the bottom of the cavity and serves as a guide, enabling the lifting column 302 to maintain vertical movement.

[0048] The push pin bracket 303 is fixedly installed on the top of the lifting column 302 to form a cooperation mechanism with the push pin 304, thereby pushing the push pin 304 to lift the wafer from the support platform 200 during the lifting assembly 300's ascent.

[0049] like Figure 4 As shown, the push pin support 303 is in the shape of a ring. There are multiple push pins 304 on the support platform 200, which are arranged in a ring. The ring shape of the push pin support 303 allows the push pins 304 on the support platform 200 to be lifted, thereby allowing the wafer on the support platform 200 to be lifted.

[0050] The ejector pin 304 is vertically penetrating and slidably disposed in the carrier platform 200, allowing the ejector pin 304 to slide freely in the vertical direction. When the wafer position needs to be adjusted, the ejector pin bracket 303 abuts against the ejector pin 304, and the ejector pin 304 is lifted up, thereby lifting the wafer off the carrier platform 200.

[0051] In this embodiment, the ejector pin 304 includes a through portion (not shown in the figure) and a blocking portion (not shown in the figure) located at the top of the through portion. The radial dimension of the blocking portion is larger than the radial dimension of the through portion. During the descent of the lifting assembly 300, even if the lifting assembly 300 does not abut against the ejector pin 304, the ejector pin 304 will not fall off the support platform 200.

[0052] It should be noted that there are three ejector pins 304 arranged in a circle. When the ejector pin support 303 abuts against the ejector pins 304, the ejector pins 304 arranged in a circle are lifted up.

[0053] It should also be noted that there are two main operating modes during wafer transfer: one is to slowly lower the wafer onto the support platform 200 by adjusting the height of the lifting component 300; the other is to keep the wafer in a fixed position and have the support platform 200 rise to catch the wafer. Both modes require precise coordination between the ejector pin 304 and the abutment bracket 303.

[0054] The collaborative working process of the components of the lifting assembly 300 is as follows: The lifting slider 301, as the basic power component, realizes vertical lifting and lowering movement through the first linear module 700; the lifting column 302 is fixed on the top of the lifting slider 301 and moves up and down with the movement of the lifting slider 301; the abutment bracket 303 is designed in a ring shape and is fixedly installed on the top of the lifting column 302, following the movement of the lifting column 302; the ejector pin 304 is slidably set on the support platform 200. When the abutment bracket 303 moves upward, it will abut against the ejector pin 304, pushing the ejector pin 304 to lift the wafer from the support platform 200.

[0055] like Figure 5 As shown, the limiting block 400 includes a fixed segment 401 and a limiting segment 402 that are parallel to each other, and a connecting segment 403 that connects the fixed segment 401 and the limiting segment 402. The fixed segment 401 includes a first end 401a, and the limiting segment 402 includes a second end 402a.

[0056] The parallel arrangement of the fixed section 401 and the limiting section 402 ensures the structural stability and uniform force distribution of the limiting block 400 under stress. This allows the fixed section 401 to be reliably fixed to the bottom of the lifting component 300 through its first end 401a, and the limiting section 402 to extend stably to the bottom of the lifting slider 100 through its second end 402a. As a result, during the rising process of the lifting component 300, it forms a reliable contact with the bottom of the lifting slider 100, preventing the lifting component 300 from rising further. Therefore, it effectively prevents the collision between the lifting component 300 and the lifting slider 100.

[0057] In this embodiment, the fixed section 401 includes a first end 401a, which is used to fix and connect to the bottom of the lifting assembly 300, and can be connected by bolts or welding.

[0058] In this embodiment, the limiting segment 402 includes a second end 402a, the length and position of which need to be precisely designed to ensure effective contact with the bottom of the lifting slider 100 at the appropriate time. The connecting segment 403 adopts an appropriate length and cross-sectional design to ensure sufficient strength to withstand possible impact forces while maintaining the compactness of the overall structure.

[0059] In this embodiment, the fixed section 401, the limiting section 402 and the connecting section 403 are rigidly connected, which can be achieved by welding or integral molding.

[0060] In other embodiments, such as Figure 6 and Figure 7 As shown, the limiting block 500 includes a vertical segment 501 and a horizontal segment 502 connected to the vertical segment 501. The vertical segment 501 includes a first end 501a, and the horizontal segment 502 includes a second end 502a.

[0061] The vertical segment 501 of the limiting block 500 is fixedly connected to the bottom of the lifting component through the first end 501a, thereby ensuring a stable connection between the limiting block 500 and the lifting component, and thus ensuring that the limiting block 500 moves synchronously with the lifting component. Therefore, when the lifting component rises, the horizontal segment 502 of the limiting block 500 abuts against the bottom of the lifting slider through the second end 502a, so that the lifting component stops rising, which is beneficial to achieving anti-collision protection between the lifting component and the bearing platform.

[0062] In this embodiment, the straight section 502 and the vertical section 501 are rigidly connected, which can be achieved by welding or integral molding.

[0063] refer to Figure 8 and Figure 9The present invention also provides a second embodiment of the anti-collision device. The similarities between this embodiment and the first embodiment will not be repeated here. The difference is that the anti-collision device further includes: a sensor 800, which is disposed at the second end of the limiting block 400 (not shown in the figure) and is used to issue a warning signal before the limiting block 400 contacts the lifting slider 100; a first linear module 700, which is used to drive the lifting assembly 300 to move closer to or further away from the bearing platform 200 in the vertical direction; and a controller, which is connected to the first linear module 700 and is used to control the first linear module 700 to drive or stop. The controller is also connected to the sensor 800 and is used to receive the warning signal and stop the first linear module 700 when the warning signal is received.

[0064] The anti-collision device includes a sensor 800, a first linear module 700, and a controller (not shown in the figure), all components of a semiconductor device. The sensor 800 is located at the second end of the limit block 400 and is used to issue a warning signal before the limit block 400 makes physical contact with the lifting slider 100, thus achieving an early warning function. The first linear module 700 is responsible for driving the lifting assembly 300 to move vertically, thereby adjusting the distance between the lifting assembly 300 and the support platform 200. After receiving the warning signal from the sensor 800, the controller, based on its connection with the first linear module 700, controls the first linear module 700 to stop.

[0065] Sensor 800 is located at the second end of limit block 400 and is used to issue a warning signal before limit block 400 contacts lifting slider 100, so as to stop the first linear module 700 and prevent lifting component 300 from continuing to rise, making the entire anti-collision protection more reliable and intelligent, which is conducive to improving the operational safety of semiconductor equipment.

[0066] In this embodiment, the sensor 800 includes a limit switch. When the lifting assembly 300 rises, the limit block 400 installed at the bottom of the lifting assembly 300 rises accordingly. When it rises to a position close to the lifting slider 100, the limit switch is triggered first, issuing a warning signal. The control system then controls the first linear module 700 to stop operating.

[0067] In this embodiment, the limit switch typically employs a mechanical contact structure, including normally open (NO) and normally closed (NC) contacts. When the limit block 400 rises, the limit switch makes mechanical contact with the bottom of the lifting slider 100, causing a change in the contact state. When the contacts actuate, the internal mechanical mechanism of the limit switch drives the electrical contacts to rapidly switch states, converting the mechanical displacement into an electrical switching signal. This electrical switching signal is transmitted to the controller, which then stops the first linear module 700 based on the received electrical switching signal.

[0068] In other embodiments, the sensor includes a distance sensor. The distance sensor can detect the distance to the lifting slider using photoelectric, ultrasonic, or electromagnetic induction methods. As the lifting assembly rises, the distance between the second end of the limit block and the lifting slider gradually decreases, and the distance sensor monitors this change in real time. When the distance between the limit block and the lifting slider is less than a preset safety threshold, the distance sensor sends a warning signal to the controller. Upon receiving the warning signal, the controller immediately stops the first linear module to prevent a collision.

[0069] The anti-collision device of this embodiment employs a dual protection mechanism of a limiting block 400 and a controller. Specifically, firstly, the first end of the limiting block 400 (not shown in the figure) is fixed to the bottom of the lifting assembly 300, and the second end extends to the bottom of the lifting slider 100. When the lifting assembly 300 rises, the limiting block 400 can directly abut against the bottom of the lifting slider 100, preventing the limiting block 400 from continuing to rise and preventing a collision. Secondly, the connection between the controller, the sensor 800, and the first linear module 700 constructs a warning-control system. The sensor 800 is installed at the second end of the limiting block 400 and can issue a warning signal before the limiting block 400 contacts the lifting slider 100. After receiving the warning signal, the controller immediately controls the first linear module 700 to stop moving. The electrical control protection can be triggered before mechanical contact occurs, providing sufficient response time for subsequent control measures.

[0070] In the specific operation of the anti-collision device, firstly, the support platform 200 moves vertically driven by the lifting slider 100. Simultaneously, the lifting assembly 300 located below the support platform 200 also moves vertically to adjust the wafer position on the support platform 200. To prevent collisions between the lifting slider 100 and the lifting assembly 300 during movement, a limiting block 400 with a first end and a second end is fixedly installed at the bottom of the lifting assembly 300, wherein the second end extends below the lifting slider 100.

[0071] When the lifting assembly 300 rises, just before it collides with the support platform 200, the second end of the limiting block 400 contacts the bottom of the lifting slider 100, preventing the lifting assembly 300 from rising further and avoiding a collision with the support platform 200. Furthermore, before the second end of the limiting block 400 contacts the lifting slider 100, the sensor 800 located at the second end of the limiting block 400 detects the potential collision risk and issues a warning signal. Upon receiving the signal, the controller immediately stops the first linear module 700, thus stopping the lifting assembly 300, forming a dual protection mechanism of warning and braking.

[0072] refer to Figure 10 and Figure 11The present invention also provides a first embodiment of a semiconductor device, comprising: a cavity 900; a support platform 200 (e.g., Figure 11 As shown), it is set in cavity 900, the support platform 200 is used to support the wafer and heat the wafer; the support part 201 (as shown) Figure 11 As shown), it is set at the bottom of the bearing platform 200 and penetrates the bottom of the cavity 900. The support part 201 is used to support the bearing platform 200; the anti-collision device described in the aforementioned embodiment.

[0073] When the semiconductor device provided in this embodiment of the present invention is in operation, the lifting slider 100 pushes the support portion 201 to move the support platform 200 in the vertical direction within the cavity 900. The lifting component 300 moves closer to or further away from the support platform 200 in the vertical direction, causing the wafer on the support platform 200 to rise or fall. The limiting block 400 includes a first end 401a and a second end 402a in the vertical direction. The first end 401a is fixedly disposed at the bottom of the lifting component 300, and the second end 402a extends to the bottom of the lifting slider 100. During the rising process of the lifting component 300, the second end 402a of the limiting block 400 abuts against the bottom of the lifting slider 100, preventing the lifting component 300 from continuing to rise, thereby limiting the position of the lifting component 300 and preventing collision between the support platform 200 and the lifting component 300, thus achieving anti-collision protection between the lifting component 300 and the support platform 200. In addition, since the limit block 400 is located at the bottom of the lifting assembly 300 and extends below the lifting slider 100, it can achieve anti-collision protection without affecting the normal lifting function, further improving the operational reliability of the semiconductor equipment.

[0074] In this embodiment, the support platform 200 is used to adsorb and heat the wafer, and to form a protective atmosphere at the edge of the wafer.

[0075] In this embodiment, the lifting slider 100 is located at the bottom of the support portion 201. The lifting slider 100 pushes the support portion 201, causing the support platform 200 to move in the vertical direction.

[0076] In this embodiment, the lifting assembly 300 includes: a lifting slider 301 located below the cavity 900; a lifting column 302 fixedly disposed on the top of the lifting slider 301 and penetrating the bottom of the cavity 900; a pin support 303 fixedly disposed on the top of the lifting column 302 and located inside the cavity 900; and a pin 304 penetrating vertically and slidably disposed in the support platform 200 for abutting against the pin support 303.

[0077] Semiconductor devices also include: upper limit position 1101 of the base (e.g.) Figure 10As shown), it is located in the area corresponding to the lifting slider 100 at the bottom of the cavity 900, and is used to limit the upper limit position of the lifting slider 100; the lower limit of the base 1102 (as shown) Figure 10 As shown in the figure, it is set at the bottom of the lifting slider 100 to limit the lower limit position of the lifting slider 100.

[0078] The upper limit stop 1101 of the base is located at the bottom of the cavity 900 in the area corresponding to the lifting slider 100, and is used to limit the upward distance of the lifting slider 100; the lower limit stop 1102 of the base is located at the bottom of the lifting slider 100, and is used to limit its downward distance. The cooperation of these two limiting devices with the lifting slider 100 prevents excessive displacement of the lifting slider 100 in the vertical direction, thereby ensuring the safe operation of the support platform 200 and improving the overall safety and reliability of the semiconductor equipment.

[0079] In this embodiment, the upper limit position 1101 and the lower limit position 1102 of the base are columnar. The end of the upper limit position 1101 of the base is provided with a thread, and the upper limit position 1101 of the base is fixed to the area corresponding to the lifting slider 100 in the bottom of the cavity 900 by the thread. The end of the lower limit position 1102 of the base is provided with a thread, and the lower limit position 1102 of the base is fixed to the bottom of the lifting slider 100 by the thread.

[0080] Semiconductor equipment also includes: lifting upper limit 1103 (such as...) Figure 10 As shown), it is set at the bottom of the cavity 900 to limit the upper limit position of the lifting assembly 300; the lower limit position 1104 (as shown) Figure 10 As shown), it is set at the bottom of the lifting assembly 300 to limit the lower limit position of the lifting assembly 300.

[0081] The upper limit of the lifting mechanism 1103 and the lower limit of the lifting mechanism 1104 limit the displacement range of the lifting component 300 to prevent the lifting component 300 from exceeding the safe movement range.

[0082] Semiconductor equipment also includes: cover plate 1400 (e.g. Figure 10 As shown), it is located at the top of cavity 900.

[0083] The semiconductor device also includes a first bellows 1200, which is vertically disposed between the bottom of the cavity 900 and the bottom of the support portion 201. The first bellows 1200 serves as a sealing element to accommodate spatial changes caused by the movement of the support portion 201 when the lifting slider 100 adjusts the height of the support platform 200. This prevents sealing failure due to the movement of the support portion 201, thus maintaining vacuum or pressure control within the cavity 900.

[0084] Specifically, the first corrugated pipe 1200 includes a first pipe body 1201, a first fixing member 1202 located at the upper end of the first pipe body 1201, and a second fixing member 1203 located at the lower end of the first pipe body 1201. The first fixing member 1202 is fixedly connected to the bottom of the cavity 900, and the second fixing member 1203 is fixedly connected to the bottom of the support portion 201.

[0085] In this embodiment, the first corrugated pipe 1200 wraps around the exposed side wall of the support portion 201 of the cavity 900, so that the first corrugated pipe 1200 can seal while allowing the support portion 201 to move up and down.

[0086] Specifically, the first tube 1201 has annular corrugations, which allow it to bend and stretch without affecting its inner diameter, thereby accommodating the lifting and lowering movement of the support 201.

[0087] The semiconductor device also includes a second bellows 1300, which is vertically disposed between the bottom of the cavity 900 and the bottom of the lifting slider 301. The second bellows 1300 serves as a sealing element to accommodate spatial changes caused by the movement of the lifting slider 301 when adjusting the height of the wafer. This prevents sealing failure due to the movement of the lifting slider 301, thus maintaining vacuum or pressure control within the cavity 900.

[0088] Specifically, the second corrugated pipe 1300 includes a second pipe body 1301 and a third fixing member 1302 located at the upper end of the second pipe body 1301. The third fixing member 1302 is fixedly connected to the bottom of the cavity 900, and the bottom of the second pipe body 1301 is directly and sealed to the lifting slider 301.

[0089] In this embodiment, the second bellows 1300 wraps around the exposed side wall of the lifting column 302 of the cavity 900, so that the second bellows 1300 can play a sealing role while also allowing the lifting assembly 300 to move up and down.

[0090] Specifically, the second tube 1301 has annular corrugations, which allow it to bend and stretch without affecting its inner diameter, thereby accommodating the lifting and lowering movement of the support 201.

[0091] refer to Figure 12This utility model also provides a second embodiment of a semiconductor device. The similarities between this embodiment and the first embodiment will not be repeated here. The difference is that the anti-collision device of the semiconductor device further includes: a sensor 800, which is disposed at the second end of the limiting block 400 (not shown in the figure) and is used to issue a warning signal before the limiting block 400 contacts the lifting slider 100; a first linear module 700, which is used to drive the lifting assembly 300 to move closer to or further away from the bearing platform 200 in the vertical direction; and a controller, which is connected to the first linear module 700 and is used to control the first linear module 700 to drive or stop. The controller is also connected to the sensor 800 to receive the warning signal and is used to stop the first linear module 700 when the warning signal is received.

[0092] The anti-collision device includes a sensor 800, a first linear module 700, and a controller. The sensor 800 is located at the second end of the limit block 400 and is used to issue a warning signal before the limit block 400 makes physical contact with the lifting slider 100, thus providing an early warning function. The first linear module 700 is responsible for driving the lifting assembly 300 to move vertically, thereby adjusting the distance between the lifting assembly 300 and the support platform 200. After receiving the warning signal from the sensor 800, the controller, based on its connection with the first linear module 700, controls the first linear module 700 to stop.

[0093] Sensor 800 is located at the second end of limit block 400 and is used to issue a warning signal before limit block 400 contacts lifting slider 100, so as to stop the first linear module 700 and prevent lifting component 300 from continuing to rise, making the entire anti-collision protection more reliable and intelligent, which is conducive to improving the operational safety of semiconductor equipment.

[0094] In this embodiment, the sensor 800 includes a limit switch. When the lifting assembly 300 rises, the limit block 400 installed at the bottom of the lifting assembly 300 rises accordingly. When it rises to a position close to the lifting slider 100, the limit switch is triggered first, issuing a warning signal. The control system then controls the first linear module 700 to stop operating.

[0095] In this embodiment, the limit switch typically employs a mechanical contact structure, including normally open (NO) and normally closed (NC) contacts. When the limit block 400 rises, the limit switch makes mechanical contact with the bottom of the lifting slider 100, causing a change in the contact state. When the contacts actuate, the internal mechanical mechanism of the limit switch drives the electrical contacts to rapidly switch states, converting the mechanical displacement into an electrical switching signal. This electrical switching signal is transmitted to the controller, which then stops the first linear module 700 based on the received electrical switching signal.

[0096] In other embodiments, sensor 800 includes a distance sensor. The distance sensor can detect the distance to the lifting slider 100 using photoelectric, ultrasonic, or electromagnetic induction methods. As the lifting assembly 300 rises, the distance between the second end of the limit block 400 and the lifting slider 100 gradually decreases, and the distance sensor monitors this change in real time. When the distance between the limit block 400 and the lifting slider 100 is less than a preset safety threshold, the distance sensor sends a warning signal to the controller. Upon receiving the warning signal, the controller immediately stops the first linear module 700 to prevent a collision.

[0097] The anti-collision device of this embodiment employs a dual protection mechanism of a limiting block 400 and a controller. Specifically, firstly, the first end of the limiting block 400 is fixed to the bottom of the lifting assembly 300, and the second end extends below the lifting slider 100. When the lifting assembly 300 rises, the limiting block 400 can directly abut against the bottom of the lifting slider 100, preventing the limiting block 400 from continuing to rise and preventing a collision. Secondly, the connection between the controller, the sensor 800, and the first linear module 700 constructs a warning-control system. The sensor 800 is installed at the second end of the limiting block 400 and can issue a warning signal before the limiting block 400 contacts the lifting slider 100. After receiving the warning signal, the controller immediately controls the first linear module 700 to stop moving. The electrical control protection is triggered before mechanical contact occurs, providing sufficient response time for subsequent control measures.

[0098] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the present invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A collision avoidance device, applied to semiconductor equipment, characterized in that, The anti-collision device includes: a lifting slider, used to push the support platform to move in the vertical direction; The lifting assembly is located below the support platform and moves vertically toward or away from the support platform, causing the wafer on the support platform to rise or fall. The limiting block includes a first end and a second end in the vertical direction. The first end is fixedly disposed at the bottom of the lifting assembly, and the second end extends to the bottom of the lifting slider for abutting against the bottom of the lifting slider during the lifting process of the lifting assembly.

2. The anti-collision device as described in claim 1, characterized in that, The limiting block includes a fixed segment and a limiting segment that are parallel to each other, and a connecting segment that connects the fixed segment and the limiting segment. The fixed segment includes a first end, and the limiting segment includes a second end. Alternatively, the limiting block may include a vertical segment and a horizontal segment connected to the vertical segment, the vertical segment including the first end and the horizontal segment including the second end.

3. The anti-collision device as described in claim 1, characterized in that, The anti-collision device also includes: A sensor, disposed at the second end of the limiting block, is used to issue a warning signal before the limiting block contacts the lifting slider; The semiconductor device includes: a first linear module for driving the lifting assembly to move vertically toward or away from the support platform; and a controller connected to the first linear module for controlling the first linear module to drive or stop. The controller is also connected to the sensor for receiving the warning signal and stopping the first linear module upon receiving the warning signal.

4. The anti-collision device as described in claim 3, characterized in that, The sensor includes a limit switch or a distance sensor.

5. The anti-collision device as described in claim 1, characterized in that, The lifting assembly includes: Lifting slider; The lifting column is fixedly installed on the top of the lifting slider; The pin support is fixedly installed on the top of the lifting column; The ejector pin is vertically inserted and slidably disposed in the support platform for contacting the ejector pin bracket.

6. The anti-collision device as described in claim 5, characterized in that, The pin support is ring-shaped.

7. The anti-collision device as described in claim 5, characterized in that, The lifting slider is located on one side of the lifting slider.

8. A semiconductor device, characterized in that, include: cavity; A support platform is disposed in the cavity, and the support platform is used to support and heat the wafer; A support portion is disposed at the bottom of the bearing platform and extends through the bottom of the cavity; the support portion is used to support the bearing platform. The anti-collision device as described in any one of claims 1 to 7.

9. The semiconductor device as claimed in claim 8, characterized in that, The anti-collision device further includes: a sensor disposed at the second end of the limiting block, used to issue a warning signal before the limiting block contacts the lifting slider; The semiconductor device further includes: a first linear module connected to the lifting assembly for driving the lifting assembly to move in the vertical direction; and a controller connected to the first linear module for controlling the rotation or stopping of the first linear module. The controller is also connected to the sensor to receive the warning signal and to stop the rotation of the first linear module when the warning signal is received.

10. The semiconductor device as claimed in claim 8, characterized in that, The semiconductor device also includes: The upper limit stop of the base is set in the area at the bottom of the cavity corresponding to the lifting slider, and is used to limit the upper limit position of the lifting slider; The lower limit of the base is set at the bottom of the lifting slider to limit the lower limit position of the lifting slider; The upper limit position of the lifting assembly is located at the bottom of the cavity and is used to limit the upper limit position of the lifting assembly; the lower limit position of the lifting assembly is located at the bottom of the lifting assembly and is used to limit the lower limit position of the lifting assembly.

11. The semiconductor device as claimed in claim 8, characterized in that, The lifting slider is located at the bottom of the support portion; The lifting assembly includes: a lifting slider located below the cavity; A lifting column is fixedly installed at the top of the lifting slider and extends through the bottom of the cavity; The pin support is fixedly mounted on the top of the lifting column and located inside the cavity; The ejector pin is vertically inserted and slidably disposed in the support platform for contacting the ejector pin bracket.

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