Liquid cooling plate for installing multiple chips
By using partitions and fin structures in the liquid cooling plate to divide the coolant into two streams and increase the contact area, the problem of poor heat dissipation uniformity in multi-chip cooling of the liquid cooling plate is solved, and a more efficient heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202423053323.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-11
- Publication Date
- 2025-12-12
- Estimated Expiration
- 2034-12-11
AI Technical Summary
Existing liquid cooling plates suffer from poor heat dissipation uniformity of the coolant when cooling multiple chips, resulting in ineffective heat dissipation.
A liquid cooling plate for mounting multiple chips was designed. The coolant is divided into two branches by a partition and the heat dissipation uniformity is improved by micro-gap and fin structure, which increases the contact area of the coolant and the heat exchange efficiency.
By using partitions and pin fins, uniform heat dissipation of the coolant to multiple chips is achieved, improving heat dissipation efficiency and uniformity, and enhancing the heat exchange effect between the coolant and the chips.
Smart Images
Figure CN223665447U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the field of radiator, especially a liquid cooling plate for installing multiple chips. BACKGROUND
[0002] The existing liquid cooling plate is sometimes used to separate when cooling multiple chips according to the need, and the cooling liquid is divided.
[0003] The common separation is to use a blocking block connected to both ends of the substrate, so that the cooling liquid on both sides of the blocking block is completely separated, but the uniformity of the cooling liquid heat dissipation is not good. SUMMARY
[0004] In view of the above problems of the prior art, the utility model discloses a liquid cooling plate for installing multiple chips, which can improve the uniformity of heat dissipation.
[0005] In order to solve the above problems, the utility model provides a liquid cooling plate for installing multiple chips, which comprises:
[0006] The substrate comprises a first surface and a second surface opposite to each other, the first surface is formed with a plurality of mounting areas, the mounting areas are used to connect the chips one by one, and the cooling liquid can flow on the second surface of the substrate;
[0007] At least one separation piece is arranged on the second surface of the substrate and at a position corresponding to the gap between the adjacent mounting areas in the predetermined direction, one separation piece can divide the mounting areas into two groups, the cooling liquid can form two branch flows on both sides perpendicular to the extension direction of the separation piece, the two branch flows can flow along the extension direction of the separation piece, one group of mounting areas corresponds to one branch flow of the cooling liquid, and the separation piece is formed with a plurality of micro gaps with a predetermined length in the extension direction to divide the separation piece into a plurality of columnar micro separation pieces.
[0008] At least two groups of needle fins are arranged on the second surface of the substrate and spaced apart from the separation piece, one group of needle fins corresponds to one group of mounting areas, and the needle fin is formed in a columnar shape.
[0009] Further, the end face of the micro separation piece is formed in a polygonal shape, an elliptical shape or a circular shape, the length of the micro separation piece in the extension direction of the separation piece is greater than the length of the micro gap and greater than the length of the needle fin in the extension direction of the separation piece.
[0010] Further, the side wall of the micro separation piece is formed with a notch, and the notch faces the needle fin.
[0011] Further, the end surface of the micro partition piece is triangular, and the notch is formed on one side of the triangle facing the adjacent needle fin.
[0012] Further, the micro partition piece is parallelogram-shaped, and the notch is formed on two opposite sides of the parallelogram facing the needle fin.
[0013] Further, the end surface of the micro partition piece is elliptical, and the micro partition piece is inclined toward the extension direction of the partition piece.
[0014] Further, the top end of the micro partition piece is flush with the top end of the needle fin.
[0015] Further, the needle fin and the partition piece are formed by cold forging.
[0016] Further, the end surface of the needle fin is polygonal, elliptical or circular.
[0017] Further, the substrate comprises:
[0018] a base body;
[0019] a pad protruding from the base body, and an upper surface of the pad being formed as the mounting area.
[0020] Thanks to the above technical scheme, the present application has the following advantages:
[0021] According to the liquid cooling plate for mounting multiple chips, the first surface of the substrate is formed with multiple mounting areas, the multiple mounting areas can correspondingly mount multiple chips, and the multiple chips are cooled synchronously. At least one partition piece is arranged on the second surface of the substrate, and the partition piece is arranged at a position corresponding to a gap between adjacent mounting areas in a predetermined direction. The cooling liquid can be divided into two branches by the partition piece, the two branches correspond to two groups of mounting areas one by one, and the two branches can also exchange heat through the micro gap of the partition piece. That is, the two branches can independently cool the two groups of mounting areas, and also have certain heat exchange, thereby improving the uniformity of the heat dissipation of the cooling liquid. Moreover, the partition piece has multiple micro partition pieces instead of a continuous partition, which can increase the contact area with the cooling liquid and improve the heat dissipation efficiency. One group of needle fins corresponds to one group of mounting areas one by one, and the needle fins can increase the contact area with the cooling liquid and improve the heat dissipation efficiency. BRIEF DESCRIPTION OF DRAWINGS
[0022] In order to make the technical scheme of the present application clearer, the following will briefly introduce the drawings needed in the embodiment or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained without creative labor on the basis of these drawings.
[0023] Figure 1 is a structural diagram of a liquid cooling plate according to the first embodiment of the present application;
[0024] Figure 2 is Figure 1 is a back view of the liquid cooling plate of the embodiment;
[0025] Figure 3 is a structural diagram of a liquid cooling plate according to the second embodiment of the present application;
[0026] Figure 4 is a structural diagram of a liquid cooling plate according to the third embodiment of the present application.
[0027] Reference signs:
[0028] 100, substrate; 110, base; 120, solder pad; 200, needle fin; 300, partition; 310, micro partition. DETAILED DESCRIPTION
[0029] In order to make the technical scheme of the present application clearer, the following will briefly introduce the drawings needed in the embodiment or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained without creative labor on the basis of these drawings.
[0030] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above drawings are used to distinguish similar objects, and do not necessarily describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion.
[0031] Next, the liquid cooling plate for mounting multiple chips according to the embodiment of the present application is described.
[0032] As Figures 1 to 4As shown, the liquid cooling plate for mounting multiple chips includes a substrate 100, at least one partition member 300, and at least two groups of needle fins 200.
[0033] First, the substrate 100 is described. The substrate 100 includes opposite first and second surfaces, the first surface is formed with a plurality of mounting areas for one-to-one corresponding connection of chips, and the cooling liquid can flow on the second surface of the substrate 100.
[0034] As shown, Figure 1 The first surface of the substrate 100 has 34 mounting areas, so that 34 chips can be mounted and cooled simultaneously. It should be noted that the number of mounting areas is not limited here.
[0035] Next, at least one partition member 300 is described. The partition member 300 is arranged on the second surface of the substrate 100 and at a position corresponding to a gap between adjacent mounting areas in a predetermined direction. One partition member 300 can divide the mounting areas into two groups, the cooling liquid can form two branches on both sides perpendicular to the extension direction of the partition member 300, the two branches can flow along the extension direction of the partition member 300, and one group of mounting areas corresponds to one branch of the cooling liquid. The partition member 300 has a plurality of micro-gaps with a predetermined length in the extension direction to divide the partition member 300 into a plurality of columnar micro-partition members 310.
[0036] As shown, Figures 2 to 4 The second surface of the substrate 100 is provided with one partition member 300, and the partition member 300 extends along the length direction of the substrate 100. It should be noted that the above is only an optional example, and the partition member 300 can also be two, three, etc., according to the number and distribution of chips.
[0037] As shown, Figure 1 And Figure 2 The gap between the two adjacent mounting areas in the width direction (predetermined direction) of the substrate 100 corresponds to the area where the partition member 300 is arranged.
[0038] Figure 2 As shown, the partition member 300 has 31 micro-partition members 310 in the extension direction (length direction of the substrate 100), and adjacent micro-partition members 310 have a micro-gap with a predetermined length. The cooling liquid can form two branches on both sides of the width direction of the partition member 300 to flow, and the two branches can also convect heat through the micro-gaps. That is, the two groups of mounting areas are relatively independent of heat dissipation through the two branches, and also have certain heat exchange, improving the uniformity of the cooling liquid heat dissipation. Moreover, the partition member 300 has a plurality of micro-partition members 310, rather than a continuous partition (easily accumulated heat and no heat exchange of the branch), which can increase the contact area with the cooling liquid and improve the heat dissipation efficiency.
[0039] Then, at least two groups of needle fins 200 are described. The needle fins 200 are arranged on the second surface of the substrate 100 and spaced apart from the partition member 300, and one group of needle fins 200 corresponds to one group of mounting areas, and the needle fins 200 are formed in a columnar shape.
[0040] As shown in Figures 2 to 4 The mounting areas are formed in two groups spaced apart along the width direction of the substrate 100, and correspondingly, the two groups of needle fins 200 correspond to the two groups of mounting areas one by one. The contact area with the cooling liquid can be increased by the needle fins 200, the heat dissipation area is increased, and the heat dissipation efficiency is improved.
[0041] The above liquid cooling plate for mounting multiple chips, the first surface of the substrate 100 is formed with a plurality of mounting areas, and the plurality of mounting areas can correspondingly mount a plurality of chips and cool the plurality of chips synchronously. At least one partition member 300 is arranged on the second surface of the substrate 100, and the partition member 300 is arranged at a position corresponding to a gap between mounting areas adjacent to a predetermined direction. The cooling liquid can be divided into two branches by the partition member 300, and the two branches correspond to the two groups of mounting areas one by one, and the two branches can also exchange heat through the micro gap of the partition member 300. That is, the two groups of mounting areas are independently cooled by the two branches respectively, and a certain heat exchange is also achieved, which improves the uniformity of the heat dissipation of the cooling liquid. Moreover, the partition member 300 has a plurality of micro partitions 310, rather than a continuous partition, which can increase the contact area with the cooling liquid and improve the heat dissipation efficiency. One group of needle fins 200 corresponds to one group of mounting areas, and the contact area with the cooling liquid can be increased by the needle fins 200, and the heat dissipation efficiency is improved.
[0042] In some embodiments of the present application, the end surface of the micro partition 310 is formed in a polygonal shape, an elliptical shape or a circular shape. Among them, the polygonal shape can be a rectangular shape, a square shape, a rhombus shape, a triangle shape, a parallelogram shape, a pentagon shape, a hexagon shape, etc. The length of the micro partition 310 in the extension direction of the partition member 300 is greater than the length of the micro gap, and greater than the length of the needle fin 200 in the extension direction of the partition member 300.
[0043] The micro partition 310 of this end surface can better split the cooling liquid, and the split branch can have a certain heat exchange. The length of the micro partition 310 in the extension direction of the partition member 300 is greater than the length of the micro gap, and greater than the length of the needle fin 200 in the extension direction of the partition member 300, which can make the cooling liquid be mainly split (alleviate the horizontal hydraulic imbalance and thermal imbalance phenomenon), and the heat exchange of the branch is auxiliary (improve the uniformity of the cooling liquid heat dissipation).
[0044] Optionally, the end surface of the micro partition 310 is formed in an elliptical shape, and the micro partition 310 is inclined towards the extension direction of the partition member 300.
[0045] As shown in Figure 4As shown, the micro-fractured parts 310 with elliptical end faces are arranged in sequence at intervals, and the micro-fractured parts 310 are inclined in the extension direction of the partition 300.
[0046] Furthermore, the sidewall of the micro-fractured part 310 is formed with a notch facing the needle fin 200.
[0047] like Figure 2 and Figure 3 As shown, the notch formed on the sidewall of the micro-fracture component 310 allows the micro-fracture component 310 to be closer to the pin fin 200 and avoids interference between the micro-fracture component 310 and the pin fin 200. This allows more pin fins 200 to be disposed on the substrate 100, increasing the heat dissipation area and improving heat dissipation efficiency. Moreover, the notch formed on the sidewall of the micro-fracture component 310 increases the contact area between the micro-fracture component 310 and the coolant, thereby increasing the heat dissipation area and improving heat dissipation efficiency.
[0048] Specifically, the micro-fracture element 310 with the notch can have the following two structures:
[0049] Structure 1: The end face of the micro-fracture element 310 is formed into a triangle. A notch is formed on one side of the adjacent needle wing 200 on the face of the triangle. The adjacent micro-fracture elements 310 are arranged symmetrically along the extension direction of the partition element 300.
[0050] like Figure 2 As shown, a plurality of triangular-faced micro-fractures 310 arranged sequentially form a partition 300, which splits the coolant flow into two branches. Adjacent micro-fractures 310 are arranged axially symmetrically along the extension direction of the partition 300. Compared to adjacent micro-fractures 310 arranged identically, this avoids large gaps on the substrate 100, increases the heat dissipation area, and improves heat dissipation efficiency. Furthermore, increasing the number of micro-fractures 310 and reducing the micro-gap between them achieves the goal of primarily splitting the coolant flow through the partition 300, with heat exchange in the branches serving as a secondary function.
[0051] Structure 2: The micro-fractured part 310 is formed as a parallelogram, with notches formed on both the orientation of the parallelogram and the two opposite sides of the needle wing 200.
[0052] like Figure 3 As shown, multiple micro-fractures 310 with parallelogram-shaped end faces arranged in sequence form a partition 300, which splits the coolant into two branches. Compared to the micro-fractures 310 in structure one, this reduces the number of micro-gap elements, thus increasing the splitting and reducing heat exchange between the branches. This can be selected according to the actual chip requirements.
[0053] In some embodiments of this utility model, the top end of the micro-fractured part 310 is flush with the top end of the needle wing 200.
[0054] likeFigures 2 to 4 As shown, the top end of the micro-break member 310 is flush with the top end of the needle fin 200, so as to facilitate connection with other cooling plates, so that the needle fin 200 and the micro-break member 310 are both in the chamber.
[0055] Further, the needle fin 200 and the partition member 300 are both formed by cold forging.
[0056] The needle fin 200 and the partition member 300 are formed by cold forging, which is relatively efficient. Moreover, using the partition member 300 with micro gaps can reduce the cost of the cold forging die. The base material can flow through the gap between the needle fins 200 and the micro gap of the micro-break member 310, and there is no complete partition, so the cold forging die structure is relatively simple.
[0057] Further, the end face of the needle fin 200 is formed in a polygonal shape, an elliptical shape or a circular shape. Among them, the polygonal shape can be a rectangular shape, a square shape, a diamond shape, a triangular shape, a parallelogram shape, a pentagonal shape, a hexagonal shape, etc.
[0058] In some embodiments of the present application, the substrate 100 includes a base body 110 and a solder pad 120. The solder pad 120 protrudes from the base body 110, and the upper surface of the solder pad 120 is formed as a mounting area.
[0059] As shown, the solder pad 120 can facilitate soldering connection with the chip. Figure 1
[0060] The above is only a preferred embodiment of the present application, and is not intended to limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.
Claims
1. A liquid cooling plate for mounting a multi-chip, characterized by, The liquid cooling plate comprises: a substrate comprising a first surface and a second surface opposite to each other, the first surface being formed with a plurality of mounting areas for one-to-one connecting chips, and cooling liquid being capable of flowing on the second surface of the substrate; at least one partition member arranged on the second surface of the substrate and at a position corresponding to a gap between the mounting areas in a predetermined direction, one partition member being capable of dividing the mounting areas into two groups, cooling liquid being capable of forming two substreams on both sides perpendicular to the extension direction of the partition member, the two substreams being capable of flowing along the extension direction of the partition member, one group of mounting areas corresponding to one substream of cooling liquid, the partition member being formed with a plurality of micro-gaps with a predetermined length in the extension direction thereof to divide the partition member into a plurality of columnar micro-partition members; at least two groups of needle fins arranged on the second surface of the substrate and spaced apart from the partition member, one group of needle fins corresponding to one group of mounting areas, the needle fins being formed in a columnar shape.
2. The liquid cold plate for mounting a multi-chip of claim 1, wherein, An end surface of the micro-partition member is formed in a polygonal shape, an elliptical shape or a circular shape, the length of the micro-partition member in the extension direction of the partition member is greater than the length of the micro-gaps and greater than the length of the needle fins in the extension direction of the partition member.
3. The liquid cold plate for mounting a multi-chip of claim 2, wherein, A side wall of the micro-partition member is formed with a notch, the notch being directed towards the needle fins.
4. The liquid cold plate for mounting a multi-chip of claim 3, wherein, An end surface of the micro-partition member is formed in a triangular shape, the notch being formed on one side of the triangular shape facing the adjacent needle fin, and the adjacent micro-partition members are arranged in an axial symmetry along the extension direction of the partition member.
5. The liquid cold plate for mounting a multi-chip of claim 3, wherein, The micro-partition member is formed in a parallelogram shape, the notch being formed on two opposite sides of the parallelogram shape facing the needle fins.
6. The liquid cold plate for mounting a multi-chip of claim 2, wherein, An end surface of the micro-partition member is formed in an elliptical shape, the micro-partition member being inclined towards the extension direction of the partition member.
7. The liquid cold plate for mounting a multi-chip of claim 1, wherein, A top end of the micro-partition member is flush with a top end of the needle fin.
8. The liquid cold plate for mounting a multi-chip of claim 7, wherein, The needle fins and the partition member are formed by cold forging.
9. The liquid cold plate for mounting a multi-chip of claim 8, wherein, An end surface of the needle fin is formed in a polygonal shape, an elliptical shape or a circular shape.
10. The liquid cold plate for mounting multi-chips according to claim 1, characterized by, The liquid cooling plate comprises: a substrate comprising a first surface and a second surface opposite to each other, the first surface being formed with a plurality of mounting areas for one-to-one connecting chips, and cooling liquid being capable of flowing on the second surface of the substrate; at least one partition member arranged on the second surface of the substrate and at a position corresponding to a gap between the mounting areas in a predetermined direction, one partition member being capable of dividing the mounting areas into two groups, cooling liquid being capable of forming two substreams on both sides perpendicular to the extension direction of the partition member, the two substreams being capable of flowing along the extension direction of the partition member, one group of mounting areas corresponding to one substream of cooling liquid, the partition member being formed with a plurality of micro-gaps with a predetermined length in the extension direction thereof to divide the partition member into a plurality of columnar micro-partition members; at least two groups of needle fins arranged on the second surface of the substrate and spaced apart from the partition member, one group of needle fins corresponding to one group of mounting areas, the needle fins being formed in a columnar shape. An end surface of the micro-partition member is formed in a polygonal shape, an elliptical shape or a circular shape, the length of the micro-partition member in the extension direction of the partition member is greater than the length of the micro-gaps and greater than the length of the needle fins in the extension direction of the partition member. A side wall of the micro-partition member is formed with a notch, the notch being directed towards the needle fins. An end surface of the micro-partition member is formed in a triangular shape, the notch being formed on one side of the triangular shape facing the adjacent needle fin, and the adjacent micro-partition members are arranged in an axial symmetry along the extension direction of the partition member. The micro-partition member is formed in a parallelogram shape, the notch being formed on two opposite sides of the parallelogram shape facing the needle fins. An end surface of the micro-partition member is formed in an elliptical shape, the micro-partition member being inclined towards the extension direction of the partition member. A top end of the micro-partition member is flush with a top end of the needle fin. The needle fins and the partition member are formed by cold forging. An end surface of the needle fin is formed in a polygonal shape, an elliptical shape or a circular shape. The liquid cooling plate comprises: a substrate comprising a first surface and a second surface opposite to each other, the first surface being formed with a plurality of mounting areas for one-to-one connecting chips, and cooling liquid being capable of flowing on the second surface of the substrate; at least one partition member arranged on the second surface of the substrate and at a position corresponding to a gap between the mounting areas in a predetermined direction, one partition member being capable of dividing the mounting areas into two groups, cooling liquid being capable of forming two substreams on both sides perpendicular to the extension direction of the partition member, the two substreams being capable of flowing along the extension direction of the partition member, one group of mounting areas corresponding to one substream of cooling liquid, the partition member being formed with a plurality of micro-gaps with a predetermined length in the extension direction thereof to divide the partition member into a plurality of columnar micro-partition members; at least two groups of needle fins arranged on the second surface of the substrate and spaced apart from the partition member, one group of needle fins corresponding to one group of mounting areas, the needle fins being formed in a columnar shape.