High-stability fixing device for wafer polishing

Abstract

The utility model relates to the technical field of wafer polishing, in particular to a high-stability fixing device for wafer polishing, which comprises a base, a support frame fixedly mounted at the top of the base, a hydraulic cylinder fixedly mounted on the support frame, a polishing machine fixedly mounted at the output end of the hydraulic cylinder, and a high-stability fixing structure body arranged below the polishing machine. The high-stability fixing structure body comprises a fixing frame fixedly installed on the base, a two-way lead screw is movably installed in the fixing frame, and a rotating wheel connected with the two-way lead screw is arranged on one side of the fixing frame. According to the utility model, through the arrangement of the high-stability fixing structure body, a wafer can be clamped and fixed more stably; on the basis of clamping and fixing of the two chucks, vacuum adsorption is conducted on the wafer through operation of the vacuum pump and the suction cup, the wafer is fixed more stably by means of the double-fixing effect, and the wafer is effectively prevented from falling off in the polishing process.

Description

TECHNICAL FIELD

[0001] The utility model relates to a kind of high-stability fixing device, in particular to a kind of high-stability fixing device for wafer polishing, belong to wafer polishing technical field. BACKGROUND

[0002] Wafer is the silicon wafer used for making silicon semiconductor circuit, and its raw material is silicon. After high-purity polysilicon is dissolved and incorporated into silicon crystal seed, it is slowly pulled out to form cylindrical single crystal silicon rod. After grinding, polishing and slicing, silicon wafer is formed, which is wafer.

[0003] During the manufacturing process of wafer, there may be small protrusions and scratches on its surface. These small defects can affect the connection of the circuit and cause serious consequences. Therefore, wafer needs to be polished. Although the commonly used polishing equipment can clamp and fix the wafer, the fixing firmness is not good, and the wafer is easy to fall off from the fixing device during polishing, which not only affects the polishing efficiency, but also easily causes the wafer to be scrapped and causes resource waste. SUMMARY

[0004] In view of the deficiencies of the prior art, the utility model provides a high-stability fixing device for wafer polishing, which can realize stable clamping and fixing of wafer.

[0005] The utility model solves the above technical problems by adopting the following technical scheme:

[0006] A high-stability fixing device for wafer polishing includes a base, a support frame is fixedly installed on the top of the base, a hydraulic cylinder is fixedly installed on the support frame, a polishing machine is fixedly installed on the output end of the hydraulic cylinder, a high-stability fixing structure body is arranged below the polishing machine, the high-stability fixing structure body includes a fixed frame fixedly installed on the base, a bidirectional screw rod is movably installed inside the fixed frame, a rotating wheel connected with the bidirectional screw rod is arranged on one side of the fixed frame, two moving blocks are symmetrically installed on the bidirectional screw rod, a chuck is fixedly installed on the top of the moving block, a vacuum pump is fixedly installed on the bottom of the chuck, and two suction cups connected with the vacuum pump are installed inside the chuck.

[0007] Further, a rubber pad is fixedly installed on the inner wall of the chuck.

[0008] Further, a slide rail is fixedly installed on one side of the chuck, and an extrusion rod is slidably installed on the slide rail.

[0009] Further, the bottom of the extrusion rod is arc-shaped, and a handle is fixedly installed on the top of the extrusion rod.

[0010] Further, the top of the fixed frame is provided with a plurality of grooves, and the chuck is fixedly provided with moving wheels matched with the grooves.

[0011] Further, one side of the rotating wheel is provided with a fixed plate mounted on the base, a supporting rod is movably mounted on the fixed plate, a spring is mounted between one end of the supporting rod and the fixed plate, and a magnetic block is fixedly mounted on the other end of the supporting rod.

[0012] Further, a magnetic ring is fixedly sleeved on the rotating wheel, and the surface of the magnetic ring is matched with the inner wall of the magnetic block and is mutually adsorbed.

[0013] Compared with the prior art, the utility model has the beneficial effects that:

[0014] The high-stability fixing structure body is arranged, so that the wafer can be more stably clamped and fixed. The rotating wheel is rotated to drive the bidirectional screw rod to rotate, the bidirectional screw rod drives the two moving blocks to approach each other, and then the two chucks approach each other. When the wafer can contact the two chucks at the same time, the wafer is placed, and then the rotating wheel is continuously rotated to move the two chucks to clamp the wafer. On the basis of the clamping and fixing of the two chucks, the vacuum pump and the suction disc are started to run to vacuum adsorb the wafer. The wafer is more stably fixed by relying on the double fixing effect, and the wafer is effectively prevented from falling off and being scrapped in the polishing process. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a whole structure schematic view of the utility model;

[0016] Figure 2 It is a vacuum pump and suction disc structure schematic view of the utility model;

[0017] Figure 3 It is an extrusion rod structure schematic view of the utility model;

[0018] Figure 4 It is a magnetic block and magnetic ring structure schematic view of the utility model.

[0019] In the drawing, 1, base; 2, support frame; 3, hydraulic cylinder; 4, polishing machine; 5, high-stability fixing structure body; 6, fixed frame; 7, bidirectional screw rod; 8, rotating wheel; 9, moving block; 10, chuck; 11, vacuum pump; 12, suction disc; 13, rubber pad; 14, sliding rail; 15, extrusion rod; 16, handle; 17, groove; 18, moving wheel; 19, fixed plate; 20, supporting rod; 21, spring; 22, magnetic block; 23, magnetic ring. DETAILED DESCRIPTION

[0020] The technical scheme of the utility model will be described clearly and completely in combination with the drawings and specific embodiments.

[0021] As shown in Figures 1-4 The embodiment provides a high-stability fixing device for wafer polishing, which comprises a base 1, a support frame 2 fixedly installed on the top of the base 1, a hydraulic cylinder 3 fixedly installed on the support frame 2, a polishing machine 4 fixedly installed on the output end of the hydraulic cylinder 3, and a high-stability fixing structure body 5 arranged below the polishing machine 4. The high-stability fixing structure body 5 comprises a fixed frame 6 fixedly installed on the base 1, a bidirectional screw rod 7 movably installed in the fixed frame 6, a rotating wheel 8 arranged on one side of the fixed frame 6 and connected with the bidirectional screw rod 7, two moving blocks 9 symmetrically installed on the bidirectional screw rod 7, a chuck 10 fixedly installed on the top of each moving block 9, a vacuum pump 11 fixedly installed on the bottom of each chuck 10, and two suction cups 12 installed in each chuck 10 and connected with the vacuum pump 11.

[0022] The high-stability fixing structure body 5 can be used for stably clamping and fixing the wafer. The rotating wheel 8 drives the bidirectional screw rod 7 to rotate, so that the bidirectional screw rod 7 drives the two moving blocks 9 to approach each other, the two chucks 10 approach each other, the wafer is placed when the wafer can contact the two chucks 10 at the same time, then the rotating wheel 8 is continuously rotated to move the two chucks 10 to clamp the wafer, and the vacuum pump 11 and the suction cups 12 are started to run to vacuum adsorb the wafer on the basis of the clamping and fixing of the two chucks 10, so that the wafer is more stably fixed by the double fixing mode, and the wafer is effectively prevented from falling off and being scrapped in the polishing process.

[0023] In the embodiment, as shown in Figures 1-4 A rubber pad 13 is fixedly installed on the inner wall of the chuck 10. The rubber pad 13 arranged on the inner wall of the chuck 10 can protect the periphery of the wafer when the wafer is clamped, which can not only prevent the periphery of the wafer from being damaged, but also increase the friction to make the clamping of the chuck 10 on the wafer more stable.

[0024] A sliding rail 14 is fixedly installed on one side of the chuck 10, and an extrusion rod 15 is slidingly installed on the sliding rail 14. The bottom of the extrusion rod 15 is arranged in an arc shape, and a handle 16 is fixedly installed on the top of the extrusion rod 15. After the chuck 10 clamps the wafer, the extrusion rod 15 is pushed to slide on the sliding rail 14, the extrusion rod 15 is pushed to the top of the wafer to press the wafer, which can correct and flatten the wafer, so that the wafer is more horizontally placed and better adheres to the multiple suction cups 12 on the bottom. The bottom of the extrusion rod 15 is arranged in an arc shape, so that the extrusion rod 15 moves on the wafer to reduce friction, and the handle 16 is arranged to facilitate pushing and pulling the extrusion rod 15.

[0025] In the embodiment, as shown in Figures 1-4As shown, the top of the fixed frame 6 is provided with a plurality of recesses 17, and the chuck 10 is fixedly provided with moving wheels 18 matched with the recesses 17; through the arrangement of the recesses 17 and the moving wheels 18, the moving wheels 18 at the bottom of the chuck 10 move in the recesses 17 while the chuck 10 moves, which can stably support the moving chuck 10 and prevent the chuck 10 from moving horizontally.

[0026] One side of the rotating wheel 8 is provided with a fixed plate 19 mounted on the base 1, the fixed plate 19 is movably provided with a supporting rod 20, the supporting rod 20 is provided with a spring 21 between one end and the fixed plate 19, and the other end of the supporting rod 20 is fixedly provided with a magnetic block 22; the rotating wheel 8 is fixedly provided with a magnetic ring 23, the surface of the magnetic ring 23 is attached to the inner wall of the magnetic block 22 and is mutually adsorbed. After the chuck 10 clamps and fixes the wafer, the supporting rod 20 is pushed to attach the magnetic block 22 at one end to the magnetic ring 23 on the rotating wheel 8, and the rotating wheel 8 can be fixed under the adsorption of the magnetic block 22 and the magnetic ring 23, thereby indirectly limiting the bidirectional screw rod 7, preventing the chuck 10 from loosening the clamping of the wafer due to the rotation of the bidirectional screw rod 7.

[0027] Working principle: rotating the rotating wheel 8 drives the bidirectional screw rod 7 to rotate, so that the bidirectional screw rod 7 drives the two moving blocks 9 to approach each other, so that the two chucks 10 approach each other, and the wafer is placed when the wafer can contact the two chucks 10 at the same time, then the rotating wheel 8 is continuously rotated to move the two chucks 10 to clamp the wafer, and then the vacuum pump 11 and the suction cup 12 are started to run to vacuum adsorb the wafer, and the wafer is more stably fixed by relying on the double fixing mode.

[0028] The above description shows and describes the preferred embodiments of the present application, and it should be understood that the present application is not limited to the form disclosed herein, and modifications and changes made by those skilled in the art without departing from the spirit and scope of the present application should be within the scope of protection of the appended claims of the present application.

Claims

1. A high-stability fixing device for wafer polishing, comprising a base (1), a support frame (2) fixedly mounted on the top of the base (1), a hydraulic cylinder (3) fixedly mounted on the support frame (2), and a polishing machine (4) fixedly mounted on the output end of the hydraulic cylinder (3), characterized in that: The polishing machine (4) is provided below with a high-stability fixing structure body (5), which comprises a fixing frame (6) fixedly installed on the base (1), a bidirectional screw rod (7) movably installed inside the fixing frame (6), a rotating wheel (8) provided on one side of the fixing frame (6) and connected with the bidirectional screw rod (7), two moving blocks (9) symmetrically installed on the bidirectional screw rod (7), a chuck (10) fixedly installed on the top of the moving block (9), a vacuum pump (11) fixedly installed on the bottom of the chuck (10), and two suction cups (12) installed inside the chuck (10) and connected with the vacuum pump (11).

2. The high-stability fixing device for wafer polishing according to claim 1, characterized in that: A rubber pad (13) is fixedly installed on the inner wall of the chuck (10).

3. The high-stability fixing device for wafer polishing according to claim 1, characterized in that: A sliding rail (14) is fixedly installed on one side of the chuck (10), and an extrusion rod (15) is slidingly installed on the sliding rail (14).

4. The high-stability fixing device for wafer polishing according to claim 3, characterized in that: The bottom of the extrusion rod (15) is provided in an arc shape, and a handle (16) is fixedly installed on the top of the extrusion rod (15).

5. The high-stability fixing device for wafer polishing according to claim 1, characterized in that: A plurality of grooves (17) are formed in the top of the fixing frame (6), and a moving wheel (18) is fixedly installed on the chuck (10) and used in cooperation with the grooves (17).

6. The high-stability fixing device for wafer polishing according to claim 1, characterized in that: A fixing plate (19) is installed on the base (1) on one side of the rotating wheel (8), a supporting rod (20) is movably installed on the fixing plate (19), a spring (21) is installed between one end of the supporting rod (20) and the fixing plate (19), and a magnetic block (22) is fixedly installed on the other end of the supporting rod (20).

7. The high-stability fixing device for wafer polishing according to claim 6, characterized in that: A magnetic ring (23) is fixedly sleeved on the rotating wheel (8), and the surface of the magnetic ring (23) is attached to the inner wall of the magnetic block (22) and is mutually adsorbed.

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