Solder paste printing table special for wafer

Abstract

The utility model discloses a solder paste printing table special for a wafer, which comprises a working table, a wafer carrier and a printing plane, and the printing plane is provided with an avoiding through hole penetrating along the lifting direction of the wafer carrier. The wafer carrier comprises a supporting structure which protrudes and extends upwards and can generate suction force to fix the wafer to be printed, the shape of the supporting structure is matched with that of the avoiding through hole, and the top end face of the supporting structure serves as a placing table top for fixing the wafer. The placing table top, the inner circumferential wall of the avoiding through hole and the top end face of the avoiding through hole jointly define a placing cavity for fixing a wafer, and the supporting structure ascends and descends in the avoiding through hole when the wafer carrier is driven to ascend and descend so as to adjust the height of the placing cavity to adapt to wafers of different thicknesses. The height of the placing cavity can be adjusted by controlling the ascending and descending distance of the wafer carrier so as to correspond to wafers with different thicknesses, the wafer on the placing table top is pre-positioned through the pre-positioning pin and the suction nozzle, then the wafer is adsorbed and fixed through the suction hole, and the printing precision is ensured.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer printing table technical field, concretely relates to a special tin cream printing table for wafer. BACKGROUND

[0002] Wafer refers to the silicon wafer used for making silicon semiconductor circuit, and usually needs to pass through multiple procedures to finally form a product, and in the processing process, a wafer carrier is used to place the wafer.

[0003] Due to the special shape of the wafer, the wafer is generally placed on the wafer carrier first, and then the wafer carrier is moved into the printing machine together with the wafer by the conveying device of the printing machine for printing. However, placing the wafer into the wafer carrier first and then moving it into the printing machine will result in a long cycle time, affecting the production capacity. On the other hand, due to the different sizes (such as thickness) of the wafers, the prior art usually uses different wafer carriers, which also increases the cost. Therefore, the utility model comes from this. SUMMARY

[0004] In view of at least one of the above technical problems, the utility model aims to provide a special tin cream printing table for wafer.

[0005] The technical scheme of the utility model is:

[0006] The utility model discloses a special tin cream printing table for wafer, which comprises a workbench, a wafer carrier which is arranged on the workbench in a liftable manner and a printing plane which is arranged on the workbench and located above the wafer carrier, a avoiding through hole is formed in the printing plane and penetrates through the wafer carrier in the lifting direction of the wafer carrier, the wafer carrier comprises a support structure which protrudes upward and extends and can generate suction force to fix the wafer to be printed, the top end surface of the support structure is implemented as a placing table surface for fixing the wafer, the placing table surface, the inner peripheral wall of the avoiding through hole and the top end surface of the avoiding through hole jointly define a placing cavity for fixing the wafer, and the support structure is lifted in the avoiding through hole to adjust the height of the placing cavity to adapt to wafers of different thicknesses when the wafer carrier is driven to perform lifting action.

[0007] Preferably, a plurality of through suction holes are formed in the top end surface of the support structure.

[0008] Preferably, a plurality of spaced and through pre-positioning holes are formed in a peripheral circle of the top end surface of the support structure, any one of the pre-positioning holes is provided with a pre-positioning pin which protrudes above the pre-positioning hole when no wafer is placed on the placing table surface and is retracted into the pre-positioning hole when a wafer is placed on the placing table surface, and a suction nozzle is arranged at the top end of the pre-positioning pin.

[0009] Preferably, the workbench comprises two support frames arranged oppositely and at intervals, and a first lifting platform and a second lifting platform arranged oppositely and at intervals, the two support frames are arranged on the second lifting platform, the printing plane is arranged on the two support frames, and the wafer carrier is arranged between the first lifting platform and the printing plane and fixed on the first lifting platform.

[0010] The first lifting platform and the second lifting platform are connected by a plurality of first lifting columns.

[0011] Preferably, the plurality of first lifting columns are driven by a first driving mechanism to realize the lifting movement of the first lifting platform relative to the second lifting platform.

[0012] Preferably, a plurality of guide shafts and guide columns are further arranged between the first lifting platform and the second lifting platform, the guide columns comprise a plurality of first guide columns fixed on the bottom of the first lifting platform and a plurality of second guide columns fixed on the bottom of the second lifting platform, and any guide shaft is movably arranged in the first guide column and the corresponding second guide column.

[0013] Preferably, the second lifting platform is driven to realize lifting by a second driving mechanism arranged thereon.

[0014] Compared with the prior art, the wafer special solder paste printing platform has the following advantages:

[0015] The wafer special solder paste printing platform is directly installed in a wafer printing machine, and for wafers with different thicknesses, a special carrier does not need to be made every time, the height of the placing cavity can be adjusted by controlling the lifting and lowering distance of the wafer carrier to correspond to wafers with different thicknesses, the applicability is improved, and the use cost is reduced. The wafer on the placing table is pre-positioned by the pre-positioning pin and the suction nozzle, and then the wafer is fixed by suction, so that the printing precision is ensured. BRIEF DESCRIPTION OF DRAWINGS

[0016] The wafer special solder paste printing platform will be further described below in combination with the drawings and embodiments:

[0017] Figure 1 FIG. 1 is a perspective view of a wafer special solder paste printing platform according to an embodiment of the present application;

[0018] Figure 2 FIG. 2 is a perspective view of a wafer special solder paste printing platform according to another embodiment of the present application; Figure 1 FIG. 3 is a top view of a wafer carrier of the wafer special solder paste printing platform in FIG. 2;

[0019] Figure 3 FIG. 4 is an enlarged view of part A of FIG. 3; Figure 2

[0020] Figure 4 ​The side view structural schematic diagram of the wafer carrier of the wafer special-purpose tin paste printing table of the embodiment of the utility model;

[0021] Figure 5 The top view structural schematic diagram of the wafer special-purpose tin paste printing table of the embodiment of the utility model omits the first lifting table and the wafer carrier and the printing plane;

[0022] Figure 6 The structural schematic diagram of another angle of the wafer special-purpose tin paste printing table of the embodiment of the utility model;

[0023] Figure 7 The bottom structural schematic diagram of the wafer special-purpose tin paste printing table of the embodiment of the utility model;

[0024] Figure 8 The side view structural schematic diagram of the wafer special-purpose tin paste printing table of the embodiment of the utility model omits the first lifting table and the wafer carrier and the printing plane;

[0025] Figure 9 For Figure 8 The local enlarged view of the middle B part.

[0026] Wherein: 10, workbench;11, first lifting table;12, second lifting table;13, support frame;20, wafer carrier;21, support structure;211, placing table;212, suction hole;213, pre-positioning hole;22, pre-positioning pin;23, suction nozzle;30, printing plane;40, placing cavity;50, first driving mechanism;51, first driving motor;52, first driving wheel;53, first driving shaft;54, second driving wheel;55, first driven wheel;56, first driven shaft;57, first transmission belt;58, first tension wheel;59, first lifting column;60, second driving mechanism;61, second driving motor;62, third driving wheel;63, second driving shaft;64, fourth driving wheel;65, second driven wheel;66, second transmission belt;67, second tension wheel;68, second driven shaft;70, guide shaft;80, first guide column;90, second guide column. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical scheme and advantages of the utility model more clear and obvious, the utility model is further explained in detail below by combining with specific implementation manners and referring to the drawings. It should be understood that these descriptions are only exemplary, and are not intended to limit the scope of the utility model. In addition, in the following description, the description of the known structure and technology is omitted to avoid unnecessary confusion of the concept of the utility model.

[0028] See Figures 1 to 9This utility model discloses a wafer-specific solder paste printing station, which mainly includes a worktable 10, a wafer carrier 20, and a printing plane 30. The wafer carrier 20 is vertically mounted on the worktable 10. The printing plane 30 is fixed on the worktable 10 and located above the wafer carrier 20. The printing plane 30 is a one-piece molded square plate with a flat top surface. There is no step difference between the wafer periphery and the printing plane 30, thus improving the seal between the wafer and the screen frame, resulting in more stable printing. An example of its design is as follows: Figure 1 An obstacle avoidance through hole (not shown) is provided in the middle position, which runs through the direction of the lifting and lowering movement of the wafer carrier 20, that is, the thickness direction of the printed plane 30. The wafer carrier 20 includes a base supported on the worktable 10 and a support structure 21 fixed above the base, extending upward and capable of generating suction to fix the wafer to be printed. The shape of the support structure 21 matches the shape of the clearance via. The top surface of the support structure 21 is a downwardly recessed surface that matches the wafer to be printed and is implemented as a mounting surface 211 for fixing the wafer. The mounting surface 211, the inner wall of the clearance via, and the top surface of the clearance via together define a mounting cavity 40 for fixing the wafer. The radial dimension of the mounting cavity 40 is consistent with that of the wafer to be printed. When driven by lifting, the support structure 21 can move up and down within the clearance via, thereby adjusting the height of the mounting cavity 40 to accommodate wafers of different thicknesses. This eliminates the need to manufacture special wafer carriers 20 for wafers of different thicknesses, improving its applicability.

[0029] Preferred, such as Figures 2 to 4 As shown, the support structure 21 is approximately cylindrical, and its top surface has several suction holes 212 for generating suction to adsorb and fix the wafer placed on the platform 211. The number and arrangement of the suction holes 212 are not described or limited; exemplarily, in this embodiment of the invention, the suction holes 212 include three concentric rings. Further preferably, as... Figure 2 As shown, the top surface of the support structure 21 is further surrounded by several (four are exemplified in the figure) spaced and through pre-positioning holes 213, such as... Figure 4 As shown, a pre-positioning pin 22 is provided in any pre-positioning hole 213, such as Figure 3As shown, the top end of the pre-positioning pin 22 is provided with a suction nozzle 23 connected with a gas pipe (not shown). When the wafer to be printed is not placed on the placing table 211, the pre-positioning pin 22 extends out of the pre-positioning hole 213, i.e. above the placing table 211, and when the wafer to be printed is placed on the placing table 211, the pre-positioning pin 22 is retracted into the pre-positioning hole 213 under the gravity of the wafer and the suction nozzle 23 is adsorbed on the bottom surface of the wafer. That is, the pre-positioning pin 22 is provided with a biasing member (not shown) which exerts an upward biasing force on the pre-positioning pin 22 so that when the wafer is not placed on the placing table 211, the pre-positioning pin 22 can extend out of the pre-positioning hole 213 under the biasing force, and after the wafer is fixed on the placing table 211, the pre-positioning pin 22 is retracted into the pre-positioning hole 213 under the gravity of the wafer against the biasing force of the biasing member. For the biasing member, an example is a spring, one end of which is abutted or fixed on the bottom frame of the wafer carrier 20 and the other end is abutted or fixed on the bottom end of the pre-positioning pin 22. Through the arrangement of the pre-positioning pin 22, the wafer is supported for pre-positioning, and after pre-positioning, the wafer is fixed by the suction force generated by the suction hole 212, which can effectively protect the wafer and reliably fix the wafer, thereby ensuring the printing precision.

[0030] For the workbench 10, as shown, Figure 1 two support frames 13 are arranged opposite and spaced apart, and a first lifting table 11 and a second lifting table 12 are arranged opposite and spaced apart, the two support frames 13 are arranged on the second lifting table 12, the first lifting table 11 is located between the two support frames 13, and the printing plane 30 is arranged on the two support frames 13. The wafer carrier 20 is arranged between the first lifting table 11 and the printing plane 30 and is fixed on the first lifting table 11, and is driven to move up and down by the lifting movement of the first lifting table 11. The first lifting table 11 and the second lifting table 12 are connected by a plurality of first lifting columns 59 (not shown). The first lifting table 11 and the second lifting table 12 are both substantially square plate-shaped tables. In order to realize the lifting movement of the first lifting table 11 relative to the second lifting table 12, a first driving mechanism 50 for driving the first lifting columns 59 to drive the wafer carrier 20 on the first lifting table 11 to move up and down is further included. For the first driving mechanism 50, as shown, Figures 5 to 7 exemplarily, the first driving mechanism 50 includes a first driving motor 51, a first driving wheel 52, a first driving shaft 53, a second driving wheel 54, a plurality of first driven shafts 56, a plurality of first driven wheels 55, a first transmission belt 57, and a tension wheel. Exemplarily, in the utility model embodiment, the number of the first driven shafts 56 and the first driven wheels 55 is three, the axes of the three first driven shafts 56 and the first driving shaft 53 are parallel and all extend as Figure 1The first driving motor 51 is arranged at the bottom of the second lifting platform 12, and a driving wheel of a driving end of the first driving motor 51 faces downward. The driving wheel is in transmission connection with the first driving wheel 52 through a first transmission structure (not shown, such as a belt or a chain, etc.). The first tensioning wheel 58 is arranged between the second driving wheel 54 and one of the first driven wheels 55 adjacent to the second driving wheel 54, and is rotationally pressed against the outside of the first transmission belt 57. The upper ends of the first driving shaft 53 and the three first driven shafts 56 are movably arranged (preferably in threaded connection) in a first lifting column 59 fixed at the bottom of the first lifting platform 11, and the first driving shaft 53 and the three first driven shafts 56 pass through the top end surface of the first lifting platform 11. The first driving motor 51 drives the first driving wheel 52 to rotate the first driving shaft 53 and the second driving wheel 54, the second driving wheel 54 drives the first transmission belt 57 to drive the remaining three first driven wheels 55 to rotate, and the three first driven shafts 56 rotate, converting the rotary motion into the linear lifting motion of the first lifting column 59, thereby driving the first lifting column 59 on the first lifting platform 11 to perform linear lifting motion relative to the first driving shaft 53 and the three first driven shafts 56, realizing the lifting of the first lifting platform 11 fixed with the first lifting column 59, and further realizing the lifting motion of the wafer carrier 20 fixed on the first lifting platform 11.

[0031] For the lifting motion of the second lifting platform 12, the second lifting platform 12 can drive the first lifting platform 11 and the support frame 13 to lift as a whole when the second lifting platform 12 lifts, that is, the lifting of the entire workbench 10 is realized. In the embodiment of the utility model, the lifting motion of the second lifting is realized by the second driving mechanism 60. For the second driving mechanism 60, the second driving mechanism 60 is arranged at the bottom of the second lifting platform 12, and a driving wheel of a driving end of the second driving motor 61 faces upward. The driving wheel is in transmission connection with the second driving wheel 54 through a second transmission structure (not shown, such as a belt or a chain, etc.). The second tensioning wheel 62 is arranged between the second driving wheel 54 and one of the second driven wheels 65 adjacent to the second driving wheel 54, and is rotationally pressed against the outside of the second transmission belt 63. The upper ends of the second driving shaft 64 and the three second driven shafts 65 are movably arranged (preferably in threaded connection) in a second lifting column 66 fixed at the bottom of the second lifting platform 12, and the second driving shaft 64 and the three second driven shafts 65 pass through the top end surface of the second lifting platform 12. The second driving motor 61 drives the second driving wheel 54 to rotate the second driving shaft 64 and the second transmission belt 63, the second transmission belt 63 drives the remaining three second driven wheels 65 to rotate, and the three second driven shafts 65 rotate, converting the rotary motion into the linear lifting motion of the second lifting column 66, thereby driving the second lifting column 66 on the second lifting platform 12 to perform linear lifting motion relative to the second driving shaft 64 and the three second driven shafts 65, realizing the lifting of the second lifting platform 12 fixed with the second lifting column 66, and further realizing the lifting motion of the wafer carrier 20 fixed on the second lifting platform 12. Figures 5 to 9As shown, the second driving mechanism 60 comprises a second driving motor 61, a third driving wheel 62, a fourth driving wheel 64, a second driving shaft 63, a plurality of second driven shafts 68, a plurality of third driven wheels, a second transmission belt 66 and a second tension wheel 67. The second driving motor 61 is fixed on the outer side of the second lifting platform 12 and the driving end of the second driving wheel (not shown) faces upward. The second driving motor 61 and the first driving motor 51 are located at two corner positions on the same side of the second lifting platform 12, one driving end faces upward and the other driving end faces downward. The second driving wheel is in transmission connection with the third driving wheel 62 through a second transmission structure (not shown, such as a belt or a chain). The axis of the second driving shaft 63 and the plurality of third driven shafts (three are exemplified in the figure) are parallel to each other and parallel to the axis of the first driving shaft 53. The second driving shaft 63 and the three second driven shafts 68 are distributed at four corner positions of the second lifting platform 12 and located outside the first driving shaft 53 and the three first driven shafts 56. The third driving wheel 62 and the fourth driving wheel 64 are coaxially arranged at the upper and lower ends of the second driving shaft 63. Specifically, the third driving wheel 62 and the fourth driving wheel 64 are both arranged at the upper end of the second lifting platform 12 and a partition plate (not shown) is arranged between the two. The second transmission belt 66 is arranged around the outer periphery of the fourth driving wheel 64 and the three second driven wheels 65. The second tension wheel 67 is arranged on the same side of the second lifting platform 12 as the first tension wheel 58 and is arranged in a staggered manner between the two. The second tension wheel 67 is rotationally pressed against the outer side of the second transmission belt 66. The second driving motor 61 drives the third driving wheel 62 to rotate the second driving shaft 63 and drive the fourth driving wheel 64 to rotate. The fourth driving wheel 64 drives the second transmission belt 66 to transmit power and in turn drives the remaining three second driven wheels 65 to rotate, and drives the three second driven shafts 68 to rotate, thereby driving the second lifting platform 12 and the first lifting platform 11 and the support frame 13 arranged on the second lifting platform 12 to perform linear motion.

[0032] As shown in Figure 6 and Figure 7 A guide column and a guide shaft 70 are further arranged between the first lifting platform 11 and the second lifting platform 12. The guide column comprises four first guide columns 80 fixed at four corner positions of the bottom of the first lifting platform 11 and four second guide columns 90 fixed at four corner positions of the bottom of the second lifting platform 12. The four first guide columns 80 and the four second guide columns 90 are arranged in a one-to-one correspondence. The number of guide shafts 70 is also four. Each guide shaft 70 is movably arranged in a first guide column 80 and a second guide column 90.

[0033] The wafer special-purpose solder paste printing platform of the embodiment of the utility model is arranged at the middle position in the existing conventional wafer solder paste printing machine, a mechanical arm is arranged at the rear side of the printing machine during use, and the wafer to be printed can be placed in the placing cavity by the mechanical arm.

[0034] It should be understood that the above specific embodiments of the present application are only used for illustrative or explanatory purposes of the principles of the present application, and do not constitute a limitation on the present application. Therefore, any modification, equivalent replacement, improvement, etc. made without departing from the spirit and scope of the present application shall be included in the protection scope of the present application. In addition, the appended claims of the present application are intended to cover all changes and modifications falling within the scope and boundaries of the appended claims, or the equivalent forms of such scope and boundaries.

Claims

1. A wafer-specific solder paste printing station, characterized in that, The device includes a worktable, a wafer carrier that is vertically mounted on the worktable, and a printing plane mounted on the worktable and located above the wafer carrier. The printing plane has a clearance through-hole that extends along the vertical direction of the wafer carrier. The wafer carrier includes an upwardly protruding support structure that generates suction to fix the wafer to be printed and whose shape matches the clearance through-hole. The top surface of the support structure is implemented as a mounting surface for fixing the wafer. The mounting surface, the inner peripheral wall of the clearance through-hole, and the top surface of the clearance through-hole together define a mounting cavity for fixing the wafer. When the wafer carrier is driven to move up and down, the support structure moves up and down within the clearance through-hole to adjust the height of the mounting cavity to accommodate wafers of different thicknesses.

2. The wafer-specific solder paste printing station according to claim 1, characterized in that, The top surface of the support structure has several through-holes.

3. The wafer-specific solder paste printing station according to claim 2, characterized in that, The top surface of the support structure has several spaced and through pre-positioning holes around its perimeter. Each pre-positioning hole is provided with a pre-positioning pin that extends above the pre-positioning hole when no wafer is placed on the mounting surface and retracts into the pre-positioning hole when a wafer is placed on the mounting surface. The top of the pre-positioning pin is provided with a suction nozzle.

4. The wafer-specific solder paste printing station according to claim 1, characterized in that, The workbench includes two opposing and spaced-apart support frames and a first lifting platform and a second lifting platform that are vertically opposite and spaced-apart. The two support frames are disposed on the second lifting platform, the printing plane is disposed on the two support frames, and the wafer carrier is disposed between the first lifting platform and the printing plane and fixed on the first lifting platform. The first lifting platform and the second lifting platform are connected by a plurality of first lifting columns.

5. The wafer-specific solder paste printing station according to claim 4, characterized in that, The first lifting columns are driven by a first driving mechanism to achieve the lifting and lowering movement of the first lifting platform relative to the second lifting platform.

6. The wafer-specific solder paste printing station according to any one of claims 4-5, characterized in that, A plurality of guide shafts and guide columns are provided between the first lifting platform and the second lifting platform. The guide columns include a plurality of first guide columns fixed to the bottom of the first lifting platform and a plurality of second guide columns fixed to the bottom of the second lifting platform. Any one of the guide shafts is movably inserted into the first guide column and the corresponding second guide column.

7. The wafer-specific solder paste printing station according to claim 6, characterized in that, The second lifting platform is driven to rise and fall by a second drive mechanism mounted on it.

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