Reinforcing sheet mounting tool
By reinforcing the lifting mechanism and flexible pad of the chip mounting tool, the problem of uneven adhesive coverage caused by the warping of large-size chips is solved, thus achieving stability and reliability in the chip packaging process.
Patent Information
- Application Number
- CN202422992091.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-05
- Publication Date
- 2025-12-12
- Estimated Expiration
- 2034-12-05
AI Technical Summary
In semiconductor flip-chip packaging, as chip size increases, chip warpage caused by underfill adhesive leads to uneven adhesive coverage on both sides during reinforcement chip mounting, which in turn causes chip failure.
A reinforcement plate mounting tool is used, including a lower pressure fixture and an upper pressure fixture. The height of the chip clamping block is adjusted by a lifting mechanism and a flexible pad to balance the force on both sides of the chip and ensure consistent adhesive coverage.
It effectively improves the problem of uneven mounting of the reinforcement chip caused by warpage during the packaging process, and reduces the chip failure rate.
Smart Images
Figure CN223665415U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of semiconductor packaging, in particular to a reinforcing sheet mounting tool. BACKGROUND
[0002] In the semiconductor flip packaging process, the chip and the substrate are first interconnected by using the bump welding process to realize signal transmission, then the bottom filler is filled between the chip and the substrate to realize the sealing protection of the welding point, and then the reinforcing sheet or the heat dissipation cover is mounted to control the warping of the chip and enhance the heat dissipation.
[0003] However, with the continuous progress of technology and the increasing demand of application, the demand for chip computing power is also increasing, and the size of the corresponding chip is also getting larger. This makes the modulus of the bottom filling glue larger (<Tg, 7-13GPa), which leads to a large warping of the semi-finished chip filled with the bottom filler (~500μm), and because the chip is single-sided bottom filled, and many chips are designed with asymmetric structure, the semi-finished chip after the bottom filling glue is punched shows an unbalanced crying face warping (the chip faces up), which leads to uneven stress on both sides of the semiconductor chip when the reinforcing sheet is mounted, and further causes the difference in the adhesive coverage rate of the substrate on both sides, which easily causes the chip to fail. CONTENT OF THE INVENTION
[0004] The embodiments of the present application at least provide a reinforcing sheet mounting tool to improve the problem that the large crying face warping of the semi-finished chip leads to a large difference in the adhesive coverage rate on both sides of the reinforcing sheet when the reinforcing sheet is mounted, and to reduce the failure rate of the chip.
[0005] The embodiment of the present application provides a reinforcing sheet mounting tool for mounting a reinforcing sheet on a semi-finished chip, wherein the semi-finished chip comprises an interconnected chip and substrate, and an underfilling glue filled between the chip and the substrate, and the tool comprises: a lower pressing jig and an upper pressing jig; the lower pressing jig comprises a lower support base and a substrate support base; the lower support base is fixedly arranged; the substrate support base is arranged on the top surface of the lower support base, and is used for carrying the semi-finished chip with the chip facing upward; the upper pressing jig comprises an upper support base, a reinforcing sheet pressing block and a chip pressing block; the upper support base is arranged above the lower pressing jig, and is arranged to be capable of moving up and down relative to the lower pressing jig; the reinforcing sheet pressing block is annular, is arranged on the bottom surface of the upper support base, and is used for pressing the reinforcing sheet to mount the reinforcing sheet on the substrate when the upper support base moves downward; the chip pressing block is arranged in the reinforcing sheet pressing block, is arranged to be capable of moving up and down relative to the reinforcing sheet pressing block, and has a first height and a second height; when the chip pressing block is at the first height, the chip pressing block is accommodated in the reinforcing sheet pressing block; when the chip pressing block is at the second height, the chip pressing block protrudes from the lower surface of the reinforcing sheet pressing block, and is capable of applying pressure on the chip when the upper support base moves downward.
[0006] In an optional embodiment, the bottom surface of the chip pressing block is provided with a flexible pad layer.
[0007] In an optional embodiment, the flexible pad layer is one of the following structure layers: a rubber layer and a silica gel layer.
[0008] In an optional embodiment, a lifting mechanism is connected between the chip pressing block and the upper support base, and the lifting mechanism is used for controlling the chip pressing block to move up and down relative to the reinforcing sheet pressing block.
[0009] In an optional embodiment, the lifting mechanism comprises a mounting table and a telescopic rod, the top surface of the mounting table is connected to the upper support base through the telescopic rod, the bottom surface of the mounting table is connected to the chip pressing block, and the mounting table drives the chip pressing block to move up and down when the telescopic rod is telescoped.
[0010] In an optional embodiment, the upper support base is provided with a guide hole, the mounting table is located in the guide hole, and the mounting table moves up and down in the guide hole when the telescopic rod is telescoped.
[0011] In an optional embodiment, an elastic member is connected between the chip pressing block and the lifting mechanism, and the elastic member is used for being contracted when the chip pressing block flattens the chip.
[0012] In one optional embodiment, the lower pressing fixture further includes a detection device disposed on the lower support base. The detection device is used to detect the fit between the substrate and the substrate support base, so that the lifting mechanism can control the chip pressing block to move up and down relative to the reinforcing sheet pressing block when the fit exceeds the limit value.
[0013] In one optional embodiment, the detection device is specifically used to detect the distance between the substrate and the substrate support, and to determine the degree of fit between the substrate and the substrate support based on the distance.
[0014] In one alternative embodiment, the number of detection devices is multiple, and the multiple detection devices are located around the substrate support.
[0015] The above-mentioned technical solution of this application has the following beneficial technical effects:
[0016] In this embodiment of the reinforcement chip mounting tool, when the semi-finished chip has a facet warpage, the chip clamp can be moved to a second height, so that the chip clamp can gradually flatten the semi-finished chip as the upper support moves downward. This can avoid uneven force on both sides of the semi-finished chip, and make the adhesive coverage on both sides of the substrate consistent. This improves the problem of large differences in adhesive coverage on both sides during reinforcement chip mounting due to large facet warpage of the semi-finished chip, and reduces the chip failure rate.
[0017] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description
[0018] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly described below. These drawings are incorporated in and constitute a part of this specification. They illustrate embodiments conforming to this application and, together with the specification, serve to explain the technical solutions of this application. It should be understood that the following drawings only show some embodiments of this application and should not be considered as limiting the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.
[0019] Figure 1 This illustration shows a structural schematic diagram of a reinforcement sheet mounting tool provided in an embodiment of this application;
[0020] Figure 2 It shows Figure 1 Bottom view of the upper and middle pressing fixture;
[0021] Figure 3 It shows Figure 1 Top view of the middle and lower pressure jig;
[0022] Figure 4 This diagram illustrates the pressing of a reinforcement chip mounting tool when a warped semi-finished chip is present.
[0023] Figure 5 This diagram illustrates the pressing of a reinforcement chip mounting tool when the semi-finished chip is free from warping.
[0024] Figure label:
[0025] 1. Lower pressing fixture; 11. Lower support base; 12. Substrate support base; 13. Detection device; 14. Mounting base; 2. Upper pressing fixture; 21. Upper support base; 22. Reinforcing sheet pressing block; 23. Chip pressing block; 24. Flexible pad; 25. Mounting platform; 26. Telescopic rod; 27. Elastic element; 100. Chip; 200. Substrate; 300. Bottom filler; 400. Reinforcing sheet. Detailed Implementation
[0026] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values of the components and steps set forth in these embodiments do not limit the scope of the present application.
[0027] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.
[0028] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.
[0029] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0030] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0031] refer to Figures 1 to 5 This application provides a reinforcement sheet mounting tool for mounting a reinforcement sheet 400 onto a semi-finished chip, the semi-finished chip including interconnected chips 100 and substrate 200, and underfill adhesive 300 filling the space between chips 100 and substrate 200.
[0032] In some embodiments, the reinforcement sheet 400 mounting tool includes a lower pressing fixture 1 and an upper pressing fixture 2. The lower pressing fixture 1 includes a lower support base 11 and a substrate support base 12. The lower support base 11 is fixedly disposed. The substrate support base 12 is disposed on the top surface of the lower support base 11 and is used to support the semi-finished chip with the chip facing upward. The upper pressing fixture 2 includes an upper support base 21 and a reinforcement sheet pressing block 22. The upper support base 21 is disposed above the lower pressing fixture 1 and is configured to be able to move up and down relative to the lower pressing fixture 1. The reinforcement sheet pressing block 22 is disposed on the bottom surface of the upper support base 21 and is used to press the reinforcement sheet 400 onto the substrate 200 when the upper support base 21 moves downward. During the mounting process of the reinforcing sheet 400, the upper pressing fixture 2 is first moved upward to the origin, and the semi-finished chip is placed on the substrate support 12 with the chip facing upward. The reinforcing sheet 400 is then bonded to the substrate 200 around the chip 100. Then, the upper support 21 is moved downward. During the downward movement of the upper support 21, the bottom surface of the reinforcing sheet pressing block 22 first contacts the upper end of the reinforcing sheet 400. As the upper support 21 continues to move downward, the reinforcing sheet pressing block 22 and the substrate support 12 cooperate to press the reinforcing sheet 400 and the substrate 200 together. When the pressing force reaches the set value, the upper support 21 stops moving downward. That is, the reinforcing sheet pressing block 22 and the substrate support 12 maintain pressure on the reinforcing sheet 400 and the substrate 200. After the pressure is maintained, the upper pressing fixture 2 moves upward to the origin, completing the mounting of the reinforcing sheet 400.
[0033] In some embodiments, the reinforcing sheet block 22 is annular, and a chip block 23 is disposed in the reinforcing sheet 400. The chip block 23 is configured to move vertically relative to the reinforcing sheet block 22 and has a first height and a second height. At the first height, the chip block 23 is housed within the reinforcing sheet block 22. At the second height, the chip block 23 protrudes from the lower surface of the reinforcing sheet block 22 and can apply pressure to the chip 100 when the upper support 21 moves downward. Specifically, when the semi-finished chip does not have any warping, the chip block 23 can be moved to the first height to prevent the chip block 23 from contacting the chip 100 during the downward movement of the upper support 21. When the semi-finished chip has a face-shaped warp, the chip pressing block 23 can be moved to a second height, so that the chip pressing block 23 can gradually flatten the semi-finished chip as the upper support 21 moves downward. This can avoid uneven force on both sides of the semi-finished chip, and make the adhesive coverage on both sides of the substrate 200 consistent. This improves the problem of large differences in adhesive coverage on both sides when the reinforcing sheet 400 is mounted due to the large face-shaped warp of the substrate 200 during the packaging process, and reduces the failure rate of the chip 100.
[0034] In some embodiments, a flexible pad 24 is provided on the bottom surface of the chip clamp 23. Specifically, the flexible pad 24 can be a rubber layer or a silicone layer, etc. This arrangement can protect the chip 100 and prevent physical damage to the chip 100 when the chip clamp 23 applies pressure to it. However, this application embodiment does not impose any limitations on this.
[0035] In some embodiments, a lifting mechanism is connected between the chip clamping block 23 and the upper support base 21. The lifting mechanism is used to control the chip clamping block 23 to move up and down relative to the reinforcing sheet clamping block 22. This configuration enables the chip clamping block 23 to move up and down relative to the reinforcing sheet clamping block 22. However, this application embodiment does not limit this in any way. In other embodiments, the chip clamping block 23 can also slide with the reinforcing sheet clamping block 22 to achieve height adjustment.
[0036] In some embodiments, the lifting mechanism includes a mounting platform 25 and a telescopic rod 26. The top surface of the mounting platform 25 is connected to the upper support base 21 via the telescopic rod 26, and the bottom surface of the mounting platform 25 is connected to the chip clamping block 23. In a specific configuration, the telescopic rod 26 can be an electrically operated telescopic rod. During use, the mounting platform 25 can rise and fall when the telescopic rod 26 extends and retracts, thereby driving the chip clamping block 23 to move up and down. This configuration enables the lifting mechanism to control the chip clamping block 23 to move up and down relative to the reinforcing plate clamping block 22. However, the embodiments of this application do not impose any limitations on this.
[0037] In some embodiments, the upper support 21 may be provided with a guide hole. The mounting platform 25 is located in the guide hole, and the mounting platform 25 moves up and down in the guide hole when the telescopic rod 26 extends and retracts. Specifically, when the lifting mechanism controls the chip pressing block 23 to move up and down, the guide hole can guide the mounting platform 25, which can ensure the stability and reliability of the mounting platform 25 when moving up and down, and prevent the mounting platform 25 from tilting under force, thus affecting the flattening effect of the chip pressing block 23. However, the embodiments of this application do not limit this in any way.
[0038] In some embodiments, an elastic element 27 is connected between the chip pressing block 23 and the lifting mechanism. The elastic element 27 is used to contract when the chip pressing block 23 applies pressure to the chip 100. In a specific configuration, the elastic element 27 can be a spring, which is arranged along the height direction. The lower end of the spring is connected to the top surface of the chip pressing block 23, and the upper end of the spring is connected to the bottom surface of the mounting stage 25. During the process of applying pressure to the chip 100, the spring can contract under force. On the one hand, it can adjust the pressure applied by the chip pressing block 23 to the chip 100, preventing excessive pressure from damaging the chip 100. On the other hand, it can provide an elastic gap between the chip pressing block 23 and the mounting stage 25 to compensate for errors, such as chip 100 thickness error, substrate 200 thickness error, and bottom filler 300 height error.
[0039] In some embodiments, the lower pressing fixture 1 further includes a detection device 13, which is disposed on the lower support 11. The detection device 13 is used to detect the fit between the substrate 200 and the substrate support 12, so that the lifting mechanism can control the chip pressing block 23 to move up and down relative to the reinforcing sheet pressing block 22 when the fit exceeds the limit. Specifically, the detection device 13 is communicatively connected to the controller of the lifting mechanism (telescopic rod 26). Before each mounting of the reinforcing sheet 400, the detection device 13 can detect the fit between the substrate 200 and the substrate support 12 and send the detection result to the controller. When the fit does not exceed the limit (the semi-finished chip does not have a warped appearance), the controller can control the lifting mechanism to move the chip pressing block 23 to a first position. When the fit exceeds the limit (the semi-finished chip has a warped appearance), the controller can control the lifting mechanism to move the chip pressing block 23 to a second position. This configuration facilitates the automated control of the lifting mechanism.
[0040] In some embodiments, the detection device 13 is specifically used to detect the distance between the substrate 200 and the substrate support 12, and to determine the degree of adhesion between the substrate 200 and the substrate support 12 based on the distance. In a specific configuration, the detection device 13 can be a laser scanner, which can scan the distance between the substrate 200 and the substrate support 12 from the side. It should be noted that when the semi-finished chip is placed on the substrate support 12 with the chip facing upwards, the substrate 200 and the substrate support 12 are actually in contact. If the semi-finished chip has warping, the surface of the substrate 200 will inevitably be uneven, and the distance between the lower surface of the substrate 200 and the upper surface of the substrate support 12 will vary. Therefore, by detecting the distance between the substrate 200 and the substrate support 12, the degree of adhesion between the substrate 200 and the substrate support 12 can be determined.
[0041] In some embodiments, the number of detection devices 13 is multiple, and the multiple detection devices 13 are located around the substrate support 12. For example, the detection devices 13 include four laser scanners, which are mounted on the lower support 11 via mounting bases 14 and located around the substrate support 12. It should be understood that, in a specific configuration, the height of the laser scanners is determined by being able to detect the warpage height of the substrate 200.
[0042] The method of using the reinforcement sheet 400 mounting tool of this application embodiment includes:
[0043] refer to Figure 4When mounting the reinforcing sheet 400, if the laser scanner detects that the distance between the lower surface of the substrate 200 and the upper surface of the substrate support 12 exceeds the limit, the telescopic rod 26 of the upper pressing fixture 2 extends, and the chip pressing block 23 moves to the second height. When the upper pressing fixture 2 presses down, the flexible pad 24 on the chip pressing block 23 contacts the surface of the chip 100 first. At this time, the chip pressing block 23 begins to apply pressure to the chip 100 to gradually flatten it. At the same time, the spring between the chip pressing block 23 and the mounting stage 25 is gradually stretched and contracted. The upper pressing fixture 2 continues to press down, and the reinforcing sheet pressing block 22 contacts the reinforcing sheet 400. At this time, the reinforcing sheet pressing block 22 begins to apply pressure to the reinforcing sheet 400 until the pressure reaches the program set value. Then, the upper pressing fixture 2 stops pressing down and begins to hold the reinforcing sheet 400 under pressure. After the holding time ends, the upper pressing fixture 2 moves upward to the origin, completing the mounting of the reinforcing sheet 400.
[0044] refer to Figure 5 When mounting the reinforcing sheet 400, if the laser scanner identifies that the distance between the lower surface of the substrate 200 and the upper surface of the substrate support 12 does not exceed the limit, the length of the telescopic rod 26 of the upper pressing fixture 2 remains unchanged, that is, the chip pressing block 23 is located at the first height. When the upper pressing fixture 2 presses down, the reinforcing sheet pressing block 22 contacts the reinforcing sheet 400 first. At this time, the reinforcing sheet pressing block 22 begins to apply pressure to the reinforcing sheet 400 until the pressure reaches the program set value. Then, the upper pressing fixture 2 stops pressing down and starts to hold the reinforcing sheet 400 under pressure. After the holding time is over, the upper pressing fixture 2 moves upward to the origin, completing the mounting of the reinforcing sheet 400.
[0045] In this embodiment of the reinforcement chip 400 mounting tool, when the semi-finished chip does not have a facet warp, the chip pressing block 23 can be moved to a first height to prevent the chip pressing block 23 from contacting the chip 100 during the downward movement of the upper support 21. When the semi-finished chip has a facet warp, the chip pressing block 23 can be moved to a second height so that the chip pressing block 23 can gradually flatten the semi-finished chip during the downward movement of the upper support 21. This avoids uneven force on both sides of the semi-finished chip, ensuring consistent adhesive coverage on both sides of the substrate. This improves the problem of large differences in adhesive coverage on both sides during reinforcement chip 400 mounting due to significant facet warping of the substrate 200, thereby reducing the failure rate of the chip 100.
[0046] One or more embodiments in this specification are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of one or more embodiments in this specification should be included within the protection scope of this application.
[0047] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. A reinforcement chip mounting tool for mounting reinforcement chips onto a semi-finished chip, the semi-finished chip comprising interconnected chips and a substrate, and an underfill adhesive filling the space between the chips and the substrate, characterized in that, The tools include: a lower pressing jig and an upper pressing jig; The pressing fixture includes a lower support base and a substrate support base; the lower support base is fixedly installed; the substrate support base is disposed on the top surface of the lower support base, and the substrate support base is used to support the semi-finished chip with the chip facing upward. The upper pressing fixture includes an upper support base, a reinforcing sheet pressing block, and a chip pressing block. The upper support base is disposed above the lower pressing fixture and is configured to move vertically relative to the lower pressing fixture. The reinforcing sheet pressing block is annular and disposed on the bottom surface of the upper support base. The reinforcing sheet pressing block is used to press the reinforcing sheet onto the substrate when the upper support base moves downward. The chip pressing block is disposed in the reinforcing sheet pressing block and is configured to move vertically relative to the reinforcing sheet pressing block. It has a first height and a second height. At the first height, the chip pressing block is housed within the reinforcing sheet pressing block. At the second height, the chip pressing block protrudes from the lower surface of the reinforcing sheet pressing block and can apply pressure to the chip when the upper support base moves downward.
2. The reinforcing sheet mounting tool according to claim 1, characterized in that, A flexible pad is provided on the bottom surface of the chip pressing block.
3. The reinforcing sheet mounting tool according to claim 2, characterized in that, The flexible padding layer is one of the following structural layers: a rubber layer and a silicone layer.
4. The reinforcing sheet mounting tool according to claim 1, characterized in that, A lifting mechanism is connected between the chip pressing block and the upper support base. The lifting mechanism is used to control the chip pressing block to move up and down relative to the reinforcing sheet pressing block.
5. The reinforcing sheet mounting tool according to claim 4, characterized in that, The lifting mechanism includes a mounting platform and a telescopic rod. The top surface of the mounting platform is connected to the upper support base through the telescopic rod, and the bottom surface of the mounting platform is connected to the chip pressing block. When the telescopic rod extends or retracts, the mounting platform drives the chip pressing block to move up and down.
6. The reinforcing sheet mounting tool according to claim 5, characterized in that, The upper support is provided with a guide hole, the mounting platform is located in the guide hole, and the mounting platform moves up and down in the guide hole when the telescopic rod extends or retracts.
7. The reinforcing sheet mounting tool according to claim 4, characterized in that, An elastic element is connected between the chip pressing block and the lifting mechanism. The elastic element is used to contract when the chip pressing block flattens the chip.
8. The reinforcing sheet mounting tool according to claim 4, characterized in that, The pressing fixture also includes a detection device disposed on the lower support base. The detection device is used to detect the fit between the substrate and the substrate support base, so that the lifting mechanism can control the chip pressing block to move up and down relative to the reinforcing sheet pressing block when the fit exceeds the limit value.
9. The reinforcing sheet mounting tool according to claim 8, characterized in that, The detection device is specifically used to detect the distance between the substrate and the substrate support, and to determine the degree of fit between the substrate and the substrate support based on the distance.
10. The reinforcing sheet mounting tool according to claim 8, characterized in that, The number of detection devices is multiple, and the multiple detection devices are located around the substrate support.