Functional device for rapid cooling and electrostatic adsorption of ion source

Abstract

The utility model discloses a functional device about ion source rapid cooling and electrostatic adsorption, and relates to the technical field of metal coating, the functional device comprises an electrostatic plate, a cathode device is installed on one side of the electrostatic plate, an anode device is installed on the inner side of the cathode device, an insulation device is installed on one side of the cathode device, and the insulation device is installed on the other side of the cathode device. The magnetic circuit module device is installed on one side of the insulation device, the cooling device is installed on the inner side of the magnetic circuit module device, the gas circuit device is installed on one side of the magnetic circuit module device, the pressing block is installed on one side of the gas circuit device, and the water circuit device and the conductive device are installed on one side of the pressing block. According to the functional device, heat on the ion source is rapidly absorbed through the cooling device, the electrostatic plate improves the surface quality of a film layer through the electrostatic adsorption effect, abnormality of the ion source caused by foreign matter is reduced, the adhesive force of the film layer is indirectly improved, and meanwhile the overall disassembly and maintenance frequency is reduced.

Description

Technical Field

[0001] This utility model relates to the field of metal coating technology, specifically a functional device for rapid cooling of an ion source and electrostatic adsorption. Background Technology

[0002] An ion source is a device that ionizes gases or other substances to generate ions. These ions can be used in mass spectrometry, particle accelerators, materials characterization, and other fields. In current composite copper foil manufacturing methods (magnetron sputtering + water plating), BOPP materials have relatively high toughness. Since water plating mainly increases thickness, adhesion is primarily affected by the underlying copper film, i.e., magnetron sputtered copper. To improve film adhesion, an ion source plays an essential role. Magnetron sputtering further achieves high speed, low temperature, and low damage.

[0003] Existing technology CN212069066U discloses a cooling system for a plasma power supply in the production of ultrafine toner. The technical solution discloses that "this utility model discloses a cooling system for a plasma power supply in the production of ultrafine toner, including a coolant storage device, a water pump, a water inlet assembly, a water outlet assembly, a water-cooled plate, and a power module. The coolant storage device stores coolant. The inlet of the water pump is connected to the coolant storage device, the outlet of the water pump is connected to the water inlet assembly, the outlet of the water inlet assembly is connected to the inlet of the water-cooled plate, the outlet of the water-cooled plate is connected to the water outlet assembly, and the outlet of the water outlet assembly is connected to the coolant storage device. The power module is fixedly mounted on the water-cooled plate. The water pump pumps the coolant from the coolant storage device to the water-cooled plate to cool the power module. After heat exchange, the coolant flows back to the coolant storage device through the water outlet assembly. The water-cooled plate effectively isolates the coolant from the electronic components inside the power module, quickly removing heat to prevent high-temperature damage to the electronic components while preventing damage from the coolant and the water vapor generated by the vaporization of the coolant."

[0004] Although existing technologies have disclosed cooling systems for plasma power supplies produced from ultrafine toner, there are still some shortcomings. Specifically, in actual production operations, the efficiency of the cooling system is often limited by the circulation speed and heat exchange capacity of the coolant. Existing technologies use natural air cooling, but after long-term operation, the heat dissipation effect of the cooling system will be greatly reduced, causing the temperature of the ion source to rise continuously, which in turn affects its stability and service life. Utility Model Content

[0005] The purpose of this invention is to provide a functional device for rapid cooling of an ion source and electrostatic adsorption, so as to solve the problems raised in the prior art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: The functional device includes an electrostatic plate, a cathode device mounted on one side of the electrostatic plate, an anode device mounted inside the cathode device, an insulating device mounted on one side of the cathode device, a magnetic circuit module device mounted on one side of the insulating device, a cooling device mounted inside the magnetic circuit module device, a gas path device mounted on one side of the magnetic circuit module device, a pressure block mounted on one side of the gas path device, and a water path device and a conductive device mounted on one side of the pressure block. The cathode device releases electrons to form negative ions, while the anode attracts ions, maintaining the electric field inside the ion source and helping to accelerate the generation of ions. The gas path device can be used for rapid vacuuming or introducing specific gases to ensure the stability and reliability of the coating environment. The pressure block ensures the tight connection of all components inside the device. The conductive device effectively conducts current, providing the necessary electrical energy to the ion source and ensuring the stability and effectiveness of the ionization process.

[0007] The cathode device includes a cathode base plate, on which an outer cathode and an inner cathode are disposed. The magnetic circuit module device has a protrusion on one side and a groove on its surface. The magnetic circuit module device is made of magnets and a magnetic yoke. The magnetic circuit module device enhances the electrostatic adsorption effect by adjusting the distribution of the magnetic field to increase the charge density on the electrostatic plate, thereby improving the adsorption strength.

[0008] The anode device is located on the inner wall of the cathode device, and an insulating ceramic is disposed on the outer side of the anode device. A light source is disposed in the gap between the insulating ceramic and the anode device. The main function of the insulating ceramic is to provide electrical insulation to prevent direct current leakage between the cathode and anode. This ensures the effectiveness and stability of the electric field and prevents equipment damage. The ceramic material has high heat resistance and can operate normally in high-temperature environments, thereby protecting the internal electrodes and circuits from overheating. The light source provides the necessary energy to excite the gas molecules inside the ion source, causing them to ionize and form glow plasma. After the glow plasma is formed, the light source continues to provide excitation energy to maintain the stability and continuity of the plasma.

[0009] The insulating device is located on one side of the cathode base plate and has a through groove. The insulating device is made of polytetrafluoroethylene (PTFE). PTFE has good heat resistance, excellent chemical stability, and waterproof and non-stick properties. The insulating device can be used at extremely high temperatures, is not prone to dirt adhesion, and effectively prevents short circuits in the ion source caused by cathode contamination, thus preventing damage to the anode and cathode devices and avoiding malfunctions.

[0010] The cooling device includes a cooling pipe inlet pipe, with a cooling pipe installed on one side of the cooling pipe inlet pipe. The cooling pipe is located in a groove in the magnetic circuit module device, and a cooling pipe return pipe is installed on the other side of the cooling pipe. The cooling pipe inlet pipe and the cooling pipe return pipe are located on one side of the magnetic circuit module device. The cooling device can perform circulating water exchange operations, effectively controlling the temperature of the ion source body and quickly and effectively cooling the ion source body.

[0011] The gas path device includes a gas guide plate located on one side of the cooling device. The gas guide plate has a groove, and a sealing ring (made of fluororubber) is placed within the groove. An outlet hole is located inside the sealing ring. An inlet pipe is installed on one side of the gas guide plate. The sealing ring prevents gas leakage, which could lead to vacuum abnormalities.

[0012] The pressure block is equipped with an inlet pipe and a return pipe, and conductive devices are installed on the inlet pipe and the return pipe.

[0013] The electrostatic plate is made of stainless steel. Stainless steel has good thermal conductivity and a low coefficient of friction. Through electrostatic adsorption, the electrostatic plate can adsorb foreign objects (such as dust and particles) on the surface of the film, improving the surface quality of the film and reducing abnormal arcing, failure to glow, and failure to increase power caused by foreign objects (such as dust and particles). This improves the ion cleaning structure, enhances film adhesion, optimizes the performance of composite copper foil products, reduces manual wiping, and decreases the frequency of overall disassembly and maintenance.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] 1. This functional device rapidly absorbs heat from the ion source through the coolant in the cooling pipes of the cooling device, thereby reducing the temperature of the film surface and the ion source body surface. Compared with the natural air cooling method used in the prior art, it improves the cooling efficiency to a certain extent. After the coating operation is completed, it can effectively cool down the ion source and prevent burns caused by accidental contact with personnel.

[0016] 2. This functional device can adsorb foreign objects (such as dust, particles, etc.) on the surface of the membrane through electrostatic adsorption, thereby improving the surface quality of the membrane and reducing abnormalities of the ion source (arcing, failure to glow, failure to increase power) caused by foreign objects (such as dust, particles, etc.). It effectively prevents short circuits of the ion source caused by dirt or abnormalities in the cathode, thus avoiding damage to the anode and cathode devices and preventing abnormalities. Attached Figure Description

[0017] Figure 1 This is a perspective view of the present utility model;

[0018] Figure 2 For the explosion of this utility model Figure 1 ;

[0019] Figure 3 For the explosion of this utility model Figure 2 ;

[0020] Figure 4 This is a cross-section of the present invention. Figure 1 ;

[0021] Figure 5 This is a cross-section of the present invention. Figure 2 .

[0022] In the diagram: 1. Electrostatic plate; 2. Cathode device; 3. Anode device; 4. Magnetic circuit module device; 5. Cooling device; 6. Gas circuit device; 7. Press block; 8. Conductive device; 9. Water circuit device; 10. Insulation device; 11. Refrigeration pipe; 12. Refrigeration pipe inlet pipe; 13. Refrigeration pipe return pipe; 14. Air guide plate; 15. Air inlet pipe; 16. Air outlet; 17. Sealing ring; 18. Water inlet pipe; 19. Water return pipe;

[0023] 20. Insulating ceramics; 21. Light source; 22. Cathode base plate. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Please see Figures 1-5 This utility model provides a technical solution: the functional device includes an electrostatic plate 1, a cathode device 2 installed on one side of the electrostatic plate 1, an anode device 3 installed inside the cathode device 2, an insulating device 10 installed on one side of the cathode device 2, a magnetic circuit module device 4 installed on one side of the insulating device 10, a cooling device 5 installed inside the magnetic circuit module device 4, a gas path device 6 installed on one side of the magnetic circuit module device 4, a pressure block 7 installed on one side of the gas path device 6, a water path device 9 and a conductive device 8 installed on one side of the pressure block 7. The cathode device 2 is used to release electrons to form negative ions, the anode device 3 attracts ions, maintains the electric field inside the ion source, and helps to accelerate the generation of ions. The gas path device 6 can be used to quickly evacuate or introduce specific gases to ensure the stability and reliability of the coating environment. The pressure block 7 is to ensure the tight connection of various components inside the equipment. The conductive device 8 can effectively conduct current, provide the necessary electrical energy to the ion source, and ensure the stability and effectiveness of the ionization process.

[0026] The cathode device 2 includes a cathode base plate 22, on which an outer cathode and an inner cathode are disposed. A protrusion is provided on one side of the magnetic circuit module device 4, and a groove is provided on the magnetic circuit module device 4. The magnetic circuit module device 4 is made of magnets and a magnetic yoke. The magnetic circuit module device 4 enhances the effect of electrostatic adsorption by adjusting the distribution of the magnetic field to increase the charge density on the electrostatic plate 1, thereby improving the adsorption strength.

[0027] The anode device 3 is located on the inner wall of the cathode device 2. An insulating ceramic 20 is disposed on the outer side of the anode device 3, and a light source 21 is disposed in the gap between the insulating ceramic 20 and the anode device 3. The main function of the insulating ceramic 20 is to provide electrical insulation to prevent direct current leakage between the cathode and the anode, ensuring the effectiveness and stability of the electric field and preventing equipment damage. The ceramic material has high heat resistance and can work normally in high-temperature environments, thereby protecting the internal electrodes and circuits from overheating. The light source 21 provides the necessary energy to excite the gas molecules inside the ion source, causing them to ionize and form glow plasma. After the glow plasma is formed, the light source 21 continues to provide excitation energy to maintain the stability and continuity of the plasma.

[0028] The anode device 3 is located on the inner wall of the cathode device 2, and an insulating ceramic 20 is disposed on the outer side of the anode device 3. The main function of the insulating ceramic 20 is to provide electrical insulation to prevent direct current leakage between the cathode device 2 and the anode device 3, ensure the effectiveness and stability of the electric field, and prevent equipment damage. The ceramic material has high heat resistance and can work normally in high-temperature environments, thereby protecting the internal electrodes and circuits from overheating.

[0029] The insulating device 10 is located on one side of the cathode base plate 22. The insulating device 10 has a through groove and is made of polytetrafluoroethylene (PTFE). PTFE has good heat resistance, excellent chemical stability, and waterproof and non-stick properties. The insulating device 10 can be used at extremely high temperatures and is not prone to dirt adhesion, effectively preventing short circuits in the ion source caused by cathode contamination, thus avoiding damage to the anode device 3 and cathode device 2 that could lead to malfunctions.

[0030] The cooling device 5 includes a cooling pipe inlet pipe 12, a cooling pipe 11 installed on one side of the cooling pipe inlet pipe 12, the cooling pipe 11 being located in the groove of the magnetic circuit module device 4, and a cooling pipe return pipe 13 installed on the other side of the cooling pipe 11. The cooling pipe inlet pipe 12 and the cooling pipe return pipe 13 are located on one side of the magnetic circuit module device 4. The cooling device 5 can perform circulating water exchange operations, effectively controlling the temperature of the ion source body and effectively and quickly cooling the ion source body.

[0031] The gas path device 6 includes a gas guide plate 14, which is located on one side of the cooling device 5. A groove is provided on the gas guide plate 14, and a sealing ring 17, made of fluororubber, is placed inside the groove. An outlet hole 16 is opened on the inner side of the sealing ring 17. An inlet pipe 15 is installed on one side of the gas guide plate 14. The sealing ring 17 is used to prevent gas leakage, which could lead to vacuum abnormalities.

[0032] The pressure block 7 is equipped with an inlet pipe 18 and a return pipe 19, and a conductive device 8 is installed on the inlet pipe 18 and the return pipe 19.

[0033] The electrostatic plate 1 is made of stainless steel. Stainless steel has good thermal conductivity and a low coefficient of friction. Through electrostatic adsorption, the electrostatic plate 1 can adsorb foreign objects (such as dust and particles) on the surface of the film layer, improve the surface quality of the film layer, and reduce abnormal arcing of the ion source, failure to glow, and failure to increase power caused by foreign objects (such as dust and particles). This improves the ion cleaning structure, enhances the adhesion of the film layer, optimizes the performance of the composite copper foil product, reduces manual wiping, and reduces the frequency of overall disassembly and maintenance.

[0034] The working principle of this utility model is as follows: Before operation, the positive and negative wires are connected. The positive terminal of the ion source power supply is connected to the positive terminal of the ion source, and the negative terminal is grounded. Argon gas is introduced into the inlet pipe 15, and the argon gas is released from the outlet 16. The argon gas volume is gradually increased from 2 sccm until a current indicator appears, at which point the ion source begins to work. Coolant is injected into the cooling pipe inlet pipe 12, and the coolant enters the cooling pipe 11 and is discharged from the cooling pipe return pipe 13 to cool the ion source. The voltage knob of the ion source power supply is adjusted to the minimum value, and the voltage is gradually increased. When the voltage is increased to a certain value, the light source 21 at the ion source slit excites glow plasma, and the ion source is started. Subsequently, the voltage of the ion source power supply is gradually increased, and the glow intensity increases until the required power is reached. The stabilization time is greater than 5 minutes. If there are no abnormalities in the ion source, the coating operation is carried out. The electrostatic plate 1 adsorbs foreign objects (such as dust, particles, etc.) on the surface of the film layer through electrostatic adsorption, thereby improving the surface quality of the film layer and reducing abnormalities in the working process of the ion source caused by foreign objects (such as dust, particles, etc.).

[0035] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A functional device for rapid cooling of an ion source and electrostatic adsorption, characterized in that: The functional device includes an electrostatic plate (1), a cathode device (2) is installed on one side of the electrostatic plate (1), an anode device (3) is installed inside the cathode device (2), an insulation device (10) is installed on one side of the cathode device (2), a magnetic circuit module device (4) is installed on one side of the insulation device (10), a cooling device (5) is installed inside the magnetic circuit module device (4), a gas circuit device (6) is installed on one side of the magnetic circuit module device (4), a pressure block (7) is installed on one side of the gas circuit device (6), and a water circuit device (9) and a conductive device (8) are installed on one side of the pressure block (7).

2. The functional device for rapid cooling of an ion source and electrostatic adsorption according to claim 1, characterized in that: The cathode device (2) includes a cathode base plate (22), on which an outer cathode and an inner cathode are provided. The magnetic circuit module device (4) has a protrusion on one side and a groove on the magnetic circuit module device (4). The magnetic circuit module device (4) is made of a magnet and a magnetic yoke.

3. The functional device for rapid cooling of an ion source and electrostatic adsorption according to claim 2, characterized in that: The anode device (3) is located on the inner wall of the cathode device (2). An insulating ceramic (20) is provided on the outside of the anode device (3). A light source (21) is provided in the gap between the insulating ceramic (20) and the anode device (3).

4. The functional device for rapid cooling of an ion source and electrostatic adsorption according to claim 3, characterized in that: The insulating device (10) is located on one side of the cathode base plate (22), and the insulating device (10) has a through groove. The insulating device (10) is made of polytetrafluoroethylene material.

5. The functional device for rapid cooling of an ion source and electrostatic adsorption according to claim 4, characterized in that: The cooling device (5) includes a cooling pipe inlet pipe (12), a cooling pipe (11) is installed on one side of the cooling pipe inlet pipe (12), the cooling pipe (11) is located in the groove of the magnetic circuit module device (4), and a cooling pipe return pipe (13) is installed on the other side of the cooling pipe (11). The cooling pipe inlet pipe (12) and the cooling pipe return pipe (13) are located on the side of the magnetic circuit module device (4).

6. The functional device for rapid cooling of an ion source and electrostatic adsorption according to claim 5, characterized in that: The gas path device (6) includes a gas guide plate (14), which is located on one side of the cooling device (5). The gas guide plate (14) has a groove, and a sealing ring (17) is provided in the groove. The sealing ring (17) is a fluororubber ring, and an air outlet (16) is opened on the inner side of the sealing ring (17). An air inlet pipe (15) is installed on one side of the gas guide plate (14).

7. The functional device for rapid cooling of an ion source and electrostatic adsorption according to claim 6, characterized in that: The pressure block (7) is equipped with an inlet pipe (18) and a return pipe (19), and a conductive device (8) is installed on the inlet pipe (18) and the return pipe (19).

8. The functional device for rapid cooling of an ion source and electrostatic adsorption according to claim 7, characterized in that: The electrostatic plate (1) is made of stainless steel.

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