Air guide structure of rigid-flex board and rigid-flex board

Abstract

The utility model relates to an air guide structure of a rigid-flex printed circuit board and the rigid-flex printed circuit board. According to the technical scheme, the air guide structure is characterized by comprising two soft boards and pure glue, the soft board, the pure glue and the soft board are sequentially stacked and adhered; m air guide holes are formed in the soft plate; n air guide grooves communicated with the M air guide holes are formed in one side, facing the pure glue, of the soft plate; wherein M is an integer larger than 0, and M is a positive integer smaller than N; the air guide groove comprises two structural strips which are arranged at an interval; according to the invention, gas between the soft board and the pure glue can be discharged during lamination, and cavities and bubbles are prevented from being generated in the bonding area.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of circuit board more specifically, it relates to a rigid flexible combination board's air guide structure and rigid flexible combination board. BACKGROUND

[0002] With the continuous innovation and creation of electronic product design, the adhesive rigid flexible combination board has the advantage of flexible area adhesion, and for small space assembly, the soft board area occupies small space when bending, and after the flexible area is bonded by adhesive material, the blind via design selection of the flexible area can be provided, and more schemes are provided for circuit connection. But the adhesive rigid flexible combination board has many difficulties in production due to its structure, semi-solidified material and special manufacturing process, for example, the curing conditions of pure glue or double-sided coated PI material used for flexible area adhesion are low, and long time high temperature can easily cause material aging, so there are problems such as voids in soft board, poor glue filling and other pressing quality.

[0003] The existing flexible area is usually pressed in the following ways, 1) the soft board and the soft board are pressed by using low flow glue PP semi-solid sheet and pressing transmission machine. 2) the soft board and the soft board are pressed by using double-sided coated PI and pressing transmission machine. 3) the soft board and the soft board are pressed by using pure glue and pressing transmission machine. For technical scheme 1), the bending ability of PP semi-solid sheet is poor, and it is easy to cause poor flow glue, void and blister, and the pressing time is long. For technical scheme 2), double-sided coated PI with better bending ability is used instead of PP semi-solid sheet, although the bending ability is improved, but the air in the board cannot be discharged, which leads to the formation of bubbles and voids. For technical scheme 3), pure glue is used, and multiple pre-pressing is used to avoid the generation of voids and bubbles, but the pre-pressing bubbles cannot be discharged due to the copper block and circuit on the board surface.

[0004] In summary, the existing flexible area has the problems of void and bubble in the adhesive area after pressing, which cannot meet the actual production demand, and there is still room for improvement. Utility model content

[0005] In view of the defects in the prior art, the purpose of the utility model is to provide a rigid flexible combination board air guide structure and rigid flexible combination board to solve the above technical problems.

[0006] The above technical purpose of the utility model is realized by the following technical scheme: a rigid flexible combination board air guide structure, comprising: two soft boards and pure glue; the soft board, pure glue and soft board are stacked and bonded in sequence; M air guide holes are formed in the soft board; N air guide grooves communicating with the M air guide holes are arranged on the side of the soft board facing the pure glue; wherein M is an integer greater than 0, M is a positive integer less than N; the air guide groove comprises two structure strips arranged at intervals.

[0007] Specifically, by opening M air guide holes on the soft plate and connecting the M air guide holes through N air guide grooves, the air between the soft plate and the pure glue can be discharged through the air guide holes during pressing. By connecting the M air guide holes through the N air guide grooves, the air in any air guide hole can be transmitted to other air guide holes through the corresponding air guide groove, ensuring that the air can be discharged during pressing, thereby discharging the air between the soft plate and the pure glue during pressing, avoiding the formation of cavities and bubbles in the bonding area.

[0008] Optionally, the air guide hole is arranged in the forming waste area of the soft plate.

[0009] By arranging a plurality of air guide holes in the forming waste area, the air guide holes can be arranged without affecting the effective pattern area of the soft plate, so as to discharge the air between the two soft plates and the pure glue from the air guide holes to the outside of the plate. Generally, the distance between two air guide holes is set to 50% of the length of the forming waste area, which can ensure the discharge effect of the air without affecting the performance of the soft plate.

[0010] Optionally, the air guide groove extends along the edge of the forming waste area of the soft plate.

[0011] Adapting the shape of the air guide groove to the forming waste area can facilitate the communication of the air guide groove with the air guide hole in the forming waste area.

[0012] Optionally, the structure strip is a copper wire.

[0013] The structure strip is a copper wire, which can be directly formed during the inner layer pattern line process of the soft plate, and the diameter of the copper wire is set so that the air guide groove formed by two copper wires can separate the soft plate and the pure glue during pressing, ensuring that the air can pass through the air guide groove during pressing.

[0014] Optionally, a process edge is arranged on the side of the soft plate facing the pure glue; a plurality of glue flow points are arranged on the process edge at intervals.

[0015] By arranging a process edge on the soft plate and arranging glue flow points on the process edge, the air between the soft plate and the pure glue can be discharged during pressing. The diameter of the glue flow point is set to be not greater than 1 mm, and the gap between the glue flow points is not less than 1 mm, which can quickly discharge the air between the soft plate and the pure glue during pressing while meeting the function of the process edge.

[0016] Optionally, a positioning hole is formed through the soft plate, the pure glue and the edges of the soft plate and the pure glue.

[0017] By forming a positioning hole through the edges of the soft plate and the pure glue, the soft plate and the pure glue are pre-stacked and riveted before being pressed, so as to avoid deviation of the soft plate and the pure glue during pressing.

[0018] This utility model also proposes a rigid-flexible composite plate, comprising: two rigid plates and an air guiding structure as described above; the rigid plates, the air guiding structure and the rigid plates are stacked and bonded together in sequence.

[0019] The air-conducting structure is composed of a flexible plate, pure adhesive, and another flexible plate stacked and bonded together in sequence. Therefore, in the rigid-flex plate, the rigid plate, flexible plate, pure adhesive, another flexible plate, and the rigid plate are stacked and bonded together in sequence. Thus, the rigid-flex plate can be obtained simply by stacking the rigid plate, air-conducting structure, and rigid plate in sequence and then pressing them together. Furthermore, since the gas between the flexible plate and the pure adhesive is expelled during the pressing process, no voids or air bubbles will be generated in the flexible area of ​​this rigid-flex plate.

[0020] Optionally, a prepreg is provided between the rigid plate and the air-conducting structure.

[0021] Specifically, by setting low-flow prepregs at both ends of the rigid plate facing the air-guiding structure, the rigid plate is bonded to the air-guiding structure after pressing, and a flexible bonding zone is formed between the rigid plate and the air-guiding structure.

[0022] Optionally, the rigid plate is a double-sided copper-clad laminate.

[0023] The rigid board with double-sided copper core can have its inner layer circuitry fabricated on the side of the rigid board facing the gas guide structure, and then the rigid board and the gas guide structure can be laminated together to connect the inner layer circuitry of the rigid board with the flexible board; and after lamination, the circuitry can be etched on the outer copper layer.

[0024] In summary, this invention has the following beneficial effects: By opening M air guide holes on the flexible board and connecting the M air guide holes with N air guide grooves, gas between the flexible board and the pure adhesive can be discharged through the air guide holes during pressing. Furthermore, by connecting the M air guide holes with N air guide grooves, gas in any air guide hole can be transferred to other air guide holes through the corresponding air guide groove, ensuring that gas can be discharged during pressing. This effectively removes gas between the flexible board and the pure adhesive during pressing, preventing voids and air bubbles from forming in the bonding area. Attached Figure Description

[0025] Figure 1 This is a cross-sectional structural schematic diagram of the rigid-flexible composite plate of this utility model;

[0026] Figure 2 This is a schematic diagram of the structure of the flexible plate in this utility model.

[0027] In the diagram: 1. Flexible board; 2. Pure adhesive; 3. Air vent; 4. Air vent groove; 41. Structural strip; 5. Molding waste area; 6. Effective graphic area; 7. Adhesive flow point; 8. Positioning hole; 9. Rigid plate; 10. Prepreg. Detailed Implementation

[0028] In order to make the purpose, characteristics and advantages of the utility model more apparent, obvious and easy to understand, the specific embodiments of the utility model are described in detail below in combination with the drawings. The drawings show several embodiments of the utility model. However, the utility model can be realized in many different forms and is not limited to the embodiments described herein.

[0029] In the utility model, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting", "fixing" and the like should be understood in a broad sense, for example, can be fixedly connected, or can be detachably connected, or integrally connected; can be mechanically connected, or can be electrically connected; can be directly connected, or can be indirectly connected through an intermediate medium, or can be connected inside two elements. For ordinary skilled persons in the art, the specific meanings of the above terms in the utility model can be understood according to the specific circumstances. The terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include one or more features.

[0030] The utility model will be described in detail below in combination with the drawings and embodiments.

[0031] Embodiment one

[0032] The embodiment provides a rigid-flex combination board air guiding structure, as shown in Figure 1 and Figure 2 , comprising two soft boards 1 and pure glue 2, the soft board 1, pure glue 2 and soft board 1 are sequentially stacked and adhered, M air guiding holes 3 are formed on the soft board 1, N air guiding grooves 4 communicating with the M air guiding holes 3 are arranged on the side of the soft board 1 facing the pure glue 2, wherein M is an integer greater than 0, and M is a positive integer less than N, and the air guiding groove 4 comprises two structure strips 41 arranged at intervals.

[0033] Specifically, by forming M air guiding holes 3 on the soft board 1 and by N air guiding grooves 4 respectively communicating with the M air guiding holes 3, the gas between the soft board 1 and the pure glue 2 can be discharged through the air guiding hole 3 when pressing. And by N air guiding grooves 4 respectively communicating with the M air guiding holes 3, the gas in any air guiding hole 3 can be transmitted to other air guiding holes 3 through the corresponding air guiding groove 4, ensuring that the gas can be discharged when pressing, so that the gas between the soft board 1 and the pure glue 2 is discharged when pressing, avoiding the formation of cavities and bubbles in the bonding area.

[0034] Optionally, the air guiding hole 3 is arranged in the forming waste area 5 of the soft board 1.

[0035] By setting several air guide holes 3 in the forming waste area, the air guide holes 3 can be set without affecting the effective pattern area 6 of the soft plate 1, so as to discharge the gas between the two soft plates 1 and the pure glue 2 from the air guide holes 3 to the outside of the plate. Generally, the interval between the two air guide holes 3 is set to 50% of the length of the forming waste area 5, which can ensure the discharge effect of the gas without affecting the performance of the soft plate 1.

[0036] Optionally, the air guide groove 4 extends along the edge of the forming waste area 5 of the soft plate 1.

[0037] The shape of the air guide groove 4 is matched with the forming waste area 5, which can facilitate the air guide groove 4 to communicate with the air guide holes 3 in the forming waste area 5.

[0038] Specifically, the number of the air guide groove 4 corresponds to the forming waste area 5, and one air guide groove 4 can communicate with all the air guide holes 3 in the forming waste area 5. In this embodiment, the interval between the two air guide holes 3 is set to 50% of the length of the forming waste area 5, and a total of 12 air guide holes 3 are set. The soft plate 1 is provided with two forming waste areas 5, so the soft plate 1 is provided with 24 air guide holes 3, and 2 air guide grooves 4, each of which communicates with 12 air guide holes 3 in the forming waste area 5.

[0039] Embodiment two

[0040] This embodiment provides an air guide structure of a rigid-flex combined board, as shown in Figure 1 and Figure 2 The air guide structure comprises two soft plates 1 and a pure glue 2, the soft plate 1, the pure glue 2 and the soft plate 1 are sequentially stacked and adhered, M air guide holes 3 are formed in the soft plate 1, N air guide grooves 4 are arranged on the side of the soft plate 1 facing the pure glue 2 and communicating with the M air guide holes 3, M is an integer greater than 0, and M is a positive integer less than N, and the air guide groove 4 comprises two spaced structure strips 41.

[0041] Specifically, by forming M air guide holes 3 in the soft plate 1 and by N air guide grooves 4 respectively communicating with the M air guide holes 3, the gas between the soft plate 1 and the pure glue 2 can be discharged through the air guide holes 3 during pressing. And by N air guide grooves 4 respectively communicating with the M air guide holes 3, the gas in any air guide hole 3 can be transmitted to other air guide holes 3 through the corresponding air guide groove 4, so as to ensure that the gas can be discharged during pressing, thereby discharging the gas between the soft plate 1 and the pure glue 2 during pressing, and avoiding the formation of cavities and bubbles in the bonding area.

[0042] Optionally, the air guide hole 3 is arranged in the forming waste area 5 of the soft plate 1.

[0043] By setting several air guiding holes 3 in the molding waste area, the air guiding holes 3 can be set without affecting the effective pattern area 6 of the soft board 1, so as to discharge the air between the two soft boards 1 and the pure glue 2 from the air guiding holes 3 to outside the board. Generally, the interval between the two air guiding holes 3 is set to 50% of the length of the molding waste area 5, so as to ensure the air discharge effect without affecting the performance of the soft board 1.

[0044] Optionally, the air guiding groove 4 extends along the edge of the molding waste area 5 of the soft board 1.

[0045] The air guiding groove 4 is adapted to the shape of the molding waste area 5, so as to facilitate the air guiding groove 4 to communicate with the air guiding holes 3 in the molding waste area 5.

[0046] Optionally, the structure strip 41 is a copper wire.

[0047] The structure strip 41 is set as a copper wire, so as to be directly formed in the inner layer pattern line process of the soft board 1, and the diameter of the copper wire is set so that the air guiding groove 4 formed by two copper wires can separate the soft board 1 and the pure glue 2 during pressing, so as to ensure that the air can pass through the air guiding groove 4 during pressing.

[0048] Specifically, the number of the air guiding groove 4 corresponds to the molding waste area 5 one by one, and one air guiding groove 4 can communicate with all the air guiding holes 3 in the molding waste area 5. In this embodiment, the interval between the two air guiding holes 3 is set to 50% of the length of the molding waste area 5, and a total of 12 air guiding holes 3 are set. The soft board 1 is provided with two molding waste areas 5, so the soft board 1 is provided with 24 air guiding holes 3, and 2 air guiding grooves 4, each of which communicates with 12 air guiding holes 3 in the molding waste area 5.

[0049] Optionally, a process edge is arranged on the side of the soft board 1 facing the pure glue 2, and a plurality of glue flow points 7 are arranged on the process edge.

[0050] By arranging the process edge on the soft board 1 and arranging the glue flow points 7 on the process edge, the air between the soft board 1 and the pure glue 2 can be discharged when the soft board 1 and the pure glue 2 are pressed. The diameter of the glue flow point 7 is set to be not greater than 1 mm, and the gap between the glue flow points 7 is not less than 1 mm, so that the air between the soft board 1 and the pure glue 2 can be quickly discharged during pressing under the action of the process edge.

[0051] Optionally, a positioning hole 8 is formed through the soft board 1, the pure glue 2 and the edge of the soft board 1.

[0052] By forming the positioning hole 8 through the edge of the soft board 1 and the pure glue 2, the soft board 1 and the pure glue 2 are pre-stacked and riveted before being pressed, so as to avoid the deviation of the soft board 1 and the pure glue 2 during pressing.

[0053] Embodiment three

[0054] The embodiment provides a rigid-flexible combined board, which comprises two rigid plates 9 and a gas guiding structure as shown in the figure. Figure 1 and Figure 2 The rigid plate 9, the gas guiding structure and the rigid plate 9 are sequentially stacked and adhered.

[0055] The gas guiding structure is composed of the soft plate 1, the pure glue 2 and the soft plate 1 which are sequentially stacked and adhered, so that the rigid plate 9, the soft plate 1, the pure glue 2, the soft plate 1 and the rigid plate 9 in the rigid-flexible combined board are sequentially stacked and adhered. Therefore, the rigid-flexible combined board can be obtained by sequentially stacking the rigid plate 9, the gas guiding structure and the rigid plate 9 and then performing brown pressing, and since the gas between the soft plate 1 and the pure glue 2 has been discharged when the soft plate 1 and the pure glue 2 are pressed, no cavity and bubble will be generated in the flexible area of the rigid-flexible combined board.

[0056] Optionally, a prepreg 10 is arranged between the rigid plate 9 and the gas guiding structure.

[0057] Specifically, the low-flow glue prepreg 10 is arranged at both ends of the side of the rigid plate 9 facing the gas guiding structure, so that the rigid plate 9 is adhered to the gas guiding structure after pressing, and a flexible area is formed between the rigid plate 9 and the gas guiding structure.

[0058] Optionally, the rigid plate 9 is a double-sided copper-clad core plate.

[0059] The double-sided copper-clad core plate rigid plate 9 can be pressed after inner layer circuit manufacturing on the side of the rigid plate 9 facing the gas guiding structure, so that the inner layer circuit of the rigid plate 9 is connected to the soft plate 1, and the circuit can be etched on the outer copper skin after pressing.

[0060] Embodiment four

[0061] The embodiment provides a manufacturing method of a rigid-flexible combined board, which comprises the following steps.

[0062] Manufacturing a hard plate, forming an inner layer circuit of the hard plate according to a conventional circuit board process, and protecting an outer copper skin, performing acid etching and AOI detection scanning after manufacturing the inner layer circuit of the hard plate;

[0063] Manufacturing a soft plate 1, optimizing an engineering design file of the soft plate 1 in advance, manufacturing a gas guiding structure on the soft plate 1 according to the engineering design file after cutting, and then performing acid etching and inner etching detection and pressing processes to brown, and waiting for pure glue 2 pressing;

[0064] Manufacturing pure glue 2, wrapping the pure glue 2 by using an epoxy resin plate; and setting a positioning hole 8 of the pure glue 2 according to positioning hole 8 data of the soft plate 1.

[0065] The epoxy resin plate is used as a backing plate, rivets are used to press and connect the soft plate 1, the pure glue 2 and the soft plate 1 in sequence, and the welding points are used to fix the empty area;

[0066] The soft plate 1, the pure glue 2 and the soft plate 1 are placed in sequence on the quick press machine to be pressed and connected, and a flexible plate is obtained; specifically, the first quick pressing is pre-pressing, the pressing parameter is set as the first preset parameter, and the air is discharged through the process edge glue point 7 and the air guide hole 3; the second quick pressing is performed, the pressing parameter is set as the second preset parameter, the gas between the soft plate 1, the pure glue 2 and the soft plate 1 is further discharged, and the pure glue 2 is preliminarily solidified; the third quick pressing is performed, the parameter is set as the third preset parameter, the pure glue 2 is completely solidified, and the soft plate 1, the pure glue 2 and the soft plate 1 are bonded together;

[0067] The hard plate pressing and connecting process is brown pressing and connecting with the flexible plate, and the semi-cured sheet 10 is used to bond between the hard plate and the flexible plate.

[0068] The above is only the preferred embodiment of the present application, the protection scope of the present application is not limited to the above-mentioned embodiments, any technical scheme belonging to the idea of the present application is within the protection scope of the present application. It should be noted that for ordinary skilled in the art, some improvements and decorations without departing from the principle of the present application are also considered as the protection scope of the present application.

Claims

1. A gas guide structure of a rigid-flex printed circuit board, characterized by, The application relates to a gas guide structure, which comprises two soft plates and pure glue; the soft plates, the pure glue and the soft plates are sequentially stacked and adhered; M gas guide holes are formed in the soft plates; N gas guide grooves which are communicated with the M gas guide holes are arranged on the side of the soft plates which faces the pure glue; wherein M is an integer greater than 0, and M is a positive integer smaller than N; the gas guide grooves comprise two structure strips which are arranged at intervals. The gas guide holes are arranged in the forming waste area of the soft plate.

2. The gas guiding structure of a rigid-flex printed circuit board of claim 1, wherein, The gas guide grooves extend along the edge of the forming waste area of the soft plate.

3. The gas guiding structure of a rigid-flex printed circuit board of claim 2, wherein, The structure strips are copper wires.

4. The gas guiding structure of a rigid-flex printed circuit board of claim 3, wherein, A process edge is arranged on the side of the soft plate which faces the pure glue; a plurality of glue flow points are arranged at intervals on the process edge.

5. The air guiding structure of a rigid-flex printed circuit board of claim 1, wherein, Positioning holes are formed through the edges of the soft plate, the pure glue and the soft plate.

6. The gas guiding structure of a rigid-flex printed circuit board of claim 1, wherein, The application relates to a gas guide structure, which comprises two rigid plates and the gas guide structure as claimed in any one of claims 1-6; the rigid plates, the gas guide structure and the rigid plates are sequentially stacked and adhered.

7. A rigid-flex printed circuit board, characterized by, A prepreg is arranged between the rigid plate and the gas guide structure. The rigid plate is a double-sided copper-clad core plate.

8. The rigid-flex printed circuit board of claim 7, wherein, ​ 9. The rigid-flex printed circuit board of claim 7, wherein, ​

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