Intelligent surface packaging structure, intelligent surface structure, electronic equipment and vehicle

By setting up light-blocking areas in the intelligent surface structure and using light-transmitting and light-blocking encapsulation plastic materials, the problems of uneven light emission and light leakage in the IME process were solved, achieving uniform light emission and stable fixation of light-emitting components, thereby improving product quality and production efficiency.

CN223672002UActive Publication Date: 2025-12-16BYD CO LTD
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Patent Information

Application Number
CN202422424812.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-30
Publication Date
2025-12-16
Estimated Expiration
2034-09-30

AI Technical Summary

Technical Problem

In existing technologies, light-emitting components in the IME process cannot be made into light-guiding or light-blocking structures, resulting in uneven light emission and light leakage, which affects product quality and molding effect.

Method used

In intelligent surface structures, light-blocking areas are set between adjacent light-emitting components. Light-transmitting and light-blocking areas are formed by using light-transmitting and opaque encapsulation plastic materials, respectively, to fix the light-emitting components and prevent light leakage. Low-temperature solder paste or conductive adhesive is used to weld and fix them to the film to prevent the components from falling off during the injection molding process.

Benefits of technology

It achieves uniform light emission from light-emitting components, improves the overall appearance and molding quality of products, reduces scrap rate and production costs, and enhances the fixation and light guiding effect of components.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to an intelligent surface packaging structure, an intelligent surface structure, electronic equipment and a vehicle, the intelligent surface packaging structure comprises a membrane and a plurality of light-emitting components, the plurality of light-emitting components are fixed on the membrane through a packaging plastic material, and a light isolation area for preventing light channeling is formed between the adjacent light-emitting components. The light-emitting component can be welded and fixed on the diaphragm in advance and then packaged and fixed through the packaging plastic material, so that a reinforcing effect can be achieved, and the light-emitting component is prevented from being impacted and falling off in the injection molding process of the last step of IME. By arranging the light insulation areas between the adjacent light-emitting components, the light guide and light insulation effects can be achieved, so that the problem of light channeling is solved, and it is guaranteed that light is emitted more evenly.
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Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of intelligent surfaces, in particular, to an intelligent surface packaging structure, an intelligent surface structure, an electronic device and a vehicle. BACKGROUND

[0002] IME (In-Mold-Electronics), a process of directly integrating patterns, conductive circuits, electronic components, such as LED lights, resistors, capacitors, touch electrodes, etc. into injection molded products during the injection molding process, is an intelligent surface technology widely used in the fields of automobiles, household appliances, medical devices, portable electronic devices, aviation, etc. to display specific patterns and achieve certain functions.

[0003] In the related art, due to the use of one-piece injection molding, the light-emitting components cannot be made into light-guiding or light-blocking structures, resulting in uneven light emission and light leakage. CONTENT OF THE UTILITY MODEL

[0004] The purpose of the present disclosure is to provide an intelligent surface packaging structure, an intelligent surface structure, an electronic device and a vehicle to solve at least one problem mentioned in the related art.

[0005] To achieve the above purpose, the present disclosure provides an intelligent surface packaging structure, comprising a diaphragm and a plurality of light-emitting components, the plurality of light-emitting components being fixed to the diaphragm by a packaging plastic material, and a light-blocking area being formed between adjacent light-emitting components to prevent light leakage.

[0006] Optionally, the packaging plastic material comprises a first packaging plastic material that is light-transmissive and a second packaging plastic material that is not light-transmissive, the light-blocking area is formed by the second packaging plastic material, the first packaging plastic material forms a light-transmissive area, and the light-transmissive area is arranged at a light-emitting surface of at least the light-emitting component, and the light-blocking area is arranged at a non-light-emitting surface of the light-emitting component.

[0007] Optionally, the electronic component comprises a non-light-emitting component, and the periphery of at least the non-light-emitting component is the light-blocking area.

[0008] Optionally, the light-emitting component is provided with a dam at the periphery, and the packaging plastic material is filled to the outside of the dam.

[0009] Optionally, the light-transmissive area contains scattering particles in the corresponding first packaging plastic material.

[0010] Optionally, the packaging thickness of the packaging plastic material is 0.5-1.5mm.

[0011] According to a second aspect of the present disclosure, there is provided an intelligent surface structure comprising a decorative layer, a substrate layer and a functional layer arranged in a stack, the functional layer comprising the intelligent surface package structure described above.

[0012] Optionally, a light-transmitting region between two adjacent light-emitting components is provided with the light-blocking region.

[0013] Optionally, the intelligent surface structure comprises a substrate film and a pattern unit, a conductive circuit and an electronic component provided on the substrate film.

[0014] Optionally, the pattern unit, the conductive circuit and the electronic component are respectively configured as a pattern layer, a conductive circuit layer and an electronic component layer, and the pattern layer, the conductive circuit layer and the electronic component layer are arranged in a stack and located between the substrate film and the substrate layer, and the intelligent surface package structure is provided in the electronic component layer.

[0015] Optionally, the decorative layer comprises a first film and a pattern unit provided on the first film, and / or,

[0016] the functional layer comprises a second film and a conductive circuit and an electronic component provided on the second film.

[0017] Optionally, the pattern unit is configured as a pattern layer, and the pattern layer is located between the first film and the substrate layer.

[0018] Optionally, the conductive circuit and the electronic component are respectively configured as a conductive circuit layer and an electronic component layer, and the conductive circuit layer and the electronic component layer are arranged in a stack and located between the substrate layer and the second film, and the intelligent surface package structure is provided in the electronic component layer.

[0019] Optionally, the decorative layer is provided with an information mark, and the information mark has:

[0020] an extinguished state, the information mark is not displayed, and the decorative layer is consistent with the surface to be installed of the intelligent surface structure;

[0021] an awakened state, the information mark is lit, and touching the information mark can trigger a preset action.

[0022] Optionally, the decorative layer has an inner surface and an outer surface, the information mark is provided on the inner surface, the information mark on the inner surface is formed by printing with light-transmitting ink, and other regions on the inner surface except the information mark are printed with light-blocking ink.

[0023] Optionally, the outer surface of the decorative layer is provided with a texture consistent with the surface to be installed of the intelligent surface structure.

[0024] Optionally, the substrate layer is a light-transmitting material.

[0025] According to a third aspect of the present disclosure, an electronic device is provided, comprising the smart surface structure as described above.

[0026] According to a fourth aspect of the present disclosure, a vehicle is provided, comprising the smart surface structure as described above or comprising the electronic device as described above.

[0027] Through the above technical solution, in the smart surface packaging structure provided by the present disclosure, the light-emitting component can be fixed on the diaphragm in advance by low-temperature tin paste or conductive glue welding, and then packaged and fixed by packaging plastic material, which can play a reinforcing role, so that the light-emitting component is not displaced and falls off in the last step of IME injection molding. The smart surface packaging structure provided by the present disclosure can play a light guiding and light shielding role by setting a light shielding area between adjacent light-emitting components, thereby solving the light leakage problem and ensuring more uniform light emission.

[0028] Other features and advantages of the present disclosure will be described in detail in the following specific embodiments. BRIEF DESCRIPTION OF DRAWINGS

[0029] The accompanying drawings are included to provide a further understanding of the present disclosure and constitute a part of the specification, and are used together with the following specific embodiments to explain the present disclosure, but do not constitute a limitation on the present disclosure. In the drawings:

[0030] Figure 1 is a schematic diagram of a smart surface structure provided by the related embodiments of the present disclosure.

[0031] Figures 2 to 8 is a structural schematic diagram of a seat controller provided by the exemplary embodiments of the present disclosure; wherein,

[0032] Figure 2 is a top view of the seat controller provided by the exemplary embodiments of the present disclosure;

[0033] Figure 3 is a front view of the seat controller provided by the exemplary embodiments of the present disclosure (information mark in an off state);

[0034] Figure 4 is a front view of the seat controller provided by the exemplary embodiments of the present disclosure (information mark in an awake state);

[0035] Figure 5 is an exploded view of the seat controller provided by an exemplary embodiment of the present disclosure;

[0036] Figure 6is a schematic view of the second surface of the substrate layer in a seat controller according to an example embodiment of the present disclosure;

[0037] Figure 7 is an exploded view of a seat controller according to another example embodiment of the present disclosure;

[0038] Figure 8 is a schematic view of the second surface of the substrate layer in a seat controller according to another example embodiment of the present disclosure.

[0039] Figures 9 to 15 is a structural schematic view of a sunroof controller according to an example embodiment of the present disclosure; wherein,

[0040] Figure 9 is a perspective view of a sunroof controller according to an example embodiment of the present disclosure;

[0041] Figure 10 is an exploded view of a sunroof controller according to an example embodiment of the present disclosure;

[0042] Figure 11 is a perspective view of a sunroof controller according to another example embodiment of the present disclosure;

[0043] Figure 12 is a cross-sectional view of a sunroof controller according to an example embodiment of the present disclosure;

[0044] Figure 13 is a schematic view of a functional layer in a sunroof controller according to an example embodiment of the present disclosure;

[0045] Figure 14 is a front view of a sunroof controller according to an example embodiment of the present disclosure (information indicia in an off state);

[0046] Figure 15 is a front view of a sunroof controller according to an example embodiment of the present disclosure (information indicia in an on state).

[0047] Figures 16 to 18 is a schematic view of a smart surface structure according to an example embodiment of the present disclosure;

[0048] Figure 16 is a cross-sectional view of a smart surface structure according to an example embodiment of the present disclosure;

[0049] Figure 17 is an exploded view of a smart surface structure according to an example embodiment of the present disclosure;

[0050] Figure 18 is a cross-sectional view of a smart surface structure according to an example embodiment of the present disclosure;

[0051] Figure 19is a schematic view of a smart surface package structure provided by an exemplary embodiment of the present disclosure;

[0052] Figure 20 is a sectional view of a smart surface structure provided by an exemplary embodiment of the present disclosure;

[0053] Figure 21 is a sectional view of a smart surface structure provided by an exemplary embodiment of the present disclosure.

[0054] Reference Signs Description

[0055] 1, 1'- substrate layer; 10- groove; 11- first surface; 12- second surface; 121- accommodating groove; 122- limiting structure; 123- mounting groove; 124- contact column.

[0056] 2, 2'- decorative layer; 20- information mark; 21- first diaphragm; 22- pattern layer.

[0057] 3, 3'- functional layer; 30- electronic component; 31- circuit board; 32- packaging part; 33- second diaphragm; 34- electronic component layer; 311- light emitting component; 312- connecting piece; 313- vibration component; 314- touch sensing component; 315- capacitive component; 316- silver paste circuit; 35- mounting hole; 36- mounting seat; 37- diaphragm; 371- positioning hole; 372- opening; 38- conductive circuit layer.

[0058] 4- packaging plastic material; 40- dam; 41- light transmission area; 42- light blocking area; 43- non-light emitting component; 50- substrate diaphragm. DETAILED DESCRIPTION

[0059] The specific embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely intended to illustrate and explain the present disclosure, and are not intended to limit the present disclosure.

[0060] In the present disclosure, the orientation words such as "up, down, top, bottom" used without the opposite description generally refer to the definition in the normal installation of the smart surface structure provided by the present disclosure, and the specific reference can be made to Figure 1 and Figure 16 The direction of the drawing surface, "inner, outer" can refer to the inner and outer of the outline of the corresponding component or its location inside or outside the environment according to the specific context. In addition, the following description refers to the drawings, and unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The terms "first", "second", etc. used in the present disclosure are used to distinguish one element from another element, and do not have sequential and important nature.

[0061] Taking the application of the intelligent surface structure to the automobile field as an example, the interior decoration of the automobile is becoming more and more entertainment and comfortable, large screens, lights and touch keys are everywhere, which brings convenience but also causes more and more control factors, lack of design sense, overall sense, distraction and other defects. By applying the IME, the invisible backlight and hidden touch key technology of high integration of multiple material surfaces are realized, which can not only meet the interaction demand but also can be invisible at any time, reduce driving distraction, be safer, have high overall degree of modeling and more design; meanwhile, the structural parts and the circuit are fused, lightened and have high space utilization.

[0062] In the present disclosure, as shown in Figures 2 to 18 , the present disclosure provides an intelligent surface structure, which comprises a decorative layer 2, a substrate layer 1 and a functional layer 3 arranged in layers, and different embodiments of the intelligent surface structure are provided. Before introducing the embodiments, the decorative layer 2, the substrate layer 1 and the functional layer 3 are introduced.

[0063] As for the substrate layer 1, the material with good light transmission is generally selected, such as PC (polycarbonate), PMMA (polymethyl methacrylate), acrylic acid, ABS (acrylonitrile-styrene-butadiene copolymer), AES (sodium fatty alcohol polyoxyethylene ether sulfate), PI (polyimide), PPA (polyphthalamide) and the like, which will not affect the light emitted by the light emitting components of the functional layer 3 to pass through the substrate layer 1 to the decorative layer 2. The substrate layer 1 can be formed during the injection molding of the decorative layer 2, or can be manufactured separately, both of which belong to the protection scope of the present disclosure.

[0064] As for the decorative layer 2, as shown in Figure 4 and Figure 15 , the decorative layer 2 is provided with information marks 20, in the seat controller embodiment shown in Figure 4 , the information marks 20 include the position adjustment of the headrest, backrest and cushion, and also include the adjustment of the working mode of the seat, H represents the heating mode, V represents the ventilation mode, and M represents the massage mode. In the embodiment of the sunroof controller shown in Figure 15 , the information marks 20 include the light emitting position of the two reading lights and the control and emergency help marks of the sunroof. Of course, the above-mentioned information marks 20 are not limited to the content provided by the embodiments, and can be designed according to the needs.

[0065] The information mark 20 has an extinguished state and a wake-up state. In the extinguished state, the information mark 20 is not displayed, the outer surface of the decorative layer 2 is consistent with the surface to be installed of the smart surface installation structure, and is integrated with the surrounding interior, achieving a hidden effect, higher overall styling, and not distracting the driver's attention, being safer and more reliable. When the driver needs it, he can touch the information mark 20 to switch to the wake-up state, and the information mark 20 is displayed. Touching the information mark 20 can trigger a preset action, which is performed by a driving member inside the seat or sunroof, which can be an action of driving the seat back to adjust forward or backward, or an action of heating the back by a heater, etc., which is not limited in particular. Only by pressing the corresponding information mark 20 with a finger, the information mark 20 is pressed to make corresponding actions and feedback, so that the seat and sunroof can be adjusted, and the brightness of the reading light can be changed by pressing the circle position on both sides of the sunroof controller, and can be adjusted according to the user's needs. In addition, only the information mark of the reading light can be displayed in the sunroof controller, and the information mark of the sunroof adjustment is extinguished within a set time. When the reading light function is not needed, double-clicking the information mark of the reading light can extinguish the reading light, and the interaction mode of the information mark 20 can be designed differently according to needs.

[0066] In Figure 5 、 Figure 7 and Figure 10 The decorative layer 2 has an inner surface and an outer surface, and the information mark 20 is provided on the inner surface. In order to achieve better hiding effect, the outer surface of the decorative layer 2 can be printed with a texture consistent with the surface to be installed of the smart surface structure or covered with a light-transmitting fabric, leather, etc. to achieve a hidden effect, and the information mark 20 can be hidden under the light-transmitting texture or light-transmitting fabric. Of course, the outer surface of the decorative layer 2 can have the same material, pattern, modeling design, etc. as the surface to be installed of the smart surface structure, so as to improve the overall consistency.

[0067] The information mark 20 on the inner surface of the decorative layer 2 is printed by light-transmitting ink, and the other areas of the inner surface are printed with light-shielding ink. In this way, the light-emitting component 311 in the functional layer 3 can transmit through the information mark 20 to display the information mark 20 or display a hidden backlight, or be used as a reading light. The other areas of the decorative layer 2 except the information mark 20 are printed with light-shielding ink to block the light of the light-emitting component 311 from transmitting from other positions except the information mark 20, ensuring the overall visual effect and the use of passengers.

[0068] As to the functional layer 3, the functional layer 3 is provided with light emitting components 311, which can be LED lamps. The light emitting components 311 can be multiple and correspond to the positions of the information marks 20 of the decorative layer 2, capable of providing backlight, realizing the lighting and display of the information marks 20, and more favorably making the information marks 20 brighter and more uniform. The positions, quantity and arrangement of the light emitting components 311 can be designed according to the quantity and positions of the information marks 20. In order to realize the sensing of the touch action, the functional layer 3 is provided with touch sensing components 314 to detect the pressure acting on the surface. The functional layer 3 can also be provided with capacitive components 315, inductive components, silver paste circuit 316, sensing chips and the like. The capacitive components 315 can correspond to the positions of the information marks 20 of the decorative layer 2, effectively identifying and monitoring the positions of the user pressing action. When the information mark 20 triggers a certain action, for example, when adjusting the seat back forward, the functional layer 3 is provided with a vibration component 313, such as a vibration motor, to provide feedback by vibration and remind the user that the action has been performed. In other embodiments, feedback can also be provided by the flickering of the information mark 20, without limitation on the specific form.

[0069] In the existing IME technology, as shown in Figure 1 The decorative layer 2', electronic components, circuit and the like (functional layer 3') are integrated in the same film layer (substrate layer 1'), the LED lamp is close to the pattern surface, and cannot be subjected to light guide treatment, resulting in uneven light guide and light leakage of the product. In order to increase the strength of the pattern layer, the number of overprinting needs to be increased, and the same film layer needs to be printed and injection molded repeatedly, resulting in high scrap rate. The hardness of the component and the circuit ink affects the tension, resulting in damage to the pattern layer. Due to the uneven heating of the film printing conductive silver paste and the mounting of electronic components, the product surface is locally shrunk and printed. The electronic components such as LED lamp beads are easily offset during the injection molding process. In order to solve the above problems, in the intelligent surface structure provided in the present disclosure, the decorative layer 2 and the functional layer 3 are arranged on the opposite surfaces of the substrate layer 1, respectively. The decorative layer 2 and the functional layer 3 are separately arranged and manufactured, reducing the influence on the decorative layer 2 and the scrap rate, directly reducing the printing processing times of the single film, and reducing the cost. By adjusting the thickness of the substrate layer 1, the light emitting components 311 in the functional layer 3 can be away from the decorative layer 2, increasing the distance between the light emitting components 311 and the decorative layer 2, and the light guide treatment can be performed to avoid the light leakage phenomenon. The structure will be described in detail in combination with different embodiments.

[0070] In an example embodiment of the present disclosure, the decorative layer 2 and the substrate layer 1 can be an integral structure, and the functional layer 3 is fixed on the surface of the substrate layer 1 away from the decorative layer 2. The decorative layer 2 can be first injection molded with the substrate layer 1, and then the functional layer 3 is fixed at the bottom of the substrate layer 1 to form a complete structure. The functional layer 3 does not participate in the injection molding process, so as to avoid that the electronic devices 311 in the functional layer 3, such as light emitting components, are displaced or damaged during the injection molding process. The outer surface of the substrate layer 1 and the decorative layer 2 after injection molding is not affected by the electronic devices in the functional layer 3, so as to avoid that the circuit and the element pin are embossed, the flatness is good, the heating is more uniform, and the surface shrinkage phenomenon is avoided.

[0071] Here, it should be noted that the intelligent surface structure can be applied to the fields of automobiles, household appliances, portable electronic devices, aviation, etc. When applied to automobiles, it can be an intelligent center control display, a seat controller, an air conditioner controller, a sunroof controller, a steering wheel induction control, a door handle light display control, a safety belt fabric surface control, a vice-instrument panel intelligent display, etc. The interior surface structure all belongs to the protection scope of the present disclosure. The substrate layer 1 and the decorative layer 2 can be formed into an integral piece by in-film injection molding, and the decorative layer 2 can also be transferred to the substrate layer 1 by in-film transfer printing technology or pasted and fixed on the surface of the substrate layer 1 by pasting. The functional layer 3 can be fixed on the surface of the substrate layer 1 by pasting, welding, microstructure, etc.

[0072] Taking a seat controller as an example, in an example embodiment of the present disclosure, as shown in Figures 2 to 8 , the functional layer 3 includes a circuit board 31, and the substrate layer 1 has a first surface 11 for fixing the decorative layer 2 and a second surface 12 for fixing the functional layer 3, as shown in Figure 6 and Figure 8 , the second surface 12 is provided with a limiting structure 122 for positioning the circuit board 31. The limiting structure 122 can be a positioning column provided on the second surface 12, and the circuit board 31 is provided with a positioning hole matched with the positioning column. The limiting structure 122 can be two and arranged at diagonally opposite positions. In other embodiments, the limiting structure 122 can also be a stop sheet, a clamping convex, etc.

[0073] In another example embodiment of the seat controller, as shown in Figure 5As shown, the functional layer 3 further comprises a film 37 provided on the second surface 12 of the substrate layer 1, and the film 37 is provided with the touch sensing element 314. The circuit board 31 can be connected to the film 37 through the connecting member 312 to be fixed on the second surface 12 of the substrate layer 1. The film 37 is provided with the touch sensing element 314, and the film 37 can be fixed on the second surface 12 by adhesion. The second surface 12 of the substrate layer 1 is provided with a receiving groove 121, and the touch sensing element 314 is located in the receiving groove 121 to realize the adhesion of the touch sensing element 314 to the substrate layer 1, avoid the protrusion of the touch sensing element 314 from the second surface 12 of the substrate layer 1, and make the touch sensing element 314 closer to the decorative layer 2 to more easily receive the touch signal of the user to monitor the change of the surface pressure of the decorative layer 2 and realize the corresponding function. The number of the touch sensing element 314 can be selected according to the requirement.

[0074] In Figure 7 In the embodiment shown, the touch sensing element 314 is directly arranged on the circuit board 31, and the connecting member 312 can be omitted in this case. In the embodiment, as shown in Figure 8 In the embodiment shown, the second surface 12 of the substrate layer 1 is provided with a contact column 124 abutting against the touch sensing element 314. The pressure of the user pressing the information mark 20 can be transmitted to the touch sensing element 314 through the contact column 124 to realize the signal transmission and monitor the intention of the user.

[0075] To realize the fixation of the vibration element 313, the second surface 12 of the substrate layer 1 is provided with a mounting groove 123, and the circuit board 31 is provided with the vibration element 313, and the vibration element 313 is mounted in the mounting groove 123. In Figure 5 In the embodiment shown, the film 37 is provided with a positioning hole 371 through which the limiting structure 122 passes and an opening hole 372 for avoiding the vibration element 313, and the positioning and mounting of the circuit board 31 and the installation of the vibration element 313 will not be affected.

[0076] The connecting member 312 can be arranged at the edge of the circuit board 31 to be connected to the film 37. The connecting member 312 can be a flexible member to transmit the signal of the touch sensing element 314 to the circuit board 31 and then to the vehicle controller to control the seat or the sunroof. The light emitting element 311, the capacitive element 315 and the like introduced above can be arranged on the circuit board 31.

[0077] In Figure 5In the shown embodiment of the seat controller, the decorative layer 2 and the substrate layer 1 are first formed into an integrated piece by in-mold injection, transfer or pasting, etc., and then the film piece 37 with the touch sensing element 314 is pasted on the second surface 12 of the substrate layer 1, the touch sensing element 314 is placed in the accommodating groove 121 during the pasting process, then the vibration element 313 is placed in the mounting groove 123, finally the circuit board 31 is connected with the film piece 37 through the connecting piece 312, and the circuit board 31 is limited and fixed by the limiting structure 122, thereby completing the assembly of the intelligent surface structure.

[0078] In another exemplary embodiment of the present disclosure, as shown in Figures 9 to 15 An intelligent surface structure is provided, which includes a substrate layer 1 and a decorative layer 2 and a functional layer 3 respectively arranged on opposite two surfaces of the substrate layer 1, wherein the decorative layer 2, the substrate layer 1 and the functional layer 3 are an integrated structure. The decorative layer 2 and the functional layer 3 can be respectively placed on the front and rear molds of an injection mold, and low-pressure injection is performed in the middle of the front and rear molds to form an integrated structure.

[0079] The decorative layer 2 and the functional layer 3 are respectively located on two sides of the substrate layer 1, which effectively increases the light guide distance of the light emitting component 311 in the functional layer 3, and makes the light more uniform on the decorative layer 2, so that the information mark 20 on the decorative layer 2 is more uniform and clear in brightness. The three are designed as an integrated structure, which can effectively ensure the waterproof and dustproof function of the parts, improve the oxidation resistance, avoid the phenomenon of fixed not firm after oxidation, reduce the assembly steps, and improve the assembly efficiency. The low-pressure injection molding technology can effectively reduce the impact of the substrate layer 1 on the electronic component 30 in the functional layer 3 during the molding process, and improve the yield of the molded product.

[0080] In this embodiment, taking a sunroof controller as an example, as shown in Figure 12 The functional layer 3 has an electronic component 30 and a packaging portion 32 for covering the electronic component 30. The electronic component 30 can be at least one of the light emitting component 311, the capacitive element 315, the resistive element, the inductive element, the touch sensing element 314, the inductive chip and the silver paste circuit 316 introduced above. In order to avoid the impact of the base material on the electronic component 30 in the functional layer 3 during the one-step injection molding, which may cause the risk of deviation of the electronic component 30, the electronic component 30 in the functional layer 3 is first packaged before injection molding. The electronic component 30 can be packaged by low-pressure injection molding or liquid silicone molding, which can avoid damage to the electronic component during the later injection molding process. Since the amount of base material used in the packaging process is significantly less than that used in the one-step injection molding of the three, the early packaging process can effectively reduce the damage to the electronic component 30.

[0081] By incorporating light-emitting components 311, capacitors 315, sensing chips, and silver paste circuitry 316 into functional layer 3, the PCB layout area and the number of electronic components 30 used can be reduced, thus decreasing the weight of the components. The position and number of multiple electronic components 30 within functional layer 3 are not limited, such as... Figure 13 As shown, the functional layer 3 has a capacitor element 315. There can be multiple capacitor elements 315, which correspond to the positions of the information mark 20 in the decorative layer 2. The multiple capacitor elements 315 can be arranged in a matrix, and a capacitor element 315 is provided between two adjacent light-emitting elements 311. Light-emitting elements 311 and capacitor elements 315 are provided on both sides of the touch sensing element 314. The specific arrangement and design can be carried out as needed.

[0082] like Figure 12 As shown, the second surface 12 of the substrate layer 1 facing the functional layer 3 has a groove 10 for avoiding the encapsulation part 32, which ensures the integrity of the smart surface structure. The encapsulation part 32 protrudes from the surface of the functional layer 3. During overall injection molding, the second surface 12 of the substrate layer 1 automatically forms the groove 10 structure to ensure the integrity of the structure.

[0083] The functional layer 3 has mounting holes 35 for mounting the vibration element 313. A mounting base 36 is provided within the mounting holes 35, allowing the vibration element 313 to be fixed onto the mounting base 36. During overall injection molding, the mounting position of the vibration element 313 can be adjusted to allow space for the mounting holes 35, and the mounting base 36 can be installed within the mounting holes 35. Then, the vibration element 313 can be directly fixed onto the mounting base 36.

[0084] exist Figures 9 to 11 In the illustrated embodiment, multiple electronic components 30 in functional layer 3 are first packaged to form... Figure 13 The functional layer 3 is shown. Then, the decorative layer 2 and the functional layer 3 are placed on the front and rear molds of the injection mold, and low-pressure injection molding is performed between the front and rear molds to form an integral structure. Finally, the vibration element 313 is installed to complete the molding process of the intelligent surface structure.

[0085] In the above embodiments, the decorative layer 2 and the functional layer 3 can be separate patch layers. In this disclosure, as shown... Figure 16 and Figure 17As shown, an intelligent surface structure is provided, which comprises a decorative layer 2, a substrate layer 1 and a functional layer 3 arranged in sequence. The decorative layer 2 comprises a first film 21 and a pattern layer 22 fixedly connected to the first film 21. The functional layer 3 comprises a second film 33 and an electronic component layer 34 fixed on the second film 33. The pattern layer 22 can be printed on the first film 21, formed into a required shape by heating, pressing and vacuum adsorption forming, and cut to form the decorative layer 2. The electronic component layer 34 can be a film layer with a plurality of electronic components 30 and is fixed on the second film 33 by a tin paste printing, patching, welding and other processes to form the functional layer 3. The first film 21 and the second film 33 can be PMMA+PC films, PET films or PPA films, etc. Here, the pattern layer 22 can be understood as the inner surface of the decorative layer 2 described above, and the information mark 20 is arranged on the pattern layer 22. The information mark 20 is formed by printing a light-transmitting ink, and other positions are printed with a light-shielding ink. The first film 21 can be the outer surface of the decorative layer 2, which is provided with a texture or fabric consistent with the mounting surface of the intelligent surface structure. The electronic components 30 can also be at least one of the light-emitting components 311, the capacitive components 315, the resistive components, the inductive components, the touch sensing components 314, the inductive chips and the silver paste circuit 316 described above, which will not be repeated here. Whether the decorative layer 2 and the functional layer 3 are separately pasted or the decorative layer 2 and the functional layer 3 are printed on the corresponding film, they are applicable to the technical solution of separately pasting the functional layer 3 described above and applicable to the technical solution of integrally injection molding the functional layer 3 in advance with the decorative layer 2.

[0086] As shown in Figure 16 The pattern layer 22 is located between the first film 21 and the substrate layer 1, and the electronic component layer 34 is located between the second film 33 and the substrate layer 1. The pattern layer first film 21 can be a uniform light film, which is beneficial to the uniform illumination of the light of the light-emitting component 311 to the pattern layer 22.

[0087] The upper part of the electronic components 30 on the electronic component layer 34 is protrudingly arranged, and the surface of the substrate layer 1 facing the functional layer 3 is provided with a groove 10 for avoiding the electronic components 30. The substrate layer 1 avoids the electronic components 30 in the functional layer 3, which can reduce the influence on the electronic components 30 in the functional layer 3. Meanwhile, the thickness and shape of the substrate layer 1 are controllable, which can reduce the arrangement difficulty of the plurality of electronic components 30 in the functional layer 3.

[0088] To solve the problem that the components in the background art are easy to displace and not fixed firmly, as shown in Figure 19As shown, the present disclosure provides an intelligent surface packaging structure, which comprises a film (not shown in the figure), an electronic component 30 arranged on the film, and a packaging plastic material 4 for fixing the electronic component 30 on the film, the periphery of the electronic component 30 is provided with a dam 40, and the packaging plastic material 4 is filled to the outside of the dam 40 and is divided into a light-transmitting area 41 and a light-blocking area 42.

[0089] Here, it should be noted that the electronic component 30 herein can be various electronic components in the functional layer 3 introduced above, can be a light-emitting component 311, a capacitor element 315, a resistance element, an inductance element, a touch sensing element 314, a vibration element 313, an inductive chip, etc., can be any appropriate component to be packaged in advance on the film, and the electronic component 30 can be welded and fixed on the film in advance.

[0090] The dam 40 is constructed around the electronic component 30, and before packaging, a circle of dam glue is coated around the electronic component 30 to form the dam 40, which can effectively protect the electronic component 30 in the dam 40 from the influence of the packaging plastic material 4 during packaging.

[0091] During packaging, the film to be packaged can be placed in a first low-pressure injection mold, a low-pressure injection machine is started, and light-blocking low-pressure injection packaging plastic material is injected into the first low-pressure injection mold and filled to a predetermined position. After the light-blocking plastic material is solidified in the mold, the film is taken out, and at this time, the light-blocking area 42 is formed on part of the film. Then, the film is placed in a second low-pressure injection mold, a low-pressure injection machine is started, and light-transmitting low-pressure injection packaging plastic material is injected into the second low-pressure injection mold and filled to at least the light-emitting surface of the light-emitting component 311. After the light-transmitting plastic material is solidified in the mold, the film is taken out, and the film packaging is completed. Of course, the light-transmitting packaging plastic material can also be injected first, and then the light-blocking packaging plastic material is injected, that is, the order of packaging to form the light-blocking area 42 and the light-transmitting area 41 is not limited. In addition, the position and amount of the light-blocking area 42 and the light-transmitting area 41 formed on the outside of the dam 40 are not limited, and can be designed according to the shape of the dam 40 and the light guide requirement. Taking the case where the outer contour of the dam 40 is a rectangle as an example, any one or more edges can be filled with the light-transmitting area 41, and the remaining edges can be filled with the light-blocking area 42.

[0092] In the intelligent surface packaging structure provided in the present disclosure, the film sheet 37 and the plurality of light emitting components 311 are fixed to the film sheet 37 by the packaging plastic material 4, and the light shielding area 42 is formed between the adjacent light emitting components 311 to prevent light leakage. The light emitting components 311 can be fixed on the film sheet by low-temperature tin paste or conductive glue in advance, and then be fixed by the packaging plastic material 4, which can play a reinforcing role to prevent the light emitting components from being displaced and falling off in the injection molding process in the last step of the IME. By arranging the light shielding area 42 between the adjacent light emitting components 311, the light guiding and light shielding effects can be achieved, thereby solving the problem of light leakage and ensuring more uniform light emission.

[0093] In some embodiments, the packaging plastic material 4 can include a first packaging plastic material for transmitting light and a second packaging plastic material for not transmitting light. The light shielding area 42 is formed by the second packaging plastic material, and the light transmitting area 41 is formed by the first packaging plastic material. The light transmitting area 41 is arranged at the light emitting surface of the light emitting component 311, and the light shielding area 42 is arranged at the non-light emitting surface of the light emitting component 311.

[0094] In the present disclosure, the electronic component 30 can include the light emitting component 311 and the non-light emitting component 43, which can be the inductance component, the resistance component, the capacitance component 315, the vibration component 313, etc.

[0095] The light shielding area 42 can be filled around the non-light emitting component 43, the non-light emitting surface of the light emitting component 311, and the non-light transmitting position, and the light transmitting area 41 can be filled at the light emitting surface of the light emitting component 311 and other light transmitting positions. For example, as shown in FIG. 4, the cross section of the light emitting component 311 can be a square, and only one surface can be the light emitting surface. The light emitting surface is filled with the light transmitting area 41, and the other three surfaces are filled with the light shielding area 42. Figure 19 As shown in FIG. 5, the four surfaces of the non-light emitting component 43 are filled with the light shielding area 42, and the surface opposite to the light shielding area 42 of the light emitting component 311 is filled with the light transmitting area 41. The first low-pressure injection mold and the second low-pressure injection mold can be designed according to the requirements of light transmission and light shielding, and the light transmitting area 41 and the light shielding area 42 are formed at the corresponding positions, respectively. Figure 20 Figure 21 In the embodiments provided in the present disclosure, the light emitting surface of the light emitting component 311 can be the surface facing the pattern unit of the decorative layer, and the surface of the light emitting component 311 away from the pattern unit can be the non-light emitting surface, so as to ensure that the light beam of the light emitting component 311 can irradiate on the pattern unit, thereby realizing the display function of the information marker 20.

[0096] ​In some embodiments, the light emitting component 311 is provided with a dam 40, and the encapsulation plastic 4 is filled to the outside of the dam 40. Specifically, before encapsulation, the electronic component 30 is provided with the dam 40, so as to avoid the influence of the encapsulation plastic 4 on the electronic component 30 in the dam 40.

[0097] The encapsulation plastic 4 can be polyamide (PA), polyolefin (PO), polyurethane (PU), polycarbonate (PC), etc., and the encapsulation plastic 4 corresponding to the light transmission region 41 contains scattering particles, so as to form a light transmission low-pressure injection encapsulation plastic. The encapsulation thickness of the encapsulation plastic 4 can be 0.5-1.5 mm.

[0098] Correspondingly, as shown in Figure 20 and Figure 21 , the present disclosure provides a smart surface structure, which comprises a decorative layer 2, a substrate layer 1 and a functional layer 3 arranged in layers, and the functional layer 3 comprises the smart surface encapsulation structure provided by the present disclosure.

[0099] In an exemplary embodiment of the present disclosure, as shown in Figure 20 , the pattern unit of the decorative layer 2 and the electronic component 30 of the functional layer 3 can be located on a piece of substrate film 50, and the smart surface structure comprises the substrate film 50 and the pattern unit, the conductive circuit and the electronic component 30 arranged on the substrate film 50. In this embodiment, the pattern unit, the conductive circuit and the electronic component can be respectively configured as a separate pattern layer 22, a conductive circuit layer 38 and an electronic component layer 34, which are arranged in layers and located between the substrate film 50 and the substrate layer 1. Here and in the conductive circuit layer 38 described below, the conductive circuit layer 38 can comprise a conductive circuit, a touch electrode and a pad. The pattern layer 22, the conductive circuit of the conductive circuit layer 38, the touch electrode and the pad can be printed on the substrate film 50, and the electronic component 30 is fixed by conductive silver paste or low-temperature tin paste after being pasted, and the film after pasting is put into a forming and punching machine for forming and punching, so as to form the film to be encapsulated mentioned above, which is sequentially put into a first low-pressure injection mold and a second low-pressure injection mold, and the low-pressure injection encapsulation plastic is injected into the mold and quickly solidified using a low-pressure injection molding machine, so as to encapsulate the light transmission region 41 and the light shielding region 42, and complete the reinforcement of the electronic component 30, etc. Finally, the encapsulated film is put into an injection mold cavity, and molten plastic material is injected into the mold to form the substrate layer 1, and the IME product is completed.

[0100] In another exemplary embodiment of the present disclosure, as shown in Figure 21As shown, the decorative layer 2 comprises a first film 21 and a pattern unit arranged on the first film 21, and / or the functional layer 3 comprises a second film 33 and a conductive circuit and electronic components 30 arranged on the second film 33. In this embodiment, the pattern unit is configured as a separate pattern layer 22, which is located between the first film 21 and the substrate layer 1. The conductive circuit and electronic components 30 are respectively configured as a separate conductive circuit layer 38 and an electronic component layer 34, which are sequentially stacked and located between the substrate layer 1 and the second film 33. The pattern layer 22 can be printed on the first film 21, and the decorative layer 2 is placed into a forming and punching machine for forming and punching to form the decorative layer 2; the conductive circuit layer 38 is printed on the second film 33, the electronic components 30 are welded using conductive silver glue or low-temperature tin paste, the film after pasting is placed into a forming and punching machine for forming and punching, and then sequentially placed into the inner cavities of a first low-pressure injection mold and a second low-pressure injection mold, and a low-pressure injection molding machine is used to inject low-pressure injection packaging plastic material into the mold and quickly solidify to form the functional layer 3. Finally, the decorative layer 2 and the functional layer 3 are placed into the inner cavity of an injection mold, and molten plastic material is injected into the mold to complete the IME product. Figure 20 and Figure 21 In the two embodiments of the present disclosure, the decorative layer 2 and the functional layer 3 are in the form of a single-patch layer or a separate pattern layer 22 and electronic component layer 34 arranged on the film, which is similar to the embodiments mentioned in Figure 16 and Figure 17 The embodiments are not repeated here.

[0101] In the present disclosure, a light-blocking region 42 is arranged between two adjacent light-emitting components 311 in the functional layer 3, which can effectively solve the problem of light leakage. By arranging and adjusting the light-transmitting region 41 and the light-blocking region 42, a uniform light-emitting effect can be achieved.

[0102] In addition, in the present disclosure, a low-pressure injection molding process is used to package the film. The packaging plastic material is injected into the mold at a very low injection pressure, usually 1.5-40 bar, and quickly solidified (5-50 seconds). Low-pressure injection molding is a process between potting and high-pressure injection molding. Compared with other potting processes, the low-pressure injection molding process can improve the performance of the terminal product. The pressure is very low during injection, which will not damage the components. The temperature is low, the defect rate is low, and the product has the advantages of sealing, waterproofing, moisture-proofing, shock-absorbing, insulation, flame-retardant, etc.

[0103] According to an embodiment of the present disclosure, a vehicle is provided, which comprises the smart surface structure as described above or the smart surface structure formed by the processing method as described above. The smart surface structure can be any suitable functional surface structure in the interior of the vehicle, not limited to the seat controller and the sunroof controller. The vehicle has all the beneficial effects of the smart surface structure and the processing method as described above, which will not be repeated here.

[0104] According to an embodiment of the present disclosure, an electronic device is provided, which comprises the smart surface structure as described above or the smart surface structure formed by the processing method as described above. The electronic device can be an electronic device in other fields than the vehicle field, such as a television, a mobile phone, a watch, a computer, a headset, etc., or an electronic device on the vehicle, such as a central control display, etc., to realize the hidden effect of the physical button. The electronic device has all the beneficial effects of the smart surface structure and the processing method as described above, which will not be repeated here.

[0105] The preferred embodiments of the present disclosure are described in detail above with reference to the drawings, but the present disclosure is not limited to the specific details in the above-described embodiments. Within the technical concept of the present disclosure, various simple modifications can be made to the technical solutions of the present disclosure, and all these simple modifications belong to the protection scope of the present disclosure.

[0106] In addition, it should be noted that each specific technical feature described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present disclosure will not further describe various possible combinations.

[0107] In addition, any combination of various different embodiments of the present disclosure can also be made, as long as it does not deviate from the idea of the present disclosure, and it should also be considered as the disclosed content of the present disclosure.

Claims

1. An intelligent surface package structure, characterized by, The smart surface packaging structure comprises a film sheet and a plurality of light emitting components fixed to the film sheet by encapsulation plastic, and a light shielding area is formed between adjacent light emitting components to prevent light leakage.

2. The smart surface package structure of claim 1, wherein, The encapsulation plastic comprises light-transmissive first encapsulation plastic and non-light-transmissive second encapsulation plastic, the light shielding area is formed by the second encapsulation plastic, the first encapsulation plastic forms a light-transmissive area, and the light-transmissive area is arranged at a light emitting surface of the light emitting component.

3. The smart surface package structure of claim 1, wherein, The light emitting component is provided with a dam, and the encapsulation plastic is filled to the outside of the dam.

4. The smart surface package structure of claim 2, wherein, The first encapsulation plastic corresponding to the light-transmissive area contains scattering particles.

5. The smart surface package structure of claim 1, wherein, The encapsulation thickness of the encapsulation plastic is 0.5-1.5 mm.

6. An intelligent surface structure, characterized by, The smart surface structure comprises a decorative layer, a substrate layer and a functional layer arranged in layers, and the functional layer comprises the smart surface packaging structure of any one of claims 1-5.

7. The smart surface structure of claim 6, wherein, The light-transmissive area between two adjacent light emitting components is provided with the light shielding area.

8. The smart surface structure of claim 6, wherein, The smart surface structure comprises a substrate film sheet and a pattern unit, a conductive circuit and an electronic component arranged on the substrate film sheet.

9. The smart surface structure of claim 8, wherein, The pattern unit, the conductive circuit and the electronic component are respectively configured as a separate pattern layer, a conductive circuit layer and an electronic component layer, and the pattern layer, the conductive circuit layer and the electronic component layer are arranged in layers and located between the substrate film sheet and the substrate layer, and the electronic component layer is provided with the smart surface packaging structure.

10. The smart surface structure of claim 6, wherein The decorative layer comprises a first film sheet and a pattern unit arranged on the first film sheet, and / or The functional layer comprises a second film sheet and a conductive circuit and an electronic component arranged on the second film sheet.

11. The smart surface structure of claim 10, wherein, The pattern unit is configured as a separate pattern layer, and the pattern layer is located between the first film sheet and the substrate layer.

12. The smart surface structure of claim 10, wherein, The conductive circuit and the electronic component are respectively configured as a separate conductive circuit layer and an electronic component layer, and the conductive circuit layer and the electronic component layer are arranged in layers and located between the substrate layer and the second film sheet, and the electronic component layer is provided with the smart surface packaging structure.

13. The smart surface structure of any one of claims 6-12, wherein, The decorative layer is provided with an information mark, and the information mark has: an extinguished state in which the information mark is not displayed, and the decorative layer is consistent with a surface to be installed of the smart surface structure; an awakened state in which the information mark is lighted, and a preset action can be triggered by touching the information mark.

14. The smart surface structure of claim 13, wherein, The decorative layer has an inner surface and an outer surface, the information mark is arranged on the inner surface, the information mark on the inner surface is formed by printing with light-transmissive ink, and other areas on the inner surface except the information mark are printed with light-shielding ink.

15. The smart surface structure of claim 14, wherein, The outer surface of the decorative layer is provided with a texture consistent with the surface to be installed of the smart surface structure.

16. The smart surface structure of claim 6, wherein, The substrate layer is a light-transmissive material.

17. An electronic device, comprising: The smart surface structure of any one of claims 6-16.

18. A vehicle characterized by comprising: An intelligent surface structure according to any one of claims 6-16 or an electronic device according to claim 17.