Heat pipe type refrigeration helmet

Abstract

The utility model discloses a heat pipe type refrigeration helmet which is characterized in that a buffer cushion layer and an inner container liner are arranged in a helmet shell, and a heat pipe is laid between the buffer cushion layer and the inner container liner; a cold and heat source temperature control module is arranged on the rear portion of the shell, and a heat conduction cabin, a ventilation cabin and a power supply cabin which are independent are arranged in the temperature control module. Wherein a heat conduction block matched with the semiconductor chilling plate is arranged in the heat conduction cabin, and one end of the heat pipe is connected with the heat conduction block; and a radiating fin matched with the semiconductor chilling plate is arranged in the ventilation cabin, and an axial flow fan matched with the radiating fin is arranged in the ventilation cabin. The cooling capacity is evenly distributed through the inherent structure of the heat pipe and the helmet, the heat pipe is small in occupied space, can be applied to various helmets and is wide in application range, meanwhile, the temperature of all points in the helmet and a cold and heat source temperature control area is effectively controlled and adjusted, the good cooling effect meeting the requirement of a user is achieved, the condensate water precipitation phenomenon is avoided, and a wearer feels comfortable.

Description

TECHNICAL FIELD

[0001] The utility model relates to helmet manufacturing technology especially a kind of heat pipe type refrigeration helmet using semiconductor refrigeration principle, which is combined with heat pipe heat transfer technology. BACKGROUND

[0002] As necessary protective appliance for driving motorcycle, electric vehicle, bicycle and other life scenes, and necessary protective appliance for factory, construction site and other working scenes, helmet is widely used. However, in summer or high-intensity physical activity, helmet affects the heat dissipation of human head, and head is the concentrated part of human heat dissipation, so there is a feeling of high temperature and stuffiness in this case, so there is a phenomenon that people are unwilling to wear helmet due to insufficient comfort, which brings safety hazard.

[0003] To solve this problem, the design represented by the refrigeration helmet with patent publication number CN103120434A and the refrigeration helmet with patent publication number CN105559229A both use liquid cooling method for helmet refrigeration, and the difference between them is the preparation method of refrigerant. However, there are obvious problems in the liquid cooling refrigeration of helmet, such as complex liquid cooling pipeline process in narrow space of helmet, risk of liquid leakage in liquid cooling pipeline, and too much condensate water on the surface of liquid cooling pipeline which cannot be discharged.

[0004] For example, the design represented by the helmet with refrigeration function with patent publication number CN114190641A and the refrigeration helmet with patent publication number CN210043266U, although using semiconductor refrigeration and other methods for helmet refrigeration, the application method of semiconductor refrigeration only uses cold end radiation for cooling, and the result is that the refrigeration effect cannot be completely and uniformly distributed, resulting in uneven cold and heat inside the helmet, and the cold end of semiconductor refrigeration sheet is directly arranged in the helmet, which also has the problem of condensate water precipitation and cannot be discharged. SUMMARY

[0005] The utility model aims at solving the problem that helmet cannot be effectively refrigerated when the temperature inside the helmet is high, and provides a heat pipe type refrigeration helmet, which uses semiconductor refrigeration method to create low temperature condition and uses heat pipe to transfer cold quantity to the helmet, avoids condensate water precipitation, ensures uniform refrigeration effect, and effectively combines helmet structure and refrigeration system.

[0006] The technical problems of the above-mentioned heat pipe type refrigeration helmet are solved by the following technical scheme: a heat pipe type refrigeration helmet, comprising a shell, characterized in that: a buffer pad layer and an inner liner gasket are arranged in the shell, and a heat pipe is arranged between the buffer pad layer and the inner liner gasket; a cold and hot source temperature control module is arranged at the rear part of the shell, the temperature control module comprises a module box, and a heat conduction cabin, a ventilation cabin and a power supply cabin that are independent of each other are arranged in the module box; a heat conduction block matched with a semiconductor refrigeration piece is arranged in the heat conduction cabin, and one end of the heat pipe is connected with the heat conduction block; a heat dissipation fin matched with the semiconductor refrigeration piece is arranged in the ventilation cabin, and an axial flow fan is arranged in cooperation with the heat dissipation fin.

[0007] As preferred, the heat pipe type refrigeration helmet has a recess for accommodating the heat pipe on the inner side of the buffer pad layer, and the depth of the recess is equal to the thickness of the heat pipe.

[0008] As preferred, the heat pipe type refrigeration helmet has a hollow part corresponding to the heat pipe on the inner liner gasket.

[0009] As preferred, the heat pipe type refrigeration helmet has a controller in the temperature control module, the controller obtains temperature and humidity data by combining a plurality of sensors to complete temperature control, and the temperature and humidity data obtained by the controller at least includes the temperature and humidity in the helmet, the temperature and humidity in the ventilation cabin and the temperature and humidity in the heat conduction cabin.

[0010] As preferred, the heat pipe type refrigeration helmet has equal radii of curvature of the heat pipe and the buffer pad layer.

[0011] As preferred, the heat pipe type refrigeration helmet has a heat conduction groove matched with the heat pipe on the heat conduction block, and the heat pipe is seamlessly matched with the heat conduction groove.

[0012] As preferred, the heat pipe type refrigeration helmet has a separate cuboid box body of the module box, and the module box is connected and matched with the shell in a module assembly mode, or the module box and the matching part of the shell jointly form a cuboid box body structure.

[0013] As preferred, the heat pipe type refrigeration helmet has a controller and a power supply in the power supply cabin, and the controller and the power supply are isolated by a control cover plate.

[0014] As preferred, the heat pipe type refrigeration helmet has a heat conduction silica gel layer coated between the semiconductor refrigeration piece and the heat conduction block and between the heat conduction block and the heat pipe.

[0015] The technical scheme adopts the mode of combining semiconductor refrigeration with heat pipes, and sends cold energy from the cold and hot source temperature control module arranged at the rear part of the shell to the helmet to meet the purpose of uniform cooling in the helmet.

[0016] The present scheme designs the heat pipe and other required component structure according to the shape of the helmet and its internal structure, adopts multiple heat pipes for heat conduction, so as to strengthen the refrigeration effect and ensure the uniformity of the refrigeration area. The cold end of the semiconductor refrigeration piece of the device is ensured to stably, reliably and effectively conduct the cold quantity of the semiconductor refrigeration to the heat pipe, and then to the helmet, and the hot end of the semiconductor refrigeration piece is ensured to always meet the use requirement by the heat dissipation fins and the axial flow fan.

[0017] The air inlet of the ventilation system of the present scheme can enter from the heat dissipation louvers and the specially designed air inlet, and is blown out through the heat dissipation air outlet after completing heat exchange with the heat dissipation fins.

[0018] In order to ensure the refrigeration effect of the helmet and the effective operation of the semiconductor refrigeration system, the device is provided with a plurality of sensors, all of which have temperature and humidity monitoring and data transmission functions, and all kinds of data are uniformly collected into the controller for processing. The setting of the sensors can monitor the dew point temperature in the helmet and the surface temperature of the heat pipe, avoid condensate, synchronously detect the cold end and hot end temperature of the semiconductor refrigeration piece, feedback control the air supply temperature and the refrigeration power of the semiconductor refrigeration piece, prevent the damage of the refrigeration piece caused by overcooling and overheating, so as to protect and improve the refrigeration effect in the helmet.

[0019] Compared with the prior art, the present application has the beneficial effects that: the semiconductor refrigeration is combined with the heat pipe heat transfer principle to carry out the internal refrigeration of the helmet, the cold quantity is uniformly distributed through the heat pipe and the inherent structure of the helmet, the heat pipe occupies small space, can be applied to various helmets, has wide application range, effectively controls and adjusts the temperature of each point in the temperature control area of the helmet and the cold and heat source, achieves good refrigeration effect meeting the requirements of the user, and there is no condensate phenomenon, so that the wearer feels comfortable. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 is a refrigeration principle diagram of the present application.

[0021] Figure 2 is a temperature control module structure schematic diagram of the present application.

[0022] Figure 3 is a refrigeration helmet overall sectional structure schematic diagram of the present application.

[0023] Figure 4 is Figure 3 is a local enlarged structure schematic diagram of A in the figure.

[0024] Figure 5 is a heat pipe structure schematic diagram of the present application.

[0025] Figure 6 is a local structure schematic diagram of the cooperation part of the heat conduction block and the heat pipe of the present application.

[0026] Figure 7 is a liner gasket structure schematic diagram of the utility model.

[0027] Figure 8 is a shape embodiment structure schematic diagram of the utility model.

[0028] In the drawing: 1-shell, 2-temperature control module, 201-controller, 202-power supply, 203-axial flow fan, 204-radiating fins, 205-semiconductor refrigeration piece, 206-heat conducting block, 207-inlet air port, 208-radiating air port, 209-hot end sensor, 210-heat pipe sensor, 211-helmet inside sensor, 212-ventilation cabin, 213-heat conducting cabin, 214-heat insulation layer, 3-heat pipe, 4-cushioning layer, 5-cushioning layer, 501-hollow part, 6-breathing hole, 7-safety glasses. DETAILED DESCRIPTION

[0029] The technical scheme of the utility model will be further specifically explained below by examples and in combination with the drawings.

[0030] The heat pipe type refrigeration helmet of the embodiment, as shown in Figure 3 , Figure 4 , comprises a full helmet structure shell 1, a cushioning layer 4 and an inner liner gasket 5 are sequentially arranged in the shell 1, the heat pipe 3 is laid between the cushioning layer 4 and the inner liner gasket 5, and the rear part of the shell 1 is provided with a cold and hot source temperature control module 2.

[0031] The shell 1 is made of carbon fiber, glass fiber and the like, the breathing hole 6 is arranged below the front end of the helmet, and the helmet is also provided with safety glasses 7, as shown in Figure 8 . The cushioning layer 4 is made of EPS and the like, can be extruded and deformed when the helmet is impacted, absorbs the impact force, reduces the injury of the head, the EPS and the like are formed lightweight materials, and are also convenient for processing. In order to meet the requirement of uniform refrigeration, the cushioning layer 4 is provided with a recess for accommodating the heat pipe 3, and the heat pipe 3 is laid in the recess and is flush with the surface of the cushioning layer 4.

[0032] The heat pipe 3 is a flat tube structure and has a curvature radius matched with the cushioning layer 4, as shown in Figure 5 . The cushioning layer 4 plays the functions of protection and heat preservation, so that the cold energy of the heat pipe 3 is radiated and dissipated to the inside of the helmet. In actual production, the heat pipe 3 can be one-time bent and formed according to the inherent structure of the cushioning layer 4, and a plurality of heat pipes are considered to be laid, the corresponding curvature radius and bending are matched to ensure the installation effect.

[0033] The inner liner gasket 5 considers the comfort of wearing, can be made of velvet and the like, and the hollow part 501 of the inner liner gasket 5 is appropriately arranged, as shown in Figure 4 , Figure 7As shown, the size of the cutout 501 is flexible, and the main principle is not to create strong obstruction to the heat dissipation of the heat pipe 3.

[0034] The construction of the buffer layer 4 and the inner liner layer 5 ensures the uniformity of cooling of the heat pipe 3.

[0035] See Figure 1 , Figure 2 In this embodiment, the temperature control module 2 is a cuboid with rounded corners and can be installed as a modular assembly inside the helmet shell 1. Of course, the parts of the module box 200 and the shell 1 that mate can also be designed to form a cuboid box structure, that is, the module box 200 part of the structure is integrally formed with the helmet shell 1.

[0036] The temperature control module 2 includes a module box 200. The module box 200 is divided into three independent compartments—a heat-conducting compartment 213, a ventilation compartment 212, and a power supply compartment—by a thermoelectric cooler 205 and internal reinforcing plates. During manufacturing, the thermoelectric cooler 205 is positioned between the heat-conducting compartment 213 and the ventilation compartment 212. The partition between the two compartments should be reinforced with heat-insulating material to prevent heat loss through heat exchange. The number of thermoelectric coolers 205 can be adjusted according to actual needs, such as one or two.

[0037] Specifically, the heat-conducting chamber 213 contains a heat-conducting block 206 that cooperates with the semiconductor cooling chip 205, and one end of the heat pipe 3 is connected to the heat-conducting block 206. The ventilation chamber 212 contains heat dissipation fins 204 that cooperate with the semiconductor cooling chip 205, and an axial flow fan 203 that cooperates with the heat dissipation fins 204. The heat-conducting block 206 is made of materials with good thermal conductivity, such as aluminum alloy or copper. The heat-conducting block 206 is used to transfer the cooling capacity to the heat pipe 3 to the maximum extent, and then deliver it into the helmet. The heat-conducting block 206 has corresponding heat-conducting grooves according to the number of heat pipes 3, and the heat pipes 3 are laid in the heat-conducting grooves, such as... Figure 6 As shown in the example, the heat-conducting block 206 is provided with several heat-conducting grooves that cooperate with the heat pipe 3, and each heat pipe 3 has three surfaces that are tightly fitted with the heat-conducting grooves.

[0038] The semiconductor cooling chip 205, the heat-conducting block 206, and the heat pipe 3 are all coated with effective thermally conductive materials such as thermally conductive silicone to ensure heat transfer performance. The remaining part of the heat-conducting chamber 213 is completely filled with thermal insulation material to avoid energy loss.

[0039] The power supply 202 is arranged in the power supply cabin, which can adopt a form of a rechargeable lithium battery or the like, or the power supply can be wholly concealed, and a charging interface is reserved on the outside, which can facilitate external power supply for continuous power supply when the helmet is used for a long time. A power supply cabin cover plate is arranged on the outside of the power supply cabin to facilitate battery replacement, and when the battery is wholly concealed and the charging interface is reserved, the power supply cabin cover plate can not be arranged. The controller 201 is arranged on the inside of the power supply cabin, and a control cover plate is arranged between the controller 201 and the power supply 202 to play a role of isolation.

[0040] The controller 201 obtains temperature and humidity data by combining the sensors arranged at multiple positions to realize the temperature control function of the refrigeration helmet. The temperature and humidity data obtained by the controller at least include the temperature and humidity in the helmet, which are obtained by the in-helmet sensor 211, the temperature and humidity of the ventilation cabin 212, which are obtained by the heat pipe sensor 210, and the temperature and humidity of the heat conduction cabin 213, which are obtained by the hot end sensor 209.

[0041] The principle of the embodiment is to manufacture a low-temperature condition by a semiconductor refrigeration mode, and to transmit the cold quantity to the helmet by using the heat conduction principle of the heat pipe 3 and the rapid heat transfer property of the phase change medium, so that the helmet is cooled. In work, the cold quantity of the semiconductor refrigeration sheet 205 is transmitted to the heat pipe 3 to complete the preparation and delivery of the cold quantity, and the purpose of refrigeration of the helmet is achieved; the outdoor air in the ventilation cabin 212 enters from the bottom air inlet 207 or enters from the periphery of the side heat dissipation air inlet 208, exchanges heat with the heat dissipation fins 204 at one end of the semiconductor refrigeration sheet 205, and is blown out of the heat dissipation air inlet 208 by the axial flow fan 203 to complete the heat dissipation of the hot end of the refrigeration sheet.

[0042] The above embodiment takes the summer working condition as an example, but the method and the helmet manufactured by the method should have a corresponding winter working condition operation logic. As long as the positive and negative poles of the power supply of the semiconductor refrigeration sheet 205 are switched, the cold end is in a heating working condition, the hot end is in a cooling working condition, and the heating effect in the helmet can be achieved by combining the monitoring of the sensor and the adjustment of the controller 201. Details are not expanded.

[0043] The above embodiment is a description of the utility model, not a limitation of the utility model. The helmet in the embodiment is described by taking the full helmet structure shell 1 as an example, but it can be a half helmet, a 3 / 4 helmet, an off-road helmet, and the like. The described embodiment is only a part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the ordinary skill in the art without creative labor under the inspiration of the utility model belong to the scope of protection of the utility model.

Claims

1. A heat pipe type refrigeration helmet comprising a shell (1), characterized in that: The shell is internally provided with a buffer pad layer (4) and an inner liner pad (5), and a heat pipe (3) is laid between the buffer pad layer and the inner liner pad; the rear part of the shell is provided with a cold and hot source temperature control module (2), which comprises a module box (200), and the module box is internally provided with a heat conduction cabin (213), a ventilation cabin (212) and a power supply cabin which are independent of each other; wherein the heat conduction cabin is internally provided with a heat conduction block (206) matched with a semiconductor refrigeration sheet, and one end of the heat pipe is connected with the heat conduction block; the ventilation cabin is internally provided with a heat dissipation fin (204) matched with the semiconductor refrigeration sheet, and an axial flow fan (203) is matched with the heat dissipation fin.

2. A heat pipe cooling helmet according to claim 1, wherein, The inner side of the buffer pad layer (4) is provided with a recess for accommodating the heat pipe (3), and the depth of the recess is equal to the thickness of the heat pipe.

3. A heat pipe cooling helmet according to claim 2, wherein, The inner liner pad (5) is provided with a hollow part (501) corresponding to the heat pipe.

4. A heat pipe cooling helmet according to claim 1, wherein, The temperature control module (2) is provided with a controller (201), which obtains temperature and humidity data in combination with a plurality of sensors to complete temperature control, and the temperature and humidity data obtained by the controller at least includes the temperature and humidity in the helmet, the temperature and humidity in the ventilation cabin (212) and the temperature and humidity in the heat conduction cabin (213).

5. A heat pipe helmet according to claim 1 or 2 or 3, wherein, The heat pipe (3) and the buffer pad layer (4) have equal radii of curvature.

6. A heat pipe cooling helmet according to claim 1, wherein, The heat conduction block (206) is provided with a heat conduction recess matched with the heat pipe (3), and the heat pipe is seamlessly matched with the heat conduction recess.

7. A heat pipe cooling helmet according to claim 1, wherein, The module box (200) is an independent cuboid box body, which is connected and matched with the shell (1) in a module assembly type, or the module box and the shell (1) are matched to jointly form a cuboid box body structure.

8. A heat pipe helmet according to claim 1 or 3, wherein The power supply cabin is internally provided with a controller (201) and a power supply (202), and the controller and the power supply are isolated by a control cover plate.

9. A heat pipe helmet according to claim 1 or 6, wherein, The semiconductor refrigeration sheet (205) and the heat conduction block (206) are both coated with a heat conduction silica gel layer, and the heat conduction block and the heat pipe (3) are also coated with a heat conduction silica gel layer.

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