Laser cutting device
By using a rotating mechanism and laser beams of different wavelengths in synergy, the problems of PCB damage and dust pollution caused by laser cutting devices have been solved, achieving efficient cutting and cleaning and improving processing efficiency.
Patent Information
- Application Number
- CN202423106605.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-16
- Publication Date
- 2025-12-16
- Estimated Expiration
- 2034-12-16
AI Technical Summary
Existing laser cutting equipment is prone to damaging components and generating dust pollution when cutting PCBs, and traditional cleaning methods are inefficient.
A rotating mechanism is used to drive the PCB to rotate, combined with green nano laser cutting and purple nano laser cleaning. While the rotating mechanism drives the PCB to rotate, the purple nano laser is used to vertically cut the cross-section for cleaning.
It shortens the cutting time, improves the problem of carbonization and blackening of the cut surface, increases cutting efficiency, and reduces damage to components on the PCB.
Smart Images
Figure CN223670453U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to laser cutting technical field, especially relate to a laser cutting device. BACKGROUND
[0002] The current laser cutting device uses the lower milling type board separating module, and the contact type cutting mode can damage the parts on the PCB, the dust generated during cutting can cause pollution, and the dust extraction equipment is large in size. When cleaning the carbonized and blackened PCB cutting surface after cutting, the traditional cleaning method is to clean the cutting surface by laser parallel to the cutting surface, and the cleaning time is equivalent to the cutting time, so the processing efficiency is low.
[0003] Therefore, it is necessary to develop a laser cutting device to solve the problem of carbonization and blackening of the PCB cutting surface and improve the cutting efficiency. UTILITY MODEL CONTENT
[0004] The purpose of the case is to provide a laser cutting device which can solve one or more defects of the prior art.
[0005] In order to achieve the above-mentioned purpose, the utility model provides a laser cutting device, which comprises: a rotating mechanism comprising a rotating platform and a rotating shaft connected to each other, the rotating platform being used for placing a PCB; a first laser for emitting a first laser beam; a second laser for emitting a second laser beam, after the first laser beam completes cutting of the PCB along a predetermined track, the rotating mechanism drives the PCB to rotate, and the second laser beam cleans the cutting surface of the PCB.
[0006] According to an embodiment of the utility model, the laser cutting device further comprises: a first scanning head, the first laser beam is transmitted to the first scanning head through a laser light path, the first scanning head makes the first laser beam perpendicular and focused on the PCB, and the first scanning head moves along the predetermined track to make the first laser beam cut the PCB.
[0007] According to an embodiment of the utility model, the laser cutting device further comprises an expander mirror and at least two mirrors, the expander mirror and the at least two mirrors are arranged on the laser light path, and after the first laser beam is expanded by the expander mirror, the first laser beam is reflected into the first scanning head through the at least two mirrors.
[0008] According to an embodiment of the utility model, the laser cutting device further comprises: a second scanning head connected to the second laser through an optical fiber and making the second laser beam perpendicular and focused on the cutting surface, when the rotating mechanism drives the PCB to rotate, the second laser beam cleans the cutting surface.
[0009] According to an embodiment of the utility model, the second scanning head has a scanning range, and within the scanning range, the second scanning head makes the second laser beam perpendicular and focused on the cutting surface.
[0010] In an embodiment of the present application, the first laser is a YAG laser, the first laser beam is green nanosecond laser, and the power of the first laser beam is 40 W.
[0011] In an embodiment of the present application, the second laser is a fiber laser, the second laser beam is purple nanosecond laser, and the power of the second laser beam is 15 W.
[0012] The laser cutting device provided by the present application shortens the cutting time of the PCB and improves the carbonization and blackening of the cutting surface by using green nanosecond laser to cut the PCB and using the rotating mechanism to drive the PCB to rotate and using the purple nanosecond laser to vertically cut the cutting surface to clean it. BRIEF DESCRIPTION OF DRAWINGS
[0013] In order to more clearly illustrate the technical solutions of the embodiments, the drawings needed in the embodiments will be briefly introduced as follows.
[0014] Figure 1 FIG. 1 is a schematic diagram of the overall structure of the laser cutting device of the present application. DETAILED DESCRIPTION
[0015] Example implementations will now be described more fully with reference to the accompanying drawings. Example implementations may, however, be implemented in many different forms and should not be construed as limited to the implementations set forth herein; rather, these implementations are provided so that this disclosure will be thorough and complete, and will fully convey the inventive aspects of example implementations to those skilled in the art.
[0016] When introducing elements / components / etc. which are described and / or illustrated herein, the articles "a", "an", "the", and "said" are intended to mean that there are one or more of the elements / components unless the context of use explicitly dictates otherwise. The terms "comprises", "comprising", "includes", "including" and "has" are intended to be inclusive and mean that there can be additional elements / components / etc. other than those listed. Furthermore, the term "first", "second" and the like used in the description and / or in the claims are used for distinguishing between similar elements / components / etc. and do not necessarily indicate the order / priority of the elements / components / etc. with respect to each other. The term "coupled" as used herein is intended to mean a direct or indirect connection between elements / components / etc. that is / are in physical contact with each other (and / or some other items are between the coupled elements / components / etc.), and / or that are / are not in physical contact with each other (i.e. they can be separated by some distance and / or some other items can be present between the coupled elements / components / etc.). The term "and / or" as used herein is intended to mean either "and" or "or". The term "about" means approximately or nearly as understood by one of ordinary skill in the art. The term "comprising" as used herein is intended to mean that the compositions and methods include the recited elements / components / etc. but not excluding others. "Consisting essentially of" when used herein in relation to a composition or method means that the composition or method includes the recited elements / components / etc. and those that do not materially affect the basic and novel characteristics of the composition or method. "Consisting of" when used herein in relation to a composition or method means only the recited elements / components / etc. are present. The term "method" refers to a set of steps that can be performed manually or mechanically. The term "step" refers to a set of operations that can be performed manually or mechanically. The term "computer" refers to a set of operations that can be performed manually or mechanically. The term "computer" refers to a set of operations that can be performed manually or mechanically.
[0017] Figure 1 FIG. 1 is a schematic diagram of the overall structure of the laser cutting device of the present application. As shown in FIG. 1, the laser cutting device of the present application comprises a first laser, a second laser, a rotating mechanism, and a cleaning mechanism. Figure 1As shown in the figure, the laser cutting device 100 comprises a rotating mechanism 1, a first laser 2 and a second laser 3. The rotating mechanism 1 comprises a rotating platform 11 and a rotating shaft 12 connected with each other, and the rotating platform 1 is used for placing the PCB; the first laser 2 is used for emitting a first laser beam L1, which is used for cutting the PCB; the second laser 3 is used for emitting a second laser beam L2, which is used for cleaning the cutting section of the PCB. After the first laser beam L1 completes the cutting of the PCB along the predetermined track, the rotating mechanism 1 drives the PCB to rotate, and the second laser beam L2 cleans the cutting section.
[0018] As shown in the figure, Figure 1 the laser cutting device 100 further comprises a first scanning head 4, the first laser beam L1 is transmitted to the first scanning head 4 via a laser light path G, the first scanning head 4 makes the first laser beam L1 perpendicular and focused on the PCB, the first scanning head 4 moves along the predetermined track to make the first laser beam L1 cut the PCB and form a cutting section. During the cutting process, the first laser 2 does not need to move, which shortens the cutting time, and on the predetermined track, the first laser beam L1 is perpendicular and focused on the PCB, and outside the predetermined track, the first laser beam L1 will not be focused on other positions on the PCB, so the first laser beam L1 will not cause damage to the components on the PCB.
[0019] The laser cutting device 100 further comprises an expander mirror 5 and two reflecting mirrors 6, which are arranged on the laser light path G, and after the first laser beam L1 is expanded by the expander mirror 5, it is reflected into the first scanning head 4 by the two reflecting mirrors 6. In other embodiments, the laser light path of the laser cutting device 100 can further comprise more reflecting mirrors, and the specific number of reflecting mirrors is set according to the actual situation.
[0020] The laser cutting device 100 further comprises a second scanning head 7, which is connected with the second laser 3 through an optical fiber F and makes the second laser beam L2 perpendicular and focused on the cutting section of the PCB, and when the rotating mechanism 1 drives the PCB to rotate, the second laser beam L2 cleans the cutting section of the PCB. Among them, the second scanning head 7 has a scanning range, within the scanning range, the second scanning head 7 makes the second laser beam L2 perpendicular and focused on the cutting section, therefore, the second laser 3 and the second scanning head 7 do not need to move, when the rotating mechanism 1 drives the PCB to rotate, within the scanning range of the second scanner 7, the second laser beam L2 can complete the cleaning of the cutting section, which shortens the cleaning time. And outside the scanning range, the second laser beam L2 will not be focused on positions other than the cutting section, and will not cause damage to the components on the PCB.
[0021] In the embodiment, the first laser 2 is a YAG laser, the first laser beam L2 is green nanosecond laser, the power of the first laser beam L1 is 40W, the second laser 3 is a fiber laser, the second laser beam L2 is purple nanosecond laser, and the power of the second laser beam L2 is 15W.
[0022] The laser cutting device of the present application realizes the purposes of shortening the cutting time of the PCB and improving the carbonization and blackening of the cutting surface by using green nanosecond laser to cut the PCB and using purple nanosecond laser to clean the cutting surface vertically while the PCB is rotated by the rotating mechanism.
[0023] Although the embodiments of the present application have been shown and described, it is to be understood that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present application, and the scope of protection of the present application is defined by the appended claims.
Claims
1. A laser cutting apparatus, characterized by, The laser cutting device comprises: a rotating mechanism comprising a rotating platform and a rotating shaft connected to each other, the rotating platform being used for placing a PCB; a first laser used for emitting a first laser beam; a second laser used for emitting a second laser beam, after the first laser beam cuts the PCB along a predetermined track, the rotating mechanism drives the PCB to rotate, and the second laser beam cleans the cutting surface of the PCB.
2. The laser cutting apparatus of claim 1, wherein, The laser cutting device further comprises a first scanning head, the first laser beam is transmitted to the first scanning head through a laser light path, the first scanning head makes the first laser beam perpendicular and focused on the PCB, and the first scanning head moves along the predetermined track to make the first laser beam cut the PCB.
3. The laser cutting apparatus of claim 2, wherein, The laser cutting device further comprises an expander mirror and at least two mirrors, the expander mirror and the at least two mirrors are arranged on the laser light path, the first laser beam is expanded by the expander mirror and then reflected by the at least two mirrors into the first scanning head.
4. The laser cutting apparatus of claim 1, wherein, The laser cutting device further comprises a second scanning head, the second scanning head is connected to the second laser through an optical fiber, and makes the second laser beam perpendicular and focused on the cutting surface, and when the rotating mechanism drives the PCB to rotate, the second laser beam cleans the cutting surface.
5. The laser cutting device according to claim 4, wherein the second scanning head has a scanning range, and within the scanning range, the second scanning head makes the second laser beam perpendicular and focused on the cutting surface.
6. The laser cutting device according to claim 1, wherein the first laser is a YAG laser, the first laser beam is a green nanosecond laser, and the power of the first laser beam is 40 W.
7. The laser cutting device according to claim 1, wherein the second laser is a fiber laser, the second laser beam is a purple nanosecond laser, and the power of the second laser beam is 15 W.