Heat dissipation structure of semiconductor refrigeration magnetic attraction wireless power bank

Abstract

The utility model discloses a heat dissipation structure of a semiconductor refrigeration magnetic attraction wireless power bank in the technical field of magnetic attraction wireless power banks, the semiconductor refrigeration magnetic attraction wireless power bank comprises a shell, a battery, a semiconductor refrigeration sheet and a fan are arranged in the shell, the heat absorption surface of the fan is attached to the hot end of the semiconductor refrigeration sheet, and the semiconductor refrigeration sheet is arranged in the shell. The air inlet face of the fan is communicated with the air inlet in the shell through an air inlet airflow channel, the peripheral air outlet end of the fan is communicated with the air outlet in the shell through an air outlet airflow channel, and external air is exhausted through the air inlet, the air inlet airflow channel, the cavity where the fan is located, the air outlet airflow channel and the air outlet in sequence and used for exhausting heat of the semiconductor chilling plate. According to the utility model, the channel specially used for dissipating heat in the space where the fan is located is formed between the air inlet and the air outlet on the shell, so that a gas flowing loop is formed, and rapid dissipation of heat is realized through the special air channel.

Description

Technical Field

[0001] This utility model relates to the field of magnetic wireless charging technology, specifically to a heat dissipation structure for a semiconductor-cooled magnetic wireless charging power bank. Background Technology

[0002] With the development of technology, people are using more and more wireless charging devices, including mobile phones, earphones, and watches. These devices are also being used for longer periods, making magnetic wireless power banks an indispensable part of daily life. Magnetic wireless power banks can magnetically hold electronic devices in place and charge them using electromagnetic principles. During the charging process, current flows through a coil to create a magnetic field, which in turn generates current in the coil within the electronic device, thus charging it.

[0003] As is well known, the flow of current through a coil creates a magnetic field, a process that easily generates a large amount of heat. This heat causes the magnet and coil in the magnetic power bank to heat up, and the increased temperature of the electromagnetic charging and discharging components affects the charging and discharging efficiency. Therefore, the high-temperature problem of magnetic wireless power banks is a current challenge.

[0004] To address this deficiency, existing magnetic wireless power banks often incorporate fans for heat dissipation. For high-power magnetic power banks, a thermoelectric cooler is also required. A thermoelectric cooler utilizes the thermoelectric effect of semiconductors for cooling. It has a cold end and a hot end; the cold end cools the magnetic power bank, while the heat from the hot end is dissipated by the fan. For example, utility model patent CN218276149U discloses a wireless mobile power bank with a circuit board fixed to one side of its body. A battery is mounted on one side of the circuit board, and a mounting plate is located outside the battery. A charging coil is fixed on the mounting plate, and a thermoelectric cooler is mounted on one side of the mounting plate. A cooling fan is mounted on the other side of the base, and the heat generated by the thermoelectric cooler is dissipated through the cooling fan.

[0005] According to its instruction manual Figure 1 , 2 It is known that the cooling fan is used to extract and dissipate heat from the semiconductor cooling chip. However, the cooling fan is located on the casing, and the entire casing does not have a channel for air intake. As a result, relying solely on the fan to extract heat is insufficient to fully exhaust the high-temperature air. The entire structure does not have a specific channel for exhausting hot air, making it difficult to alleviate the high temperature of the entire power bank.

[0006] The aforementioned shortcomings deserve improvement. Utility Model Content

[0007] To overcome the shortcomings of existing technologies, this utility model provides a heat dissipation structure for a semiconductor-cooled magnetic wireless power bank. It utilizes an air inlet channel to connect the air inlet of the power bank's casing with the space where the fan is located, and an air outlet channel to connect the air outlet of the power bank's casing with the space where the fan is located. This creates a dedicated channel between the air inlet and outlet on the casing for dissipating heat from the space where the fan is located, forming a gas flow loop. The dedicated air duct enables rapid heat dissipation.

[0008] The technical solution of this utility model is as follows:

[0009] A heat dissipation structure for a semiconductor-cooled magnetic wireless charging bank, comprising a housing, a battery inside the housing, and a semiconductor cooling chip and a fan for cooling and heat dissipation, characterized in that...

[0010] The heat absorption surface of the fan is attached to the hot end of the semiconductor cooling chip to absorb the heat emitted by the semiconductor cooling chip;

[0011] The air inlet of the fan is connected to the air inlet on the housing through the air inlet airflow channel, and the air outlet of the fan is connected to the air outlet on the housing through the air outlet airflow channel. Outside air passes through the air inlet, the air inlet airflow channel, the chamber where the fan is located, the air outlet airflow channel, and the air outlet in sequence and is discharged to dissipate the heat of the semiconductor cooling chip.

[0012] According to the above-described scheme, the present utility model is characterized in that the housing includes a bottom shell and an inner shell placed inside the bottom shell. The bottom shell is provided with a first air inlet and a first air outlet, and the inner shell is provided with a second air inlet and a second air outlet. The positions of the first air inlet and the second air inlet correspond to each other, and the positions of the first air outlet and the second air outlet correspond to each other.

[0013] Furthermore, a portion / all of the battery is located below the fan, and an inner shell air duct is provided on the side of the inner shell. The inner shell air duct is isolated from the air outlet, so that the inner shell air duct forms an air intake channel for gas to flow in.

[0014] Furthermore, the housing is provided with a heat insulation sheet located between the lower side of the fan and the battery, which is used to isolate the chamber where the fan is located from the chamber where the battery is located.

[0015] Furthermore, the housing is equipped with a fan bracket, and the bottom of the fan bracket is provided with an air inlet that runs vertically through the bottom. The inner shell air duct, the air duct between the fan bracket and the heat insulation sheet, and the opening together constitute an airflow channel for gas to flow in.

[0016] Furthermore, the air inlet opening corresponds to the air inlet surface of the fan.

[0017] Furthermore, the battery is located on one side of the fan, and the bottom of the inner shell is provided with an air inlet that runs vertically through the bottom. This air inlet serves as a second air inlet and forms an airflow channel for gas to flow in.

[0018] Furthermore, the first air inlet is located at the bottom of the bottom shell, and both the first air inlet and the second air inlet correspond to the air intake surface of the fan.

[0019] According to the above-described scheme, the present utility model is characterized in that the first air inlet is located at the corner of the bottom shell; or, the first air inlet is located at the bottom of the bottom shell, and the first air inlet is connected to the corner of the bottom shell through an air inlet grille.

[0020] According to the above-described scheme, the present invention is characterized in that a heat sink is provided between the hot end of the semiconductor cooling chip and the fan, and the fan absorbs the heat from the hot end of the semiconductor cooling chip through the heat sink.

[0021] According to the above-described solution, the beneficial effects of this utility model are as follows:

[0022] This invention features an air inlet and an air outlet on the housing, with the fan placed inside the housing. This allows the air inlet and outlet to be connected via an air intake channel, the space where the fan is located, and an air outlet channel, forming a complete gas flow loop. This design is more conducive to the dissipation of hot air and avoids insufficient airflow or poor air circulation that would affect the cooling effect if the fan is used solely for suction or blowing.

[0023] The casing of this utility model is equipped with a semiconductor cooling chip. The cold end of the semiconductor cooling chip can cool the coil and magnet of the magnetic wireless charging bank, while its hot end is attached to the fan, so that the heat can be absorbed by the fan and discharged through the gas flow circuit of the fan. This makes the cooling effect of the magnetic wireless charging bank better. This utility model is conducive to the realization of high-power charging banks. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the structure of Embodiment 1 of the present utility model;

[0025] Figure 2 This is a side sectional view of Embodiment 1 of the present utility model;

[0026] Figure 3 This is a schematic diagram of the structure surrounding the formation of the air duct in Embodiment 1 of this utility model;

[0027] Figure 4This is a schematic diagram of the gas flow direction in Embodiment 1 of this utility model;

[0028] Figure 5 This is an exploded view of the structure surrounding the formation of the air duct in Embodiment 1 of this utility model;

[0029] Figure 6 This is a schematic diagram of the structure of Embodiment 2 of the present invention;

[0030] Figure 7 This is a side sectional view of Embodiment 2 of the present invention;

[0031] Figure 8 This is a schematic diagram of the structure surrounding the formation of the air duct in Embodiment 2 of this utility model;

[0032] Figure 9 This is a schematic diagram of the gas flow direction in Embodiment 2 of this utility model;

[0033] Figure 10 This is an exploded view of the structure surrounding the air duct in Embodiment 2 of this utility model.

[0034] In the diagram, the labels for each item are as follows:

[0035] 10. Bottom shell; 11. First air inlet; 12. First air outlet; 20. Inner shell; 21. Second air inlet; 22. Second air outlet; 23. Inner shell air duct; 30. Panel; 40. Battery; 50. Fan; 60. Heat sink; 70. Fan bracket; 80. Heat insulation sheet; 90. Semiconductor cooling chip. Detailed Implementation

[0036] The present invention will be further described below with reference to the accompanying drawings and embodiments:

[0037] To overcome the shortcomings of existing magnetic wireless charging banks that fail to form a dedicated heat dissipation channel when using semiconductor cooling chips for cooling, thus hindering heat dissipation and cooling efficiency, this invention proposes a heat dissipation structure for a semiconductor-cooled magnetic wireless charging bank. This structure features an air inlet and an air outlet on the charging bank's casing. An air inlet channel connects the air inlet to the space containing the fan, and an air outlet channel connects the air outlet to the space containing the fan. This allows the fan to dissipate heat absorbed from the semiconductor cooler and magnetic wireless charging components through a circulating gas loop, improving the cooling effect.

[0038] Specifically, the semiconductor-cooled magnetic wireless charging bank includes a housing, within which a battery is housed. The battery is placed in a battery chamber A within the housing. The housing also contains a semiconductor cooling chip and a fan (preferably a turbine fan) for cooling and heat dissipation. The cold end of the semiconductor cooling chip is attached to the magnetic wireless charging and discharging assembly (including a magnet assembly and a charging / discharging coil), while the heat-absorbing surface of the fan is attached to the hot end of the semiconductor cooling chip to absorb the heat dissipated by the semiconductor cooling chip. In this invention, the semiconductor cooling chip and the magnetic wireless charging and discharging assembly are located within the charging / discharging and cooling chamber C, and the fan is placed within a fan chamber B specifically for housing the fan and related components.

[0039] In this invention, a magnetic charging and discharging assembly is also provided inside the housing, and the magnetic charging and discharging assembly is attached to the cold end of the semiconductor cooling chip. The magnetic charging and discharging assembly includes structures such as magnets and coils; the specific structure and implementation principle of the magnetic charging and discharging assembly will not be described in detail here.

[0040] The housing is also equipped with an air inlet channel and an air outlet channel. The air inlet surface of the fan is connected to the air inlet on the housing through the air inlet channel, and the air outlet end of the fan is connected to the air outlet on the housing through the air outlet channel. Outside air passes through the air inlet, the air inlet channel, the chamber where the fan is located, the air outlet channel, and the air outlet in sequence and is discharged to dissipate the heat of the semiconductor cooling chip.

[0041] Different air duct designs can be created depending on the battery's installation location.

[0042] Example 1

[0043] like Figures 1 to 5 As shown, this embodiment provides a heat dissipation structure for a semiconductor-cooled magnetic wireless charging bank. The housing of the semiconductor-cooled magnetic wireless charging bank includes a bottom shell 10 and an inner shell 20 placed inside the bottom shell 10. The bottom shell 10 is provided with a first air inlet 11 and a first air outlet 12, and the inner shell 20 is provided with a second air inlet 21 and a second air outlet 22. The positions of the first air inlet 11 and the second air inlet 21 are corresponding, and the positions of the first air outlet 12 and the second air outlet 22 are corresponding.

[0044] Preferably, the bottom shell 10 has three first air inlets 11 on the three sides near the fan 50, and correspondingly, the inner shell 20 has three second air inlets 21 on the three sides. This allows gas to enter the power bank from three different angles, ensuring both the amount of gas and the uniformity of airflow. Similarly, the bottom shell 10 has three first air outlets 12 on the three sides near the fan 50, and correspondingly, the inner shell 20 has three second air outlets 22 on the three sides. The three first air outlets 12 and three second air outlets 22 correspond to the air outlet position of the turbine fan 50, which can increase the opening of the air outlet channel and ensure the uniformity of airflow. Of course, in other embodiments, the number and distribution of the first air inlets 11, second air inlets 21, first air outlets 12, and second air outlets 22 can be adjusted.

[0045] In this embodiment, the first air inlet 11 is located at the corner of the bottom shell 10. This corner location allows the first air inlet 11 to communicate with the side of the bottom shell 10, preventing it from being blocked when the bottom of the bottom shell 10 is laid flat, thus avoiding any impact on its air intake performance. This structural design ensures that even when the semiconductor-cooled magnetic wireless charging bank is placed flat on a table, air can still enter from the side of the bottom shell 10, guaranteeing that outside air enters the charging bank regardless of its orientation.

[0046] like Figures 2 to 5 As shown, in this embodiment, a portion / entirety of the battery 40 is located below the fan 50. Figure 2 In the diagram, only a portion of the battery 40 is located below the fan 50, while the other portion is located to the left of the fan 50. To avoid the fan 50 affecting the airflow, an inner shell airflow duct 23 is provided on the side of the inner shell 20, which guides the direction of airflow. The inner shell airflow duct 23 is isolated from the air outlet, thus forming an airflow channel for gas to flow in.

[0047] In this embodiment, a heat insulation sheet 80 is provided inside the housing. The heat insulation sheet 80, the inner shell 20, and the bottom shell 10 surround and form the battery chamber A. The heat insulation sheet 80 can isolate the battery 40 from the circulation loop where the hot air is located, preventing the hot air from affecting the temperature of the battery 40. Specifically, the heat insulation sheet 80 is located between the lower side of the fan 50 and the battery 40, and it is used to isolate the chamber where the fan 50 is located from the battery chamber A where the battery 40 is located. Magnetic wireless charging and discharging assembly

[0048] In this embodiment, a fan bracket 70 is provided inside the housing. The bottom plate of the fan bracket 70 is connected to the inner housing air duct 23. The bottom plate of the fan bracket 70 isolates the inner housing air duct 23 from the air outlet and guides the airflow direction, directing it to the lower side of the fan 50. Additionally, the bottom of the fan bracket 70 has a through-hole air inlet. The inner housing air duct 23, the air duct between the fan bracket 70 and the heat insulation sheet 80, and the inlet together constitute the airflow channel for gas entry (e.g., Figure 4 (The direction of airflow is indicated by the dashed arrow). Preferably, the air inlet opening corresponds to the air inlet surface of the fan 50; specifically, the air inlet opening is located directly below the fan 50.

[0049] A heat sink 60 is provided between the hot end of the thermoelectric cooler 90 and the fan 50. The fan 50 absorbs heat from the hot end of the thermoelectric cooler 90 through the heat sink 60. A fan chamber B is formed between the lower part of the heat sink 60, the fan bracket 70, and the inner shell 20 to accommodate the fan 50. This fan chamber B is isolated from other structures, forming a dedicated airflow channel for heat dissipation and preventing interference with other structures. Preferably, to facilitate heat dissipation from the fan 50, the heat sink 60 in this embodiment has annular fins. The fan 50 is placed within the inner ring of the annular fins, so that the outer ring of the fan 50 forms outward-blowing air (i.e., hot air), and this airflow is blown outward from the channels provided by the annular fins. In this embodiment, the fan 50 is embedded in the bottom of the heat sink 60, and the heat sink 60 is in contact with the hot end of the thermoelectric cooler 90. This allows the heat sink 60 to absorb heat from the thermoelectric cooler 90, and the fan 50 then blows the heat from the heat sink 60 out through the air outlet, increasing the speed at which the fan 50 dissipates heat.

[0050] The magnetic wireless charging and discharging component is located in the space enclosed by the heat sink 60, the panel 30, and the inner shell, forming a charging, discharging, and cooling chamber C.

[0051] exist Figure 5 In this embodiment, components such as the magnetic wireless charging and discharging assembly and circuit board are omitted to better showcase the structure of the airflow channel. This embodiment is suitable for applications where there are other structural barriers such as the battery 40 and circuit board between the bottom air intake position of the fan 50 and the housing. The airflow is guided by the avoidance design of the air intake channel.

[0052] Example 2

[0053] like Figures 6 to 10 As shown, this embodiment provides a heat dissipation structure for a semiconductor-cooled magnetic wireless charging bank. Unlike Embodiment 1, in this embodiment, the battery 40 is located on one side of the fan 50, and the bottom of the inner shell 20 has a vertically penetrating air inlet. This air inlet serves as a second air inlet 21, forming an airflow channel for gas to flow in (e.g., ...). Figure 9(The airflow direction is indicated by the dashed line). This embodiment can also use the air intake channel structure shown in Embodiment 1, which will not be discussed again here.

[0054] like Figure 10 As shown, since the inner shell 20 in this embodiment has an air inlet that directly guides airflow into the air inlet of the fan 50, and the battery 40 is directly isolated by the partition on the inner shell 20, the fan 50 in this embodiment can be directly mounted on the heat sink 60 without the need for a fan bracket 70 to guide the airflow direction. Similarly, this invention also eliminates the need for a heat insulation sheet 80 to isolate the battery 40.

[0055] Preferably, the first air inlet 11 is located at the bottom of the bottom shell 10. The first air inlet 11 and the second air inlet 21 are both located at the air intake surface of the fan 50, so that external air enters the air intake position of the fan 50 through the airflow intake channel formed by the first air inlet 11 and the second air inlet 21, resulting in a larger airflow and better heat dissipation.

[0056] In this embodiment, the inner shell 20 can adopt the structure described in Embodiment 1, in which case the first air inlet 11 is located at the corner of the bottom shell 10. In this embodiment, the inner shell 20 can also adopt the specific structure described in this embodiment, in which case the first air inlet 11 is located at the bottom of the bottom shell 10, and the first air inlet 11 is connected to the corner of the bottom shell 10 through an air inlet grille. This structure can also prevent the first air inlet 11 from being blocked by the flat bottom shell 10.

[0057] Similarly, in Figure 10 The magnetic wireless charging and discharging components, circuit boards, and other structures are omitted from the illustration. This embodiment is suitable for applications where there are no other structural barriers between the bottom air intake position of the fan 50 and the housing. The airflow intake channel can be directly designed to be aligned with the air intake direction of the fan 50, or the avoidance structure of Embodiment 1 can be used to guide the airflow.

[0058] It should be understood that those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

[0059] The present utility model patent has been described above with reference to the accompanying drawings. Obviously, the implementation of the present utility model patent is not limited to the above-described manner. Any improvements made by adopting the inventive concept and technical solution of the present utility model patent, or the direct application of the inventive concept and technical solution of the present utility model patent to other occasions without modification, are all within the protection scope of the present utility model.

Claims

1. A heat dissipation structure for a semiconductor-cooled magnetic wireless charging bank, the semiconductor-cooled magnetic wireless charging bank comprising a housing, a battery disposed within the housing, and a semiconductor cooling chip and a fan for cooling and heat dissipation, characterized in that, The heat absorption surface of the fan is attached to the hot end of the semiconductor cooling chip to absorb the heat emitted by the semiconductor cooling chip. The cold end of the semiconductor cooling chip is attached to the magnetic wireless charging and discharging assembly, which includes a magnet group and a charging and discharging coil. The air inlet of the fan is connected to the air inlet on the housing through the air inlet airflow channel, and the air outlet of the fan is connected to the air outlet on the housing through the air outlet airflow channel. Outside air passes through the air inlet, the air inlet airflow channel, the chamber where the fan is located, the air outlet airflow channel, and the air outlet in sequence and is discharged to dissipate the heat of the semiconductor cooling chip. The battery is placed in the battery chamber A inside the casing, the semiconductor cooling chip and the magnetic wireless charging and discharging assembly are located in the charging, discharging and cooling chamber C, and the fan is placed in the fan chamber B. The housing includes a bottom shell, on which a first air inlet and a first air outlet are provided. The first air inlet is located at a corner of the bottom shell; or, the first air inlet is located at the bottom of the bottom shell, and the first air inlet is connected to the corner of the bottom shell through an air inlet grille.

2. The heat dissipation structure of the semiconductor-cooled magnetic wireless charging bank according to claim 1, characterized in that, The housing includes an inner shell placed inside the bottom shell. The inner shell is provided with a second air inlet and a second air outlet. The positions of the first air inlet and the second air inlet are corresponding, and the positions of the first air outlet and the second air outlet are corresponding.

3. The heat dissipation structure of the semiconductor-cooled magnetic wireless charging bank according to claim 2, characterized in that, Part / all of the battery is located on the lower side of the fan. The inner shell has an inner shell air duct on its side. The inner shell air duct is isolated from the air outlet, so that the inner shell air duct forms an air intake channel for gas to flow in.

4. The heat dissipation structure of the semiconductor-cooled magnetic wireless charging bank according to claim 3, characterized in that, The housing is equipped with a heat insulation sheet located between the fan and the battery, which is used to isolate the chamber where the fan is located from the chamber where the battery is located.

5. The heat dissipation structure of the semiconductor-cooled magnetic wireless charging bank according to claim 4, characterized in that, The housing is equipped with a fan bracket, and the bottom of the fan bracket is provided with an air inlet opening that runs vertically through it. The inner shell air duct, the air duct between the fan bracket and the heat insulation sheet, and the opening together constitute an airflow channel for gas to flow in.

6. The heat dissipation structure of the semiconductor-cooled magnetic wireless charging bank according to claim 5, characterized in that, The air inlet opening corresponds to the air inlet surface of the fan.

7. The heat dissipation structure of the semiconductor-cooled magnetic wireless charging bank according to claim 2, characterized in that, The battery is located on one side of the fan, and the bottom of the inner shell is provided with an air inlet that runs vertically through the bottom. This air inlet serves as a second air inlet and forms an airflow channel for gas to flow in.

8. The heat dissipation structure of the semiconductor-cooled magnetic wireless charging bank according to claim 7, characterized in that, The first air inlet is located at the bottom of the bottom shell, and both the first air inlet and the second air inlet correspond to the air intake surface of the fan.

9. The heat dissipation structure of the semiconductor-cooled magnetic wireless charging bank according to claim 1, characterized in that, A heat sink is provided between the hot end of the thermoelectric cooler and the fan, and the fan absorbs the heat from the hot end of the thermoelectric cooler through the heat sink.

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