Intelligent temperature control IC (integrated circuit) removal device and TOC (total organic carbon) analysis system

Abstract

The embodiment of the utility model discloses an intelligent temperature control IC removal device and a TOC analysis system. The intelligent temperature control IC removal device comprises a heat insulation protective shell, a reaction container, a heating unit, a temperature sensing unit, a stirring and uniform mixing unit, a cooling regulation and control unit and an intelligent control unit. The reaction container is provided with a flow guide coating; an alloy resistance wire of the heating unit is matched with a current limiter to realize stable heating; the temperature sensing unit is used for accurately monitoring; the stirring unit is used for uniformly heating a sample;

Description

Technical Field

[0001] This application relates to the field of IC removal technology, specifically to an intelligent temperature-controlled IC removal device and a TOC analysis system. Background Technology

[0002] Total Organic Carbon (TOC) analyzers are widely used in industries such as municipal water supply, pharmaceuticals, food and beverage, and microelectronics for the quantitative detection of organic pollutants in water. The principle of a TOC analyzer is to simultaneously detect the total organic carbon (TC) and inorganic carbon (IC, which is divided into carbonate, carbonate ions, and bicarbonate ions) content in a sample, and calculate the TOC content of the sample according to the following formula: TOC = TC - IC.

[0003] As shown in the formula above, when the IC content in the sample is too high, the cumulative error effect will affect the accuracy of TOC detection. Traditional IC removal devices have many shortcomings. For example, in the heating process, most traditional devices lack an effective temperature control mechanism. On the one hand, when the temperature is too high, the sample may undergo unnecessary chemical reactions, such as premature decomposition or structural changes of certain organic components, which will undoubtedly interfere with the accuracy of TOC detection; on the other hand, if the temperature is too low, the IC removal reaction will be slow, which not only reduces work efficiency but also causes unnecessary waste of energy. Utility Model Content

[0004] This application provides an intelligent temperature-controlled IC removal device and a TOC analysis system to improve the problem that traditional IC removal devices cannot achieve temperature control.

[0005] In a first aspect, embodiments of this application provide an intelligent temperature-controlled IC removal device, comprising:

[0006] A heat-insulating protective shell, wherein a receiving chamber is formed inside the heat-insulating protective shell, and a heat-insulating layer is attached to the inner wall of the receiving chamber;

[0007] A reaction vessel is disposed in the containment chamber. The inner wall of the reaction vessel is provided with a smooth flow-guiding coating. The top of the reaction vessel is provided with a sealing cap. The sealing cap has an inlet port, an exhaust port and a temperature sensing port.

[0008] The heating unit includes an alloy resistance wire that is spirally and uniformly wound around the outer wall of the reaction vessel. A thermally conductive silicone layer is provided between the alloy resistance wire and the outer wall of the reaction vessel. The heating unit also includes a current limiter connected in series with the alloy resistance wire.

[0009] A temperature sensing unit, a probe of a thermocouple sensor of the temperature sensing unit extends into the reaction container through a temperature sensing connection port, the probe is located at a central axis of the reaction container and is spaced from a bottom of the reaction container;

[0010] A stirring mixing unit, including a driving source and a stirring paddle, the stirring paddle is connected with the driving source through a detachable shaft coupling, the stirring paddle is located in the reaction container, and the driving source is located at the bottom of the reaction container;

[0011] A cooling regulation unit, including a cooling pipe spiraled on an outer wall of the reaction container and a cooling medium circulation assembly connected with the cooling pipe, the cooling medium circulation assembly includes a cooling liquid storage tank arranged outside the heat protection shell, a circulating pump and a flow regulating valve, the cooling liquid storage tank is connected with the circulating pump, the cooling liquid storage tank is connected with the cooling pipe through a connecting pipe penetrating through the heat protection shell, the flow regulating valve is arranged on the connecting pipe, and heat dissipation fins are arranged between the cooling pipe and the outer wall of the reaction container;

[0012] An intelligent control unit, electrically connected with the temperature sensing unit, the heating unit and the cooling regulation unit, used for receiving a signal of the temperature sensing unit, controlling operation of the heating unit and the cooling regulation unit through a preset control algorithm to stabilize the temperature in the reaction container in a set range, and the intelligent control unit includes an adjustable temperature threshold setting module used for adjusting a target temperature range according to different sample characteristics.

[0013] In some embodiments of the present application, an alloy resistance wire of the heating unit is wrapped with a heat-conducting insulation layer, and the heat-conducting insulation layer has a thickness of 0.5-1 mm.

[0014] In some embodiments of the present application, an inner wall of the temperature sensing connection port is provided with a sealing rubber ring, the temperature sensing unit is inserted into the temperature sensing connection port and presses the sealing rubber ring, and a probe of the temperature sensing unit extends into the reaction container through the temperature sensing connection port.

[0015] In some embodiments of the present application, an edge of the stirring paddle is provided with a rubber protective layer.

[0016] In some embodiments of the present application, the cooling liquid storage tank includes a stainless steel inner layer and a heat preservation outer layer wrapping the stainless steel inner layer.

[0017] In some embodiments of the present application, the intelligent control unit is connected with an alarm module, the alarm module includes a buzzer and a flashing indicator, and the alarm module issues an audible and light alarm when the temperature exceeds preset upper and lower threshold values for a preset time.

[0018] In some embodiments of the present application, the bottom of the reaction container is provided with a buffer seat, and the driving source is arranged between the buffer seat and the reaction container.

[0019] In some embodiments of the present application, the sample inlet connector is provided with a filter, and the filter comprises multiple layers of filter screens, and the mesh size of the multiple layers of filter screens gradually decreases in the direction away from the inside of the reaction container.

[0020] In some embodiments of the present application, the flow regulating valve is an electromagnetic regulating valve, and a shielded cable is used to connect the flow regulating valve and the intelligent control unit.

[0021] In the second aspect, embodiments of the present application provide a TOC analysis system comprising the intelligent temperature-controlled IC removal device as described in the first aspect.

[0022] Therefore, the intelligent temperature-controlled IC removal device disclosed in the embodiments of the present application can efficiently convert electric energy into heat energy and transfer the heat energy to the sample by tightly attaching the alloy resistance wire in the heating unit to the outer wall of the reaction container through the heat-conducting silica gel layer, so that the sample can be rapidly heated to a temperature range conducive to IC removal. The current limiter is connected in series in the alloy resistance wire circuit, which effectively controls the initial heating current and prevents damage to the resistance wire and the device caused by current impact, thereby ensuring the stability of the heating process. At the same time, the thermocouple sensor probe of the temperature sensing unit accurately detects the temperature of the sample in the reaction container and transmits the signal to the intelligent control unit in real time. The intelligent control unit accurately controls the power of the heating unit and the operation of the cooling control unit according to the preset algorithm and the temperature signal. For example, when the sample is heated to near the optimal IC removal temperature, the intelligent control unit reduces the heating power to avoid excessive temperature rise. If the temperature has a rising trend due to external factors, the cooling control unit is quickly started under the instruction of the intelligent control unit, and the excess heat is timely removed through the circulation of the cooling liquid in the cooling pipeline and the heat dissipation effect of the heat dissipation fins. Such accurate temperature control ensures that the sample is always in the most suitable IC removal temperature environment, significantly improves the IC removal efficiency, reduces the interference of IC residues on TOC detection, and thus improves the accuracy of TOC analysis. According to experimental comparison, the IC removal rate using the device can be increased by about 30%-50% compared with the traditional device without precise temperature control, and the TOC detection accuracy is also improved accordingly. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0024] Figure 1 A structural block diagram of a TOC analysis system provided by an embodiment of the present application is shown in FIG. 1.

[0025] Figure 2 A structural schematic diagram of an IC removing device with intelligent temperature control provided by an embodiment of the present application is shown in FIG. 2.

[0026] Figure 3 An internal structural schematic diagram of a reaction container in the IC removing device with intelligent temperature control provided by an embodiment of the present application is shown in FIG. 3.

[0027] Legend of reference signs:

[0028] 1, IC removing device with intelligent temperature control; 11, heat insulation protective shell; 111, accommodating cavity; 112, heat insulation layer; 12, reaction container; 121, sealing cover; 122, sample feeding connecting port; 1221, filter element; 123, exhaust connecting port; 124, temperature sensing connecting port; 13, heating unit; 131, alloy resistance wire; 132, heat-conducting silica gel layer; 14, temperature sensing unit; 141, probe; 15, stirring and mixing unit; 151, driving source; 152, stirring paddle; 16, cooling regulation and control unit; 161, cooling pipeline; 162, cooling liquid storage tank; 1621, stainless steel inner layer; 1622, heat preservation outer layer; 163, circulating pump; 164, flow regulating valve; 17, intelligent control unit; 171, alarm module; 18, buffer seat; 2, sample feeding and conveying module; 3, carbon detection and analysis module; 4, data processing and display interaction module. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0030] In the description of the present application, it should be understood that the words “first”, “second” are used only for the purpose of description, and cannot be understood as indicating or implying relative importance or indicating the number of the indicated technical features. Therefore, the features defined with “first”, “second” can explicitly or implicitly include one or more features. In the description of the present application, the meaning of “multiple” is two or more, unless otherwise specifically limited.

[0031] Please refer to Figure 1Embodiments of the present application provide a TOC analysis system, which comprises an intelligent temperature-controlled IC removal device, a sample feeding and conveying module 2, a carbon detection and analysis module 3, and a data processing and display interaction module 4.

[0032] The sample feeding and conveying module 2 is connected to the IC removal device through a sample pipeline for conveying the sample to the IC removal device. The carbon detection and analysis module 3 is connected to the IC removal device for detecting the carbon content of the processed sample. The data processing and display interaction module 4 is in bidirectional communication with the intelligent control unit 17, receives and processes data from the sample feeding and conveying module 2, the IC removal device, and the carbon detection and analysis module 3. The display interface of the module can display sample feeding parameters, IC removal process temperature change curves, TOC detection results, and system operation state information. The module has data storage function and external data transmission interface, which is convenient for further analysis and report generation of data.

[0033] Please refer to Figure 2 and Figure 3 In some embodiments, the intelligent temperature-controlled IC removal device 1 comprises a heat-insulated protective shell 11, a reaction container 12, a heating unit 13, a temperature sensing unit 14, a stirring and mixing unit 15, a cooling regulation unit 16, and an intelligent control unit 17.

[0034] The heat-insulated protective shell 11 has an accommodating cavity 111 formed therein, and the inner wall of the accommodating cavity 111 is attached with a heat insulation layer 112. The heat-insulated protective shell 11 is made of metal material (such as stainless steel), which has good mechanical strength and stability, and can provide reliable protection for the internal components. The heat insulation layer 112 attached to the inner wall is made of ceramic fiber material, and the thickness is about 5-10 mm. The ceramic fiber has the characteristics of low thermal conductivity, which can effectively reduce the loss of internal heat to the external environment, make the temperature field in the device relatively stable, and reduce the interference of external temperature changes on the internal reaction, to create favorable external environmental conditions for precise temperature control.

[0035] The reaction container 12 is arranged in the accommodating chamber 111, the inner wall of the reaction container 12 is provided with a smooth flow guide coating, the top of the reaction container 12 is provided with a sealing cover 121, the sealing cover 121 is provided with a sample inlet connecting port 122, an exhaust connecting port 123 and a temperature sensing connecting port 124. The reaction container 12 is made of quartz glass material in a cylindrical shape, the inner diameter is 8-12 cm, and the height is 15-25 cm. The quartz glass has the advantages of high temperature resistance, corrosion resistance and good chemical stability, and can adapt to the processing environment of various samples. The inner wall is provided with a smooth flow guide coating, which can use Teflon material, and the smooth surface can guide the sample to form an orderly flow path in the container, which helps the sample to mix uniformly during stirring, avoids local retention or turbulent flow, makes the sample heated more uniformly, improves the consistency and stability of the reaction, and improves the IC removal effect and the accuracy of TOC analysis. The sealing cover 121 at the top is precisely processed with the sample inlet connecting port 122, the exhaust connecting port 123 and the temperature sensing connecting port 124, the diameters of the sample inlet connecting port 122 and the exhaust connecting port 123 are about 4-6 mm, so as to connect the sample inlet pipe and the exhaust pipe with appropriate pipe diameters, and ensure the smooth inlet and outlet of the sample and the gas; the diameter of the temperature sensing connecting port 124 is about 3-5 mm, which is used to install the probe 141 of the temperature sensing unit 14, so that it can accurately extend into the appropriate position inside the reaction container 12 for temperature monitoring.

[0036] The heating unit 13 includes an alloy resistance wire 131 wound uniformly in a spiral shape on the outer wall of the reaction container 12, a heat-conducting silica gel layer 132 is arranged between the alloy resistance wire 131 and the outer wall of the reaction container 12, and the heating unit 13 further includes a current limiter connected in series with the alloy resistance wire 131. The alloy resistance wire 131 is made of nickel-chromium alloy material, and the diameter is about 1.5-2.5 mm. The nickel-chromium alloy has high resistivity and oxidation resistance, and can generate stable heat when electrified. The heat-conducting silica gel layer 132 is uniformly coated when winding, and the thickness is about 1-2 mm. The heat-conducting silica gel has good heat-conducting performance, can effectively fill the small gap between the resistance wire and the outer wall of the reaction container 12, reduce the thermal resistance, make the heat quickly and uniformly transmitted from the resistance wire to the reaction container 12, ensure that the sample can be quickly heated to the preset temperature range, improve the heating efficiency, reduce the heating time, and be beneficial to the rapid start of the IC removal reaction. At the same time, the current limiter is connected to the circuit, the rated current of the current limiter is selected according to the power of the resistance wire and the circuit requirement, generally 0.8-1.2 times of the rated current of the resistance wire. The current limiter can limit the impact of the initial current on the resistance wire when the device starts, prevent the resistance wire from being damaged due to instantaneous large current, prolong the service life of the resistance wire, ensure the long-term stable operation of the heating unit 13, lay a foundation for the continuous work of the whole device, indirectly improve the reliability and stability of the system, and be beneficial to the continuous and efficient IC removal operation and the smooth TOC analysis.

[0037] The probe 141 of the thermocouple sensor of the temperature sensing unit 14 extends into the reaction container 12 through the temperature sensing connection port 124, and is located at the central axis of the reaction container 12 and spaced from the bottom of the reaction container 12. The temperature sensing unit 14 adopts a high-precision thermocouple sensor, and the probe 141 of the thermocouple sensor is inserted into the reaction container 12 through the temperature sensing connection port 124, located at the central axis and about 3-5 cm away from the bottom. Such a position design can enable the probe 141 to more comprehensively perceive the average temperature of the sample in the reaction container 12, avoiding temperature monitoring deviation caused by being close to the edge or the bottom. The probe 141 is made of stainless steel, has good high-temperature resistance and corrosion resistance, and can ensure stable work in the harsh environment of the reaction container 12. A sealing rubber ring is installed on the inner wall of the temperature sensing connection port 124, and the sealing rubber ring is made of high-temperature-resistant rubber material, such as fluororubber. The fluororubber has excellent high-temperature resistance, chemical corrosion resistance and good sealing performance, and can effectively prevent sample leakage from the connection port under the condition of high temperature and various chemicals, ensure the sealing performance of the reaction container 12, avoid damage to the internal components of the device caused by sample leakage, and at the same time ensure that the temperature sensing unit 14 can accurately obtain the temperature information in the reaction container 12, provide reliable temperature data for the intelligent control unit 17, so as to accurately control the heating and cooling process, ensure that the IC removal reaction is carried out under suitable temperature conditions, and improve the IC removal efficiency and TOC detection accuracy.

[0038] The stirring mixing unit 15 comprises a driving source 151 and a stirring paddle 152, the stirring paddle 152 is connected with the driving source 151 through a detachable shaft coupling, the stirring paddle 152 is located in the reaction container 12, and the driving source 151 is located at the bottom of the reaction container 12. The stirring paddle 152 is made of stainless steel and has a three-leaf or four-leaf structure, the length of the paddle blade is 3-5 cm, and the width is 1-2 cm. The stainless steel material ensures the chemical stability and mechanical strength of the stirring paddle 152 during contact with the sample, the three-leaf or four-leaf structure and the specific paddle size design can generate reasonable fluid shear force and stirring effect during stirring, so that the sample forms sufficient convection and mixing in the reaction container 12. The stirring paddle 152 is connected with the driving source 151 through a detachable shaft coupling, this connection mode is convenient for installation, disassembly and replacement of the stirring paddle 152, and when it is necessary to adjust the type of the stirring paddle 152 according to different sample characteristics or to maintain, it can be quickly operated. The driving source 151 selects a direct current motor, the power is 30-80 watts, and the rotating speed range is 100-1000 revolutions per minute. The direct current motor has the characteristics of adjustable rotating speed and high control precision, the stirring speed can be flexibly adjusted through the intelligent control unit 17 according to the properties, volume and reaction demand of the sample, so that the sample is uniformly heated during heating, the IC removal reaction is accelerated, the reaction rate and efficiency are improved, different samples can be processed under the best stirring condition, the adaptability and processing capacity of the device to various samples are enhanced, which is beneficial to obtain more accurate IC removal effect and TOC analysis result.

[0039] The cooling regulation unit 16 comprises a cooling pipe 161 spirally arranged on the outer wall of the reaction container 12 and a cooling medium circulation assembly connected with the cooling pipe 161. The cooling medium circulation assembly comprises a cooling liquid storage tank 162 arranged outside the heat insulation protective shell 11, a circulating pump 163 and a flow regulating valve 164. The cooling liquid storage tank 162 is connected with the circulating pump 163, and the cooling liquid storage tank 162 is connected with the cooling pipe 161 through a connecting pipe penetrating through the heat insulation protective shell 11. The flow regulating valve 164 is arranged on the connecting pipe. Heat dissipation fins are arranged between the cooling pipe 161 and the outer wall of the reaction container 12. The cooling pipe 161 is made of copper material, which has good heat conduction performance and is beneficial to heat transfer. The outer diameter of the copper pipe is 6-10 mm, the inner diameter is 4-8 mm, the copper pipe is spirally arranged on the outer wall of the reaction container 12, the number of spirally arranged turns is 8-12 turns, the contact area between the cooling pipe 161 and the reaction container 12 can be increased, and the cooling efficiency can be improved. The heat dissipation fins are made of aluminum material, which has a high thermal conductivity and can quickly dissipate the heat of the cooling pipe 161. The thickness of the heat dissipation fins is 1-2 mm, the length is 2-4 cm, and the interval between adjacent fins is 3-5 mm, which is helpful to form a good air convection channel and further enhance the heat dissipation effect. The cooling pipe 161 is connected with the cooling liquid storage tank 162, the circulating pump 163 and the flow regulating valve 164 to form a cooling medium circulation assembly. The cooling liquid storage tank 162 is arranged outside the shell and has a volume of 10-20 liters. The cooling liquid storage tank 162 has a stainless steel inner layer 1621 and a heat preservation outer layer 1622. The stainless steel inner layer 1621 ensures the structural strength and chemical stability of the cooling liquid storage tank 162, preventing the leakage of cooling liquid and chemical reaction with the tank wall. The heat preservation outer layer 1622 can be made of polyurethane foam material with a thickness of 3-5 cm. The polyurethane foam has good heat insulation performance, which can reduce the heat exchange between the cooling liquid and the external environment, maintain the temperature stability of the cooling liquid and reduce the cooling energy consumption. The pipe penetrating through the shell and connected with the cooling pipe 161 is made of acid and alkali resistant polytetrafluoroethylene material with an inner diameter of 6-10 mm, which ensures that the cooling liquid is not corroded during transmission and ensures the long-term stable operation of the cooling system. The flow regulating valve 164 is an electromagnetic regulating valve with a response time of 0.1-0.5 seconds, which can quickly adjust the flow of the cooling liquid according to the instructions of the intelligent control unit 17 to realize precise control of the temperature of the reaction container 12. The flow of the circulating pump 163 is 5-15 liters per minute, and the lift is 5-10 m, which provides sufficient power for the circulation of the cooling liquid in the system and ensures the smooth progress of the cooling process.The cooling regulation unit 16 can timely and effectively regulate the temperature of the reaction container 12 according to the temperature information fed back by the temperature sensing unit 14 under the coordination of the intelligent control unit 17, rapidly starts the cooling cycle when the sample temperature is too high, and makes the sample temperature rapidly drop to the preset range by precisely controlling the flow of the cooling liquid, so as to avoid the sample deterioration or abnormal reaction caused by the too high temperature, ensure the IC removal reaction to be carried out at the appropriate temperature, optimize the energy utilization, avoid the energy waste caused by excessive cooling, improve the stability and reliability of the system, and provide strong support for obtaining accurate TOC analysis results.

[0040] The intelligent control unit 17 is electrically connected with the temperature sensing unit 14, the heating unit 13 and the cooling regulation unit 16, used for receiving the signal of the temperature sensing unit 14, controlling the operation of the heating unit 13 and the cooling regulation unit 16 through a preset control algorithm, so as to stabilize the temperature in the reaction container 12 within a set range, and the intelligent control unit 17 comprises an adjustable temperature threshold setting module, used for adjusting the target temperature range according to different sample characteristics. The intelligent control unit 17 adopts a programmable logic controller (PLC) or a microprocessor (MCU) as a core control element, with a high-precision temperature acquisition module and a control output module. The temperature acquisition module can accurately receive the temperature signal transmitted by the temperature sensing unit 14, with a resolution of 0.1℃ or even higher, ensuring accurate perception of the temperature change in the reaction container 12. The control output module accurately regulates the power of the heating unit 13 and the operation state of the cooling regulation unit 16 according to the preset control algorithm. The intelligent control unit 17 is connected with the temperature sensing unit 14, the heating unit 13 and the cooling regulation unit 16 through a shielded cable, which can effectively reduce the influence of external electromagnetic interference on signal transmission, ensuring the accuracy and stability of data transmission, so that the intelligent control unit 17 can timely and reliably obtain temperature information and issue control instructions. The intelligent control unit 17 internally stores preset temperature threshold setting modules for different sample types and reaction conditions, and the operator can select or adjust the appropriate target temperature range according to actual needs, for example, for some samples containing special ingredients, a specific IC removal temperature range can be set. During the operation of the device, the intelligent control unit 17 continuously compares the real-time temperature with the preset temperature range, and when the temperature deviates from the preset range, the corresponding regulation measures are immediately started, such as adjusting the power of the heating unit 13 or starting the cooling regulation unit 16, so that the temperature in the reaction container 12 is always maintained within the set range, with a fluctuation of not more than ±1℃. The existence of the intelligent control unit 17 realizes the automation and intelligent control of the entire device, greatly improves the precision and stability of temperature control, effectively improves the IC removal efficiency, reduces the problems of incomplete IC removal or sample damage caused by temperature fluctuation, and further improves the accuracy and reliability of TOC analysis, while having a fault monitoring and alarm function. When the temperature sensor fails, the heating unit 13 abnormally or the cooling system fails, an alarm signal can be issued in time to remind the operator to maintain and handle, ensuring the safe and stable operation of the device, reducing the influence of equipment failure on the analysis work, and improving the operability and maintainability of the entire system.

[0041] The specific working process of the IC removal device provided in the present application is as follows:

[0042] An appropriate amount of sample to be analyzed is filtered through the filter 1221 of the sample inlet connector 122 and then injected into the reaction container 12. The filter 1221 of the sample inlet connector 122 adopts a multi-layer stainless steel screen structure, and the screen mesh size is 100 mesh, 200 mesh and 300 mesh from the side close to the sample container. The large-particle impurities in the sample can be effectively removed. The setting of the filter 1221 prevents large-particle impurities from entering the reaction container 12, avoids damage to the reaction process and device components, ensures the normal progress of the IC removal reaction, improves the reliability and service life of the device, and further ensures the accuracy of the TOC analysis results.

[0043] The intelligent control unit 17 determines the target temperature range according to the preset temperature threshold setting module and starts the heating unit 13. During heating, the temperature sensing unit 14 monitors the temperature in real time and sends signals to the intelligent control unit 17. For example, for general water samples, the preset IC removal temperature range is 60-90°C. The intelligent control unit 17 controls the power of the heating unit 13 according to the temperature information fed back by the temperature sensing unit 14, so that the sample temperature quickly rises to the range and is maintained within the range with a fluctuation of not more than ±1°C. The intelligent control unit 17 accurately controls the heating power according to the preset temperature range, so that the sample quickly rises to the appropriate temperature interval, accelerates the decomposition of IC components, improves the IC removal efficiency, reduces the influence of temperature fluctuation on TOC detection, and improves the TOC analysis accuracy.

[0044] As the sample temperature rises, the stirring and mixing unit 15 is started, and the stirring paddle 152 rotates at a speed of 300-600 revolutions per minute to uniformly heat the sample. During heating and stirring, the IC components in the sample begin to decompose. The rotation of the stirring paddle 152 uniformly heats the sample, promotes the full contact reaction between the IC components and the sample, further improves the IC removal efficiency, avoids IC residues caused by incomplete local reaction, and ensures the accuracy of TOC detection.

[0045] If the temperature approaches or exceeds the preset upper limit, the intelligent control unit 17 starts the cooling regulation unit 16, the circulating pump 163 sends cooling liquid to the cooling pipeline 161, and the flow regulating valve 164 adjusts the cooling liquid flow according to the instructions of the intelligent control unit 17 to reduce the sample temperature. For example, when the temperature rises to 91°C, the intelligent control unit 17 starts the cooling regulation unit 16, adjusts the cooling liquid flow to 8-12 liters per minute, and reduces the sample temperature to below 90°C within 1-2 minutes. The rapid response and accurate flow regulation of the cooling regulation unit 16 effectively prevent damage to the sample and the device caused by excessive temperature, ensure that the IC removal reaction is carried out at an appropriate temperature, maintain the stability of the system, avoid excessive cooling and waste of energy, and optimize the energy utilization efficiency.

[0046] When the temperature returns to the preset interval, the cooling control unit 16 adjusts or stops, and the heating unit 13 maintains the temperature, so that the sample completes IC removal at the appropriate temperature. During the whole process, the intelligent control unit 17 continuously monitors the running state of each unit and transmits relevant data to the data processing and display interaction module 4. The continuous monitoring and data transmission of the intelligent control unit 17 facilitate the operator to master the device running condition in real time, discover and handle the abnormality in time, guarantee the stable operation of the device, and provide the basis for subsequent data analysis and processing, which is helpful to improve the reliability and comprehensiveness of TOC analysis.

[0047] The foregoing detailed description has set forth various embodiments of the application via the use of specific terminology. As such, it is to be understood that the term "include" or "comprise" or variations thereof herein are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of elements is not necessarily limited to only those elements but can include other elements not expressly listed or inherent to such process, method, system, article, or apparatus. Further, unless otherwise specified, terms of approximation including "approximately," "substantially," and "about" can refer to ±10%.

[0048] Also, the use of "a" or "an" to describe embodiments of the present application are intended to be a non-exclusive inclusive of the potential that more than one of those elements exist. Further, the use of "one" or "another" to describe embodiments of the present application are intended to be a non-exclusive inclusive of the potential that more than one of those elements exist.

[0049] Similarly, it is to be noticed that the term coupled, when used in the description, is not limited to the case where a connection between the entities is directly made, but it is also intended to material or virtual media - like energy waves - that allow the entities to co-operate without a direct mechanical or magnetic connection.

[0050] This application incorporates by reference for each patent, patent application, patent application publication, and other materials cited herein, such as articles, books, specifications, publications, documents, and the like; except to the extent that the content incorporated by reference is inconsistent with the description of the application, which takes precedent. Also, to the extent that any meaning or definition of a term in any of the materials incorporated by reference alters or otherwise is contrary to the meaning or definition of the term as used in the description, the description controls. Note that if there is a plurality of meanings or definitions of a term in the materials incorporated by reference, the description selects only one of those meanings or definitions to apply to the description.

[0051] The above merely provides preferred embodiments of the present application, and is not used to limit the present application. For those skilled in the art, the present application can have various modifications and changes. Any modifications, equivalent replacements, improvements, etc. made within the principles and technical scope of the present application shall fall into the scope of the present application.

Claims

1. An intelligent temperature-controlled IC removal device, characterized by, include: A heat-insulating protective shell, wherein a receiving chamber is formed inside the heat-insulating protective shell, and a heat-insulating layer is attached to the inner wall of the receiving chamber; A reaction vessel is disposed within the containment chamber. The inner wall of the reaction vessel is provided with a smooth flow-guiding coating. The top of the reaction vessel is provided with a sealing cap. The sealing cap has an inlet port, an exhaust port and a temperature sensing port. The heating unit includes an alloy resistance wire that is spirally and uniformly wound around the outer wall of the reaction vessel. A thermally conductive silicone layer is provided between the alloy resistance wire and the outer wall of the reaction vessel. The heating unit also includes a current limiter connected in series with the alloy resistance wire. A temperature sensing unit, wherein the probe of the thermocouple sensor of the temperature sensing unit extends into the reaction vessel through a temperature sensing connection port, and the probe is located at the central axis of the reaction vessel and spaced apart from the bottom of the reaction vessel. A stirring and mixing unit includes a drive source and a stirring paddle. The stirring paddle and the drive source are connected by a detachable coupling. The stirring paddle is located inside the reaction vessel, and the drive source is located at the bottom of the reaction vessel. The cooling control unit includes a cooling pipe that spirals around the outer wall of the reaction vessel and a cooling medium circulation assembly connected to the cooling pipe. The cooling medium circulation assembly includes a coolant storage tank, a circulation pump, and a flow regulating valve located outside the heat-insulating protective shell. The coolant storage tank is connected to the circulation pump, and the coolant storage tank is connected to the cooling pipe through the heat-insulating protective shell via a connecting pipe. The flow regulating valve is located on the connecting pipe, and heat dissipation fins are provided between the cooling pipe and the outer wall of the reaction vessel. The intelligent control unit is electrically connected to the temperature sensing unit, the heating unit, and the cooling control unit. It receives signals from the temperature sensing unit and controls the operation of the heating unit and the cooling control unit through a preset control algorithm to stabilize the temperature inside the reaction vessel within a set range. The intelligent control unit includes an adjustable temperature threshold setting module for adjusting the target temperature range according to different sample characteristics.

2. The smart temperature-controlled IC removal device of claim 1, wherein, The alloy resistance wire of the heating unit is wrapped with a thermally conductive insulating layer, the thickness of which is between 0.5-1mm.

3. The smart temperature-controlled IC removal device of claim 1, wherein, The inner wall of the temperature sensing connection port is provided with a sealing ring. The temperature sensing unit is inserted into the temperature sensing connection port and the sealing ring is squeezed. The probe of the temperature sensing unit extends into the reaction vessel through the temperature sensing connection port.

4. The intelligent temperature-controlled IC removal device of claim 1, wherein, The edge of the stirring paddle is provided with a rubber protective layer.

5. The intelligent temperature-controlled IC removal device of claim 1, wherein, The coolant storage tank includes a stainless steel inner layer and an insulating outer layer that wraps around the stainless steel inner layer.

6. The intelligent temperature-controlled IC removal device of claim 1, wherein, The intelligent control unit is connected to an alarm module, which includes a buzzer and a flashing indicator light. When the temperature exceeds the preset upper and lower thresholds for a preset time, the alarm module will issue an audible and visual alarm.

7. The intelligent temperature-controlled IC removal device of claim 1, wherein, The bottom of the reaction vessel is provided with a buffer seat, and the drive source is located between the buffer seat and the reaction vessel.

8. The intelligent temperature-controlled IC removal device of claim 1, wherein, The sample injection connecting port is provided with a filter, and the filter comprises multiple layers of filter screens, and the mesh size of the multiple layers of filter screens gradually decreases in the direction away from the inside of the reaction container.

9. The intelligent temperature-controlled IC removal device of claim 1, wherein, The flow regulating valve is an electromagnetic regulating valve, and a shielded cable is used to connect the flow regulating valve and the intelligent control unit.

10. A TOC analysis system characterized by, An IC removal device comprising the intelligent temperature control as claimed in any one of claims 1 to 9.

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