Tracking system

Abstract

The utility model provides a tracking system, which is configured to track a component in the processing process of the component and / or a component bearing piece, and comprises a carrier tape, the carrier tape comprises at least one first mark and at least one accommodating concave part, the accommodating concave part is configured to accommodate the component, and the first mark and the accommodating concave part are arranged on the carrier tape. One first mark is associated with one accommodating recess; a component carrier configured to receive and carry the component from the carrier tape and including a second mark associated with an assembly position of the component; a pickup device configured to pick up the component from the accommodating recess to place the component into the component carrier; the reading device is used for reading the first mark and the second mark; and a processor that associates the first mark from the receiving recess of the carrier tape with the second mark from the component carrier.

Description

Technical Field

[0001] This utility model relates to the field of electronic devices, and in particular to a tracking system. Background Technology

[0002] In the prior art, with the increasing functionality of component carriers equipped with one or more electronic components, the gradual miniaturization of such components, and the increasing number of components to be mounted on component carriers such as printed circuit boards, increasingly powerful array-shaped components or packages with multiple contacts or connections, with increasingly smaller intervals between these contacts, are being adopted. As the component carrier structure becomes miniaturized and the number of components it carries increases, the product quality of each component plays a crucial role in the final product.

[0003] In existing component carrier manufacturing processes, the number of components placed on and / or embedded in the component carrier typically reaches dozens or even hundreds. These components may come from the same batch of incoming materials or different batches, and may originate from the same manufacturer or different manufacturers. However, existing production systems lack an effective correlation between the components carried by the component carrier and the incoming materials. This makes it impossible to trace the incoming materials of defective components when defects are discovered during manufacturing. Firstly, it is impossible to determine the source of the defective components based on the correlation, nor can it determine whether other components in the same batch have the same defect, making future improvements impossible. Secondly, it is impossible to promptly recall potentially defective components from the production line, causing them to continue being transported to various processing stations for further processing, impacting the final product yield.

[0004] Therefore, there is a need for a tracking system that can track components during the handling of components and / or component carriers. Utility Model Content

[0005] The purpose of this invention is to provide a tracking system that at least addresses the deficiencies described above in the prior art.

[0006] According to an exemplary embodiment of the present invention, a tracking system is provided, which can be configured to track said component during the handling of a component and / or a component carrier. The tracking system may include: a carrier belt including at least one first mark and at least one receiving recess configured to receive the component, one of the first marks being associated with one of said receiving recesses; a component carrier configured to receive and carry the component from the carrier belt and including a second mark associated with an assembly position of the component; a pickup device configured to pick up the component from the receiving recess to place the component into the component carrier; a reading device reading the first mark and the second mark; and a processor associating the first mark from the receiving recess of the carrier belt with the second mark from the component carrier.

[0007] In the context of this application, the term "component carrier" may specifically refer to any support structure capable of accommodating one or more components thereon and / or therein to provide mechanical support and / or electrical connection. In other words, a component carrier can be constructed as a mechanical and / or electronic carrier of a component. In particular, a component carrier can be one of a printed circuit board, an organic interposer, and an IC (integrated circuit) substrate. A component carrier can also be a hybrid board combining different carriers of the above types of component carriers.

[0008] In the context of this application, the term "component carrier structure" may specifically refer to a prefabricated component carrier currently being manufactured. Specifically, a component carrier structure may include multiple component carriers or prefabricated components that remain integrally connected, and these component carriers or prefabricated components may be manufactured in a batch process prior to individualization. In particular, a component carrier structure may be a panel (e.g., having a size of 18 inches × 24 inches or larger) or an array (e.g., an array of six component carriers currently being manufactured). For example, the manufactured component carrier may be a printed circuit board or an IC substrate.

[0009] In alternative embodiments, the manufactured component carrier may include a stack of at least one electrically insulating layer structure and / or at least one conductive layer structure. For example, the component carrier may be a laminate of electrically insulating and conductive layer structures, particularly formed by applying mechanical pressure and / or heat. A “stack” can provide a plate-like component carrier that offers a large mounting surface for other components while remaining very thin and compact. The term “layer structure” may specifically refer to a continuous layer, a patterned layer, or multiple discontinuous islands within a common plane.

[0010] In an alternative implementation, the component carrier is shaped like a plate. This contributes to a compact design, where the component carrier still provides a large base for mounting components. Furthermore, particularly as a bare mold for embedded electronic components, its small thickness allows for easy embedding into thin plates, such as printed circuit boards.

[0011] In an alternative implementation, the component carrier is configured as one of a group consisting of a printed circuit board, a substrate (particularly an IC substrate), and an intermediate layer.

[0012] In the context of this application, the term "printed circuit board" (PCB) can specifically refer to a board-shaped component carrier formed by laminating several conductive layer structures with several electrically insulating layer structures, for example by applying pressure and / or by providing heat. As the preferred material for PCB technology, the conductive layer structures are made of copper, while the electrically insulating layer structures can consist of resin and / or glass fiber, i.e., so-called prepreg or FR4 material. Various conductive layer structures can be formed with through-holes in the laminate, for example by laser drilling or mechanical drilling, and connected to each other in the desired manner by filling them with a conductive material (particularly copper), thus forming through-hole connections. In addition to one or more components that can be embedded in the PCB, PCBs are generally constructed to accommodate one or more components on one or two opposing surfaces of the board-shaped PCB. They can be soldered to their respective main surfaces. The dielectric portion of the PCB can consist of resin and reinforcing fibers (such as glass fiber).

[0013] In the context of this application, the term "substrate" can specifically refer to a small component carrier. In the case of a PCB, a substrate can be a relatively small component carrier on which one or more components can be mounted, and can act as a connection medium between one or more chips and another PCB. For example, a substrate can have substantially the same dimensions as the components (particularly electronic components) to be mounted thereon (e.g., in the case of chip-scale packages (CSP)). More specifically, a substrate can be understood as a carrier of electrical connections or electrical networks, and a component carrier equivalent to a printed circuit board (PCB), but with a considerably high density of lateral and / or vertical interconnects. For example, lateral connections are conductive channels, while vertical connections may be drilled holes. These lateral and / or vertical connections are arranged within the substrate and can be used to provide electrical, thermal, and / or mechanical connections between packaged or unpackaged components (such as bare molds), particularly IC chips, and printed circuit boards or intermediate printed circuit boards. Therefore, the term "substrate" also includes "IC substrate." The dielectric portion of the substrate can be composed of resin with reinforcing particles (e.g., reinforcing spheres, particularly glass spheres).

[0014] The substrate or interlayer may include or consist of at least one layer of glass, silicon (Si), or photo-imaging or dry-etching organic material such as epoxy-based stacked materials (e.g., epoxy-based stacked films) or polymer compounds such as polyimide, polybenzoxazole, or benzocyclobutene functionalized polymers.

[0015] In alternative embodiments, at least one electrical insulating layer structure may include at least one of the following: resin (e.g., reinforced or unreinforced resin, such as epoxy or bis(methylenediamide)-trinitride resin), cyanate ester resin, polystyrene derivative, glass (particularly glass fiber, multilayer glass, glass-like materials), prepreg (e.g., FR-4 or FR-5), polyimide, polyamide, liquid crystal polymer (LCP), epoxy-based constructed film, polytetrafluoroethylene (PTFE, Teflon), ceramic, metal oxide. Reinforcing structures such as fiber webs, fibers, or spheres, made of glass (multilayer glass), may also be used. While prepregs, particularly FR4, are generally preferred for rigid PCBs, other materials, particularly epoxy-based deposited films or photo-imaging dielectric materials, may also be used. For high-frequency applications, high-frequency materials such as PTFE, liquid crystal polymers and / or cyanate ester resins, low-temperature co-fired ceramics (LTCC), or other low, very low, or ultra-low DK materials may be implemented as electrical insulating layer structures in component carriers.

[0016] At least one component that can be embedded and / or surface-mounted on a stack can be selected from the group consisting of: non-conductive inlays (e.g., ceramic inlays, preferably including aluminum nitride or aluminum oxide), conductive inlays (e.g., metallic inlays, preferably including copper or aluminum), heat transfer units (e.g., heat pipes), light guiding elements (e.g., optical waveguides or optical conductor connections), optical elements (e.g., lenses), electronic components, or combinations thereof. For example, the component can be an active electronic component, a passive electronic component, an electronic chip, a storage device (e.g., DRAM or other data storage), a filter, an integrated circuit, a signal processing component, a power management component, an optoelectronic interface element, a light-emitting diode, an optical connector, a voltage converter (e.g., a DC / DC converter or an AC / DC converter), a encryption component, a transmitter and / or a receiver, an electromechanical transducer, a sensor, an actuator, a microelectromechanical system (MEMS), a microprocessor, a capacitor, a resistor, an inductor, a battery, a switch, a camera, an antenna, a logic chip, and an energy harvesting unit. However, other components can be embedded within a component carrier. For example, magnetic elements can be used as components. This magnetic element can be a permanent magnetic element (e.g., a ferromagnetic element, an antiferromagnetic element, a multiferromagnetic element, or a ferrite core) or a paramagnetic element. However, the component can also be a substrate, an interlayer, or another component carrier, such as in a board-in-board configuration. The component can be surface-mounted on a component carrier and / or embedded therein. Furthermore, other components can also be used as components.

[0017] Furthermore, it should be noted that, in the context of this application, the term "structure" may specifically refer to any physical body to be metallized, particularly a plate-like body.

[0018] In optional embodiments, the metal includes at least one of the following: gold, palladium, tin, silver, iron, nickel, cobalt, lead, iridium, zinc, and copper. The metal may be present in dissolved form and / or as an elemental metal. In particular, any kind of heavy metal treated during the surface metallization process (e.g., in the manufacture of component carriers) can be recovered through exemplary embodiments. In the context of this application, the term "heavy metal" may specifically refer to a density greater than 5 g / cm³. 3 Metals. In particular, heavy metals can include iron, copper, nickel, tin, silver, gold, palladium, and platinum. However, given the limited availability of gold and palladium, their recycling may be of paramount importance.

[0019] In the context of this application, the term "array" can specifically refer to an arrangement of components formed on the main surface of a plate-like component carrier. For example, K arrays can be placed on the component carrier, each array consisting of M × N components laid flat on the component carrier.

[0020] In the context of this application, the terms "longitudinal" and "longitudinal direction" can specifically refer to the direction of extension of the carrier belt in a tracking system, or the length direction of the carrier belt, for example... Figure 2 The direction indicated by the X-direction; the terms "lateral" or "transverse direction" can specifically refer to the direction perpendicular to the extension direction of the carrier tape in the tracking system, or the width direction of the carrier tape, for example... Figure 2 The direction shown in the Y direction.

[0021] In the context of this application, the term "carrier tape" may specifically refer to a strip structure used to accommodate and transport components to the vicinity of a component carrier. Upon receiving a wafer from a manufacturer, the wafer is first diced into multiple individual components, such as chips. All components are placed into receiving recesses of the carrier tape, with one receiving recess accommodating one component. The carrier tape then carries all the components and transports them to the vicinity of a component carrier, whereby the components are subsequently placed in or on the surface of the component carrier by a transfer method such as a pick-up device.

[0022] Other example implementations of the tracking system will be described below.

[0023] In an optional embodiment, the carrier tape may include a plurality of holes, wherein each of the receiving recesses may be associated with two holes disposed adjacent to the receiving recess. As the carrier tape moves forward through the corresponding transmission device and engages with the holes, the receiving recesses associated with the holes may correspond to the holes.

[0024] In an optional embodiment, the first mark, the receiving recess, and the hole can all be arranged along the extension direction of the carrier tape.

[0025] In an optional implementation, the first mark may be disposed between the two holes of each of the receiving recesses. This allows for a one-to-one correspondence between the first mark and its corresponding receiving recess, thereby establishing a one-to-one correspondence with the component placed within the receiving recess.

[0026] In an optional embodiment, the width of the first mark in the width direction perpendicular to the extension direction of the carrier tape can be equal to the diameter of the hole. In an optional embodiment, depending on actual production needs, the width of the first mark in the width direction perpendicular to the extension direction of the carrier tape can also be greater than or less than the diameter of the hole.

[0027] In an alternative embodiment, the first mark and the hole may each be axisymmetric with respect to the extension direction of the carrier tape.

[0028] In an optional embodiment, the receiving recess and the first mark corresponding to the receiving recess may be axially symmetrical with respect to a direction perpendicular to the extension direction of the carrier tape. This also ensures a one-to-one correspondence between the first mark and its corresponding receiving recess, thereby creating a one-to-one correspondence with the component placed within the receiving recess, preventing confusion.

[0029] In an optional implementation, the reading device may include a first reader for reading the first marker and a second reader for reading the second marker. The first and second readers can read the first and second markers simultaneously to improve the operating efficiency of the tracking system.

[0030] In an optional implementation, the first reader can read multiple first tags simultaneously, thereby reducing reading time and improving tracking efficiency.

[0031] In an optional implementation, the reading device may include an optical reading device, and the first mark and the second mark are optically readable marks.

[0032] In an optional implementation, the first mark and the second mark can be QR codes.

[0033] In an alternative embodiment, the pickup device may be configured to pick up each of the components on the carrier belt and place each of the components into a different cavity of the component carrier.

[0034] In an optional embodiment, the assembly position of the component may correspond to the position of the cavity in the component carrier where the component is placed.

[0035] In an optional embodiment, the size of the first mark in the extension direction of the carrier tape does not exceed 1.5 mm.

[0036] In an alternative implementation, the second mark may be configured to define the item information of the component carrier and / or the component.

[0037] In an optional implementation, the tracking system may further include a database coupled to the processor, the database being configured to store data representing the relationship between the first tag and the second tag. This data may include, for example, but is not limited to, component material, manufacturer information, wafer code, manufacturing batch, component weight, component size, and component location number.

[0038] In an optional implementation, one of the plurality of first marks may be associated with one of the plurality of receiving recesses for receiving the component, and the processor may be configured to associate each of the first marks with a corresponding portion of a second mark in the component carrier that receives and carries the component. For example, the processor may be configured to associate information recorded in each of the first marks with a corresponding information portion of information recorded in the second mark in the component carrier that receives and carries the component, so that after scanning the second mark and reading the corresponding information portion in the second mark, the first mark can be traced based on the association, and upstream tracing can be performed based on the information recorded in the first mark, such as tracing the specific dimensions of the component, manufacturer information, wafer batch, etc.

[0039] According to the embodiments of this application, a tracking system is provided with a first mark on a carrier belt that accommodates and transports components, and a second mark on a component carrier that receives and carries components from the carrier belt. The first mark and the second mark are associated by a processor, establishing a correlation between the incoming components and the components on the component carrier transported in the production line, so that each component on the component carrier is traceable.

[0040] During the manufacturing process, if any defect is found in any component on the carrier, the source of the defective component can be traced based on the correlation between the first and second markings. For example, the defective component may originate from a specific batch of components from a particular manufacturer. After tracing the source, on the one hand, the component defect can be recorded to investigate its cause and prevent its recurrence in subsequent production processes. On the other hand, the whereabouts of other components in the same batch of incoming materials can be tracked to check for similar defects in other components on the same carrier. If such defects are found, they can be promptly recalled to avoid causing defects in the final product. Attached Figure Description

[0041] The above-defined aspects and other aspects of the present invention will become apparent from the embodiments described below with reference to the accompanying drawings. The present invention will be described below with reference to the embodiments, but the present invention is not limited to the described embodiments.

[0042] Figure 1 This is a schematic diagram of a tracking system according to an embodiment of the present invention.

[0043] Figure 2 This is a top plan view of a portion of the carrier tape according to the present invention.

[0044] Figure label:

[0045] 1 Tracking system; 2 Carrier tape; 22 First mark; 24 Receiving recess; 26 Hole;

[0046] 3. Component carrier; 32. Second mark; 4. Pick-up device; 5. Reading device;

[0047] 52 First reader; 54 Second reader; 6 Processor; 10 Components. Detailed Implementation

[0048] The illustrations in the accompanying drawings are schematic. It should be noted that in different drawings, similar or identical elements or features are given the same reference numerals or reference numerals that differ only in the first digit. To avoid unnecessary repetition, elements or features already described with respect to the foregoing embodiments will not be described again in subsequent descriptions.

[0049] Furthermore, spatially related terms, such as "front" and "back," "up" and "down," "left" and "right," are used to describe the relationship between one element and another as shown in the figures. Thus, spatially related terms can be applied to orientations in use that differ from those illustrated in the figures. Clearly, all such spatially related terms refer only to the orientations shown in the figures for ease of description and are not necessarily limiting, as the device according to the embodiments of this invention may be assumed to have orientations different from those illustrated in the figures during use. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0050] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0051] Figure 1 A tracking system 1 according to an embodiment of the present invention is schematically shown. This tracking system 1 can be configured to track the component 10 during the handling of the component 10 and / or the component carrier 3. Specifically, the tracking system 1 includes a carrier belt 2, which includes at least one first marker 22 (see...). Figure 2 The component carrier 2 includes at least one receiving recess 24 configured to receive component 10, a first mark 22 associated with a receiving recess 24; a component carrier 3 configured to receive and carry component 10 from carrier tape 2 and including a second mark 32 associated with the assembly position of component 10; a pickup device 4 configured to pick up component 10 from receiving recess 24 to place component 10 into component carrier 3; a reading device 5 that reads the first mark 22 and the second mark 32; and a processor 6 that associates the first mark 22 from receiving recess 24 of carrier tape 2 with the second mark 32 from component carrier 3.

[0052] In some embodiments, the carrier belt 2 may represent a strip structure for receiving the component 10 and transporting the component 10 to the component carrier 3. In some embodiments, the carrier belt 2 may also include a plurality of holes 26 (see...). Figure 2The hole 26 can be configured such that when the carrier belt 2 is transported in the production line, a retaining device, such as a pin, on the transport device can pass through the hole 26 to retain and secure the carrier belt 2, thereby transporting the carrier belt 2 and the component 10 contained in the carrier belt 2 to the component carrier 3 or other processing station.

[0053] Specifically, upon receiving a wafer from a supplier, the wafer is first diced to form multiple individual components 10, such as chips, each component 10 having a uniquely assigned code, for example, randomly generated. All components 10 are placed into receiving recesses 24 of the carrier tape 2, with one receiving recess 24 accommodating one component 10. The carrier tape 2 then carries all components 10 and transports them to a component carrier 3 located near the component carrier 3, where a pickup device 4 picks up the components 10 from the receiving recesses 24 and places them into the cavity of the component carrier 3 for further processing.

[0054] In some embodiments, the receiving recess 24 can be an outwardly opening bag-shaped piece disposed on the carrier belt 2. The opening of the receiving recess 24 may not be closed, or the opening of the receiving recess 24 may be closed by a partition to better protect the components contained therein.

[0055] For example in Figure 2 As schematically shown in the plan view, the portion of the carrier tape 2 shown includes three receiving recesses 24, three first marks 22, and six holes 26. Each receiving recess 24 can be associated with two holes 26 located adjacent to it, and each receiving recess 24 is associated with a first mark 22. A first mark 22 can be positioned between two holes 26. The first marks 22, receiving recesses 24, and holes 26 can all be arranged along the extension direction of the carrier tape 2 (e.g., the longitudinal direction indicated by X, also known as the length direction). Preferably, the first marks 22 and holes 26 are aligned along the longitudinal direction.

[0056] Understandable, Figure 2The arrangement and number of receiving recesses 24, first marks 22, and holes 26 shown in the embodiments are merely illustrative. The correspondence between the receiving recesses 24 and the first marks 22 and holes 26 can vary according to requirements. For example, when two holes 26 are provided next to each receiving recess 24, each receiving recess 24, its corresponding first mark 22, and the two holes 26 can be arranged in a direction perpendicular to the extension direction of the carrier tape 2 (e.g., the transverse direction indicated by Y, also known as the width direction) (not shown in the figures). Preferably, each receiving recess 24, its corresponding first mark 22, and the two holes 26 are aligned in the transverse direction. In the transverse direction, the first mark 22 can be provided between the two holes 26 or between the two holes 26 and their corresponding receiving recesses 24. As another example, each receiving recess 24 can be provided with only one hole 26 and one first mark 22 associated with it. A hole 26 and a first mark 22 can be arranged in the longitudinal direction or in the transverse direction. Preferably, the hole 26 and the first mark 22 are arranged in a manner that aligns them in the lateral or longitudinal direction.

[0057] In some embodiments, the width of the first mark 22 in the width direction perpendicular to the extension direction of the carrier tape 2 may be equal to the diameter of the hole 26. For example, the dimension of the first mark 22 in the width direction may not exceed 1.5 mm. Preferably, the dimension of the first mark 22 in the width direction, or the diameter of the hole 26, may be, but is not limited to, 1.45 mm, 1.4 mm, 1.35 mm, 1.30 mm, 1.25 mm, or 1.2 mm.

[0058] In some embodiments, the width of the first mark 22 in the width direction perpendicular to the extension direction of the carrier tape 2 may be greater than or less than the diameter of the hole 26, and may be set according to the actual situation.

[0059] In some embodiments, the size of the first mark 22 in the extension direction of the carrier tape 2 may not exceed 1.5 mm. Preferably, the size of the first mark 22 in the extension direction of the carrier tape 2 may be, but is not limited to, 1.45 mm, 1.4 mm, 1.35 mm, 1.30 mm, 1.25 mm, or 1.2 mm.

[0060] In some embodiments, the first mark 22 and the hole 26 may each be axisymmetric with respect to the extension direction of the carrier tape 2. For example Figure 2 As shown in the planar schematic diagram, the first mark 22 can be square and the hole 26 can be circular, so that each of them is axially symmetric with respect to the longitudinal direction. However, it is understood that the shapes of the first mark 22 and the hole 26 are not limited to these; for example, one or both of them can be circular, rectangular, square, rhomboid, etc.

[0061] In some embodiments, the receiving recess 24 and the first mark 22 corresponding to the receiving recess 24 may each be axisymmetric with respect to the width direction perpendicular to the extension direction of the carrier tape 2. For example Figure 2 As shown in the planar schematic diagram, the first mark 22 can be square in shape, and the receiving recess 24 can be rectangular in shape, so that the two are axially symmetrical with respect to the width direction. However, it is understood that the shapes of the first mark 22 and the receiving recess 24 are not limited to these; for example, one or both of them can also be circular, rectangular, square, rhomboid, etc. The specific shape of the receiving recess 24 can be determined by the shape of the component 10 obtained by cutting the wafer.

[0062] In some implementations, the first mark 22 may be a QR code. It is understood that the first mark 22 may also take other forms; examples of the first mark 22 include barcodes, two-dimensional matrices (e.g., dot matrix), alphanumeric characters (or multiple characters), binary digits or characters, or any other optically readable symbol (or multiple symbols). Furthermore, the first mark 22 is not limited to optically readable marks; other types of marks may also be used (e.g., RFID tags, human-readable marks, etc.). The first mark 22 can be formed on the carrier tape 2 using any suitable technique, including laser marking, ink marking, dot marking, embossing, and other techniques.

[0063] In some embodiments, the first mark 22 may include at least one of the following information: material, manufacturer, wafer code, weight, proprietary number (ID) of component 10, size, location number of receiving recess 24, etc.

[0064] In this configuration, each component 10 placed in each receiving recess 24 of the carrier tape 2 is associated with a corresponding first mark 22. When the first mark 22 is scanned, the specific information of the component 10 corresponding to the first mark 22 can be determined.

[0065] In an alternative embodiment, the pickup device 4 may be configured to pick up each component 10 on the carrier tape 2 and place each component 10 into a cavity in the component carrier 3. For example, the component carrier may have a plurality of cavities arranged in an array, one of which may be used to receive and accommodate the component 10 picked up and transferred by the pickup device 4. The pickup device 4 may also be configured to place the component 10 diced from the wafer into a receiving recess 24 in the carrier tape 2.

[0066] The picking device 4 can be, for example, a robotic arm. It is understood that when the number of components 10 is small, components 10 can also be picked up manually, for example, by picking up the component 10 obtained from the wafer and placing it into the receiving recess 24, or by picking up the component 10 from the receiving recess 24 and placing it into the cavity of the component carrier 3. The assembly position of one component 10 in the component carrier 3 can correspond to the position of one cavity in the component carrier 3. It is understood that in some embodiments, the component can also be placed on the surface of the component carrier and then fixed to the surface of the component carrier by surface mounting. In this case, the component carrier does not need to have a pre-set receiving cavity.

[0067] like Figure 1 As shown, the picking device 4 can pick up the component 10 from the receiving recess 24 and place it into the component carrier 3, where the components are arranged in an array on the component carrier 3. For example, in Figure 1 The component carrier 3 shown has 16 arrays arranged on it, each array having 32 components 10, and the 32 components 10 are arranged in a 4-row × 8-column configuration.

[0068] The component carrier 3 is plate-shaped. The arrangement of components 10 on the component carrier 3 is merely illustrative; it is understood that the number of arrays and the specific arrangement of components 10 can be changed as needed. For example, the component carrier 3 may include more or fewer arrays, such as, but not limited to, 10, 12, 14, 18, or 20 arrays. Each array may include more or fewer components 10, such as, but not limited to, 36, 40, 44, 48, or 52 components.

[0069] A second mark 32 is also provided on the component carrier 3 (especially on one side of the component carrier). The second mark 32 can be configured to define the item information of the component carrier 3 and / or component 10. The second mark 32 may include multiple parts, each of which can be associated with an assembly position of a component 10. The second mark 32 may also include, but is not limited to, the following information: the number of the component carrier 3, the number of the component 10, the placement position of the component 10, etc.

[0070] It is understood that the number of second marks 32 is only illustrative. Each component carrier 3 may also be provided with an additional second mark 32, for example, at another side of the component carrier, to assist in recording information of the component 10, or to serve as a backup, recording the same information as the second mark 32.

[0071] In some implementations, the second mark 32 may be a QR code. It is understood that the second mark 32 may also take other forms; examples of the second mark 32 include barcodes, two-dimensional matrices (e.g., dot matrix), alphanumeric characters (or multiple characters), binary digits or characters, or any other optically readable symbol (or multiple symbols). Furthermore, the second mark 32 is not limited to optically readable marks; other types of marks may also be used (e.g., RF device-readable tags, human-readable marks, etc.). The second mark 32 can be formed on the carrier tape 2 using any suitable technique, including laser marking, ink marking, dot marking, embossing, and other techniques.

[0072] In some embodiments, one of the plurality of first marks 22 may be associated with one of the plurality of receiving recesses 24 for receiving the component 10. The processor 6 may be configured to associate each first mark 22 with a corresponding portion of the information carried by a second mark 32 of the component carrier 3 that receives and carries the component 10.

[0073] For example, multiple first marks are provided on a carrier belt, each first mark corresponding to information about a component on the carrier belt. Scanning a first mark reveals the location of the component corresponding to that first mark (e.g., the component is located at the third receiving recess on the carrier belt), the component's manufacturer information, etc. The component is then picked up by a pickup device and placed onto a component carrier, and the corresponding information of the component is recorded in the corresponding information portion of a second mark. For example, the corresponding information portion of the second mark records that the component is placed at the position of the first cavity in the second row of the third matrix of the component carrier. Subsequently, the processor associates the information recorded by the first mark at the position of the third receiving recess on the carrier belt with the corresponding information portion recorded in the second mark at the position of the first cavity in the second row of the third matrix of the component carrier.

[0074] In this scenario, when a component at the location of the first cavity in the second row of the third matrix of the component carrier exhibits a defect or needs to be traced, the corresponding information portion of the second marker can be identified by scanning. Based on its correlation with the first marker, the corresponding first marker can be traced. Furthermore, based on the specific information of the first marker, information such as the manufacturer, wafer source, and manufacturing batch of the component can be found. This allows for, for example, improvements to subsequent components supplied by the same source, or the tracing of component carriers carrying other components on the same carrier to confirm whether other components exhibit similar defects. It is understood that the location information presented here is exemplary; different portions of the first and second markers correspond to information about different components. This exemplary description is merely to help understand how the processor correlates, establishes correlations, and performs tracing between the information recorded by the first and second markers.

[0075] In some embodiments, the tracking system 1 may further include a database coupled to the processor 6. The database may be configured to store data representing a first tag 22, data representing a second tag 32, and data representing the relationship between the first tag 22 and the second tag 32.

[0076] In some embodiments, the reading device 5 may include an optical reading device 5. The first mark 22 and the second mark 32 may be optically readable marks. The reading device 5 may include a first reader 52 for reading the first mark 22 and a second reader 54 for reading the second mark 32.

[0077] In view of the above, in the tracking device according to the present invention, a plurality of components 10 are first produced by dicing a wafer provided by a supplier. The picking device 4 places each of the plurality of components 10 into a receiving recess 24 of a carrier tape 2. During the process of placing the component 10 into the receiving recess 24, the processor 6 associates each component 10 with a first mark 22 corresponding to the corresponding receiving recess 24, and the corresponding information is recorded in a database. When the optical reading device 5 scans the first mark 22, the specific information of the component 10 corresponding to the first mark 22 can be obtained, such as the component 10. The component number, the position of component 10 in carrier tape 2, the position of component 10 on wafer, etc.; carrier tape 2 is fixed to transport device through holes 26 provided thereon, and transport device transports carrier tape 2 and component 10 to the vicinity of component carrier 3. Pick-up device 4 picks up component 10 in receiving recess 24 and transfers component 10 to component carrier 3, for example, embedding it into cavity of component carrier 3. Each component 10 has a specific placement position; processor 6 associates the first mark 22 and the part of the second mark 32 corresponding to a component 10 with the part corresponding to that component 10.

[0078] By using the structure and setup of the tracking system 1, when a defect is found in a component 10 of the component carrier 3 during the manufacturing process of the component carrier 3, the operator can scan the second mark 32 on the component carrier 3 using the optical reading device 5 based on the location information of the defective component 10. The processor 6 determines the portion of the second mark 32 corresponding to the defective component 10, and at the same time, based on the correspondence between the second mark 32 and the first mark 22 stored in the database, determines the first mark 22 corresponding to the defective component 10 on the component carrier 3, and views the information recorded in the first mark 22, such as the number of the defective component 10, the specific location of the recess 24 on the original carrier tape 2, the material, manufacturer, wafer code, weight, and the size of the component 10.

[0079] After obtaining the specific information of the first mark 22 corresponding to the defective component 10, on the one hand, the operator can record the defect of component 10, find the cause of the defect, and avoid the recurrence of such defects in subsequent production processes; on the other hand, the operator can track the whereabouts of other components 10 produced in the same batch of wafers, check whether other components 10 on the same carrier tape 2 have similar defects, and promptly recycle them after discovery to avoid causing the final product to be defective.

[0080] Unless the context explicitly requires it, the word "comprising" and similar terms in the specification and claims are considered inclusive, as opposed to exclusive or comprehensive; that is, meaning "including but not limited to." The use of singular or plural terms also includes both singular and plural forms, respectively. Furthermore, the use of the terms "here," "above," "below," and similar terms in this application refers to the entire application and not any particular part thereof. When the expression "or" is used to refer to a list of two or more items, this expression covers all interpretations of the word below: any item in the list, all items in the list, and any combination of items in the list.

[0081] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it; although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A tracking system, characterized by The tracking system (1) is configured to implement tracking of the components (10) during a handling process of the components (10) and / or of the component carriers (3), the tracking system (1) comprising: a carrier tape (2) comprising at least one first marking (22) and at least one accommodation recess (24) configured to accommodate the components (10), one first marking (22) being associated with one accommodation recess (24); a component carrier (3) configured to receive and carry the components (10) from the carrier tape and comprising second markings (32) associated with assembly positions of the components (10); a picking device (4) configured to pick the components (10) from the accommodation recesses (24) and to place the components (10) into the component carrier (3); a reading device (5) reading the first markings (22) and the second markings (32); and a processor (6) associating the first markings (22) from the accommodation recesses (24) of the carrier tape (2) with the second markings (32) from the component carrier (3).

2. The tracking system of claim 1, wherein, The carrier tape (2) comprises a plurality of holes (26), wherein each accommodation recess (24) is associated with two holes (26) arranged next to the accommodation recess.

3. The tracking system of claim 2, wherein, The first markings (22), the accommodation recesses (24), the holes (26) are all arranged along an extension direction of the carrier tape (2).

4. The tracking system of claim 2, wherein, The first markings (22) are arranged between the two holes (26) of each accommodation recess (24).

5. The tracking system of claim 3, wherein, The width of the first markings (22) in a width direction perpendicular to the extension direction of the carrier tape (2) is equal to the diameter of the holes (26).

6. The tracking system of any one of claims 2 to 5, wherein, The first markings (22) and the holes (26) are each axially symmetrical with respect to the extension direction of the carrier tape (2).

7. The tracking system of any one of claims 1 to 5, wherein, The accommodation recesses (24) and the first markings (22) corresponding to the accommodation recesses (24) are each axially symmetrical with respect to a direction perpendicular to the extension direction of the carrier tape (2).

8. The tracking system of claim 1, wherein, The reading device (5) comprises a first reader (52) reading the first markings (22) and a second reader (54) reading the second markings (32).

9. The tracking system of claim 1 or 8, wherein, The reading device (5) comprises an optical reading device and the first markings (22) and the second markings (32) are optically readable markings.

10. The tracking system of claim 1, wherein, The first markings (22) and the second markings (32) are two-dimensional codes.

11. The tracking system of claim 1, wherein, The picking device (4) is configured to pick each component (10) on the carrier tape (2) and to place each component (10) into a cavity of the component carrier (3).

12. The tracking system of claim 1, wherein, The assembly positions of the components (10) correspond to positions of cavities of the component carrier (3) in which the components (10) are placed.

13. The tracking system of claim 1 or 10, wherein, The first markings (22) have a size in the extension direction of the carrier tape (2) of no more than 1.5 mm.

14. The tracking system of claim 1, wherein, Said second marker (32) is configured to define an item information of said component carrier (3) and / or of said component (10).

15. The tracking system of claim 1, wherein, Said tracking system (1) further comprises a database coupled to said processor (6), said database being configured to store data representative of a relationship between said first marker (22) and said second marker (32).

16. The tracking system of claim 1, wherein, One first marker (22) of said plurality of first markers (22) is associated with one containing recess (24) of a plurality of containing recesses (24) for containing said component (10), and said processor (6) is configured to associate each said first marker (22) with a respective portion of a second marker (32) of said component carrier (3) that will receive and carry said component (10).

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