Electronic package

Abstract

An electronic package mainly provides a bearing structure, an optoelectronic device is arranged on the bearing structure, and the optoelectronic device comprises a package module, a semiconductor element arranged in the package module and an optical element connected to the package module. And the optical element and an optical element (optical fiber or optical fiber connector) connected with the optical element can be stably contacted and combined on the bearing structure, so that the optical fiber support protection is increased, and the optical fiber transmission signal is stable.

Description

TECHNICAL FIELD

[0001] The present application relates to a semiconductor device, in particular, an electronic package with a photoelectric device. BACKGROUND

[0002] With the rapid development of the electronic industry, electronic products are gradually moving towards the trend of multi-function and high performance. The application of the current fifth generation (5G) communication technology has been extended to Internet of Things (IoT), Industrial Internet of Things (IIoT), Cloud, artificial intelligence (AI), autonomous driving cars, and medical fields. With the expansion of the application level, a very large amount of data needs to be transmitted, calculated and stored efficiently, especially for the transmission of data. The industry has begun to replace "electricity" with "light" as the carrier of data transmission to improve the capacity, efficiency or distance of transmission and reduce the energy consumption in the transmission process. Under this background, co-packaged optics has become a development trend of future semiconductor and packaging technology.

[0003] Figure 1 A cross-sectional view of a conventional co-packaged optics semiconductor package 1. The substrate 10 of the semiconductor package 1 is provided with an electronic element 11, an electronic integrated circuit element 12, and a photonic integrated circuit element 13 combined above the electronic integrated circuit element 12. One side end of the photonic integrated circuit element 13 is connected to an optical element (optical fiber or optical fiber connector) 14.

[0004] However, in the aforementioned semiconductor package 1, the position of the optical element (optical fiber or optical fiber connector) connected to the photonic integrated circuit element 13 (as shown in the circle) is in a suspended state, which may have problems such as poor stability of the connector position, easy breakage of the optical element plug, and easy loosening of the optical fiber at the contact point.

[0005] Therefore, how to overcome the problems of the prior art has become a pressing issue to be solved at present. CONTENT OF THE INVENTION

[0006] In view of the above deficiencies of the prior art, the present application provides an electronic package, comprising: a carrier structure having opposite first and second surfaces; an optoelectronic device disposed on the first surface of the carrier structure and electrically connected to the carrier structure, wherein the optoelectronic device comprises a package module, a semiconductor element disposed in the package module, and an optical element disposed on the package module, and the optoelectronic device is contact-bonded to the carrier structure with one side of the optical element, so that one side of the package module faces away from the carrier structure; and an electronic element disposed on the first surface of the carrier structure and electrically connected to the carrier structure.

[0007] The present application also provides a method for manufacturing an electronic package, comprising: providing a carrier structure having opposite first and second surfaces; disposing an optoelectronic device on the first surface of the carrier structure and electrically connecting the optoelectronic device to the carrier structure, wherein the optoelectronic device comprises a package module, a semiconductor element disposed in the package module, and an optical element disposed on the package module, and the optoelectronic device is contact-bonded to the carrier structure with one side of the optical element, so that one side of the package module faces away from the carrier structure; and disposing an electronic element on the first surface of the carrier structure and electrically connecting the electronic element to the carrier structure.

[0008] In the foregoing electronic package and method, the first surface of the carrier structure is formed with a recess for accommodating the optoelectronic device in the recess.

[0009] In the foregoing electronic package and method, the package module is a fan-out type package structure, the semiconductor element is an electronic integrated circuit element, and the optical element is an optical chip or an optical chip module.

[0010] In the foregoing electronic package and method, the optical chip module comprises a coupler, an optical chip, a total reflection mirror, or an optical fiber array unit.

[0011] In the foregoing electronic package and method, the optical element is bonded with an optical element.

[0012] In the foregoing electronic package and method, a plurality of wire bonds are provided for electrically connecting the carrier structure and the optoelectronic device.

[0013] In the foregoing electronic package and method, one end of each wire bond is connected to the first surface of the carrier structure, and the other end is connected to an electrical contact on the surface of the package module of the optoelectronic device.

[0014] In the foregoing electronic package and method, the electronic element is bonded to the carrier structure via a carrier.

[0015] In the foregoing electronic package and method, the carrier is bonded to the first surface of the carrier structure via a plurality of conductive elements.

[0016] The foregoing electronic package and method of manufacturing the same further comprises a covering layer formed on the carrier structure to cover the electronic element and the optoelectronic device.

[0017] As can be seen from the above, the electronic package of the present application mainly places the optoelectronic device on the carrier structure in an inverted manner, so that the optical element of the optoelectronic device and the connected optical element are placed in the edge groove of the carrier structure, and the electrical contacts on the surface of the inverted packaging module are electrically connected to the carrier structure in a wire bonding manner, so as to increase the support and protection of the optical fiber, and stabilize the signal transmission of the optical element, thereby solving the problems of fracture of the contacts of the optical element and abnormal signal transmission in the prior art. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 FIG. 1 is a sectional view of a prior art common optically packaged semiconductor package.

[0019] Figures 2A to 2E FIG. 2 is a sectional view of the electronic package and method of manufacturing the same according to the present application.

[0020] REFERENCE NUMERALS

[0021] 1 semiconductor package

[0022] 10 substrate

[0023] 11 electronic element

[0024] 12 electronic integrated circuit element

[0025] 13 photonic integrated circuit element

[0026] 14 optical element

[0027] 2 electronic package

[0028] 20 carrier structure

[0029] 20a first surface

[0030] 20b second surface

[0031] 200 groove

[0032] 201 insulating layer

[0033] 202 circuit layer

[0034] 21 optoelectronic device

[0035] 210 packaging module

[0036] 211 semiconductor element

[0037] 212 optical element

[0038] 22 optical element

[0039] 23 solder wire

[0040] 24 electronic element

[0041] 25 carrier

[0042] 250 conductive element

[0043] 26 cladding layer DETAILED DESCRIPTION

[0044] The present application is herein described, by way of example only, with the

[0045] It must be noted that the structure, proportions, sizes, etc. shown in the attached drawings, are included only as matters of illustrative convenience and do not exclude other embodiments that are not shown in detail. Any modification of the structure, proportions, sizes, etc. that are not considered to materially affect the nature of the application, are intended to be within the scope of the present application. Similarly, the terms "upper", "first", "second", "third", "one", etc. are used only for the sake of clarity in describing the present application and are not intended to limit the scope of the present application. Any change in the relative relationship of these terms, without materially affecting the nature of the application, is intended to be within the scope of the present application.

[0046] Reference will now be made to the drawings, wherein Figures 2A to 2E is a cross-sectional view of an electronic package and a method of manufacturing the same.

[0047] As shown in Figure 2A , a carrier structure 20 having opposite first and second surfaces 20a and 20b is provided. In the present embodiment, the carrier structure 20 is, for example, a substrate with or without a core layer, which includes an insulating layer 201 and a circuit layer 202 bonded to the insulating layer 201. The insulating layer 201 is made of, for example, a dielectric material such as polybenzoxazole (PBO), polyimide (PI), prepreg (PP), etc. The circuit layer 202 is, for example, a fan-out redistribution circuit layer.

[0048] Next, at least one groove 200 is formed at the edge of the first surface 20a of the carrier structure 20 by means of laser, grinding or etching, etc. In the present embodiment, two grooves 200 are formed.

[0049] As shown in FIG. 1, an optoelectronic device 21 is disposed in a recess 200 of a carrier structure 20. The optoelectronic device 21 includes a package module 210, a semiconductor element 211 disposed in the package module 210, and an optical element 212 disposed on the package module 210. Figure 2B

[0050] The package module 210 is, for example, a fan-out package on package (FO-PoP) structure. The semiconductor element 211 is, for example, an electronic integrated circuit (EIC) element. The optical element 212 is, for example, an optical chip or an optical chip module (PIC module) including a coupler, an optical chip, a total reflection mirror, a fiber array unit (FAU), etc. The optical element 212 can be combined with an optical element (optical fiber or optical fiber connector) 22.

[0051] In the present embodiment, the optoelectronic device 21 is combined with one side of the optical element 212 and the optical element 22 in a flat contact manner to the recess 200 of the carrier structure 20, and the optoelectronic device 21 is oriented with one side of the package module 210 facing away from the carrier structure 20.

[0052] As shown in FIG. 1, a plurality of wire bonds 23 are used to electrically connect the carrier structure 20 and the optoelectronic device 21. In the present embodiment, one end of each wire bond 23 is connected to the first surface 20a of the carrier structure 20, and the other end is connected to an electrical contact on the surface of the package module 210 of the optoelectronic device 21. Figure 2C

[0053] As shown in FIG. 1, at least one electronic element 24 is combined and electrically connected to the carrier structure 20. Figure 2D The electronic element 24 is, for example, an active element such as a switch chip, a system on chip (SOC), a high bandwidth memory (HBM) chip, or other functional chip, or a passive element such as a resistor, a capacitor, or an inductor. In the present embodiment, the electronic element 24 can be combined and electrically connected to the first surface 20a of the carrier structure 20 via a carrier 25.

[0054] The carrier 25 is, for example, a core substrate with circuit layers, a coreless substrate with circuit layers, or an interposer with conductive vias. The electronic element 24 can be electrically connected to the carrier 25 in a flip-chip manner via a plurality of conductive bumps such as solder bumps, copper bumps, or other conductive bumps. The carrier 25 can be combined and electrically connected to the first surface 20a of the carrier structure 20 via a plurality of conductive elements 250.

[0055] The carrier 25 is, for example, a core substrate with circuit layers, a coreless substrate with circuit layers, or an interposer with conductive vias. The electronic element 24 can be electrically connected to the carrier 25 in a flip-chip manner via a plurality of conductive bumps such as solder bumps, copper bumps, or other conductive bumps. The carrier 25 can be combined and electrically connected to the first surface 20a of the carrier structure 20 via a plurality of conductive elements 250.​​

[0056] As shown in Figure 2E The encapsulation layer 26 is formed on the carrier structure 20 to encapsulate the electronic component 24, the optoelectronic device 21 and the plurality of wire bonds 23 to form the electronic package 2.

[0057] The material of the encapsulation layer 26 is an insulating material, such as a polyimide (PI) or an epoxy encapsulation.

[0058] Through the above process, the present application also discloses an electronic package 2, comprising a carrier structure 20, an optoelectronic device 21 and an electronic component 24 disposed on the carrier structure 20.

[0059] The carrier structure 20 has opposite first and second surfaces 20a and 20b, and comprises an insulating layer 201 and a circuit layer 202 combined with the insulating layer 201. At least one recess 200 is formed on the first surface 20a of the carrier structure 20 for accommodating the optoelectronic device 21.

[0060] The optoelectronic device 21 comprises an encapsulation module 210, a semiconductor component 211 disposed in the encapsulation module 210, and an optical component 212 disposed on the encapsulation module 210. The encapsulation module 210 is a fan-out type stacked package structure, the semiconductor component 211 is an electronic integrated circuit component, and the optical component 212 is an optical chip or an optical chip module comprising a coupler, an optical chip, a total reflection mirror, an optical fiber array unit, etc. The optical component 212 can be combined with an optical element (optical fiber or optical fiber connector) 22.

[0061] The optoelectronic device 21 is combined with the recess 200 of the carrier structure 20 in a stable contact manner on one side of the optical component 212 and the optical element 22, and the optoelectronic device 21 is arranged with one side of the encapsulation module 210 facing away from the carrier structure 20, so as to electrically connect the carrier structure 20 and the encapsulation module 210 of the optoelectronic device 21 by means of the plurality of wire bonds 23.

[0062] The electronic component 24 can be combined and electrically connected with the first surface 20a of the carrier structure 20 by means of a carrier 25. An encapsulation layer 26 can be formed on the carrier structure 20 to encapsulate the electronic component 24, the optoelectronic device 21 and the plurality of wire bonds 23.

[0063] In summary, the electronic package of the present application mainly sets the optoelectronic device in an inverted manner on the bearing structure, so that the optical element of the optoelectronic device and the connected optical fiber are placed at the edge groove of the bearing structure, and the electrical contact on the surface of the inverted packaging module of the optoelectronic device is electrically connected to the bearing structure in a wire bonding manner, so as to increase the support and protection of the optical element (optical fiber or optical fiber joint), stabilize the signal transmission of the optical element, solve the problems of fracture of the contact of the optical element and abnormal signal transmission in the existing structure, and reduce the production cost of the product without the need to purchase special equipment, and the technical implementation is highly feasible.

[0064] The above embodiments are used to illustrate the principles and effects of the present application, but are not used to limit the present application. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of the present application. Therefore, the protection scope of the present application should be subject to the claims.

Claims

1. An electronic package, characterized by Comprising: a carrier structure having opposite first and second surfaces; a photoelectric device disposed on the first surface of the carrier structure and electrically connected to the carrier structure, wherein the photoelectric device includes a package module, a semiconductor element disposed in the package module, and an optical element disposed on the package module, and the photoelectric device is bonded to the carrier structure with one side of the optical element facing away from the carrier structure; and an electronic element disposed on the first surface of the carrier structure and electrically connected to the carrier structure.

2. The electronic package of claim 1, wherein, The first surface of the carrier structure is formed with a recess for accommodating the photoelectric device in the recess.

3. The electronic package of claim 1, wherein, The package module is a fan-out type stacked package structure, the semiconductor element is an electronic integrated circuit element, and the optical element is an optical chip or an optical chip module.

4. The electronic package of claim 3, wherein, The optical chip module includes a coupler, an optical chip, a total reflection mirror, or an optical fiber array unit.

5. The electronic package of claim 1, wherein, The optical element is bonded with an optical element.

6. The electronic package of claim 1, wherein, The electronic package further includes a plurality of wire bonds electrically connecting the carrier structure and the photoelectric device.

7. The electronic package of claim 6, wherein, One end of each of the wire bonds is connected to the first surface of the carrier structure, and the other end is connected to an electrical contact on the surface of the package module of the photoelectric device.

8. The electronic package of claim 1, wherein, The electronic element is bonded to and electrically connected to the carrier structure by a carrier.

9. The electronic package of claim 8, wherein, The carrier is bonded to and electrically connected to the first surface of the carrier structure by a plurality of conductive elements.

10. The electronic package of claim 1, wherein, The electronic package further includes a cladding layer formed on the carrier structure to cover the electronic element and the photoelectric device.

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