Calibration device

Abstract

The utility model provides a calibration device, which is used for calibrating a base of laser annealing equipment, and mainly comprises at least three laser range finders, the laser range finders are arranged above the base, the at least three laser range finders are located at the same horizontal height and are not collinear, and the laser range finders are used for measuring the vertical distance between the laser range finders and the base; the plurality of adjusters are arranged on the edge of the base, and the adjusters are used for adjusting the levelness of the base; and the controller is electrically connected with the laser range finders and the plurality of adjusters respectively, and the controller controls the plurality of adjusters to adjust the levelness of the base based on the at least three vertical distances measured by the at least three laser range finders. The levelness of the base can be monitored in real time based on the laser range finder no matter whether the laser annealing equipment is executing the laser annealing process or not, the levelness of the base is adjusted in real time through the adjuster, the adjusting time of the levelness of the base can be shortened, and the adjusting efficiency can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of automatic control, and in particular to a calibration device. BACKGROUND

[0002] In the integrated circuit manufacturing process, a laser annealing process can be used to process the wafer surface, a high-energy laser beam is used to irradiate the wafer quickly, the wafer absorbs the laser energy and converts it into heat energy, causing the wafer to rapidly heat up locally to a high temperature, and in the high temperature state, impurity atoms diffuse and occupy the replacement position in the lattice, and in the rapid cooling state, the atoms in the lattice are rearranged, thereby realizing control of the carrier diffusion, stress release or metal silicide formation on the wafer surface. Since the wafer surface temperature exceeds 1400℃ during the execution of the laser annealing process, the silicon wafer is extremely sensitive to temperature, and uneven heating will break the surface stress balance, resulting in the generation of fragments.

[0003] When performing the laser annealing process, the position of the laser light path is unchanged, and the base carries the wafer to move horizontally to change the position of the wafer irradiated by the laser beam. During the horizontal movement of the base, if the levelness of the base is not enough, the distance from the laser to the wafer surface changes, thereby affecting the focusing of the laser and causing the size of the laser spot to change. Therefore, how to quickly adjust the levelness of the base and monitor the change in the levelness of the base in a timely manner during the process or between processes is the key to improving the annealing uniformity and reducing the laser annealing process fragment rate.

[0004] In the related art, as shown in FIG. 1, an annealing laser 15 irradiates annealing laser onto a wafer carried by a wafer carrier 12 through a reflecting prism 16, so as to perform a laser annealing process on the wafer. The wafer carrier 12 is arranged on a base 11, and a laser range finder 13 is arranged directly above the wafer carrier. During the movement of the base 11, the laser range finder 13 measures the distance between the laser range finder 13 and multiple height adjustment points on the base 11, and draws a distance distribution graph. An operator manually adjusts 3 height adjustment screws 14 according to the distance distribution graph to drive the levelness of the base 11, thereby ensuring that the distance between the base 11 and the annealing laser 15 remains unchanged. However, during the manual adjustment of the height adjustment screws 14, the change in the levelness of the base cannot be measured and monitored in real time, and multiple distance measurements and manual adjustments are required, which wastes manpower and time. Figure 1 Practical new type content

[0005] ​The technical problem solved by the present application is the low efficiency of adjusting the level of the base. To solve the above technical problem, the present application provides a calibration device for calibrating a base of a laser annealing device, comprising: at least three laser range finders arranged above the base, the at least three laser range finders being at the same height and not collinear, the laser range finders being used to measure the vertical distance between the laser range finders and the base; a plurality of adjusters arranged at the edges of the base, the adjusters being used to adjust the level of the base; and a controller electrically connected with the laser range finders and the plurality of adjusters, the controller controlling the plurality of adjusters to adjust the level of the base based on the at least three vertical distances measured by the at least three laser range finders.

[0006] In some embodiments of the present application, the adjuster comprises: a lead screw, one end of the lead screw being arranged at the edge of the base through a connecting point; a servo motor, a control end of the servo motor being electrically connected with the controller, an output shaft of the servo motor being connected with the other end of the lead screw, the servo motor being used to adjust the level of the base through the lead screw based on the controller.

[0007] In some embodiments of the present application, a first surface of the base is used to arrange the lead screw and the servo motor, and a second surface of the base is used to arrange a wafer carrier.

[0008] In some embodiments of the present application, the plurality of connecting points corresponding to the plurality of adjusters comprises a first connecting point and at least two second connecting points, the at least two second connecting points being located on a straight line, and the first connecting point being located on the perpendicular line of the straight line.

[0009] In some embodiments of the present application, the number of the adjusters is three.

[0010] In some embodiments of the present application, the three connecting points corresponding to the three adjusters are uniformly distributed in the circumferential direction of the base.

[0011] In some embodiments of the present application, the calibration device further comprises: a bracket fixedly arranged at the top or the side of the laser annealing device, the bracket being used to fix the laser range finders, so that the laser emitted by at least one of the laser range finders can irradiate on the base during the movement of the base driven by a movement platform, and the vertical distance between the laser range finders and the base is measured; wherein the movement platform is fixedly arranged below the base.

[0012] In some embodiments of the present application, the bracket comprises at least three fixing positions for placing the laser range finders, and the number of the fixing positions is the same as that of the laser range finders.

[0013] In some embodiments of the present application, the support further comprises at least three leveling screws disposed on the side of the fixing position, the leveling screws being used to adjust the horizontal height of the fixing position, and the leveling screws corresponding to the fixing positions one by one.

[0014] In some embodiments of the present application, the calibration device further comprises a display connected to the controller, the display being used to display the real-time posture of the base based on the at least three vertical distances.

[0015] Compared with the prior art, the present application provides a calibration device, the controller controls the plurality of adjusters to adjust the levelness of the base based on the at least three vertical distances measured by the at least three laser range finders. In this way, whether the laser annealing equipment is performing the laser annealing process or not, the levelness of the base can be monitored in real time based on the laser range finder, and the levelness of the base can be adjusted in real time by the adjuster, which can reduce the adjustment time of the levelness of the base and improve the adjustment efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0016] The following drawings describe the exemplary embodiments disclosed in the present application in detail. The same reference signs in the several views of the drawings represent similar structures. A person of ordinary skill in the art will understand that these embodiments are non-limiting, exemplary embodiments, the drawings are only for the purpose of illustration and description, and are not intended to limit the scope of the present application, and other ways of embodiments can also achieve the same intention of the invention in the present application. It should be understood that the drawings are not drawn to scale.

[0017] Figure 1 is a structural schematic diagram of an existing calibration device and part of a laser annealing device according to some embodiments of the present application;

[0018] Figure 2 is a structural schematic diagram of a calibration device according to some embodiments of the present application;

[0019] Figure 3 is a distribution schematic diagram of a connection point according to some embodiments of the present application;

[0020] Figure 4 is a schematic diagram of a hardware control logic according to some embodiments of the present application;

[0021] BRIEF DESCRIPTION OF DRAWINGS: 11- base, 12- wafer carrier, 13- laser range finder, 14- height adjustment screw, 15- annealing laser, 16- reflecting prism, 21- adjuster, 211- screw rod, 212- connecting point, 213- servo motor, 22- controller, 23- support, 231- fixed position, 232- leveling screw. DETAILED DESCRIPTION

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some examples or embodiments of the present application, and for those skilled in the art, the present application can also be applied to other similar scenarios without creative labor. Unless it is obvious from the language environment or otherwise stated, the same reference numbers in the drawings represent the same structure or operation. It should be clearly understood that the drawings are for the purpose of illustration and description, and are not intended to limit the scope of the disclosure.

[0023] It should be understood that the "module", "circuit" used herein is a method for distinguishing different components, elements, parts, portions or assemblies at different levels. However, if other words can achieve the same purpose, the words can be replaced by other expressions.

[0024] The terms used in the present application are only for the purpose of describing specific example embodiments, and are not limiting. When used in the present description, the terms "include", "contain" and / or "have" mean that the associated integers, steps, operations, elements and / or components exist, but do not exclude the presence of one or more other features, integers, steps, operations, elements, components and / or groups. When different components described in the present description are associated, it can be a direct relationship or an indirect relationship. For example, "A and B are connected" can mean that A and B are directly connected, or A and B are indirectly connected through other components.

[0025] For the base used to perform the laser annealing process, the level of the base may not be sufficient, i.e. the base is not on a standard horizontal plane, when initially assembling or replacing components. During the execution of the laser annealing process, the cumulative error caused by material deformation or motion wear may also cause the level of the base to be insufficient. Therefore, in order to improve the annealing uniformity and reduce the laser annealing process fragment rate, it is necessary to monitor the level change of the base in time during the process or between process pieces, and adjust the level of the base.

[0026] Based on the above analysis, as Figure 2As shown, for calibrating the base 11 of the laser annealing device, the calibration device provided in the embodiment of the present application can include:

[0027] at least three laser range finders 13 arranged above the base 11, the at least three laser range finders 13 being at the same horizontal height and not collinear, and the laser range finders 13 being used for measuring vertical distances between the laser range finders 13 and the base 11;

[0028] a plurality of adjusters 21 arranged at edges of the base 11, the adjusters 21 being used for adjusting the levelness of the base; and

[0029] a controller 22 electrically connected with the laser range finders 13 and the plurality of adjusters 21 respectively, the controller 22 controlling the plurality of adjusters 21 to adjust the levelness of the base based on the at least three vertical distances measured by the at least three laser range finders 13.

[0030] In the embodiment of the present application, the base 11 can be arranged on a moving platform of the laser annealing device, and the moving platform can move along the X axis or the Y axis, so that any position on a wafer processed by the laser annealing device can be directly irradiated by the annealing laser.

[0031] It can be understood that, during movement of the base 11 along with the moving platform, in order to enable the laser emitted by the laser range finder 13 to irradiate the base 11, a linkage assembly can be arranged to enable the laser range finder 13 to be always above the base 11 during movement of the base 11 driven by the moving platform, so as to ensure that the laser range finder 13 can measure the vertical distance between the laser range finder and the base.

[0032] In the embodiment of the present application, the laser range finder 13 is an instrument for measuring the distance of a target by modulating a parameter of laser. The spot of the laser range finder 13 can be directly 200 μm to 500 μm. The at least three laser range finders 13 can measure at least three vertical distances, and since the at least three laser range finders 13 are at the same horizontal height and not collinear, the levelness of the base 11 can be determined based on the at least three vertical distances.

[0033] It should be noted that, based on the principle that three non-collinear points can form a plane, by measuring the distance between the plane where the laser range finder 13 is located and the base 11, whether the plane of the base 11 is horizontal can be determined. The levelness refers to the parallel degree between a certain plane and a horizontal reference plane.

[0034] Specifically, in a case that the distance difference between at least three of the vertical distances is less than the preset distance, the positions of the pedestals are in the same horizontal plane. In a case that the distance difference between at least three of the vertical distances is greater than or equal to the preset distance, the positions of the pedestals are not in the same horizontal plane.

[0035] Thus, the vertical distance between the laser range finder 13 and the pedestal 11 measured by the laser range finder 13 can improve the accuracy of obtaining the levelness of the pedestal 11, and further improve the accuracy of the levelness of the pedestal 11 adjusted by the controller 22 and the plurality of adjusters 21.

[0036] In the embodiments of the present application, the laser range finder 13 can be arranged above the edge of the pedestal 11 other than the wafer carrier 12, and similarly, the adjuster 21 can be arranged on the edge of the pedestal 11 other than the wafer carrier 12.

[0037] Thus, during the laser annealing process, the laser beam can be prevented from irradiating the laser range finder 13 and the adjuster 21, and the service life of the laser range finder 13 and the adjuster 21 can be prolonged.

[0038] It can be understood that there is a certain gap between different laser range finders 13 and between different adjusters 21. The size of the gap can meet the space required for installation deviation, use looseness, and rotation of the adjuster 21 (for adjusting the levelness of the pedestal).

[0039] In some embodiments of the present application, as shown in Figure 2 The calibration device provided in the embodiments of the present application further includes a support 23 fixedly arranged on the top or side of the standard laser annealing equipment. The support 23 is used to fix the laser range finder 13, so that the laser emitted by at least one laser range finder 13 can irradiate the pedestal 11 during movement of the pedestal 11 driven by the movement platform, and the vertical distance between the laser range finder 13 and the pedestal 11 is measured. The movement platform is fixedly arranged below the pedestal 11.

[0040] In the embodiments of the present application, the laser range finder 13 is fixedly arranged on the support 23. The specific arrangement mode can be fixed connection, adhesive connection, or detachable connection through a fixing member. Exemplarily, the fixing member can be a buckle or a bolt.

[0041] In the embodiments of the present application, the support 23 can be Y-shaped, triangular, rectangular, or the like. In the embodiments of the present application, the support 23 can be fixedly arranged on the pedestal 11.

[0042] It can be understood that during the installation of the bracket 23, the levelness of the bracket 23 can be detected to ensure that the at least three laser range finders 13 are at the same level.

[0043] In some embodiments of the present application, as shown in Figure 2 The bracket 23 includes at least three fixing positions 231 for placing the laser range finders 13, and the number of the fixing positions 231 is the same as that of the laser range finders 13.

[0044] In embodiments of the present application, the at least three fixing positions 231 are not collinear.

[0045] In embodiments of the present application, the fixing positions 231 do not affect the emission and reception of light by the laser range finders 13 after the laser range finders 13 are placed.

[0046] In embodiments of the present application, the fixing positions 231 can be clamping grooves arranged at the bottom of the bracket 23, and the clamping grooves are adapted to the laser range finders 13.

[0047] In some embodiments of the present application, as shown in Figure 2 The bracket 23 further includes at least three leveling screws 232 arranged at the side of the fixing positions 231, the leveling screws 232 are used to adjust the level of the fixing positions 231, and the number of the leveling screws 232 is the same as that of the fixing positions 231.

[0048] In embodiments of the present application, during the installation of the bracket 23 and the placement of the laser range finders 13, it is difficult to ensure that the at least three laser range finders 13 are at the same level, therefore, the corresponding leveling screw 232 is arranged for each fixing position 231 to facilitate the instant adjustment of the level of the at least three laser range finders 13.

[0049] It can be understood that in response to the manual operation of rotating one end of the leveling screw 232 by the user, the acting force of the other end of the leveling screw 232 relative to the fixing position 231 is adjusted, the deformation degree of the fixing position 231 is increased or decreased, and the level of the at least three laser range finders 13 is adjusted.

[0050] In this way, the bracket is arranged to facilitate the placement of the laser range finders 13, and to ensure that the at least three laser range finders 13 are at the same level.

[0051] In the embodiment of the present application, the controller 22 is electrically connected with the laser range finder 13 and the plurality of adjusters 21 respectively, so that the laser range finder 13 can transmit the obtained vertical distance to the controller 22, the controller 22 can generate a control signal according to the vertical distance, and the controller 22 can transmit the control signal to the plurality of adjusters 21. The control signal is used to control the plurality of adjusters 21 to adjust the levelness of the base 11.

[0052] It should be noted that the electrical connection mode can be wired connection or wireless connection, which is not limited in the embodiment of the present application. The control signal can be one signal or a group of signals, and the number of signals in the control signal is not limited in the embodiment of the present application.

[0053] In some embodiments of the present application, as shown in Figure 2 The adjuster 21 comprises:

[0054] A lead screw 211, one end of the lead screw 211 is arranged at the edge of the base 11 through a connecting point 212;

[0055] A servo motor 212, a control end of the servo motor 212 is electrically connected with the controller 22, an output shaft of the servo motor 212 is connected with the other end of the lead screw 211, and the servo motor 212 is used to adjust the levelness of the base 11 through the lead screw 211 based on the controller 22.

[0056] In the embodiment of the present application, the servo motor 212 receives the control instruction sent by the controller 22, and rotates according to the control instruction, and then drives the base 11 to adjust the levelness through the lead screw 211.

[0057] In some embodiments of the present application, the first surface of the base 11 is used to arrange the lead screw 211 and the servo motor 212, and the second surface of the base 11 is used to arrange the wafer carrier 12.

[0058] In this way, during the laser annealing process, the laser beam can be prevented from irradiating the servo motor 212, and the service life of the servo motor 212 can be prolonged.

[0059] In the embodiment of the present application, the servo motor 212 rotates according to the control instruction, can drive the lead screw 211 to rotate, and then drives the base 11 to rise or fall.

[0060] In some embodiments of the present application, the plurality of connecting points corresponding to the plurality of adjusters 21 comprise a first connecting point and at least two connecting points, the at least two second connecting points are located on a straight line, and the first connecting point is located on the perpendicular line of the straight line.

[0061] In the embodiments of the present application, since three scattered points can determine a plane, the number of the adjusters 12 can be three to adjust the levelness of the base 11. If the number of the plurality of adjusters 21 is greater than three, three of the adjusters 21 are used to adjust the levelness of the base 11, and the other adjusters 21 are used to lock the base 11.

[0062] In the embodiments of the present application, as shown in Figure 3 If the number of the adjusters 21 is three, the three connection points 212 corresponding to the three adjusters 21 are uniformly distributed in the circumference of the base 11, that is, the three connection points 212 as virtual points are directly connected to form an equilateral triangle.

[0063] In the embodiments of the present application, the same straight line where the at least two second connection points are located can be determined as the X axis, and the perpendicular of the straight line where the first connection point is located can be determined as the Y axis. By adjusting the height of the lead screw 211 connected by the connection points, the inclination of the X axis or the Y axis can be adjusted, that is, the levelness of the base 11 can be adjusted.

[0064] In this way, the process of obtaining the control signal is simplified, the efficiency of generating the control signal is improved, and the adjustment time of the base 11 is reduced.

[0065] In some embodiments of the present application, the controller 22 is an industrial computer or a programmable logic controller (PLC).

[0066] In some embodiments of the present application, the calibration process of the calibration device for calibrating the levelness of the base 11 is as shown in Figure 4 First, at least three laser range finders 13 measure at least three vertical distances between the laser range finders 13 and the base 11 (if the vertical distance exceeds the preset distance, it means that the laser emitted by the laser range finder 13 does not irradiate to the base 11, and this vertical distance is invalid and cannot be used to adjust the levelness of the base 11), and then the controller 22 receives at least three vertical distances and controls the servo motor 212 in the plurality of adjusters 21 to adjust the levelness of the base 11 according to the at least three vertical distances. At the same time, in the cyclic calibration process, at least three vertical distances obtained each time are also needed to be counted, and the plane scanning result of the base 11 is determined according to the movement law of the base 11, and whether the base 11 is horizontal is determined according to the plane scanning result. In this way, the control process of the base 11 is a closed-loop control process, and finally the base 11 can be adjusted to a standard horizontal plane.

[0067] It can be understood that the planar scanning result can be a data table, a three-dimensional surface topography, or a real-time attitude diagram.

[0068] It can also be understood that during the calibration process, the base 11 is in a moving state, and the vertical distance obtained each time can be the same or different for the position of the laser emitted by the laser range finder 13 on the base 11.

[0069] For example, the calibration device includes three laser range finders 13, which measure three vertical distances (L1, L2, and L3) between the laser range finder 13 and the connecting point 212. The servo motor 212 in the plurality of adjusters 21 is controlled according to L1, L2, and L3 to adjust the levelness of the base 11, specifically including: obtaining three distance differences (L12, L13, and L23) between L1, L2, and L3, comparing the three distance differences with a preset distance, if L12, L13, and L23 are all less than the preset distance, it can be confirmed that the base 11 is horizontal, and the levelness of the base does not need to be adjusted; if L12 is less than the preset distance, the servo motor 213 corresponding to the laser range finder 13 for obtaining L3 is adjusted until L12, L13, and L23 are all less than the preset distance; if L1>L2>L3, the servo motor 213 corresponding to the laser range finder 13 for obtaining L1 and L3 is repeatedly adjusted until L12, L13, and L23 are all less than the preset distance; if |L12|>|L23|, the servo motor 213 corresponding to the laser range finder 13 for obtaining L1 is repeatedly adjusted until L12, L13, and L23 are all less than the preset distance.

[0070] For example, the preset distance can be any value in 10 μm to 60 μm, such as 20 μm, 30 μm, 50 μm, and the like.

[0071] In some embodiments of the present application, before each wafer is annealed by a laser annealing device, the controller 22 can repeatedly adjust the above-mentioned adjustment process to calibrate the levelness of the base 11.

[0072] In some embodiments of the present application, the calibration device further includes a display, the display 23 is connected with the controller 22, and the display is used to display the real-time attitude of the base 11 based on at least three vertical distances.

[0073] In embodiments of the present application, the display can be arranged outside the laser annealing device, so as to facilitate real-time monitoring of the real-time attitude of the base 11.

[0074] The embodiment of the present application provides a calibration device, the controller 22 controls the plurality of adjusters 21 to adjust the levelness of the base 11 based on at least three vertical distances measured by the at least three laser range finders 13. In this way, whether the laser annealing equipment is performing a laser annealing process or not, the levelness of the base 11 can be monitored in real time based on the laser range finder 13, and the levelness of the base 11 can be adjusted in real time by the adjuster 21, so that the adjustment time of the levelness of the base 11 can be reduced, and the adjustment efficiency can be improved.

[0075] It should be noted that different embodiments can have different beneficial effects, and in different embodiments, the beneficial effects that can be produced can be any one or a combination of the above, or any other beneficial effects that can be obtained.

[0076] In summary, after reading the content of the present application, those skilled in the art can understand that the foregoing content of the application can be presented only in an exemplary manner and can not be limiting. Although it is not explicitly stated here, those skilled in the art can understand that the present application is intended to encompass various reasonable changes, improvements and modifications to the embodiments. These changes, improvements and modifications are within the spirit and scope of the exemplary embodiments of the present application.

[0077] It should also be understood that although the terms first, second, third, etc. can be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. Therefore, the first element in some embodiments can be referred to as the second element in other embodiments without departing from the teachings of the present application. The same reference numbers or the same reference signs represent the same elements throughout the specification.

Claims

1. A calibration device for calibrating the base of a laser annealing equipment, characterized in that, include: At least three laser rangefinders are provided, which are positioned directly above the base. The three laser rangefinders are at the same horizontal level and are not collinear. The laser rangefinders are used to measure the vertical distance between the laser rangefinder and the base. A plurality of adjusters are disposed at the edge of the base, the adjusters being used to adjust the levelness of the base; as well as A controller is electrically connected to the laser rangefinder and the plurality of adjusters respectively. The controller controls the plurality of adjusters to adjust the levelness of the base based on at least three vertical distances measured by at least three of the laser rangefinders.

2. The calibration device as described in claim 1, characterized in that, The regulator includes: A lead screw, one end of which is disposed at the edge of the base via a connection point; A servo motor, the control end of which is electrically connected to the controller, and the output shaft of which is connected to the other end of the lead screw, are used to adjust the level of the base via the lead screw based on the controller.

3. The calibration device as described in claim 2, characterized in that, The first side of the base is used to mount the lead screw and the servo motor, and the second side of the base is used to mount the wafer carrier disk.

4. The calibration device as described in claim 2, characterized in that, The plurality of connection points corresponding to the plurality of regulators include a first connection point and at least two second connection points, wherein the at least two second connection points are located on the same straight line and the first connection point is located on the perpendicular line of the straight line.

5. The calibration apparatus as described in claim 4, characterized in that, The number of regulators is three.

6. The calibration apparatus as described in claim 5, characterized in that, The three connection points corresponding to the three regulators are evenly distributed in the circumferential direction of the base.

7. The calibration apparatus as described in claim 1, characterized in that, Also includes: A bracket is fixedly installed on the top of the laser annealing equipment. The bracket is used to fix the laser rangefinder so that when the motion platform moves the base, the laser emitted by at least one of the laser rangefinders can irradiate the base to measure the vertical distance between the laser rangefinder and the base. The motion platform is fixedly installed below the base.

8. The calibration apparatus as described in claim 7, characterized in that, The bracket includes at least three fixing positions for placing the laser rangefinder, and the number of fixing positions is the same as the number of laser rangefinders.

9. The calibration apparatus as described in claim 8, characterized in that, The bracket also includes at least three leveling screws, which are disposed on the side of the fixed position. The leveling screws are used to adjust the horizontal height of the fixed position, and each leveling screw corresponds to a fixed position.

10. The calibration apparatus as claimed in claim 1, characterized in that, Also includes: A display, connected to the controller, is used to display the real-time attitude of the base based on at least three vertical distances.

Images