Data center liquid cooling device

Abstract

The utility model relates to a data center liquid cooling device which comprises a liquid cooling equipment shell, a pushing piece and a heat energy storage device, the liquid cooling equipment shell is provided with a hollow cavity, the cavity can contain a plurality of electronic plates, the cavity is internally provided with fluorinated liquid, and the liquid level of the fluorinated liquid is higher than that of the electronic plates; the pushing piece is arranged at the bottom of the liquid cooling equipment shell and can push the electronic board to move in the height direction of the liquid cooling equipment shell; the heat energy storage device is located on the side, away from the pushing piece, of the electronic plate and can exchange heat with the fluorinated liquid. According to the data center liquid cooling device, personnel can maintain and upgrade electronic equipment conveniently, and meanwhile the energy utilization rate can be increased.

Description

Technical Field

[0001] This application relates to the field of data center technology, and more specifically to a data center liquid cooling device. Background Technology

[0002] A data center is a specially designed and built facility for the centralized storage, management, and processing of large-scale electronic data and information. They typically contain numerous servers, network equipment, and storage systems to support the IT operations and data processing needs of enterprises, organizations, or internet service providers. With the continuous development of internet and big data technologies, data centers have become an indispensable part of modern society's infrastructure. However, the large number of electronic devices within a data center generates significant heat during operation. Currently, the commonly used data center cooling methods are air cooling and liquid cooling. Liquid cooling offers higher cooling efficiency, but in related technologies, immersion hydraulic cooling requires manually placing electronic devices into the coolant, increasing the difficulty of retrieving the devices. Furthermore, the dissipated heat is not utilized, reducing the practicality of the system. Utility Model Content

[0003] This application provides a data center liquid cooling device that facilitates the maintenance and upgrading of electronic equipment while improving energy efficiency.

[0004] The data center liquid cooling device provided in this application includes: a liquid cooling equipment shell, the liquid cooling equipment shell having a hollow cavity, the cavity being capable of accommodating multiple electronic boards, and a fluorinated liquid being disposed inside the cavity, the liquid level of the fluorinated liquid being higher than that of the electronic boards;

[0005] A pushing component is disposed at the bottom of the liquid cooling equipment housing, and the pushing component is capable of pushing the electronic board to move along the height direction of the liquid cooling equipment housing;

[0006] A thermal energy storage device is located on the side of the electronic board away from the pusher, and the thermal energy storage device is capable of exchanging heat with the fluorinated liquid.

[0007] In addition, the data center liquid cooling device provided in this application may also have the following additional technical features:

[0008] In one alternative embodiment, the data center liquid cooling device further includes multiple support members located within the cavity, the multiple support members being spaced apart along the length and width directions of the liquid cooling device housing; each support member includes a support plate and a support column, the support plate being spaced apart from the bottom wall of the liquid cooling device housing, and the support column connecting the bottom wall of the liquid cooling device housing and the support plate; the pushing member includes multiple electric push rods located between the gaps formed by adjacent multiple support plates.

[0009] In one alternative embodiment, when the electronic board is disposed within the cavity, the electronic board is placed on top of the support plate, and the electric push rod is capable of abutting against the electronic board and pushing the electronic board to move.

[0010] In one alternative embodiment, the data center liquid cooling device further includes a sound insulation layer disposed on the side of the thermal energy storage device away from the electronic board, and the sidewall of the sound insulation layer can be fitted with the inner wall of the liquid cooling device housing.

[0011] In one alternative embodiment, the data center liquid cooling device further includes a viewing window and a temperature monitor. The viewing window is disposed on at least one side wall of the liquid cooling device housing, and the temperature monitor is disposed on the wall of the liquid cooling device housing and is capable of monitoring the temperature of the electronic board and / or the fluorinated liquid.

[0012] In one alternative embodiment, the electronic board further includes a handle located at the center of the top of the electronic board, with both ends of the handle connected to the electronic board via reinforcing plates.

[0013] The beneficial effects of this application are as follows:

[0014] The data center liquid cooling device in this application can move the electronic board along the height direction of the liquid cooling equipment shell through the pusher, thereby facilitating personnel to replace, maintain and upgrade the electronic board; in addition, immersing the electronic board in the fluorinated liquid will cause the fluorinated liquid to boil and then dissipate. By setting a heat energy storage device on the top of the fluorinated liquid, the heat can be absorbed, stored and reused, thereby improving energy utilization efficiency.

[0015] It should be understood that the above general description and the following detailed description are merely exemplary and do not limit this application. Attached Figure Description

[0016] Figure 1 A three-dimensional structural diagram of the data center liquid cooling device provided in this application;

[0017] Figure 2A schematic diagram showing the internal disassembled structure of the data center liquid cooling device provided in this application;

[0018] Figure 3 for Figure 2 A magnified structural diagram at point A;

[0019] Figure 4 for Figure 1 A cross-sectional view of the liquid cooling unit in the central data center;

[0020] Figure 5 A schematic diagram of the arrangement of the support and pusher components provided in this application.

[0021] Reference numerals: 1. Liquid cooling equipment housing; 11. Cavity; 2. Electronic board; 21. Handle; 22. Reinforcing plate; 3. Fluorinated liquid; 4. Electric push rod; 5. Thermal energy storage device; 6. Support component; 61. Support plate; 62. Support column; 7. Sound insulation layer; 8. Viewing window; 9. Temperature monitor.

[0022] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. Detailed Implementation

[0023] To better understand the technical solution of this application, the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0024] It should be understood that the described embodiments are merely some embodiments of this application, and not all embodiments. All other technical solutions obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0025] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0026] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0027] It should be noted that the directional terms such as "upper," "lower," "left," and "right" described in the embodiments of this application are used to describe the angles shown in the accompanying drawings and should not be construed as limiting the embodiments of this application. Furthermore, in the context, it should be understood that when it is mentioned that an element is connected "upper" or "lower" to another element, it can be directly connected to the other element "upper" or "lower," or indirectly connected to the other element "upper" or "lower" through an intermediate element.

[0028] like Figure 1-5 As shown in the figure, this application embodiment provides a data center liquid cooling device, which includes a liquid cooling equipment shell 1, a pushing component, and a thermal energy storage device 5. The liquid cooling equipment shell 1 has a hollow cavity 11, which can accommodate multiple electronic boards 2, and a fluorinated liquid 3 is disposed within the cavity 11, with the liquid level of the fluorinated liquid 3 higher than that of the electronic boards 2. The pushing component is disposed at the bottom of the liquid cooling equipment shell 1 and can push the electronic boards 2 to move along the height direction of the liquid cooling equipment shell 1. The thermal energy storage device 5 is located on the side of the electronic boards 2 away from the pushing component, and the thermal energy storage device 5 is made of a phase change material and can exchange heat with the fluorinated liquid 3.

[0029] In this embodiment, the data center liquid cooling device can move the electronic board 2 along the height direction of the liquid cooling equipment shell 1 through the pusher, thereby facilitating personnel to replace, maintain and upgrade the electronic board 2; in addition, when the electronic board 2 is immersed in the fluorinated liquid 3, the heat generated will cause the fluorinated liquid 3 to boil and then dissipate. By setting the heat energy storage device 5 on the top of the fluorinated liquid 3, the heat can be absorbed, stored and reused, thereby improving the energy utilization rate.

[0030] like Figure 2-5 As shown, in one specific embodiment, the data center liquid cooling device further includes multiple support members 6, which are located within the cavity 11. The multiple support members 6 are arranged at intervals along the length and width directions of the liquid cooling device housing 1, and generally, they are equidistant from each other. Each support member 6 includes a support plate 61 and a support column 62. The support plate 61 is spaced apart from the bottom wall of the liquid cooling device housing 1, and the support column 62 connects the bottom wall of the liquid cooling device housing 1 and the support plate 61. The pushing member includes multiple electric push rods 4, which are located between the gaps formed by adjacent support plates 61.

[0031] When the electronic board 2 is placed inside the cavity 11, it rests on top of the support plate 61. The electric push rod 4 can contact and move the electronic board 2. Specifically, the electronic board 2, which needs to be cooled, is immersed in the fluorinated liquid 3. The electronic board 2 can be positioned in the fluorinated liquid 3 by the support plate 61 and the support column 62. At the same time, the movement of the electronic board 2 can be controlled by activating the electric push rod 4, making it easy to remove the electronic board 2. By setting up a heat storage device 5, the heat emitted by the fluorinated liquid 3 can be absorbed, thereby improving the energy utilization rate.

[0032] like Figure 1-4 As shown, in one specific embodiment, the data center liquid cooling device further includes a sound insulation layer 7, which is disposed on the side of the thermal energy storage device 5 away from the electronic board 2, and the sidewall of the sound insulation layer 7 can fit against the inner wall of the liquid cooling device housing 1. Additionally, the data center liquid cooling device also includes a viewing window 8 and a temperature monitor 9. The viewing window 8 is disposed on at least one sidewall of the liquid cooling device housing 1, and the temperature monitor 9 is disposed on the wall surface of the liquid cooling device housing 1 and can monitor the temperature of the electronic board 2 and / or the fluorinated liquid 3.

[0033] In this embodiment, the sound insulation layer 7 can absorb the noise generated by the device, thereby reducing the noise generated during heat dissipation and cooling, and thus improving the comfort of the working environment; the viewing window 8 allows personnel to easily observe the internal heat dissipation from the outside.

[0034] like Figure 2-3 As shown, in one specific embodiment, the electronic board 2 also includes a handle 21, which is located at the middle of the top of the electronic board 2. The two ends of the handle 21 are connected to the electronic board 2 via reinforcing plates 22. The handle 21 is fixedly connected to the top wall of the electronic board 2, which makes it easier for the operator to pick up the electronic board 2. At the same time, the handle 21 can improve the stability of the installation through the reinforcing plates 22, and prevent it from falling during the picking process.

[0035] Working Principle: A certain amount of fluorinated liquid 3 is stored inside the outer shell 1 of the liquid cooling equipment. The electronic board 2, which needs to dissipate heat, is immersed in the fluorinated liquid 3. Due to the low boiling point of the fluorinated liquid 3, when the electronic device reaches a certain temperature, the fluorinated liquid 3 will boil, thus dissipating heat. Simultaneously, support plates 61 are installed at the four corners of the bottom wall of the electronic board 2. The support columns 62 on the bottom wall of the support plates 61 are fixedly connected to the inner bottom wall of the outer shell 1 of the liquid cooling equipment, ensuring that the electronic board 2 can be stably placed on the top wall of the support plates 61. The electronic board 2 can be moved up and down by activating the electric push rod 4, making it easy for personnel to retrieve it. Furthermore, a heat storage device 5 is installed on top of the fluorinated liquid 3 to absorb and store the dissipated heat, allowing for reuse and improving the practicality of the device while saving resources. A sound insulation layer 7 is installed on the top of the inner wall of the outer shell 1 of the liquid cooling equipment. This layer effectively absorbs the noise generated during the boiling and heat dissipation of the fluorinated liquid 3, improving the quality of the working environment.

[0036] The above are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A data center liquid cooling device, characterized in that, include: A liquid cooling device housing, the liquid cooling device housing having a hollow cavity capable of accommodating multiple electronic boards, and the cavity containing fluorinated liquid, the liquid level of the fluorinated liquid being higher than that of the electronic boards; A pushing component is disposed at the bottom of the liquid cooling equipment housing, and the pushing component is capable of pushing the electronic board to move along the height direction of the liquid cooling equipment housing; A thermal energy storage device is located on the side of the electronic board away from the pusher, and the thermal energy storage device is capable of exchanging heat with the fluorinated liquid.

2. The data center liquid cooling device according to claim 1, characterized in that, The data center liquid cooling device further includes multiple support members located within the cavity. These support members are spaced apart along the length and width of the liquid cooling device housing. Each support member includes a support plate and a support column. The support plate is spaced apart from the bottom wall of the liquid cooling device housing, and the support column connects the bottom wall of the liquid cooling device housing and the support plate. The pushing member includes multiple electric push rods located between the gaps formed by adjacent support plates.

3. The data center liquid cooling device according to claim 2, characterized in that, When the electronic board is placed in the cavity, the electronic board is positioned on top of the support plate, and the electric push rod can abut against the electronic board and push the electronic board to move.

4. The data center liquid cooling device according to any one of claims 1-3, characterized in that, The data center liquid cooling device also includes a sound insulation layer, which is disposed on the side of the thermal energy storage device away from the electronic board, and the sidewall of the sound insulation layer can fit against the inner wall of the liquid cooling device housing.

5. The data center liquid cooling device according to claim 4, characterized in that, The data center liquid cooling device also includes a viewing window and a temperature monitor. The viewing window is disposed on at least one side wall of the liquid cooling device housing, and the temperature monitor is disposed on the wall of the liquid cooling device housing and is capable of monitoring the temperature of the electronic board and / or the fluorinated liquid.

6. The data center liquid cooling device according to any one of claims 1-3 or 5, characterized in that, The electronic board also includes a handle, which is located in the middle of the top of the electronic board, and the two ends of the handle are connected to the electronic board by reinforcing plates.

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