High-temperature-resistant film capacitor
By using a gold-plated design of metallized polypropylene film and single aluminum metallized film in the capacitor, combined with epoxy resin and polyphenylene sulfide encapsulation layer and heat dissipation fins, the high-temperature breakdown problem of ultra-small AC capacitors is solved, and the high temperature resistance and thermal conductivity are improved.
Patent Information
- Application Number
- CN202422963183.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-03
- Publication Date
- 2025-12-12
- Estimated Expiration
- 2034-12-03
AI Technical Summary
Existing ultra-miniature AC capacitors are prone to showing signs of burning on both ends of the core during use, leading to film breakdown and failing to meet the automotive-grade high-temperature resistance requirement of 125℃.
Metallized polypropylene film is used as the film layer, combined with a gold-plated layer of single aluminum metallized film to increase the contact area of the gold-plated layer. Epoxy resin and polyphenylene sulfide materials are used as the encapsulation layer, and heat dissipation fins and thermal grease are provided to improve thermal conductivity.
It improves the peak operating current withstand capability of the capacitor, reduces scorching damage, enhances high temperature resistance and thermal conductivity, and ensures stable operation of the capacitor in high temperature environments.
Smart Images

Figure CN223665310U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to thin film capacitor technical field, concretely relates to high temperature resistant thin film capacitor. BACKGROUND
[0002] Traditional alternating current capacitor adopts safety film structure, better solve capacitor withstand voltage and current endurance problem, but the capacitor of this structure is big in size, high in cost, and is limited in use in some circuits with small size requirement, the existing super small alternating current capacitor often has serious traces of burning on the both end surfaces of the core during use, and it is found through disassembly that the capacitor is caused by large working current, product heating leads to thermal energy imbalance, and film breakdown under local high temperature, therefore, the existing super small alternating current capacitor does not meet the requirement of high temperature resistance of 125 DEG C of the current vehicle, and therefore still has certain deficiency.
[0003] In summary, it is necessary to provide a high temperature resistant thin film capacitor. UTILITY MODEL CONTENTS
[0004] Therefore, the utility model provides a high temperature resistant thin film capacitor to solve the problem that the existing super small alternating current capacitor often has serious traces of burning on the both end surfaces of the core during use.
[0005] In order to realize the above purpose, the utility model provides the following technical scheme: a high temperature resistant thin film capacitor, comprising an electric core layer, the electric core layer comprises a thin film layer and a gold plating layer, the outer layer of the electric core layer is provided with a second packaging layer, and the outer side of the second packaging layer is provided with a shell layer.
[0006] Preferably, the gold plating layer is evaporated on the side wall of the thin film layer, the outer wall of the electric core layer is further wrapped with a moisture-proof layer, and the thickness size of the moisture-proof layer is less than the thickness size of the second packaging layer.
[0007] Preferably, the outer wall side end of the moisture-proof layer is wrapped with a first packaging layer, the second packaging layer is wrapped on the outer wall of the first packaging layer, and the outer wall of the electric core layer is sprayed with a gold spraying layer on both sides.
[0008] Preferably, the gold spraying layer is connected with a pin on the side away from the outer wall of the electric core layer, and the pin extends to the lower side of the capacitor body through the outer wall of the second packaging layer and the gold spraying layer.
[0009] Preferably, the shell layer is wrapped on the outer wall of the second packaging layer, heat-conducting silicone grease for heat conduction is sprayed between the second packaging layer and the shell layer, and heat dissipation fins are integrally fixed on the outer wall side end of the shell layer.
[0010] Preferably, the thin film layer is a metalized polypropylene film, and the gold plating layer is a single aluminum metalized film.
[0011] The utility model discloses beneficial effect is:
[0012] In the utility model, through redesigning the thin film layer and gold plating layer, increase the contact area of gold spraying layer and electric core layer, reduce the contact resistance, reduce the high frequency loss value, improve the current carrying capacity of electrode, thereby improve the working current bearing peak value of capacitor, and through the design of moisture-proof layer, second encapsulation layer and shell layer can improve its overall heat conduction performance and high temperature resistance characteristic, therefore can reduce the burnt damage situation of both ends. BRIEF DESCRIPTION OF DRAWINGS
[0013] Figure 1 It is the external structure schematic diagram of the utility model's front direction;
[0014] Figure 2 It is the sectional structure schematic diagram of the utility model's front direction;
[0015] Figure 3 It is the utility model Figure 2 The structure schematic diagram of enlarged scale in A place in the utility model;
[0016] Figure 4 It is the three-dimensional structure schematic diagram of electric core layer in the utility model.
[0017] In the drawing: 100, electric core layer;110, thin film layer;120, gold plating layer;200, moisture-proof layer;300, first encapsulation layer;400, second encapsulation layer;500, shell layer;510, radiating fin;600, gold spraying layer;700, pin. DETAILED DESCRIPTION
[0018] The preferred embodiments of the utility model are described below in conjunction with the drawings, and it should be understood that the preferred embodiments described here are only used to illustrate and explain the utility model, and are not used to limit the utility model.
[0019] Refer to the drawings Figures 1-4The utility model provides a high temperature -resistant film capacitor, including electric core layer 100, electric core layer 100 includes film layer 110 and gold plating layer 120, film layer 110 metalized polypropylene film, gold plating layer 120 is single aluminium metalized film, specifically, the low square resistance metalized polypropylene film that the film layer 110 of setting adopts has square resistance lower, can effectively reduce the energy loss in the conductive process, simultaneously possesses excellent conductive performance, can ensure that the current is evenly distributed in the film, thereby guarantee the stable operation of electronic equipment, and still have certain heat conductivity, can in time emit the heat generated in the working process, and the gold plating layer 120 of setting adopts single aluminium metalized film thickness to be thick than zinc aluminium metalized film, thus current -carrying capacity is big, so change single aluminium metalized film can reduce electrode heat output, and the gold plating layer 120 of setting can be fixed in the outer wall of film layer 110 through adopting evaporation technology, and then can improve the current -carrying capacity of electrode, improve product overcurrent capacity, personnel can also improve the thickness of film layer 110 simultaneously, to this to increase the contact area of electric core layer 100 and gold spraying layer 600, the outer layer of electric core layer 100 is provided with second encapsulation layer 400, and the second encapsulation layer 400 is set to encapsulate the whole capacitor, and the material of second encapsulation layer 400 is epoxy resin, which has good insulation performance, can effectively prevent the internal electrode of capacitor from contacting the external environment, avoid short circuit and leakage and other problems, its sealing performance is good, can block the moisture, dust etc. of outside into capacitor interior, protect the inside film and electrode, prolong the service life of capacitor, and epoxy resin also has certain mechanical strength, can bear a certain degree of external force impact and vibration, provides physical protection for capacitor, gold plating layer 120 is evaporated in the side wall of film layer 110, the outer wall of electric core layer 100 is also wrapped with moistureproof layer 200, the thickness size of moistureproof layer 200 is less than the thickness size of second encapsulation layer 400, the outer wall side end of moistureproof layer 200 is wrapped with first encapsulation layer 300, and the material of moistureproof layer 200 selects polyphenylene sulfide, because polyphenylene sulfide has excellent heat resistance, the melting point can reach 278 DEG C, the continuous use temperature is 220 DEG C, is suitable for use in high temperature environment, can guarantee the stability of encapsulation layer when capacitor is at higher temperature, simultaneously the crystallinity is high, and water vapor barrier performance is good, can prevent moisture from entering capacitor interior, maintain its performance stability, and its flame retardant performance is superior, reaches UL-94V0 level, oxygen element index reaches 49, and safety is high, also can improve the adhesion performance with epoxy resin by adding modified additive, and polyphenylene sulfide can fill some copper powder inside to guarantee its heat dissipation effect, guarantee that the temperature of electric core layer 100 is too high, the first encapsulation layer 300 of setting can be the epoxy resin layer mixed with moisture absorbent, which mainly plays the role of moisture-proof, and the thickness size of first encapsulation layer 300 needs to be much smaller than the thickness size of second encapsulation layer 400, second encapsulation layer 400 is wrapped in the outer wall of first encapsulation layer 300, the outer wall both sides of electric core layer 100 are sprayed with gold spraying layer 600,The pin 700 is connected to the outer wall of the gold spraying layer 600 away from the electric core layer 100, penetrates the outer wall of the second packaging layer 400 and the gold spraying layer 600 and extends to the lower side of the capacitor body.
[0020] The outer side of the second packaging layer 400 is provided with a shell layer 500, the shell layer 500 is wrapped on the outer wall of the second packaging layer 400, the second packaging layer 400 and the shell layer 500 are sprayed with heat-conducting silicone grease for heat conduction, the outer wall side ends of the shell layer 500 are integrally fixed with heat dissipation fins 510, the shell layer 500 is made of copper or aluminum, the second packaging layer 400 can transmit the heat in the capacitor to the shell layer 500 through the heat-conducting silicone grease, and the shell layer 500 can quickly discharge the heat through the heat dissipation fins 510, so that the heat dissipation effect of the capacitor body is ensured.
[0021] The use process of the utility model is as follows: in the utility model, the gold plating layer 120 is evaporated on one side of the outer wall of the film layer 110 by using an evaporation machine, then the film layer 110 and the gold plating layer 120 are wound into the electric core layer 100 by winding equipment, then the gold spraying layer 600 is sprayed on the two outer walls of the electric core layer 100, then the pin 700 is led out by welding after the gold spraying layer 600 is solidified, then the electric core layer 100 is immersed in the moisture-proof layer 200, then the moisture-proof layer 200 is heated and solidified, then a layer of epoxy resin mixed with a moisture absorbent is coated on the outer wall of the moisture-proof layer 200, and the first packaging layer 300 is formed after the epoxy resin is heated and solidified, then a layer of epoxy resin is coated on the whole capacitor except the pin 700, and the second packaging layer 400 is formed after the epoxy resin is heated and solidified, then a layer of heat-conducting silicone grease is sprayed on the outer wall of the second packaging layer 400, and then the shell layer 500 provided with the heat dissipation fins 510 is wrapped on the outer wall of the second packaging layer 400, so that the heat dissipation performance of the capacitor is ensured, and the produced film capacitor can be detected after completion.
[0022] The above is only the preferred embodiment of the utility model, any skilled person in the art can modify the utility model by using the technical solutions described above or modify it into equivalent technical solutions. Therefore, any simple modification or equivalent replacement according to the technical solutions of the utility model is within the scope of protection of the utility model.
Claims
1. A high temperature resistant thin film capacitor comprising a core layer (100), characterized in that: The electric core layer (100) comprises a film layer (110) and a gold-plated layer (120), an outer layer of the electric core layer (100) is provided with a second packaging layer (400), and an outer side of the second packaging layer (400) is provided with a shell layer (500).
2. The high temperature thin film capacitor of claim 1, wherein: The gold-plated layer (120) is evaporated on the side wall of the film layer (110), the outer wall of the electric core layer (100) is further wrapped with a moisture-proof layer (200), and the thickness size of the moisture-proof layer (200) is smaller than that of the second packaging layer (400).
3. The high temperature thin film capacitor of claim 2, wherein: The outer wall side end of the moisture-proof layer (200) is wrapped with a first packaging layer (300), the second packaging layer (400) is wrapped on the outer wall of the first packaging layer (300), and the outer wall of the electric core layer (100) is sprayed with a gold spraying layer (600) on both sides.
4. The high temperature thin film capacitor of claim 3, wherein: The gold spraying layer (600) is connected with a pin (700) away from the outer wall of the electric core layer (100) on both sides, the pin (700) penetrates through the outer wall of the second packaging layer (400) and the gold spraying layer (600) and extends to the lower side of the capacitor body.
5. The high temperature thin film capacitor of claim 1, wherein: The shell layer (500) is wrapped on the outer wall of the second packaging layer (400), the second packaging layer (400) and the shell layer (500) are sprayed with heat-conducting silicone grease for heat conduction, and the outer wall side end of the shell layer (500) is integrally fixed with a heat dissipation fin (510).
6. The high temperature thin film capacitor of claim 1, wherein: The film layer (110) is a metalized polypropylene film, and the gold-plated layer (120) is a single aluminum metalized film.