PCB binding area anomaly detection device

Abstract

The utility model provides a PCB binding area abnormity detection device comprising a detection bench used for bearing a bound product to be detected; the CCD camera is used for positioning the bound product to be detected; the adjusting mechanism is used for adjusting the position of the detection table according to the positioning information of the bound to-be-detected product; the spectrum confocal sensor is arranged above the detection table; the spectral confocal sensor is used for scanning the bound to-be-detected product through a spectral line to obtain data point information corresponding to the bound to-be-detected product; the processor is electrically connected with the spectrum confocal sensor and used for forming a curve graph according to the data point information and judging whether the binding area is abnormal or not according to the height difference Zn of the wave crest and the wave trough of the curve graph. According to the utility model, on-line detection of the PCB binding area is realized, the working efficiency is improved, and unqualified products are prevented from flowing into rear-section equipment to cause loss.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of binding equipment, specifically relates to a PCB binding area abnormity detection device. BACKGROUND

[0002] In the binding process of PCB (printed circuit board) and FPC (flexible printed circuit) or COF (chip on flexible substrate), due to the problems such as foreign matter mixing, poor binding, ACF (anisotropic conductive film) attachment offset and protrusion, the appearance defects such as floating and bulging often occur in the binding area, which further causes conductive abnormality and makes the screen unable to normally light up. Figure 1 A shows that the normal binding area has a normal appearance, and the defective product as shown in B has an abnormal appearance. Figure 1 Currently, such problems are difficult to effectively detect in the mass production stage, which leads to the flow of batch defective products into the subsequent production link and causes significant losses.

[0003] The existing detection means mainly relies on artificial microscope inspection, which is not only low in efficiency and easy to be interfered by human factors, but also can only carry out sampling inspection and cannot realize comprehensive and online detection. UTILITY MODEL CONTENTS

[0004] To solve the above defects, the utility model aims at providing a PCB binding area abnormity detection device which is efficient, accurate and can realize online detection, so as to replace the traditional artificial detection mode and improve the production efficiency and product quality.

[0005] A PCB binding area abnormity detection device, comprising: a detection table for carrying a product to be detected after binding; a CCD camera for positioning the product to be detected after binding; an adjusting mechanism arranged on the lower side of the detection table, the adjusting mechanism being used for adjusting the position of the detection table according to the positioning information of the product to be detected after binding; a spectral confocal sensor arranged above the detection table; the spectral confocal sensor being used for scanning the product to be detected after binding by a spectral line to obtain data point information corresponding to the product to be detected after binding; and a processor electrically connected with the spectral confocal sensor, the processor being used for forming a curve graph according to the data point information, determining whether the binding area is abnormal according to the height difference Z of the wave crest and the wave trough of the curve graph, and outputting an alarm signal when the binding area is abnormal. n determining whether the binding area is abnormal.

[0006] In an embodiment of the utility model, the adjusting mechanism comprises a base, a Y-axis linear module and an electric rotating platform, the detection table is connected with the electric rotating platform through a mounting plate, the bottom of the electric rotating platform is installed on the Y-axis linear module, and the Y-axis linear module is installed on the base.

[0007] In an embodiment of the utility model, the PCB binding area abnormality detection device further includes a mounting frame, the mounting frame is arranged perpendicularly to the base, an X-axis linear module is arranged on the mounting frame, and the spectral confocal sensor is mounted on the X-axis linear module.

[0008] In an embodiment of the utility model, the PCB binding area abnormality detection device includes two detection tables, and each detection table is provided with a corresponding adjusting mechanism.

[0009] In an embodiment of the utility model, a threshold parameter Z0 is arranged in the processor; when the height difference Znof the wave crest and the wave trough of the curve graph is less than or equal to Z0, it is determined to be qualified; when a convex region appears in the curve graph, the convex value Zn is greater than Z0, it is determined to be unqualified and an alarm is given.

[0010] In summary, the utility model provides a PCB binding area abnormality detection device, and the utility model has the advantages of:

[0011] (1) improving detection efficiency: realizing online and full-automatic detection, replacing manual microscope inspection, realizing double-station detection of the abnormality of the PCB binding area, significantly improving detection efficiency, and saving detection time.

[0012] (2) enhancing detection accuracy: through high-precision scanning and data analysis of the spectrometer, human interference is reduced, and detection accuracy is improved.

[0013] (3) high flexibility: according to different binding processes and diameters of conductive particles, scanning speed and other parameters can be flexibly adjusted, and the adaptability is high.

[0014] (4) reducing production cost: timely discovery and processing of the abnormality of the binding area, reduction of defective products flowing into subsequent production links, and reduction of production cost. DRAWINGS

[0015] Figure 1 It is an appearance schematic view of qualified products and unqualified products after binding. Figure 1 A is a qualified product, Figure 1 B is an unqualified product.

[0016] Figure 2 It is a three-dimensional structure schematic view of the binding abnormality detection device provided in an embodiment of the utility model.

[0017] Figure 3 It is a front view of the binding abnormality detection device provided in an embodiment of the utility model.

[0018] Figure 4 It is a curve graph of qualified products and unqualified products after binding. Figure 4 A is a qualified product, Figure 4 B is an unqualified product.

[0019] Main element symbol explanation: 1, base; 2, mounting frame; 3, X-axis linear module; 4, spectral confocal sensor; 51, first detection table; 52, second detection table; 61, first electric rotating platform; 62, second electric rotating platform; 71, first Y-axis linear module; 72, second Y-axis linear module. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme of the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are some of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application.

[0021] As shown in Figures 2 to 3 A PCB binding area abnormality detection device includes a detection table, a CCD camera, an adjustment mechanism, a spectral confocal sensor 4, and a processor.

[0022] The detection table is used to carry the bound product to be inspected. In this embodiment, a first detection table 51 and a second detection table 52 are provided to realize double-station detection of the PCB binding area abnormality and improve the detection efficiency.

[0023] Next, the CCD camera is arranged above the station, and the CCD camera positions the bound product to be inspected.

[0024] Then, the adjustment mechanism is arranged on the lower side of the detection table, and the adjustment mechanism adjusts the position of the detection table according to the positioning information of the bound product to be inspected.

[0025] In the embodiment, the first detection table 51 and the second detection table 52 are respectively provided with a first adjusting mechanism and a second adjusting mechanism, and the first adjusting mechanism and the second adjusting mechanism are installed on the base 1. The first adjusting mechanism comprises a first Y-axis linear module 71 and a first electric rotating platform 61, and the first detection table 51 is connected with the first electric rotating platform 61 through a mounting plate. The bottom of the first electric rotating platform 61 is installed on the first Y-axis linear module 71, and the first Y-axis linear module 71 is installed on the base 1. The second adjusting mechanism comprises a second Y-axis linear module 72 and a second electric rotating platform 62, and the second detection table 52 is connected with the second electric rotating platform 62 through a mounting plate. The bottom of the second electric rotating platform 62 is installed on the second Y-axis linear module 72, and the second Y-axis linear module 72 is installed on the base 1.

[0026] Then, the spectral confocal sensor 4 is arranged above the detection table. The spectral confocal sensor 4 is used for scanning the bound product to be detected through a spectral line to obtain data point information corresponding to the bound product to be detected. The spectral confocal sensor 4 uses a special lens to extend the focus halo range of different color lights, forms a special magnification chromatic aberration, and focuses a light of an accurate wavelength on the measured object according to the distance from the measured object to the lens. By measuring the wavelength of the reflected light, the accurate distance from the measured object to the lens can be obtained.

[0027] The processor is electrically connected with the spectral confocal sensor 4, and the processor is used for forming a curve graph according to the data point information, and determining whether the bound area is abnormal according to the height difference Z1 between the wave crest and the wave trough of the curve graph. n determining whether the bound area is abnormal.

[0028] Further, the PCB bound area abnormality detection device further comprises a mounting frame 2, the mounting frame 2 is arranged perpendicularly to the base 1, and the X-axis linear module 3 is arranged on the mounting frame 2. The spectral confocal sensor 4 is installed on the X-axis linear module 3, and the spectral confocal sensor 4 moves along the X direction.

[0029] The threshold parameter Z0 is set in the processor. In the embodiment, when the height difference Z1 between the wave crest and the wave trough of the curve graph is less than or equal to the threshold parameter Z0, it is determined to be qualified. For example, when the height difference Z1 between the wave crest and the wave trough of the curve graph is greater than the threshold parameter Z0, it is determined to be unqualified. Figure 4 A, when the height difference Z1 between the wave crest and the wave trough of the curve graph is less than or equal to the threshold parameter Z0, it is determined to be qualified. For example, when the height difference Z1 between the wave crest and the wave trough of the curve graph is greater than the threshold parameter Z0, it is determined to be unqualified. Figure 4 B, when the curve graph appears a convex region, and the convex value Z2 is greater than the threshold parameter Z0, it is determined to be unqualified and an alarm is given.

[0030] In other embodiments, the processor processes the data obtained by the spectral confocal sensor 4 in the following manner:

[0031] (1) Quadratic fitting:

[0032] Given data points (X_i, Z_i), where i = 1, 2,..., n;

[0033] (2) Fitting model selection:

[0034] Quadratic fitting model: Z = aX^2 + bX + c;

[0035] (3) Calculate fitting parameters:

[0036] Least squares objective: find a, b, c that minimize the sum of squared errors S:

[0037] S = Σ(Z_i - (aX_i^2 + bX_i + c))^2;

[0038] Take partial derivatives of S with respect to a, b, c, and set them equal to 0:

[0039]

[0040]

[0041]

[0042] Form a linear system of equations:

[0043] ΣX_i^4a + ΣX_i^3b + ΣX_i^2c = ΣX_i^2Z_i;

[0044] ΣX_i^3a + ΣX_i^2b + ΣX_i c = ΣX_i Z_i;

[0045] ΣX_i^2a + ΣX_i b + n c = ΣZ_i;

[0046] Matrix form:

[0047]

[0048] (4) Calculate residuals:

[0049] Residuals

[0050] (5) Identify outliers:

[0051] Set a threshold T;

[0052] Label points that exceed the threshold as outliers: |r_i| > T;

[0053] (6) Output results.

[0054] Working process: the first detection table 51, the second detection table 52 on the binding after the detection product is detected by the spectral confocal sensor 4 respectively. When the spectral confocal sensor 4 scans the binding after the detection product on the upside of the first detection table 51, the CCD camera positions the binding after the detection product on the upside of the second detection table 52, the second adjusting mechanism adjusts the Y direction and the angle direction of the binding after the detection product on the upside, after the binding after the detection product on the upside of the first detection table 51 is scanned and processed, the spectral confocal sensor 4 moves to the upside of the second detection table 52 along the X direction to scan the binding after the detection product on the upside. The binding after the detection product on the upside of the first detection table 51 is calculated and analyzed by the processor, if it is judged as qualified, it is transported to the next process, if it is judged as defective, it enters the NG buffer area, and waits for manual detection.

[0055] The preferred embodiments of the present application have been described above by way of example only, not for limitation, for those skilled in the art, various changes and modifications can be made to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A PCB land area abnormality detection apparatus characterized by comprising: It includes: The detection platform is used to carry the bound product to be inspected; CCD camera is used for positioning the bound product to be inspected; Adjusting mechanism is arranged on the lower side of the detection platform, which is used to adjust the position of the detection platform according to the positioning information of the bound product to be inspected; Spectral confocal sensor is arranged above the detection platform; the spectral confocal sensor is used to scan the bound product to be inspected by spectral line and obtain the corresponding data point information of the bound product to be inspected; a processor electrically connected with the spectral confocal sensor, the processor being configured to form a curve graph according to the data point information, and to determine a height difference Z between a wave crest and a wave trough of the curve graph n determine whether the binding area is abnormal.

2. The PCB land zone anomaly detection apparatus of claim 1, wherein The adjusting mechanism includes a base, a Y-axis linear module and an electric rotating platform, the detection platform is connected with the electric rotating platform through a mounting plate, the bottom of the electric rotating platform is installed on the Y-axis linear module, and the Y-axis linear module is installed on the base.

3. The PCB land zone anomaly detection apparatus of claim 2, wherein It also includes a mounting bracket, which is arranged vertically with the base, and an X-axis linear module is arranged on the mounting bracket, and the spectral confocal sensor is installed on the X-axis linear module.

4. The PCB land zone anomaly detection apparatus of claim 1, wherein It includes two detection platforms, and each detection platform is respectively provided with a corresponding adjusting mechanism.

5. The PCB land zone anomaly detection apparatus of claim 1, wherein The threshold parameter Z0 is arranged in the processor.

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